PHILIPS BGU7005_10

BGU7005
SiGe:C Low Noise Amplifier MMIC for GPS
Rev. 02 — 4 March 2010
Product data sheet
1. Product profile
1.1 General description
The BGU7005 is a Low Noise Amplifier (LNA) for GPS receiver applications in a plastic
leadless 6-pin, extremely small SOT886 package. The BGU7005 requires only one
external matching inductor and one external decoupling capacitor.
The BGU7005 adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for low power
consumption and optimal performance when jamming signals from co-existing cellular
transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise
figure of 0.9 dB. During high jamming power levels, resulting for example from a cellular
transmit burst, it temporarily increases its bias current to improve sensitivity.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
„
„
„
„
„
„
„
„
„
„
„
„
„
„
„
Small 6-pin leadless package 1 mm × 1.45 mm × 0.5 mm
Low noise high gain MMIC
Integrated temperature stabilized bias for easy design
Requires only one input matching inductor and one supply decoupling capacitor
Input and output DC decoupled
Noise figure (NF) = 0.9 dB at 1.575 GHz
Integrated matching for the output
Gain 16.5 dB at 1.575 GHz
High 1 dB compression point of −11 dBm
High out of band IP3i of 9 dBm
110 GHz transit frequency - SiGe:C technology
Supply voltage 1.5 V to 2.85 V, optimized for 1.8 V
Power-down mode current consumption < 1 μA
Optimized performance at low 4.5 mA supply current
ESD protection on all pins (HBM > 1 kV)
1.3 Applications
„ LNA for GPS in handsets, PDA’s and Portable Navigation Devices
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
1.4 Quick reference data
Table 1.
Quick reference data
f = 1575 MHz; VCC = 1.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH
inductor; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
1.5
-
2.85 V
Pi < −40 dBm
-
4.5
-
mA
Pi = −20 dBm
-
12
-
mA
Pi < −40 dBm
14
16.5 19
dB
Pi = −20 dBm
15
17.5 20
dB
Pi < −40 dBm
-
0.9
1.3
dB
Pi = −20 dBm
-
1.2
1.6
dB
VCC
supply voltage
RF input AC coupled
ICC
supply current
VENABLE ≥ 0.8 V
power gain
Gp
NF
noise figure
Pi(1dB)
input third-order intercept point
IP3i
[1]
input power at 1 dB gain compression
f = 1.575 GHz
VCC = 1.5 V
−15 −12
-
dBm
VCC = 1.8 V
−14 −11
-
dBm
VCC = 2.85 V
−11 −8
-
dBm
f = 1.575 GHz
VCC = 1.5 V
[1]
5
8
-
dBm
VCC = 1.8 V
[1]
5
9
-
dBm
VCC = 2.85 V
[1]
5
12
-
dBm
f1 = 1713 MHz; f2 = 1851 MHz.
2. Pinning information
Table 2.
Pinning
Pin
Description
1
GND
2
GND
3
RF_IN
4
VCC
5
ENABLE
6
Simplified outline
1
2
Graphic symbol
4
3
5
3
6
2
6
5
bottom view
RF_OUT
4
1
sym129
3. Ordering information
Table 3.
Ordering information
Type number
BGU7005
BGU7005_2
Product data sheet
Package
Name
Description
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 x 1.45 x 0.5 mm
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 4 March 2010
Version
© NXP B.V. 2010. All rights reserved.
2 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
4. Marking
Table 4.
Marking codes
Type number
Marking code
BGU7005
AC
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
RF input AC coupled
−0.2
+3.1
V
Ptot
total power dissipation
Tsp ≤ 130 °C
55
mW
Tstg
storage temperature
−65
150
°C
Tj
junction temperature
-
150
°C
[1]
[1]
Tsp is the temperature at the soldering point of the emitter lead.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
Typ
Unit
225
K/W
7. Characteristics
Table 7.
