BGA2801 MMIC wideband amplifier Rev. 1 — 17 August 2010 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits Internally matched to 50 Ω A gain of 22.2 dB at 250 MHz increasing to 23.0 dB at 2150 MHz Output power at 1 dB gain compression = 2 dBm Supply current = 14.3 mA at a supply voltage of 3.3 V Reverse isolation > 29 dB up to 2 GHz Good linearity with low second order and third order products Noise figure = 4 dB at 950 MHz 1.3 Applications LNB IF amplifiers General purpose low noise wideband amplifier for frequencies between DC and 2.2 GHz 2. Pinning information Table 1. Pinning Pin Description 1 VCC 2, 5 GND2 3 RF_OUT 4 GND1 6 RF_IN Simplified outline 6 5 Graphic symbol 1 4 6 1 2 3 3 4 2, 5 sym052 3. Ordering information Table 2. Ordering information Type number BGA2801 Package Name Description Version - plastic surface-mounted package; 6 leads SOT363 BGA2801 NXP Semiconductors MMIC wideband amplifier 4. Marking Table 3. Marking Type number Marking code Description BGA2801 *E8 * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage RF input AC coupled ICC supply current Ptot total power dissipation Tstg Min Max Unit 3.0 3.6 V - 55 mA - 200 mW storage temperature −40 +125 °C Tj junction temperature - 125 °C Pdrive drive power - −16.5 dBm Tsp = 90 °C 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to Ptot = 200 mW; Tsp = 90 °C solder point Conditions Typ Unit 300 K/W 7. Characteristics Table 6. Characteristics VCC = 3.3 V; ZS = ZL = 50 Ω; Pi = −30 dBm; Tamb = 25 °C; measured on demo board; unless otherwise specified. Symbol Parameter VCC supply voltage ICC supply current Gp power gain RLin RLout input return loss output return loss BGA2801 Product data sheet Conditions Min Typ Max Unit 3.0 3.3 3.6 V 12.2 14.3 16.3 mA f = 250 MHz 21.6 22.2 22.8 dB f = 950 MHz 21.7 22.4 23.1 dB f = 2150 MHz 21.5 23.0 24.4 dB f = 250 MHz 15 17 19 dB f = 950 MHz 15 17 19 dB f = 2150 MHz 10 12 19 dB f = 250 MHz 13 17 22 dB f = 950 MHz 14 15 16 dB f = 2150 MHz 10 12 15 dB All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 2 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier Table 6. Characteristics …continued VCC = 3.3 V; ZS = ZL = 50 Ω; Pi = −30 dBm; Tamb = 25 °C; measured on demo board; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ISL f = 250 MHz 58 78 99 dB f = 950 MHz 46 47 49 dB f = 2150 MHz 29 32 34 dB f = 250 MHz 3.4 3.8 4.3 dB f = 950 MHz 3.4 3.8 4.3 dB f = 2150 MHz 3.5 3.9 4.4 dB GHz NF isolation noise figure B−3dB −3 dB bandwidth 3 dB below gain at 1 GHz 2.5 2.8 3.1 K Rollett stability factor f = 250 MHz 252 308 363 f = 950 MHz 7 8 10 f = 2150 MHz 0.7 1.3 1.9 PL(sat) PL(1dB) IP3I IP3O saturated output power f = 250 MHz 4 4 5 dBm f = 950 MHz 2 4 5 dBm f = 2150 MHz 1 2 3 dBm output power at 1 dB gain compression f = 250 MHz 1 2 3 dBm f = 950 MHz 0 2 3 dBm f = 2150 MHz −1 0 1 dBm f1 = 250 MHz; f2 = 251 MHz −10 −8 −6 dBm f1 = 950 MHz; f2 = 951 MHz −11 −8 −6 dBm f1 = 2150 MHz; f2 = 2151 MHz −17 −14 −10 dBm 12 14 16 dBm Pdrive = −34 dBm (for each tone) input third-order intercept point output third-order intercept point Pdrive = −34 dBm (for each tone) f1 = 250 MHz; f2 = 251 MHz PL(2H) ΔIM2 f1 = 950 MHz; f2 = 951 MHz 12 14 16 dBm f1 = 2150 MHz; f2 = 2151 MHz 6 9 13 dBm f1H = 250 MHz; f2H = 500 MHz −62 −60 −58 dBm f1H = 950 MHz; f2H = 1900 MHz −51 −50 −48 dBm f1 = 250 MHz; f2 = 251 MHz 34 45 56 dBc f1 = 950 MHz; f2 = 951 MHz 27 39 50 dBc Pdrive = −31 dBm second harmonic output power second-order intermodulation distance Pdrive = −34 dBm (for each tone) 8. Application information Figure 1 shows a typical application circuit for the BGA2801 MMIC. The device is internally matched to 50 Ω, and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. The 22 nF supply decoupling capacitor C1 should be located as close as possible to the MMIC. BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 3 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes as close as possible to the MMIC. VS C1 C2 RF input VS RF_OUT C3 RF_IN GND1 RF output GND2 001aaf761 Fig 1. Typical application circuit 8.1 Application examples mixer wideband amplifier from RF circuit LNA to IF circuit or demodulator oscillator Application as IF amplifier BGA2801 Product data sheet mixer to IF circuit or demodulator antenna oscillator 001aaf762 001aaf763 As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution. The MMIC is very suitable as IF amplifier in e.g. LNB’s. The excellent wideband characteristics make it an easy building block. Fig 2. wideband amplifier Fig 3. Application as RF amplifier All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 4 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 8.2 Graphs 