CYPRESS CY8C29X66

PSoC™ Mixed-Signal Array
Final Data Sheet
CY8C21123,
CY8C21223, and CY8C21323
Features
■ Flexible On-Chip Memory
■ Powerful Harvard Architecture Processor
❐ 4K Flash Program Storage 50,000 Erase/Write
Cycles
❐ M8C Processor Speeds to 24 MHz
❐ Low Power at High Speed
❐ 256 Bytes SRAM Data Storage
❐ In-System Serial Programming (ISSP™)
❐ 2.4V to 5.25V Operating Voltage
❐ Operating Voltages Down to 1.0V Using
On-Chip Switch Mode Pump (SMP)
❐ Industrial Temperature Range: -40°C to +85°C
Port 1
❐ Pull Up, Pull Down, High Z, Strong, or Open
Drain Drive Modes on All GPIO
■ Complete Development Tools
❐ Free Development Software
(PSoC™ Designer)
❐ Full-Featured, In-Circuit Emulator and
Programmer
❐ Full Speed Emulation
❐ Complex Breakpoint Structure
❐ 128 Bytes Trace Memory
Flash
CPU Core
(M8C)
Interrupt
Controller
Sleep and
Watchdog
Clock Sources
(Includes IMO and ILO)
DIGITAL SYSTEM
Digital
PSoC Block
Array
■ Additional System Resources
❐ I2C™ Master, Slave and Multi-Master to
400 kHz
❐ Watchdog and Sleep Timers
❐ User-Configurable Low Voltage Detection
❐ Integrated Supervisory Circuit
PSoC™ Functional Overview
Port 0
Global Analog Interconnect
SROM
❐ Up to 8 Analog Inputs on GPIO
❐ Configurable Interrupt on All GPIO
❐ On-Chip Precision Voltage Reference
SystemBus
SRAM
■ Programmable Pin Configurations
❐ 25 mA Drive on All GPIO
PSoC
CORE
Global Digital Interconnect
❐ Internal Oscillator for Watchdog and Sleep
❐ Flexible Protection Modes
■ Advanced Peripherals (PSoC Blocks)
- 2 Comparators with DAC Refs
- Single or Dual 8-Bit 8:1 ADC
❐ 4 Digital PSoC Blocks Provide:
- 8- to 32-Bit Timers, Counters, and PWMs
- CRC and PRS Modules
- Full-Duplex UART, SPI™ Master or Slave
- Connectable to All GPIO Pins
❐ Complex Peripherals by Combining Blocks
❐ Internal ±2.5% 24/48 MHz Oscillator
❐ Partial Flash Updates
❐ EEPROM Emulation in Flash
❐ 4 Analog Type “E” PSoC Blocks Provide:
■ Precision, Programmable Clocking
ANALOG SYSTEM
Analog
PSoC Block
Array
Analog
Ref.
The PSoC™ family consists of many Mixed-Signal Array with
On-Chip Controller devices. These devices are designed to
replace multiple traditional MCU-based system components
with one, low cost single-chip programmable component. A
PSoC device includes configurable blocks of analog and digital
logic, as well as programmable interconnect. This architecture
allows the user to create customized peripheral configurations,
to match the requirements of each individual application. Additionally, a fast CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient
pinouts.
The PSoC architecture, as illustrated on the left, is comprised of
four main areas: the Core, the System Resources, the Digital
System, and the Analog System. Configurable global bus
resources allow all the device resources to be combined into a
complete custom system. Each PSoC device includes four digital blocks. Depending on the PSoC package, up to two analog
comparators and up to 16 general purpose IO (GPIO) are also
included. The GPIO provide access to the global digital and
analog interconnects.
The PSoC Core
Digital
Clocks
POR and LVD
I2C
System Resets
Sw itch
Mode
Pump
SYSTEM RESOURCES
February 25, 2005
Internal
Voltage
Ref.
The PSoC Core is a powerful engine that supports a rich
instruction set. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers, and IMO (internal main oscillator) and ILO (internal low speed oscillator). The
© Cypress Semiconductor Corp. 2004-2005 — Document No. 38-12022 Rev. *G
1
CY8C21x23 Final Data Sheet
PSoC™ Overview
CPU core, called the M8C, is a powerful processor with speeds
up to 24 MHz. The M8C is a four MIPS 8-bit Harvard architecture microprocessor.
Port 1
Port 0
System Resources provide additional capability, such as digital
clocks to increase the flexibility of the PSoC mixed-signal
arrays, I2C functionality for implementing an I2C master, slave,
MultiMaster, an internal voltage reference that provides an
absolute value of 1.3V to a number of PSoC subsystems, a
switch mode pump (SMP) that generates normal operating voltages off a single battery cell, and various system resets supported by the M8C.
To System Bus
DigitalClocks
FromCore
To Analog
System
DIGITAL SYSTEM
The Digital System is composed of an array of digital PSoC
blocks, which can be configured into any number of digital
peripherals. The digital blocks can be connected to the GPIO
through a series of global busses that can route any signal to
any pin. Freeing designs from the constraints of a fixed peripheral controller.
Row 0
DBB00
DBB01
DCB02
4
DCB03
4
8
Row Output
Configuration
Row Input
Configuration
Digital PSoC Block Array
8
8
The Analog System is composed of four analog PSoC blocks,
supporting comparators and analog-to-digital conversion up to
8 bits in precision.
8
GIE[7:0]
Global Digital
Interconnect
GIO[7:0]
The Digital System
GOE[7:0]
GOO[7:0]
Digital System Block Diagram
The Digital System is composed of 4 digital PSoC blocks. Each
block is an 8-bit resource that can be used alone or combined
with other blocks to form 8, 16, 24, and 32-bit peripherals, which
are called user module references. Digital peripheral configurations include those listed below.
The Analog System
■
PWMs (8 to 32 bit)
■
PWMs with Dead band (8 to 32 bit)
■
Counters (8 to 32 bit)
The Analog System is composed of 4 configurable blocks to
allow creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific
application requirements. Some of the more common PSoC
analog functions (most available as user modules) are listed
below.