Characteristics
f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor;
unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
Max
Unit
1.5
-
2.85
V
Pi < −40 dBm
-
4.5
-
mA
Pi = −20 dBm
-
12
-
mA
VENABLE ≤ 0.35 V
-
-
0.001 mA
VCC
supply voltage
RF input AC coupled
ICC
supply current
VENABLE ≥ 0.8 V
Tamb
−40 +25
ambient temperature
BGU7005_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 4 March 2010
+85
°C
© NXP B.V. 2010. All rights reserved.
3 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
Table 7.
Characteristics …continued
f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor;
unless otherwise specified.
Symbol Parameter
Conditions
Gp
Tamb = 25 °C
power gain
Min Typ
Max
Unit
no jammer
14
16.5 19
dB
Pi = −20 dBm; fi = 1575 MHz
15
17.5 20
dB
Pjam = −20 dBm; fjam = 850 MHz
15
17.5 20
dB
Pjam = −20 dBm; fjam = 1850 MHz
15
17.5 20
dB
no jammer
13
-
20
dB
Pi = −20 dBm; fi = 1575 MHz
14
-
21
dB
Pjam = −20 dBm; fjam = 850 MHz
14
-
21
dB
−40 °C ≤ Tamb ≤ +85 °C
Pjam = −20 dBm; fjam = 1850 MHz
RLin
input return loss
RLout
output return loss
ISL
isolation
NF
noise figure
14
-
21
dB
Pi < −40 dBm
5
8
-
dB
Pi = −20 dBm
6
10
-
dB
Pi < −40 dBm
10
20
-
dB
Pi = −20 dBm
10
14
-
dB
20
23
-
dB
-
0.9
1.3
dB
Tamb = 25 °C
no jammer
Pi = −20 dBm; fi = 1575 MHz
-
1.2
1.6
dB
Pjam = −20 dBm; fjam = 850 MHz
-
1.1
1.5
dB
Pjam = −20 dBm; fjam = 1850 MHz
-
1.3
1.7
dB
no jammer
-
-
1.7
dB
Pi = −20 dBm; fi = 1575 MHz
-
-
1.9
dB
Pjam = −20 dBm; fjam = 850 MHz
-
-
1.8
dB
Pjam = −20 dBm; fjam = 1850 MHz
-
-
2.0
dB
−40 °C ≤ Tamb ≤ +85 °C
Pi(1dB)
input power at 1 dB gain compression
f = 1575 MHz
VCC = 1.5 V
−15 −12
-
dBm
VCC = 1.8 V
−14 −11
-
dBm
VCC = 2.85 V
−11 −8
-
dBm
f = 806 MHz to 928 MHz
VCC = 1.5 V
[1]
−15 −12
-
dBm
VCC = 1.8 V
[1]
−14 −11
-
dBm
VCC = 2.85 V
[1]
−14 −11
-
dBm
VCC = 1.5 V
[1]
−13 −10
-
dBm
VCC = 1.8 V
[1]
−12 −9
-
dBm
VCC = 2.85 V
[1]
−10 −7
-
dBm
f = 1612 MHz to 1909 MHz
BGU7005_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
4 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
Table 7.
Characteristics …continued
f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor;
unless otherwise specified.
Symbol Parameter
Conditions
IP3i
f = 1.575 GHz
input third-order intercept point
Min Typ
Max
Unit
VCC = 1.5 V
[2]
5
8
-
dBm
VCC = 1.8 V
[2]
5
9
-
dBm
VCC = 2.85 V
[2]
5
12
-
dBm
turn-on time
[3]
-
-
2
μs
toff
turn-off time
[3]
-
-
1
μs
K
Rollett stability factor
1
-
-
ton
[1]
Out of band.
[2]
f1 = 1713 MHz; f2 = 1851 MHz.
[3]
Within 10 % of the final gain.
Table 8.
