BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS Rev. 02 — 4 March 2010 Product data sheet 1. Product profile 1.1 General description The BGU7005 is a Low Noise Amplifier (LNA) for GPS receiver applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU7005 requires only one external matching inductor and one external decoupling capacitor. The BGU7005 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise figure of 0.9 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Small 6-pin leadless package 1 mm × 1.45 mm × 0.5 mm Low noise high gain MMIC Integrated temperature stabilized bias for easy design Requires only one input matching inductor and one supply decoupling capacitor Input and output DC decoupled Noise figure (NF) = 0.9 dB at 1.575 GHz Integrated matching for the output Gain 16.5 dB at 1.575 GHz High 1 dB compression point of −11 dBm High out of band IP3i of 9 dBm 110 GHz transit frequency - SiGe:C technology Supply voltage 1.5 V to 2.85 V, optimized for 1.8 V Power-down mode current consumption < 1 μA Optimized performance at low 4.5 mA supply current ESD protection on all pins (HBM > 1 kV) 1.3 Applications LNA for GPS in handsets, PDA’s and Portable Navigation Devices BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 1.4 Quick reference data Table 1. Quick reference data f = 1575 MHz; VCC = 1.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.5 - 2.85 V Pi < −40 dBm - 4.5 - mA Pi = −20 dBm - 12 - mA Pi < −40 dBm 14 16.5 19 dB Pi = −20 dBm 15 17.5 20 dB Pi < −40 dBm - 0.9 1.3 dB Pi = −20 dBm - 1.2 1.6 dB VCC supply voltage RF input AC coupled ICC supply current VENABLE ≥ 0.8 V power gain Gp NF noise figure Pi(1dB) input third-order intercept point IP3i [1] input power at 1 dB gain compression f = 1.575 GHz VCC = 1.5 V −15 −12 - dBm VCC = 1.8 V −14 −11 - dBm VCC = 2.85 V −11 −8 - dBm f = 1.575 GHz VCC = 1.5 V [1] 5 8 - dBm VCC = 1.8 V [1] 5 9 - dBm VCC = 2.85 V [1] 5 12 - dBm f1 = 1713 MHz; f2 = 1851 MHz. 2. Pinning information Table 2. Pinning Pin Description 1 GND 2 GND 3 RF_IN 4 VCC 5 ENABLE 6 Simplified outline 1 2 Graphic symbol 4 3 5 3 6 2 6 5 bottom view RF_OUT 4 1 sym129 3. Ordering information Table 3. Ordering information Type number BGU7005 BGU7005_2 Product data sheet Package Name Description XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 x 1.45 x 0.5 mm All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 Version © NXP B.V. 2010. All rights reserved. 2 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 4. Marking Table 4. Marking codes Type number Marking code BGU7005 AC 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled −0.2 +3.1 V Ptot total power dissipation Tsp ≤ 130 °C 55 mW Tstg storage temperature −65 150 °C Tj junction temperature - 150 °C [1] [1] Tsp is the temperature at the soldering point of the emitter lead. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions Typ Unit 225 K/W 7. Characteristics Table 7. Characteristics f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.5 - 2.85 V Pi < −40 dBm - 4.5 - mA Pi = −20 dBm - 12 - mA VENABLE ≤ 0.35 V - - 0.001 mA VCC supply voltage RF input AC coupled ICC supply current VENABLE ≥ 0.8 V Tamb −40 +25 ambient temperature BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 +85 °C © NXP B.V. 2010. All rights reserved. 