■
Timers (8 to 32 bit)
■
■
UART 8 bit with selectable parity (up to 4)
Analog-to-digital converters (single or dual, with 8-bit resolution)
■
SPI master and slave
■
Pin-to-pin comparators (1)
■
I2C slave, master, multi-master (1 available as a System
Resource)
■
Single-ended comparators (up to 2) with absolute (1.3V) reference or 8-bit DAC reference
■
Cyclical Redundancy Checker/Generator (8 to 32 bit)
■
1.3V reference (as a System Resource)
■
IrDA (up to 4)
■
Pseudo Random Sequence Generators (8 to 32 bit)
In most PSoC devices, analog blocks are provided in columns
of three, which includes one CT (Continuous Time) and two SC
(Switched Capacitor) blocks. The CY8C21x23 devices provide
limited functionality Type “E” analog blocks. Each column contains one CT block and one SC block.
The digital blocks can be connected to any GPIO through a
series of global busses that can route any signal to any pin. The
busses also allow for signal multiplexing and for performing
logic operations. This configurability frees your designs from the
constraints of a fixed peripheral controller.
The number of blocks is on the device family which is detailed
in the table titled “PSoC Device Characteristics” on page 3.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family
resources are shown in the table titled “PSoC Device Characteristics” on page 3.
February 25, 2005
Document No. 38-12022 Rev. *G
2
CY8C21x23 Final Data Sheet
PSoC™ Overview
PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and
analog systems can have 16, 8, or 4 digital blocks and 12, 6, or
4 analog blocks. The following table lists the resources
available for specific PSoC device groups. The PSoC device
covered by this data sheet is highlighted below.
Array Input
Configuration
PSoC Device Characteristics
PSoC Device
Group
Digital Rows
Digital Blocks
Analog Inputs
Analog Outputs
Analog Columns
Analog Blocks
Amount of SRAM
Amount of Flash
ACI1[1:0]
Digital IO (Max)
ACI0[1:0]
CY8C29x66
64
4
16
12
4
4
12
2K
32K
CY8C27x43
44
2
8
12
4
4
12
256 Bytes
16K
CY8C24794
56
1
4
48
2
2
6
1K
16K
CY8C24x23A
24
1
4
12
2
2
6
256 Bytes
4K
CY8C24x23
24
1
4
12
2
2
6
256 Bytes
4K
CY8C21x34
28
1
4
28
0
2
4a
512 Bytes
8K
2
4a
256 Bytes
4K
ACOL1MUX
Array
ACE00
ACE01
ASE10
ASE11
CY8C21x23
Analog System Block Diagram, CY8C21x23
16
1
4
8
0
a. Limited analog functionality.
Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems. Additional resources include a switch mode pump, low voltage
detection, and power on reset. Brief statements describing the
merits of each system resource are presented below.
■
Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to
both the digital and analog systems. Additional clocks can be
generated using digital PSoC blocks as clock dividers.
■
The I2C module provides 100 and 400 kHz communication
over two wires. Slave, master, and multi-master modes are
all supported.
■
Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR
(Power On Reset) circuit eliminates the need for a system
supervisor.
■
An internal 1.3 voltage reference provides an absolute reference for the analog system, including ADCs and DACs.
■
An integrated switch mode pump (SMP) generates normal
operating voltages from a single 1.2V battery cell, providing a
low cost boost converter.
February 25, 2005
Document No. 38-12022 Rev. *G
3
CY8C21x23 Final Data Sheet
PSoC™ Overview
Getting Started
Development Tools
The quickest path to understanding the PSoC silicon is by reading this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin,
register, and electrical specifications. For in-depth information,
along with detailed programming information, reference the
PSoC Mixed-Signal Array Technical Reference Manual, which
can be found on http://www.cypress.com/psoc.
PSoC Designer is a Microsoft® Windows-based, integrated
development environment for the Programmable System-onChip (PSoC) devices. The PSoC Designer IDE and application
runs on Windows NT 4.0, Windows 2000, Windows Millennium
(Me), or Windows XP. (Reference the PSoC Designer Functional Flow diagram below.)
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
contains development kits, C compilers, and all accessories for
PSoC development. Go to the Cypress Online Store web site at
http://www.cypress.com, click the Online Store shopping cart
icon at the bottom of the web page, and click PSoC (Programmable System-on-Chip) to view a current list of available items.
PSoC Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
Importable
Design
Database
Device
Database
PSoC TM
Designer
Core
Engine
Application
Database
Consultants
Certified PSoC Consultants offer everything from technical
assistance to completed PSoC designs. To contact or become a
PSoC Consultant go to http://www.cypress.com, click on Design
Support located on the left side of the web page, and select
CYPros Consultants.
Results
Technical Training
Free PSoC technical training is available for beginners and is
taught by a marketing or application engineer over the phone.
PSoC training classes cover designing, debugging, advanced
analog, as well as application-specific classes covering topics
such as PSoC and the LIN bus. Go to http://www.cypress.com,
click on Design Support located on the left side of the web
page, and select Technical Training for more details.
Context
Sensitive
Help
Graphical Designer
Interface
PSoC TM
Designer
Commands
For up-to-date Ordering, Packaging, and Electrical Specification
information, reference the latest PSoC device data sheets on
the web at http://www.cypress.com.
PSoC Designer helps the customer to select an operating configuration for the PSoC, write application code that uses the
PSoC, and debug the application. This system provides design
database management by project, an integrated debugger with
In-Circuit Emulator, in-system programming support, and the
CYASM macro assembler for the CPUs.
Project
Database
PSoC
Configuration
Sheet
Manufacturing
Information
File
User
Modules
Library
Technical Support
PSoC application engineers take pride in fast and accurate
response. They can be reached with a 4-hour guaranteed
response at http://www.cypress.com/support/login.cfm.