ENABLE (pin 5)
−40 °C ≤ Tamb ≤ +85 °C; 1.5 V ≤ VCC ≤ 2.85 V
VENABLE (V)
State
≤ 0.35
OFF
≥ 0.8
ON
8. Application information
8.1 GPS LNA
Ven Vcc
C1
RFin
5
L1
3
IC1
4
RFout
6
1
2
001aak685
For a list of components see Table 9.
Fig 1.
Schematics GPS LNA evaluation board
Table 9.
List of components
For schematics see Figure 1.
BGU7005_2
Product data sheet
Component
Description
Value
Supplier
C1
decoupling capacitor
1 nF
various
IC1
BGU7005
-
NXP
L1
high quality matching inductor
5.6 nH
Murata LQW15A
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 4 March 2010
Remarks
© NXP B.V. 2010. All rights reserved.
5 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak688
6
ICC
(mA)
001aak689
6
ICC
(mA)
(1)
(2)
5
5
(3)
(3)
(2)
(1)
4
4
3
1.0
1.5
2.0
2.5
3
−55
3.0
3.5
VCC (V)
Pi = −45 dBm.
−15
65
105
Tamb (°C)
Pi = −45 dBm.
(1) Tamb = −40 °C
(1) VCC = 1.5 V
(2) Tamb = +25 °C
(2) VCC = 1.8 V
(3) Tamb = +85 °C
(3) VCC = 2.85 V
Fig 2.
25
Supply current as a function of supply voltage;
typical values
Fig 3.
001aak690
20
Gp
(dB)
Supply current as a function of ambient
temperature; typical values
001aak691
20
Gp
(dB)
16
16
12
12
(1)
(4)
(2)
8
(3)
8
(3)
(2)
(1)
4
4
0
500
1000
1500
2000
0
500
2500
3000
f (MHz)
VCC = 1.8 V; Pi = −45 dBm.
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 °C.
(1) Tamb = −40 °C
(1) Pi = −45 dBm
(2) Tamb = +25 °C
(2) Pi = −30 dBm
(3) Tamb = +85 °C
(3) Pi = −20 dBm
(4) Pi = −15 dBm
Fig 4.
Power gain as a function of frequency;
typical values
BGU7005_2
Product data sheet
Fig 5.
Power gain as a function of frequency;
typical values
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
6 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak692
18
001aak693
20
Gp
Gp
(dB)
Gp
(dB)
12
ICC
(mA)
(3)
(2)
(1)
17
(3)
20
15
(3)
(2)
(2)
(1)
(1)
14
10
ICC
6
11
0
500
1000
1500
2000
5
8
−50
2500
3000
f (MHz)
Pi = −45 dBm; Tamb = 25 °C.
−40
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Power gain as a function of frequency;
typical values
Fig 7.
001aak694
1.6
NF
(dB)
−10
0
Pi (dBm)
0
Power gain as a function of input power;
typical values
001aak695
1.6
NF
(dB)
1.2
1.2
0.8
0.8
0.4
0.4
0
1.2
1.6
2.0
2.4
0
−50
2.8
3.2
VCC (V)
f = 1575 MHz; Tamb = 25 °C; no jammer.
Fig 8.
−20
Tamb = 25 °C; f = 1575 MHz.
(1) VCC = 1.5 V
Fig 6.
−30
Product data sheet
10
40
70
100
Tamb (°C)
f = 1575 MHz; VCC = 1.8 V; no jammer.
Noise figure as a function of supply current;
typical values
BGU7005_2
−20
Fig 9.
Noise figure as a function of ambient
temperature; typical values
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
7 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak696
4
NF
(dB)
001aak697
4
NF
(dB)
3
3
2
2
(3)
(3)
1
(2)
1
(2)
(1)
(1)
0
−50
−40
−30
−20
0
−50
−10
0
Pjam (dBm)
fjam= 850 MHz; Tamb = 25 °C; f = 1575 MHz.
−40
−20
−10
0
Pjam (dBm)
fjam= 1850 MHz; Tamb = 25 °C; f = 1575 MHz.