3 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS Table 7. Characteristics …continued f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Conditions Gp Tamb = 25 °C power gain Min Typ Max Unit no jammer 14 16.5 19 dB Pi = −20 dBm; fi = 1575 MHz 15 17.5 20 dB Pjam = −20 dBm; fjam = 850 MHz 15 17.5 20 dB Pjam = −20 dBm; fjam = 1850 MHz 15 17.5 20 dB no jammer 13 - 20 dB Pi = −20 dBm; fi = 1575 MHz 14 - 21 dB Pjam = −20 dBm; fjam = 850 MHz 14 - 21 dB −40 °C ≤ Tamb ≤ +85 °C Pjam = −20 dBm; fjam = 1850 MHz RLin input return loss RLout output return loss ISL isolation NF noise figure 14 - 21 dB Pi < −40 dBm 5 8 - dB Pi = −20 dBm 6 10 - dB Pi < −40 dBm 10 20 - dB Pi = −20 dBm 10 14 - dB 20 23 - dB - 0.9 1.3 dB Tamb = 25 °C no jammer Pi = −20 dBm; fi = 1575 MHz - 1.2 1.6 dB Pjam = −20 dBm; fjam = 850 MHz - 1.1 1.5 dB Pjam = −20 dBm; fjam = 1850 MHz - 1.3 1.7 dB no jammer - - 1.7 dB Pi = −20 dBm; fi = 1575 MHz - - 1.9 dB Pjam = −20 dBm; fjam = 850 MHz - - 1.8 dB Pjam = −20 dBm; fjam = 1850 MHz - - 2.0 dB −40 °C ≤ Tamb ≤ +85 °C Pi(1dB) input power at 1 dB gain compression f = 1575 MHz VCC = 1.5 V −15 −12 - dBm VCC = 1.8 V −14 −11 - dBm VCC = 2.85 V −11 −8 - dBm f = 806 MHz to 928 MHz VCC = 1.5 V [1] −15 −12 - dBm VCC = 1.8 V [1] −14 −11 - dBm VCC = 2.85 V [1] −14 −11 - dBm VCC = 1.5 V [1] −13 −10 - dBm VCC = 1.8 V [1] −12 −9 - dBm VCC = 2.85 V [1] −10 −7 - dBm f = 1612 MHz to 1909 MHz BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 4 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS Table 7. Characteristics …continued f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Conditions IP3i f = 1.575 GHz input third-order intercept point Min Typ Max Unit VCC = 1.5 V [2] 5 8 - dBm VCC = 1.8 V [2] 5 9 - dBm VCC = 2.85 V [2] 5 12 - dBm turn-on time [3] - - 2 μs toff turn-off time [3] - - 1 μs K Rollett stability factor 1 - - ton [1] Out of band. [2] f1 = 1713 MHz; f2 = 1851 MHz. [3] Within 10 % of the final gain. Table 8. ENABLE (pin 5) −40 °C ≤ Tamb ≤ +85 °C; 1.5 V ≤ VCC ≤ 2.85 V VENABLE (V) State ≤ 0.35 OFF ≥ 0.8 ON 8. Application information 8.1 GPS LNA Ven Vcc C1 RFin 5 L1 3 IC1 4 RFout 6 1 2 001aak685 For a list of components see Table 9. Fig 1. Schematics GPS LNA evaluation board Table 9. List of components For schematics see Figure 1. BGU7005_2 Product data sheet Component Description Value Supplier C1 decoupling capacitor 1 nF various IC1 BGU7005 - NXP L1 high quality matching inductor 5.6 nH Murata LQW15A All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 Remarks © NXP B.V. 2010. All rights reserved. 5 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak688 6 ICC (mA) 001aak689 6 ICC (mA) (1) (2) 5 5 (3) (3) (2) (1) 4 4 3 1.0 1.5 2.0 2.5 3 −55 3.0 3.5 VCC (V) Pi = −45 dBm. −15 65 105 Tamb (°C) Pi = −45 dBm. (1) Tamb = −40 °C (1) VCC = 1.5 V (2) Tamb = +25 °C (2) VCC = 1.8 V (3) Tamb = +85 °C (3) VCC = 2.85 V Fig 2. 25 Supply current as a function of supply voltage; typical values Fig 3. 001aak690 20 Gp (dB) Supply current as a function of ambient temperature; typical values 001aak691 20 Gp (dB) 16 16 12 12 (1) (4) (2) 8 (3) 8 (3) (2) (1) 4 4 0 500 1000 1500 2000 0 500 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Tamb = −40 °C (1) Pi = −45 dBm (2) Tamb = +25 °C (2) Pi = −30 dBm (3) Tamb = +85 °C (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 4. Power gain as a function of frequency; typical values BGU7005_2 Product data sheet Fig 5. Power gain as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 6 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak692 18 001aak693 20 Gp Gp (dB) Gp (dB) 12 ICC (mA) (3) (2) (1) 17 (3) 20 15 (3) (2) (2) (1) (1) 14 10 ICC 6 11 0 500 1000 1500 2000 5 8 −50 2500 3000 f (MHz) Pi = −45 dBm; Tamb = 25 °C. −40 (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Power gain as a function of frequency; typical values Fig 7. 