Emulation
Pod
In-Circuit
Emulator
Device
Programmer
PSoC Designer Subsystems
Application Notes
A long list of application notes will assist you in every aspect of
your design effort. To view the PSoC application notes, go to
the http://www.cypress.com web site and select Application
Notes under the Design Resources list located in the center of
the web page. Application notes are sorted by date by default.
February 25, 2005
Document No. 38-12022 Rev. *G
4
CY8C21x23 Final Data Sheet
PSoC™ Overview
PSoC Designer Software Subsystems
Device Editor
The device editor subsystem allows the user to select different
onboard analog and digital components called user modules
using the PSoC blocks. Examples of user modules are ADCs,
DACs, Amplifiers, and Filters.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time.
PSoC Designer sets up power-on initialization tables for
selected PSoC block configurations and creates source code
for an application framework. The framework contains software
to operate the selected components and, if the project uses
more than one operating configuration, contains routines to
switch between different sets of PSoC block configurations at
run time. PSoC Designer can print out a configuration sheet for
a given project configuration for use during application programming in conjunction with the Device Data Sheet. Once the
framework is generated, the user can add application-specific
code to flesh out the framework. It’s also possible to change the
selected components and regenerate the framework.
Design Browser
The Design Browser allows users to select and import preconfigured designs into the user’s project. Users can easily browse
a catalog of preconfigured designs to facilitate time-to-design.
Examples provided in the tools include a 300-baud modem, LIN
Bus master and slave, fan controller, and magnetic card reader.
Application Editor
Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read the
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability
to program single devices.
The emulator consists of a base unit that connects to the PC by
way of the parallel or USB port. The base unit is universal and
will operate with all PSoC devices. Emulation pods for each
device family are available separately. The emulation pod takes
the place of the PSoC device in the target board and performs
full speed (24 MHz) operation
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble, compile, link, and build.
Assembler. The macro assembler allows the assembly code
to be merged seamlessly with C code. The link libraries automatically use absolute addressing or can be compiled in relative
mode, and linked with other software modules to get absolute
addressing.
C Language Compiler. A C language compiler is available
that supports PSoC family devices. Even if you have never
worked in the C language before, the product quickly allows you
to create complete C programs for the PSoC family devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the PSoC architecture. It comes complete with
embedded libraries providing port and bus operations, standard
keypad and display support, and extended math functionality.
February 25, 2005
Document No. 38-12022 Rev. *G
5
CY8C21x23 Final Data Sheet
PSoC™ Overview
Designing with User Modules
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and digital hardware blocks give the PSoC architecture
a unique flexibility that pays dividends in managing specification
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
Each block has several registers that determine its function and
connectivity to other blocks, multiplexers, busses and to the IO
pins. Iterative development cycles permit you to adapt the hardware as well as the software. This substantially lowers the risk
of having to select a different part to meet the final design
requirements.
Device Editor
User
Module
Selection
The API functions are documented in user module data sheets
that are viewed directly in the PSoC Designer IDE. These data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user module parameter and documents the setting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor, a graphical user interface (GUI)
for configuring the hardware. You pick the user modules you
need for your project and map them onto the PSoC blocks with
point-and-click simplicity. Next, you build signal chains by interconnecting user modules to each other and the IO pins. At this
stage, you also configure the clock source connections and
enter parameter values directly or by selecting values from
drop-down menus. When you are ready to test the hardware
configuration or move on to developing code for the project, you
perform the “Generate Application” step. This causes PSoC
Designer to generate source code that automatically configures
the device to your specification and provides the high-level user
module API functions.
February 25, 2005
Source
Code
Generator
Generate
Application
Application Editor
To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a library of
pre-built, pre-tested hardware peripheral functions, called “User
Modules.” User modules make selecting and implementing
peripheral devices simple, and come in analog, digital, and
mixed signal varieties. The standard User Module library contains over 50 common peripherals such as ADCs, DACs Timers, Counters, UARTs, and other not-so common peripherals
such as DTMF Generators and Bi-Quad analog filter sections.
Each user module establishes the basic register settings that
implement the selected function. It also provides parameters
that allow you to tailor its precise configuration to your particular
application. For example, a Pulse Width Modulator User Module configures one or more digital PSoC blocks, one for each 8
bits of resolution. The user module parameters permit you to
establish the pulse width and duty cycle. User modules also
provide tested software to cut your development time. The user
module application programming interface (API) provides highlevel functions to control and respond to hardware events at run
time. The API also provides optional interrupt service routines
that you can adapt as needed.
Placement
and
Parameter
-ization
Project
Manager
Source
Code
Editor
Build
Manager
Build
All
Debugger
Interface
to ICE
Storage
Inspector
Event &
Breakpoint
Manager
User Module and Source Code Development Flows
The next step is to write your main program, and any sub-routines using PSoC Designer’s Application Editor subsystem.
The Application Editor includes a Project Manager that allows
you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor
provides syntax coloring and advanced edit features for both C
and assembly language. File search capabilities include simple
string searches and recursive “grep-style” patterns. A single
mouse click invokes the Build Manager. It employs a professional-strength “makefile” system to automatically analyze all
file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in
a console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a HEX file image suitable for programming.
The last step in the development process takes place inside the
PSoC Designer’s Debugger subsystem. The Debugger downloads the HEX image to the In-Circuit Emulator (ICE) where it
runs at full speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint events that include monitoring address and data bus
values, memory locations and external signals.
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
PSoC™ Overview
Document Conventions
Table of Contents
Acronyms Used
The following table lists the acronyms that are used in this document.
Acronym
For an in depth discussion and more information on your PSoC
device, obtain the PSoC Mixed-Signal Array Technical Reference Manual on http://www.cypress.com. This data sheet
encompasses and is organized into the following chapters and
sections.
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
EEPROM
electrically erasable programmable read-only memory
FSR
full scale range
GPIO
general purpose IO
IO
input/output
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
POR
power on reset
PPOR
precision power on reset
PSoC™
Programmable System-on-Chip
PWM
pulse width modulator
ROM
read only memory
SC
switched capacitor
SMP
switch mode pump
SRAM
static random access memory
Units of Measure
1.