(1) VCC = 1.5 V
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Fig 10. Noise figure as a function of jamming power;
typical values
Fig 11. Noise figure as a function of jamming power;
typical values
001aak698
0
−30
RLin
(dB)
001aak699
0
RLin
(dB)
−3
−3
−6
−6
(1)
(2)
(3)
(4)
−9
−9
(1)
−12
−12
(2)
(3)
−15
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Pi = −45 dBm.
−15
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 °C.
(1) Tamb = −40 °C
(1) Pi = −45 dBm
(2) Tamb = +25 °C
(2) Pi = −30 dBm
(3) Tamb = +85 °C
(3) Pi = −20 dBm
(4) Pi = −15 dBm
Fig 12. Input return loss as a function of frequency;
typical values
BGU7005_2
Product data sheet
Fig 13. Input return loss as a function of frequency;
typical values
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
8 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak700
0
RLin
(dB)
001aak701
0
RLin
(dB)
−3
−3
−6
−6
−9
−9
(1)
(2)
(3)
(1)
−12
−12
(2)
(3)
−15
500
1000
1500
2000
2500
3000
f (MHz)
−15
−50
Pi = −45 dBm; Tamb = 25 °C.
−40
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Fig 14. Input return loss as a function of frequency;
typical values
001aak702
(1)
RLout
(dB)
−10
0
Pi (dBm)
Fig 15. Input return loss as a function of input power;
typical values
001aak703
0
RLout
(dB)
(2)
(3)
−4
−20
Tamb = 25 °C; f = 1575 MHz.
(1) VCC = 1.5 V
0
−30
−4
−8
−8
−12
−12
(4)
−16
(3)
−16
(2)
(1)
−20
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Pi = −45 dBm.
−20
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 °C.
(1) Tamb = −40 °C
(1) Pi = −45 dBm
(2) Tamb = +25 °C
(2) Pi = −30 dBm
(3) Tamb = +85 °C
(3) Pi = −20 dBm
(4) Pi = −15 dBm
Fig 16. Output return loss as a function of frequency;
typical values
BGU7005_2
Product data sheet
Fig 17. Output return loss as a function of frequency;
typical values
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
9 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak704
0
RLout
(dB)
001aak705
0
RLout
(dB)
−4
−4
−8
−8
−12
−12
(1)
(2)
(3)
−16
−16
(1)
(2)
(3)
−20
500
1000
1500
2000
2500
3000
f (MHz)
−20
−50
Pi = −45 dBm; Tamb = 25 °C.
−40
−30
−20
−10
0
Pi (dBm)
Tamb = 25 °C; f = 1575 MHz.
(1) VCC = 1.5 V
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Fig 18. Output return loss as a function of frequency;
typical values
Fig 19. Output return loss as a function of input
power; typical values
001aak706
0
ISL
(dB)
001aak707
0
ISL
(dB)
−10
−10
(4)
(3)
(1)
(2)
(2)
(1)
(3)
−20
−20
−30
−30
−40
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Pi = −45 dBm.
−40
500
1000
1500
2000
2500
3000
f (MHz)
VCC = 1.8 V; Tamb = 25 °C.
(1) Tamb = −40 °C
(1) Pi = −45 dBm
(2) Tamb = +25 °C
(2) Pi = −30 dBm
(3) Tamb = +85 °C
(3) Pi = −20 dBm
(4) Pi = −15 dBm
Fig 20. Isolation as a function of frequency; typical
values
BGU7005_2
Product data sheet
Fig 21. Isolation as a function of frequency; typical
values
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
10 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak708
0
ISL
(dB)
001aak709
0
ISL
(dB)
−10
−10
(1)
(2)
(1)
(3)
(2)
−20
−20
−30
−30
−40
500
1000
1500
2000
2500
3000
f (MHz)
(3)
−40
−50
Pi = −45 dBm; Tamb = 25 °C.
−40
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Fig 22. Isolation as a function of frequency; typical
values
001aak710
−10
0
Pi (dBm)
Fig 23. Isolation as a function of input power;
typical values
Pi(1dB)
(dBm)
−4
−4
(3)
(2)
001aak711
0
Pi(1dB)
(dBm)
−8
−20
Tamb = 25 °C; f = 1575 MHz.