90° 1.0 +1 135° +0.5 0.8 45° +2 0.6 +0.2 0.4 +5 0.2 180° 0 0.2 1 0.5 2 5 10 (1) 0° 0 (3) (2) −5 −0.2 −135° −2 −0.5 −45° −1 −90° 1.0 001aam281 Tamb = 25 °C; ICC = 14.1 mA; VCC = 3.3 V; Z0 = 50 Ω. (1) f = 250 MHz (2) f = 950 MHz (3) f = 2150 MHz Fig 4. BGA2801 Product data sheet Input reflection coefficient (S11); typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 5 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 90° 1.0 +1 135° +0.5 0.8 45° +2 0.6 +0.2 0.4 +5 (3) 0.2 180° 0 0.2 0.5 (1) 1 2 5 10 (2) 0 −5 −0.2 −135° 0° −2 −0.5 −45° −1 −90° 1.0 001aam282 Tamb = 25 °C; ICC = 14.1 mA; VCC = 3.3 V; Z0 = 50 Ω. (1) f = 250 MHz (2) f = 950 MHz (3) f = 2150 MHz Fig 5. BGA2801 Product data sheet Output reflection coefficient (S22); typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 6 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 001aam283 103 001aam284 0 K RLin (dB) 102 (1) (2) (3) (4) (5) (1) (2) (3) (4) (5) −10 10 −20 1 10−1 0 1 2 3 −30 0 1 2 3 f (GHz) f (GHz) Pdrive = −40 dBm; Z0 = 50 Ω. Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 12.52 mA (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 12.52 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 12.67 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 12.67 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 14.08 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 14.08 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 15.30 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 15.30 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 16.51 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 16.51 mA Fig 6. Rollett stability factor as function of frequency; typical values BGA2801 Product data sheet Fig 7. Input return loss as function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 7 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 001aam285 0 001aam286 30 Gp (dB) RLout (dB) (1) (2) (3) (4) (5) −10 (1) (2) (3) (4) (5) 25 −20 −30 20 0 1 2 3 0 1 f (GHz) 2 3 f (GHz) Pdrive = −40 dBm; Z0 = 50 Ω. Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 12.52 mA (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 12.52 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 12.67 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 12.67 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 14.08 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 14.08 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 15.30 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 15.30 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 16.51 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 16.51 mA Fig 8. Output return loss as function of frequency; typical values BGA2801 Product data sheet Fig 9. Insertion power gain as function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 8 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 001aam287 0 (5) (4) (3) (2) (1) ISL (dB) −20 001aam288 6 NF (dB) −40 5 (1) (4) 4 (3) (2) (5) −60 3 −80 2 1 2 3 0 1 2 f (GHz) 3 f (GHz) Pdrive = −40 dBm; Z0 = 50 Ω. Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 12.52 mA (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 12.52 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 12.67 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 12.67 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 14.08 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 14.08 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 15.30 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 15.30 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 16.51 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 16.51 mA Fig 10. Isolation as function of frequency; typical values Fig 11. Noise figure as function of frequency; typical values 8.3 Tables Table 7. Supply current over temperature and supply voltages Typical values. Symbol ICC Parameter supply current Conditions Tamb (°C) Unit −40 25 85 VCC = 3.0 V 12.67 12.24 12.52 mA VCC = 3.3 V 14.85 14.08 14.27 mA VCC = 3.6 V 16.51 15.65 15.30 mA Table 8. Second harmonic output power over temperature and supply voltages Typical values. Symbol Parameter Conditions Tamb (°C) −40 25 PL(2H) Unit 85 second harmonic output power f = 250 MHz; Pdrive = −33 dBm VCC = 3.0 V −53 −58 −59 dBm VCC = 3.3 V −56 −60 −59 dBm VCC = 3.6 V −58 −60 −59 dBm f = 950 MHz; Pdrive = −33 dBm BGA2801 Product data sheet VCC = 3.0 V −46 −50 −54 dBm VCC = 3.3 V −47 −50 −53 dBm VCC = 3.6 V −47 −49 −52 dBm All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 9 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier Table 9. Input power at 1 dB gain compression over temperature and supply voltages Typical