Pin Information ............................................................. 8
1.1 Pinouts ................................................................... 8
1.1.1 8-Pin Part Pinout ...................................... 8
1.1.2 16-Pin Part Pinout ..................................... 8
1.1.3 20-Pin Part Pinout .................................... 9
1.1.4 24-Pin Part Pinout ................................. 10
2.
Register Reference ..................................................... 11
2.1 Register Conventions ........................................... 11
2.2 Register Mapping Tables ..................................... 11
3.
Electrical Specifications ............................................ 14
3.1 Absolute Maximum Ratings ................................ 15
3.2 Operating Temperature ....................................... 15
3.3 DC Electrical Characteristics ................................ 15
3.3.1 DC Chip-Level Specifications ................... 15
3.3.2 DC General Purpose IO Specifications .... 16
3.3.3 DC Amplifier Specifications ..................... 17
3.3.4 DC Switch Mode Pump Specifications ..... 18
3.3.5 DC POR and LVD Specifications ............. 19
3.3.6 DC Programming Specifications ............... 20
3.4 AC Electrical Characteristics ................................ 21
3.4.1 AC Chip-Level Specifications ................... 21
3.4.2 AC General Purpose IO Specifications .... 23
3.4.3 AC Amplifier Specifications ...................... 24
3.4.4 AC Digital Block Specifications ................. 24
3.4.5 AC External Clock Specifications ............. 26
3.4.6 AC Programming Specifications ............... 27
3.4.7 AC I2C Specifications ............................... 27
4.
Packaging Information ............................................... 29
4.1 Packaging Dimensions ......................................... 29
4.2 Thermal Impedances .......................................... 31
4.3 Solder Reflow Peak Temperature ........................ 31
5.
Ordering Information .................................................. 32
5.1 Ordering Code Definitions ................................... 32
6.
Sales and Service Information .................................. 33
6.1 Revision History .................................................. 33
6.2 Copyrights and Flash Code Protection ................ 33
A units of measure table is located in the Electrical Specifications section. Table 3-1 on page 14 lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
February 25, 2005
Document No. 38-12022 Rev. *G
7
1. Pin Information
This chapter describes, lists, and illustrates the CY8C21x23 PSoC device pins and pinout configurations.
1.1
Pinouts
The CY8C21x23 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port
pin (labeled with a “P”) is capable of Digital IO. However, Vss, Vdd, SMP, and XRES are not capable of Digital IO.
1.1.1
8-Pin Part Pinout
Table 1-1. 8-Pin Part Pinout (SOIC)
Pin
No.
Type
Pin
Name
Description
Digital
Analog
1
IO
I
P0[5]
Analog column mux input.
2
IO
I
P0[3]
Analog column mux input.
3
IO
P1[1]
I2C Serial Clock (SCL), ISSP-SCLK.
Vss
Ground connection.
P1[0]
I2C Serial Data (SDA), ISSP-SDATA.
4
Power
5
IO
6
IO
I
P0[2]
Analog column mux input.
7
IO
I
P0[4]
Analog column mux input.
Vdd
Supply voltage.
8
Power
CY8C21123 8-Pin PSoC Device
A, I, P0[5]
A, I, P0[3]
I2C SCL, P1[1]
Vss
1
8
7
2
SOIC6
3
5
4
Vdd
P0[4], A, I
P0[2], A, I
P1[0], I2CSDA
LEGEND: A = Analog, I = Input, and O = Output.
1.1.2
16-Pin Part Pinout
Table 1-2. 16-Pin Part Pinout (SOIC)
Type
Pin
No.
Digital
Analog
1
IO
I
P0[7]
Analog column mux input.
2
IO
I
P0[5]
Analog column mux input.
3
IO
I
P0[3]
Analog column mux input.
4
IO
I
P0[1]
Analog column mux input.
Power
SMP
Switch Mode Pump (SMP) connection to
required external components.
Power
Vss
Ground connection.
P1[1]
I2C Serial Clock (SCL), ISSP-SCLK.
5
6
7
IO
8
Description
Vss
Ground connection.
9
IO
P1[0]
I2C Serial Data (SDA), ISSP-SDATA.
10
IO
P1[2]
11
IO
P1[4]
Optional External Clock Input (EXTCLK).
12
IO
I
P0[0]
Analog column mux input.
13
IO
I
P0[2]
Analog column mux input.
14
IO
I
P0[4]
Analog column mux input.
15
IO
I
P0[6]
Analog column mux input.
Vdd
Supply voltage.
16
Power
Name
Power
CY8C21223 16-Pin PSoC Device
A, I, P0[7]
A, I, P0[5]
A, I, P0[3]
A, I, P0[1]
SMP
Vss
I2CSCL, P1[1]
Vss
1
2
3
4
5
6
7
8
SOIC
16
15
14
13
12
11
10
9
Vdd
P0[6], A, I
P0[4], A, I
P0[2], A, I
P0[0], A, I
P1[4],EXTCLK
P1[2]
P1[0], I2CSDA
LEGEND A = Analog, I = Input, and O = Output.
February 25, 2005
Document No. 38-12022 Rev. *G
8
CY8C21x23 Final Data Sheet
1.1.3
1. Pin Information
20-Pin Part Pinout
Table 1-3. 20-Pin Part Pinout (SSOP)
Type
Pin
No.
Digital
Analog
1
IO
I
P0[7]
Analog column mux input.
2
IO
I
P0[5]
Analog column mux input.
3
IO
I
P0[3]
Analog column mux input.
4
IO
I
P0[1]
Analog column mux input.
Vss
Ground connection.
5
Power
Name
Description
6
IO
P1[7]
I2C Serial Clock (SCL).
7
IO
P1[5]
I2C Serial Data (SDA).
8
IO
P1[3]
9
IO
10
Power
P1[1]
I2C Serial Clock (SCL), ISSP-SCLK.
Vss
Ground connection.
I2C Serial Data (SDA), ISSP-SDATA.