001aak694 1.6 NF (dB) −10 0 Pi (dBm) 0 Power gain as a function of input power; typical values 001aak695 1.6 NF (dB) 1.2 1.2 0.8 0.8 0.4 0.4 0 1.2 1.6 2.0 2.4 0 −50 2.8 3.2 VCC (V) f = 1575 MHz; Tamb = 25 °C; no jammer. Fig 8. −20 Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V Fig 6. −30 Product data sheet 10 40 70 100 Tamb (°C) f = 1575 MHz; VCC = 1.8 V; no jammer. Noise figure as a function of supply current; typical values BGU7005_2 −20 Fig 9. Noise figure as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 7 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak696 4 NF (dB) 001aak697 4 NF (dB) 3 3 2 2 (3) (3) 1 (2) 1 (2) (1) (1) 0 −50 −40 −30 −20 0 −50 −10 0 Pjam (dBm) fjam= 850 MHz; Tamb = 25 °C; f = 1575 MHz. −40 −20 −10 0 Pjam (dBm) fjam= 1850 MHz; Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 10. Noise figure as a function of jamming power; typical values Fig 11. Noise figure as a function of jamming power; typical values 001aak698 0 −30 RLin (dB) 001aak699 0 RLin (dB) −3 −3 −6 −6 (1) (2) (3) (4) −9 −9 (1) −12 −12 (2) (3) −15 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. −15 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Tamb = −40 °C (1) Pi = −45 dBm (2) Tamb = +25 °C (2) Pi = −30 dBm (3) Tamb = +85 °C (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 12. Input return loss as a function of frequency; typical values BGU7005_2 Product data sheet Fig 13. Input return loss as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 8 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak700 0 RLin (dB) 001aak701 0 RLin (dB) −3 −3 −6 −6 −9 −9 (1) (2) (3) (1) −12 −12 (2) (3) −15 500 1000 1500 2000 2500 3000 f (MHz) −15 −50 Pi = −45 dBm; Tamb = 25 °C. −40 (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 14. Input return loss as a function of frequency; typical values 001aak702 (1) RLout (dB) −10 0 Pi (dBm) Fig 15. Input return loss as a function of input power; typical values 001aak703 0 RLout (dB) (2) (3) −4 −20 Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V 0 −30 −4 −8 −8 −12 −12 (4) −16 (3) −16 (2) (1) −20 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. −20 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Tamb = −40 °C (1) Pi = −45 dBm (2) Tamb = +25 °C (2) Pi = −30 dBm (3) Tamb = +85 °C (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 16. Output return loss as a function of frequency; typical values BGU7005_2 Product data sheet Fig 17. Output return loss as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 9 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak704 0 RLout (dB) 001aak705 0 RLout (dB) −4 −4 −8 −8 −12 −12 (1) (2) (3) −16 −16 (1) (2) (3) −20 500 1000 1500 2000 2500 3000 f (MHz) −20 −50 Pi = −45 dBm; Tamb = 25 °C. −40 −30 −20 −10 0 Pi (dBm) Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 18. Output return loss as a function of frequency; typical values Fig 19. Output return loss as a function of input power; typical values 001aak706 0 ISL (dB) 001aak707 0 ISL (dB) −10 −10 (4) (3) (1) (2) (2) (1) (3) −20 −20 −30 −30 −40 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. −40 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Tamb = −40 °C (1) Pi = −45 dBm (2) Tamb = +25 °C (2) Pi = −30 