values. Symbol Parameter Conditions Pi(1dB) f = 250 MHz input power at 1 dB gain compression Tamb (°C) Unit −40 25 85 VCC = 3.0 V −20 −20 −20 dBm VCC = 3.3 V −20 −19 −19 dBm VCC = 3.6 V −19 −19 −19 dBm VCC = 3.0 V −20 −20 −20 dBm VCC = 3.3 V −20 −20 −20 dBm VCC = 3.6 V −19 −19 −19 dBm VCC = 3.0 V −22 −22 −22 dBm VCC = 3.3 V −21 −21 −22 dBm VCC = 3.6 V −21 −21 −22 dBm f = 950 MHz f = 2150 MHz Table 10. Output power at 1 dB gain compression over temperature and supply voltages Typical values. Symbol Parameter Conditions PL(1dB) output power at 1 dB gain compression f = 250 MHz Tamb (°C) Unit −40 25 85 VCC = 3.0 V 1 1 0 dBm VCC = 3.3 V 2 2 1 dBm VCC = 3.6 V 3 3 2 dBm VCC = 3.0 V 1 0 0 dBm VCC = 3.3 V 2 2 1 dBm VCC = 3.6 V 3 3 2 dBm VCC = 3.0 V 0 −1 −2 dBm VCC = 3.3 V 1 0 −1 dBm VCC = 3.6 V 2 1 0 dBm f = 950 MHz f = 2150 MHz BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 10 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier Table 11. Saturated output power over temperature and supply voltages Typical values. Symbol Parameter Conditions PL(sat) saturated output power f = 250 MHz Tamb (°C) Unit −40 25 85 VCC = 3.0 V 3 3 3 dBm VCC = 3.3 V 4 4 4 dBm VCC = 3.6 V 5 5 5 dBm VCC = 3.0 V 3 3 2 dBm VCC = 3.3 V 4 4 3 dBm VCC = 3.6 V 5 5 4 dBm VCC = 3.0 V 2 1 0 dBm VCC = 3.3 V 3 2 1 dBm VCC = 3.6 V 4 3 1 dBm f = 950 MHz f = 2150 MHz Table 12. Second-order intermodulation distance over temperature and supply voltages Typical values. Symbol Parameter Conditions ΔIM2 second-order intermodulation distance f1 = 250 MHz; f2 = 251 MHz; Pdrive = −36 dBm Tamb (°C) Unit −40 25 85 VCC = 3.0 V 48 48 42 dBc VCC = 3.3 V 52 45 41 dBc VCC = 3.6 V 49 44 41 dBc VCC = 3.0 V 38 38 36 dBc VCC = 3.3 V 40 39 37 dBc VCC = 3.6 V 41 39 37 dBc f1 = 950 MHz; f2 = 951 MHz; Pdrive = −36 dBm BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 11 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier Table 13. Output third-order intercept point over temperature and supply voltages Typical values. Symbol Parameter Conditions IP3O output third-order intercept point f1 = 250 MHz; f2 = 251 MHz; Pdrive = −36 dBm Tamb (°C) Unit −40 25 85 VCC = 3.0 V 13 13 12 dBm VCC = 3.3 V 15 14 14 dBm VCC = 3.6 V 16 15 14 dBm VCC = 3.0 V 13 12 12 dBm VCC = 3.3 V 15 14 13 dBm VCC = 3.6 V 16 15 14 dBm f1 = 950 MHz; f2 = 951 MHz; Pdrive = −36 dBm f1 = 2150 MHz; f2 = 2151 MHz; Pdrive = −36 dBm VCC = 3.0 V 9 8 7 dBm VCC = 3.3 V 11 9 8 dBm VCC = 3.6 V 12 10 8 dBm Table 14. −3 dB bandwidth over temperature and supply voltages Typical values. Symbol B−3dB BGA2801 Product data sheet Parameter Conditions −3 dB bandwidth Tamb (°C) Unit −40 25 85 VCC = 3.0 V 2.875 2.832 2.745 GHz VCC = 3.3 V 2.902 2.849 2.763 GHz VCC = 3.6 V 2.920 2.866 2.775 GHz All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 12 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 9. Test information 30 mm IC1 30 mm C2 C1 C3 001aal226 True size = 30 mm × 30 mm. Fig 12. PCB layout and demo board with components Table 15. BGA2801 Product data sheet List of components used for the typical application Component Description Value Dimensions C1, C2 multilayer ceramic chip capacitor 100 pF 0603 C3 multilayer ceramic chip capacitor 22 nF 0603 IC1 BGA2801 MMIC All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 SOT363 © NXP B.V. 2010. All rights reserved. 13 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 10. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT363 JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 13. Package outline SOT363 BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 14 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 11. Abbreviations Table 16. Abbreviations Acronym Description DC Direct Current IF Intermediate Frequency LNA Low-Noise Amplifier LNB Low-Noise Block converter PCB Printed-Circuit Board RF Radio Frequency SMD Surface Mounted Device 12. Revision history Table 17. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA2801 v.1 20100817 Product data sheet - - BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 15 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 16 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGA2801 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 17 August 2010 © NXP B.V. 2010. All rights reserved. 17 of 18 BGA2801 NXP Semiconductors MMIC wideband amplifier 15. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 8.1 8.2 8.3 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Application information. . . . . . . . . . . . . . . . . . . 3 Application examples . . . . . . . . . . . . . . . . . . . . 4 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 August 2010 Document identifier: BGA2801