11
IO
P1[0]
12
IO
P1[2]
13
IO
P1[4]
14
IO
15
A, I, P0[7]
A, I, P0[5]
A, I, P0[3]
A, I, P0[1]
Vss
I2C SCL, P1[7]
I2C SDA, P1[5]
P1[3]
I2C SCL, P1[1]
Vss
1
2
3
4
5
6
7
8
9
10
SSOP
20
19
18
17
16
15
14
13
12
11
Vdd
P0[6], A, I
P0[4], A, I
P0[2], A, I
P0[0], A, I
XRES
P1[6]
P1[4],EXTCLK
P1[2]
P1[0],I2C SDA
Optional External Clock Input (EXTCLK).
P1[6]
Input
XRES
Active high external reset with internal
pull down.
16
IO
I
P0[0]
Analog column mux input.
17
IO
I
P0[2]
Analog column mux input.
18
IO
I
P0[4]
Analog column mux input.
19
IO
I
P0[6]
Analog column mux input.
Vdd
Supply voltage.
20
CY8C21323 20-Pin PSoC Device
Power
LEGEND A = Analog, I = Input, and O = Output.
February 25, 2005
Document No. 38-12022 Rev. *G
9
CY8C21x23 Final Data Sheet
1.1.4
1. Pin Information
24-Pin Part Pinout
Table 1-4. 24-Pin Part Pinout (MLF*)
I
Analog column mux input.
SMP
Switch Mode Pump (SMP) connection to
required external components.
Power
Vss
Ground connection.
4
IO
P1[7]
I2C Serial Clock (SCL).
5
IO
P1[5]
I2C Serial Data (SDA).
6
IO
P1[3]
7
IO
P1[1]
I2C Serial Clock (SCL), ISSP-SCLK.
NC
No connection.
8
9
Power
24
23
22
21
20
19
3
P0[1]
Power
Vss
Ground connection.
10
IO
P1[0]
I2C Serial Data (SDA), ISSP-SDATA.
11
IO
P1[2]
12
IO
P1[4]
13
IO
14
A, I, P0[1]
SMP
Vss
I2C SCL, P1[7]
I2C SDA, P1[5]
P1[3]
Optional External Clock Input (EXTCLK).
P1[6]
Input
XRES
15
Active high external reset with internal
pull down.
NC
No connection.
16
IO
I
P0[0]
Analog column mux input.
17
IO
I
P0[2]
Analog column mux input.
18
IO
I
P0[4]
Analog column mux input.
19
IO
I
P0[6]
Analog column mux input.
20
Power
Vdd
Supply voltage.
21
Power
Vss
Ground connection.
Vdd
P0[6], A, I
IO
2
CY8C21323 24-Pin PSoC Device
Description
22
IO
I
P0[7]
Analog column mux input.
23
IO
I
P0[5]
Analog column mux input.
24
IO
I
P0[3]
Analog column mux input.
1
2
3
4
5
6
18
17
16
MLF
(Top View ) 15
14
13
P0[4], A, I
P0[2], A, I
P0[0], A, I
NC
XRES
P1[6]
Vss
I2C SDA, P1[0]
P1[2]
EXTCLK, P1[4]
1
Name
P0[3], A, I
P0[5], A, I
P0[7], A, I
Vss
Analog
7
8
9
10
11
12
Digital
I2C SCL, P1[1]
NC
Type
Pin
No.
LEGEND A = Analog, I = Input, and O = Output.
* Note The MLF package has a center pad that must be connected to the
same ground as the Vss pin.
February 25, 2005
Document No. 38-12022 Rev. *G
10
2. Register Reference
This chapter lists the registers of the CY8C21x23 PSoC device. For detailed register information, reference the
PSoC™ Mixed-Signal Array Technical Reference Manual.
2.1
Register Conventions
2.2
The register conventions specific to this section are listed in the
following table.
Convention
R
Description
Read register or bit(s)
W
Write register or bit(s)
L
Logical register or bit(s)
C
Clearable register or bit(s)
#
Access is bit specific
February 25, 2005
Register Mapping Tables
The PSoC device has a total register address space of 512
bytes. The register space is referred to as IO space and is
divided into two banks. The XOI bit in the Flag register (CPU_F)
determines which bank the user is currently in. When the XOI
bit is set the user is in Bank 1.
Note In the following register mapping tables, blank fields are
Reserved and should not be accessed.
Document No. 38-12022 Rev. *G
11
CY8C21x23 Final Data Sheet
2. Register Reference
Register Map Bank 0 Table: User Space
RW
#
#
RW
RW
RW
RW
RW
RW
RW
RW
RW
I2C_CFG
I2C_SCR
I2C_DR
I2C_MSCR
INT_CLR0
INT_CLR1
INT_CLR3
INT_MSK3
INT_MSK0
INT_MSK1
INT_VC
RES_WDT
DEC_CR0
DEC_CR1
RW
RW
RW
RW
RW
RW
RW
CPU_F
CPU_SCR1
CPU_SCR0
Document No. 38-12022 Rev. *G
Access
#
RW
Addr
(0,Hex)
RW
Name
RW
80
81
82
83
ASE11CR0
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
February 25, 2005
ASE10CR0
Addr
(0,Hex)
00
RW
40
01
RW
41
02
RW
42
03
RW
43
04
RW
44
05
RW
45
06
RW
46
07
RW
47
08
48
09
49
0A
4A
0B
4B
0C
4C
0D
4D
0E
4E
0F
4F
10
50
11
51
12
52
13
53
14
54
15
55
16
56
17
57
18
58
19
59
1A
5A
1B
5B
1C
5C
1D
5D
1E
5E
1F
5F
DBB00DR0
20
#
AMX_IN
60
DBB00DR1
21
W
61
DBB00DR2
22
RW
PWM_CR
62
DBB00CR0
23
#
63
DBB01DR0
24
#
CMP_CR0
64
DBB01DR1
25
W
65
DBB01DR2
26
RW
CMP_CR1
66
DBB01CR0
27
#
67
DCB02DR0
28
#
ADC0_CR
68
DCB02DR1
29
W
ADC1_CR
69
DCB02DR2
2A
RW
6A
DCB02CR0
2B
#
6B
DCB03DR0
2C
#
TMP_DR0
6C
DCB03DR1
2D
W
TMP_DR1
6D
DCB03DR2
2E
RW
TMP_DR2
6E
DCB03CR0
2F
#
TMP_DR3
6F
30
70
31
71
32
ACE00CR1
72
33
ACE00CR2
73
34
74
35
75
36
ACE01CR1
76
37
ACE01CR2
77
38
78
39
79
3A
7A
3B
7B
3C
7C
3D
7D
3E
7E
3F
7F
Blank fields are Reserved and should not be accessed.