(1) VCC = 1.5 V
0
−30
(3)
(2)
(1)
−8
(1)
−12
−12
−16
−16
−20
1.2
1.6
2.0
2.4
2.8
3.2
VCC (V)
f = 850 MHz.
−20
1.2
1.6
2.8
3.2
VCC (V)
(1) Tamb = −40 °C
(2) Tamb = +25 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
(3) Tamb = +85 °C
Fig 24. Input power at 1 dB gain compression as a
function of supply voltage; typical values
Product data sheet
2.4
f = 1850 MHz.
(1) Tamb = −40 °C
BGU7005_2
2.0
Fig 25. Input power at 1 dB gain compression as a
function of supply voltage; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
11 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak716
0
Pi(1dB)
(dBm)
−4
(3)
(2)
(1)
−8
−12
−16
−20
1.2
1.6
2.0
2.4
2.8
3.2
VCC (V)
f = 1575 MHz.
(1) Tamb = −40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 26. Input power at 1 dB gain compression as a function of supply voltage;
typical values
001aak717
20
IMD3,
PL
(dBm) 0
PL of 1713 MHz signal
001aak718
20
IMD3,
PL
(dBm) 0
(1)
PL of 1713 MHz signal
(2)
(3)
−20
−20
(1)
(2)
−40
−40
(3)
IMD3 of 1575 MHz signal
−60
−60
IMD3 of 1575 MHz signal
−80
(1)
−80
(2)
(1)
−100
(3)
−100
(2)
(3)
−120
−40
−35
−30
−25
−20
−15
Pi (dBm)
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz;
Tamb = 25 °C.
−120
−40
−35
−20
−15
Pi (dBm)
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz;
VCC = 1.8 V.
(2) VCC = 1.8 V
(2) Tamb = +25 °C
(3) VCC = 2.85 V
(3) Tamb = +85 °C
Fig 27. Third order intermodulation distortion and
output power as function of input power;
typical values
Product data sheet
−25
(1) Tamb = −40 °C
(1) VCC = 1.5 V
BGU7005_2
−30
Fig 28. Third order intermodulation distortion and
output power as function of input power;
typical values
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
12 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
001aak719
102
001aak720
102
(3)
(2)
K
K
(1)
(3)
(2)
10
10
1
1
10−1
(1)
10−1
0
2000
4000
6000
8000
10000
f (MHz)
0
Tamb = 25 °C; Pi = −45 dBm.
2000
4000
6000
8000
10000
f (MHz)
VCC = 1.8 V; Pi = −45 dBm.
(1) Tamb = −40 °C
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) Tamb = +25 °C
(3) VCC = 2.85 V
(3) Tamb = +85 °C
Fig 29. Rollett stability factor as a function of
frequency; typical values
Fig 30. Rollett stability factor as a function of
frequency; typical values
8.2 GPS front-end
The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit
and its characteristics is provided here.
Ven Vcc
C1
RFin
5
BPF1
L1
3
IC1
4
BPF2
6
RFout
1
2
001aak721
For a list of components see Table 10.
Fig 31. Schematics GPS front-end evaluation board
BGU7005_2
Product data sheet
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13 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
Table 10. List of components
For schematics see Figure 31.
Component
Description
Value
Supplier
Remarks
BPF1, BPF2
GPS SAW filter
-
Murata SAFEA1G57KE0F00
Alternatives from Epcos:
•
B9444
Alternatives from Murata:
•
•
SAFEA1G57KH0F00
SAFEA1G57KB0F00
Alternatives from Fujitsu:
•
•
C1
decoupling capacitor
1 nF
Various
IC1
BGU7005
-
NXP
L1
high quality matching inductor
5.6 nH Murata LQW15A
FAR-F6KA-1G5754-L4AA
FAR-F6KA-1G5754-L4AJ
8.3 Characteristics GPS front-end
Table 11. Characteristics GPS front-end
f = 1575 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; power at LNA input Pi < −40 dBm; Tamb = 25 °C; input and output matched to
50 Ω; unless otherwise specified.