dBm (3) Tamb = +85 °C (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 20. Isolation as a function of frequency; typical values BGU7005_2 Product data sheet Fig 21. Isolation as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 10 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak708 0 ISL (dB) 001aak709 0 ISL (dB) −10 −10 (1) (2) (1) (3) (2) −20 −20 −30 −30 −40 500 1000 1500 2000 2500 3000 f (MHz) (3) −40 −50 Pi = −45 dBm; Tamb = 25 °C. −40 (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 22. Isolation as a function of frequency; typical values 001aak710 −10 0 Pi (dBm) Fig 23. Isolation as a function of input power; typical values Pi(1dB) (dBm) −4 −4 (3) (2) 001aak711 0 Pi(1dB) (dBm) −8 −20 Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V 0 −30 (3) (2) (1) −8 (1) −12 −12 −16 −16 −20 1.2 1.6 2.0 2.4 2.8 3.2 VCC (V) f = 850 MHz. −20 1.2 1.6 2.8 3.2 VCC (V) (1) Tamb = −40 °C (2) Tamb = +25 °C (2) Tamb = +25 °C (3) Tamb = +85 °C (3) Tamb = +85 °C Fig 24. Input power at 1 dB gain compression as a function of supply voltage; typical values Product data sheet 2.4 f = 1850 MHz. (1) Tamb = −40 °C BGU7005_2 2.0 Fig 25. Input power at 1 dB gain compression as a function of supply voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 11 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak716 0 Pi(1dB) (dBm) −4 (3) (2) (1) −8 −12 −16 −20 1.2 1.6 2.0 2.4 2.8 3.2 VCC (V) f = 1575 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 26. Input power at 1 dB gain compression as a function of supply voltage; typical values 001aak717 20 IMD3, PL (dBm) 0 PL of 1713 MHz signal 001aak718 20 IMD3, PL (dBm) 0 (1) PL of 1713 MHz signal (2) (3) −20 −20 (1) (2) −40 −40 (3) IMD3 of 1575 MHz signal −60 −60 IMD3 of 1575 MHz signal −80 (1) −80 (2) (1) −100 (3) −100 (2) (3) −120 −40 −35 −30 −25 −20 −15 Pi (dBm) f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; Tamb = 25 °C. −120 −40 −35 −20 −15 Pi (dBm) f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; VCC = 1.8 V. (2) VCC = 1.8 V (2) Tamb = +25 °C (3) VCC = 2.85 V (3) Tamb = +85 °C Fig 27. Third order intermodulation distortion and output power as function of input power; typical values Product data sheet −25 (1) Tamb = −40 °C (1) VCC = 1.5 V BGU7005_2 −30 Fig 28. Third order intermodulation distortion and output power as function of input power; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 12 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 001aak719 102 001aak720 102 (3) (2) K K (1) (3) (2) 10 10 1 1 10−1 (1) 10−1 0 2000 4000 6000 8000 10000 f (MHz) 0 Tamb = 25 °C; Pi = −45 dBm. 2000 4000 6000 8000 10000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (1) VCC = 1.5 V (2) VCC = 1.8 V (2) Tamb = +25 °C (3) VCC = 2.85 V (3) Tamb = +85 °C Fig 29. Rollett stability factor as a function of frequency; typical values Fig 30. Rollett stability factor as a function of frequency; typical values 8.2 GPS front-end The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit and its characteristics is provided here. Ven Vcc C1 RFin 5 BPF1 L1 3 IC1 4 BPF2 6 RFout 1 2 001aak721 For a list of components see Table 10. Fig 31. Schematics GPS front-end evaluation board BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 13 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS Table 10. List of components For schematics see Figure 31. Component Description Value Supplier Remarks BPF1, BPF2 GPS SAW filter - Murata SAFEA1G57KE0F00 Alternatives