Name
Access
Addr
(0,Hex)
Name
Access
Addr
(0,Hex)
Name
PRT0DR
PRT0IE
PRT0GS
PRT0DM2
PRT1DR
PRT1IE
PRT1GS
PRT1DM2
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
DD
DE
DF
E0
E1
E2
E3
E4
E5
E6
E7
E8
E9
EA
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
F7
F8
F9
FA
FB
FC
FD
FE
FF
RW
#
RW
#
RW
RW
RW
RW
RW
RW
RC
W
RW
RW
RL
#
#
12
CY8C21x23 Final Data Sheet
2. Register Reference
Register Map Bank 1 Table: Configuration Space
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
C0
C1
C2
C3
C4
C5
C6
C7
C8
C9
CA
CB
CC
CD
CE
CF
GDI_O_IN
D0
GDI_E_IN
D1
GDI_O_OU
D2
GDI_E_OU
D3
D4
D5
D6
D7
D8
D9
DA
DB
DC
OSC_GO_EN DD
OSC_CR4
DE
OSC_CR3
DF
OSC_CR0
E0
OSC_CR1
E1
OSC_CR2
E2
VLT_CR
E3
VLT_CMP
E4
ADC0_TR
E5
ADC1_TR
E6
E7
IMO_TR
E8
ILO_TR
E9
BDG_TR
EA
ECO_TR
EB
EC
ED
EE
EF
F0
F1
F2
F3
F4
F5
F6
CPU_F
F7
F8
F9
FLS_PR1
FA
FB
FC
FD
CPU_SCR1
FE
CPU_SCR0
FF
Document No. 38-12022 Rev. *G
Access
RW
RW
RW
RW
RW
RW
Addr
(1,Hex)
RW
RW
RW
Name
RW
RW
RW
RW
RW
80
81
82
83
ASE11CR0
84
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
91
92
93
94
95
96
97
98
99
9A
9B
9C
9D
9E
9F
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
AA
AB
AC
AD
AE
AF
RDI0RI
B0
RDI0SYN
B1
RDI0IS
B2
RDI0LT0
B3
RDI0LT1
B4
RDI0RO0
B5
RDI0RO1
B6
B7
B8
B9
BA
BB
BC
BD
BE
BF
# Access is bit specific.
Access
ASE10CR0
Addr
(1,Hex)
February 25, 2005
Name
00
RW
40
01
RW
41
02
RW
42
03
RW
43
04
RW
44
05
RW
45
06
RW
46
07
RW
47
08
48
09
49
0A
4A
0B
4B
0C
4C
0D
4D
0E
4E
0F
4F
10
50
11
51
12
52
13
53
14
54
15
55
16
56
17
57
18
58
19
59
1A
5A
1B
5B
1C
5C
1D
5D
1E
5E
1F
5F
DBB00FN
20
RW
CLK_CR0
60
DBB00IN
21
RW
CLK_CR1
61
DBB00OU
22
RW
ABF_CR0
62
23
AMD_CR0
63
DBB01FN
24
RW
CMP_GO_EN 64
DBB01IN
25
RW
65
DBB01OU
26
RW
AMD_CR1
66
27
ALT_CR0
67
DCB02FN
28
RW
68
DCB02IN
29
RW
69
DCB02OU
2A
RW
6A
2B
CLK_CR3
6B
DCB03FN
2C
RW
TMP_DR0
6C
DCB03IN
2D
RW
TMP_DR1
6D
DCB03OU
2E
RW
TMP_DR2
6E
2F
TMP_DR3
6F
30
70
31
71
32
ACE00CR1
72
33
ACE00CR2
73
34
74
35
75
36
ACE01CR1
76
37
ACE01CR2
77
38
78
39
79
3A
7A
3B
7B
3C
7C
3D
7D
3E
7E
3F
7F
Blank fields are Reserved and should not be accessed.
Access
Addr
(1,Hex)
Name
Access
Addr
(1,Hex)
Name
PRT0DM0
PRT0DM1
PRT0IC0
PRT0IC1
PRT1DM0
PRT1DM1
PRT1IC0
PRT1IC1
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
RW
RW
W
W
RW
W
RL
RW
#
#
13
3. Electrical Specifications
This chapter presents the DC and AC electrical specifications of the CY8C21x23 PSoC device. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/psoc.
Specifications are valid for -40oC ≤ TA ≤ 85oC and TJ ≤ 100oC, except where noted.
5.25
SLIMO Mode = 0
Refer to Table 3-15 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode.
5.25
SLIMO
Mode=1
4.75
Vdd Voltage
Vdd Voltage
lid ng
Va rati n
e io
Op Reg
4.75
3.60
3.00
3.00
2.40
2.40
93 kHz
12 MHz
3 MHz
SLIMO
Mode=0
SLIMO
SLIMO
Mode=1
Mode=0
SLIMO SLIMO
Mode=1 Mode=1
24 MHz
93 kHz
6 MHz
12 MHz
24 MHz
IMO Frequency
CPU Frequency
Figure 3-1a. Voltage versus CPU Frequency
Figure 3-1b.
Voltage versus IMO Frequency
The following table lists the units of measure that are used in this chapter.