Symbol Parameter
VCC
supply voltage
ICC
supply current
Tamb
ambient temperature
Conditions
RF input AC coupled
RLin
RLout
NF
input return loss
output return loss
noise figure
Pi(1dB)
IP3i
α
Max
Unit
1.5
-
2.85
V
-
4.5
-
mA
+85
°C
−40 +25
power gain
Gp
Min Typ
power at LNA input Pi < −40 dBm
[1]
-
14.5 -
dB
power at LNA input Pi = −20 dBm
[1]
-
15.5 -
dB
power at LNA input Pi < −40 dBm
[1]
-
8.5
-
dB
power at LNA input Pi = −20 dBm
[1]
-
10.5 -
dB
power at LNA input Pi < −40 dBm
[1]
-
14.5 -
dB
power at LNA input Pi = −20 dBm
[1]
-
12.5 -
dB
power at LNA input Pi < −40 dBm
[1]
-
1.8
-
dB
power at LNA input Pi = −20 dBm
[1]
-
1.9
-
dB
−8.2
dBm
f = 806 MHz to 928 MHz
[2]
31
dBm
f = 1612 MHz to 1909 MHz
[2]
40
dBm
input third-order intercept point
[3]
64
dBm
attenuation
f = 850 MHz
[4]
95
f = 1850 MHz
[4]
input power at 1 dB gain compression
f = 1575 MHz
-
-
dBc
90
-
-
dBc
ton
turn-on time
[5]
-
-
2
μs
toff
turn-off time
[5]
-
-
1
μs
[1]
Power at GPS front-end input = power at LNA input + attenuation BPF1.
[2]
Out of band.
[3]
f1 = 1713 MHz; f2 = 1851 MHz.
[4]
Relative to f = 1575 MHz.
[5]
Within 10 % of the final gain.
BGU7005_2
Product data sheet
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© NXP B.V. 2010. All rights reserved.
14 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
9. Package outline
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L1
e
6
5
e1
4
e1
6×
A
(2)
A1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
max
A1
max
b
D
E
e
e1
L
L1
mm
0.5
0.04
0.25
0.17
1.5
1.4
1.05
0.95
0.6
0.5
0.35
0.27
0.40
0.32
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
SOT886
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-07-15
04-07-22
MO-252
Fig 32. Package outline SOT886 (XSON6)
BGU7005_2
Product data sheet
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
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SiGe:C Low Noise Amplifier MMIC for GPS
10. Abbreviations
Table 12.
Abbreviations
Acronym
Description
AC
Alternating Current
FM
Frequency Modulation
GPS
Global Positioning System
HBM
Human Body Model
LNA
Low Noise Amplifier
MMIC
Monolithic Microwave Integrated Circuit
PDA
Personal Digital Assistant
RF
Radio Frequency
SAW
Surface Acoustic Wave
SiGe:C
Silicon Germanium Carbon
11. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU7005_2
20100304
Product data sheet
-
BGU7005_1
Modifications:
BGU7005_1
BGU7005_2
Product data sheet
•
•
The status of this document has been changed into “Product data sheet”.
Table 7 on page 3: The values for ISL have been changed.
20091028
Preliminary data sheet
-
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Rev. 02 — 4 March 2010
-
© NXP B.V. 2010. All rights reserved.
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SiGe:C Low Noise Amplifier MMIC for GPS
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
BGU7005_2
Product data sheet
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Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
17 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU7005_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 4 March 2010
© NXP B.V. 2010. All rights reserved.
18 of 19
BGU7005
NXP Semiconductors
SiGe:C Low Noise Amplifier MMIC for GPS
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 5
GPS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 13
Characteristics GPS front-end . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 March 2010
Document identifier: BGU7005_2