from Epcos: • B9444 Alternatives from Murata: • • SAFEA1G57KH0F00 SAFEA1G57KB0F00 Alternatives from Fujitsu: • • C1 decoupling capacitor 1 nF Various IC1 BGU7005 - NXP L1 high quality matching inductor 5.6 nH Murata LQW15A FAR-F6KA-1G5754-L4AA FAR-F6KA-1G5754-L4AJ 8.3 Characteristics GPS front-end Table 11. Characteristics GPS front-end f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; power at LNA input Pi < −40 dBm; Tamb = 25 °C; input and output matched to 50 Ω; unless otherwise specified. Symbol Parameter VCC supply voltage ICC supply current Tamb ambient temperature Conditions RF input AC coupled RLin RLout NF input return loss output return loss noise figure Pi(1dB) IP3i α Max Unit 1.5 - 2.85 V - 4.5 - mA +85 °C −40 +25 power gain Gp Min Typ power at LNA input Pi < −40 dBm [1] - 14.5 - dB power at LNA input Pi = −20 dBm [1] - 15.5 - dB power at LNA input Pi < −40 dBm [1] - 8.5 - dB power at LNA input Pi = −20 dBm [1] - 10.5 - dB power at LNA input Pi < −40 dBm [1] - 14.5 - dB power at LNA input Pi = −20 dBm [1] - 12.5 - dB power at LNA input Pi < −40 dBm [1] - 1.8 - dB power at LNA input Pi = −20 dBm [1] - 1.9 - dB −8.2 dBm f = 806 MHz to 928 MHz [2] 31 dBm f = 1612 MHz to 1909 MHz [2] 40 dBm input third-order intercept point [3] 64 dBm attenuation f = 850 MHz [4] 95 f = 1850 MHz [4] input power at 1 dB gain compression f = 1575 MHz - - dBc 90 - - dBc ton turn-on time [5] - - 2 μs toff turn-off time [5] - - 1 μs [1] Power at GPS front-end input = power at LNA input + attenuation BPF1. [2] Out of band. [3] f1 = 1713 MHz; f2 = 1851 MHz. [4] Relative to f = 1575 MHz. [5] Within 10 % of the final gain. BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 14 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 9. Package outline XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× (2) L L1 e 6 5 e1 4 e1 6× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 1.5 1.4 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 MO-252 Fig 32. Package outline SOT886 (XSON6) BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 15 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 10. Abbreviations Table 12. Abbreviations Acronym Description AC Alternating Current FM Frequency Modulation GPS Global Positioning System HBM Human Body Model LNA Low Noise Amplifier MMIC Monolithic Microwave Integrated Circuit PDA Personal Digital Assistant RF Radio Frequency SAW Surface Acoustic Wave SiGe:C Silicon Germanium Carbon 11. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes BGU7005_2 20100304 Product data sheet - BGU7005_1 Modifications: BGU7005_1 BGU7005_2 Product data sheet • • The status of this document has been changed into “Product data sheet”. Table 7 on page 3: The values for ISL have been changed. 20091028 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 - © NXP B.V. 2010. All rights reserved. 16 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 17 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGU7005_2 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 4 March 2010 © NXP B.V. 2010. All rights reserved. 18 of 19 BGU7005 NXP Semiconductors SiGe:C Low Noise Amplifier MMIC for GPS 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 8.3 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 5 GPS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 13 Characteristics GPS front-end . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 4 March 2010 Document identifier: BGU7005_2