Table 3-1: Units of Measure
Symbol
Unit of Measure
Symbol
Unit of Measure
oC
degree Celsius
µW
microwatts
dB
decibels
mA
milli-ampere
fF
femto farad
ms
milli-second
Hz
hertz
mV
milli-volts
KB
1024 bytes
nA
nanoampere
Kbit
1024 bits
ns
nanosecond
kHz
kilohertz
nV
nanovolts
kΩ
kilohm
Ω
ohm
MHz
megahertz
pA
picoampere
MΩ
megaohm
pF
picofarad
µA
microampere
pp
peak-to-peak
µF
microfarad
ppm
µH
microhenry
ps
picosecond
µs
microsecond
sps
samples per second
µV
microvolts
σ
sigma: one standard deviation
microvolts root-mean-square
V
volts
µVrms
February 2005
parts per million
Document No. 38-12022 Rev. *G
14
CY8C21x23 Final Data Sheet
3.1
3. Electrical Specifications
Absolute Maximum Ratings
Table 3-2. Absolute Maximum Ratings
Symbol
Description
Min
Typ
Max
Units
TSTG
Storage Temperature
-55
–
+100
oC
TA
Ambient Temperature with Power Applied
-40
–
+85
o
Vdd
Supply Voltage on Vdd Relative to Vss
-0.5
–
+6.0
V
VIO
DC Input Voltage
Vss - 0.5
–
Vdd + 0.5 V
VIOZ
DC Voltage Applied to Tri-state
Vss - 0.5
–
Vdd + 0.5 V
IMIO
Maximum Current into any Port Pin
-25
–
+50
mA
ESD
Electro Static Discharge Voltage
2000
–
–
V
LU
Latch-up Current
–
–
200
mA
3.2
Notes
Higher storage temperatures will reduce data
retention time.
C
Human Body Model ESD.
Operating Temperature
Table 3-3. Operating Temperature
Symbol
Description
Min
Typ
Max
Units
TA
Ambient Temperature
-40
–
+85
o
TJ
Junction Temperature
-40
–
+100
oC
3.3
3.3.1
Notes
C
The temperature rise from ambient to junction is
package specific. See “Thermal Impedances”
on page 31. The user must limit the power consumption to comply with this requirement.
DC Electrical Characteristics
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-4. DC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
Vdd
Supply Voltage
2.40
–
5.25
V
See DC POR and LVD specifications, Table 3-11
on page 19.
IDD
Supply Current, IMO = 24 MHz
–
3
4
mA
Conditions are Vdd = 5.0V, 25oC, CPU = 3 MHz,
SYSCLK doubler disabled. VC1 = 1.5 MHz, VC2
= 93.75 kHz, VC3 = 0.366 kHz.
IDD3
Supply Current, IMO = 6 MHz
–
1.2
2
mA
Conditions are Vdd = 3.3V, 25oC, CPU = 3 MHz,
clock doubler disabled. VC1 = 375 kHz, VC2 =
23.4 kHz, VC3 = 0.091 kHz.
IDD27
Supply Current, IMO = 6 MHz
–
1.1
1.5
mA
Conditions are Vdd = 2.55V, 25oC, CPU = 3
MHz, clock doubler disabled. VC1 = 375 kHz,
VC2 = 23.4 kHz, VC3 = 0.091 kHz.
ISB27
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and internal slow oscillator active. Mid temperature range.
–
2.6
4
µA
Vdd = 2.55V, 0oC to 40oC.
ISB
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and internal slow oscillator active.
–
2.8
5
µA
Vdd = 3.3V, -40oC ≤ TA ≤ 85oC.
VREF
Reference Voltage (Bandgap)
1.28
1.30
1.32
V
Trimmed for appropriate Vdd. Vdd = 3.0V to
5.25V.
VREF27
Reference Voltage (Bandgap)
1.16
1.30
1.330
V
Trimmed for appropriate Vdd. Vdd = 2.4V to
3.0V.
AGND
Analog Ground
VREF
- 0.003
VREF
VREF
+ 0.003
V
February 25, 2005
Document No. 38-12022 Rev. *G
15
CY8C21x23 Final Data Sheet
3.3.2
3. Electrical Specifications
DC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25°C and
are for design guidance only.
Table 3-5. 5V and 3.3V DC GPIO Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
4
5.6
8
kΩ
Pull down Resistor
4
5.6
8
kΩ
High Output Level
Vdd - 1.0
–
–
V
IOH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads,
4 on even port pins (for example, P0[2], P1[4]),
4 on odd port pins (for example, P0[3], P1[5])).
80 mA maximum combined IOH budget.
VOL
Low Output Level
–
–
0.75
V
IOL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads,
4 on even port pins (for example, P0[2], P1[4]),
4 on odd port pins (for example, P0[3], P1[5])).
150 mA maximum combined IOL budget.
0.8
V
Vdd = 3.0 to 5.25.
V
Vdd = 3.0 to 5.25.
RPU
Pull up Resistor
RPD
VOH
VIL
Input Low Level
–
–
VIH
Input High Level
2.1
–
VH
Input Hysteresis
–
60
–
mV
IIL
Input Leakage (Absolute Value)
–
1
–
nA
Gross tested to 1 µA.
CIN
Capacitive Load on Pins as Input
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
COUT
Capacitive Load on Pins as Output
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 2.4V to 3.0V and
-40°C ≤ TA ≤ 85°C. Typical parameters apply to 2.7V at 25°C and are for design guidance only.
Table 3-6. 2.7V DC GPIO Specifications
Symbol
Description
Min
4
Typ
5.6
Max
8
Units
Notes
kΩ
RPU
Pull up Resistor
RPD
Pull down Resistor
4
5.6
8
kΩ
VOH
High Output Level
Vdd - 0.4
–
–
V
IOH = 2.5 mA (6.25 Typ), Vdd = 2.4 to 3.0V (16
mA maximum, 50 mA Typ combined IOH budget).
VOL
Low Output Level
–
–
0.75
V
IOL = 10 mA, Vdd = 2.4 to 3.0V (90 mA maximum combined IOL budget).
VIL
Input Low Level
–
–
0.75
V
Vdd = 2.4 to 3.0.
VIH
Input High Level
2.0
–
–
V
Vdd = 2.4 to 3.0.
VH
Input Hysteresis
–
60
–
mV
IIL
Input Leakage (Absolute Value)
–
1
–
nA
Gross tested to 1 µA.
CIN
Capacitive Load on Pins as Input
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
COUT
Capacitive Load on Pins as Output
–
3.5
10
pF
Package and pin dependent. Temp = 25oC.
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3.3.3
3. Electrical Specifications
DC Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-7. 5V DC Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
VOSOA
Input Offset Voltage (absolute value)
–
2.5
15
mV
Notes
TCVOSOA
Average Input Offset Voltage Drift
–
10
–
µV/oC
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
200
–
pA
Gross tested to 1 µA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
VCMOA
Common Mode Voltage Range
0.0
–
Vdd - 1
V
GOLOA
Open Loop Gain
80
–
–
dB
ISOA
Amplifier Supply Current
–
10
30
µA
Table 3-8. 3.3V DC Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
VOSOA
Input Offset Voltage (absolute value)
–
2.5
15
mV
Notes
TCVOSOA
Average Input Offset Voltage Drift
–
10
–
µV/oC
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
200
–
pA
Gross tested to 1 µA.
Package and pin dependent. Temp = 25oC.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
VCMOA
Common Mode Voltage Range
0
–
Vdd - 1
V
GOLOA
Open Loop Gain
80
–
–
dB
ISOA
Amplifier Supply Current
–
10
30
µA
Table 3-9. 2.7V DC Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
VOSOA
Input Offset Voltage (absolute value)
–
2.5
15
mV
TCVOSOA
Average Input Offset Voltage Drift
–
10
–
µV/oC
Notes
IEBOA
Input Leakage Current (Port 0 Analog Pins)
–
200
–
pA
Gross tested to 1 µA.
CINOA
Input Capacitance (Port 0 Analog Pins)
–
4.5
9.5
pF
Package and pin dependent. Temp = 25oC.
VCMOA
Common Mode Voltage Range
0
–
Vdd - 1
V
GOLOA
Open Loop Gain
80
–
–
dB
ISOA
Amplifier Supply Current
–
10
30
µA
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3.3.4
3. Electrical Specifications
DC Switch Mode Pump Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-10. DC Switch Mode Pump (SMP) Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
VPUMP5V
5V Output Voltage from Pump
4.75
5.0
5.25
V
Configuration of footnote.a Average, neglecting
ripple. SMP trip voltage is set to 5.0V.
VPUMP3V
3.3V Output Voltage from Pump
3.00
3.25
3.60
V
Configuration of footnote.a Average, neglecting
ripple. SMP trip voltage is set to 3.25V.
VPUMP2V
2.6V Output Voltage from Pump
2.45
2.55
2.80
V
Configuration of footnote.a Average, neglecting
ripple. SMP trip voltage is set to 2.55V.
IPUMP
Available Output Current
Configuration of footnote.a
VBAT = 1.8V, VPUMP = 5.0V
5
–
–
mA
SMP trip voltage is set to 5.0V.
VBAT = 1.5V, VPUMP = 3.25V
8
–
–
mA
SMP trip voltage is set to 3.25V.
VBAT = 1.3V, VPUMP = 2.55V
8
–
–
mA
SMP trip voltage is set to 2.55V.
VBAT5V
Input Voltage Range from Battery
1.8
–
5.0
V
Configuration of footnote.a SMP trip voltage is
set to 5.0V.
VBAT3V
Input Voltage Range from Battery
1.0
–
3.3
V
Configuration of footnote.a SMP trip voltage is
set to 3.25V.
VBAT2V
Input Voltage Range from Battery
1.0
–
2.8
V
Configuration of footnote.a SMP trip voltage is
set to 2.55V.
VBATSTART
Minimum Input Voltage from Battery to Start Pump
1.2
–
–
V
Configuration of footnote.a 0oC ≤ TA ≤ 100.
1.25V at TA = -40oC.
∆VPUMP_Line
Line Regulation (over Vi range)
–
5
–
%VO
Configuration of footnote.a VO is the “Vdd Value
for PUMP Trip” specified by the VM[2:0] setting
in the DC POR and LVD Specification, Table 311 on page 19.
∆VPUMP_Load
Load Regulation
–
5
–
%VO
Configuration of footnote.a VO is the “Vdd Value
for PUMP Trip” specified by the VM[2:0] setting
in the DC POR and LVD Specification, Table 311 on page 19.
∆VPUMP_Ripple
Output Voltage Ripple (depends on cap/load)
–
100
–
mVpp
Configuration of footnote.a Load is 5 mA.
E3
Efficiency
35
50
–
%
Configuration of footnote.a Load is 5 mA. SMP
trip voltage is set to 3.25V.
E2
Efficiency
35
80
–
%
For I load = 1mA, VPUMP = 2.55V, VBAT = 1.3V,
10 uH inductor, 1 uF capacitor, and Schottky
diode.
FPUMP
Switching Frequency
–
1.3
–
MHz
DCPUMP
Switching Duty Cycle
–
50
–
%
a. L1 = 2 µH inductor, C1 = 10 µF capacitor, D1 = Schottky diode. See Figure 3-2.
D1
Vdd
L1
VBAT
+
VPUMP
C1
SMP
Battery
PSoCTM
V ss
Figure 3-2. Basic Switch Mode Pump Circuit
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3.3.5
3. Electrical Specifications
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-11. DC POR and LVD Specifications
Symbol
Description
Min
Typ
Max
Units
Vdd Value for PPOR Trip
VPPOR0
PORLEV[1:0] = 00b
VPPOR1
PORLEV[1:0] = 01b
VPPOR2
PORLEV[1:0] = 10b
–
2.36
2.40
V
2.82
2.95
V
4.55
4.70
V
Notes
Vdd must be greater than or equal to 2.5V
during startup, reset from the XRES pin, or
reset from Watchdog.
Vdd Value for LVD Trip
VLVD0
VM[2:0] = 000b
2.40
2.45
2.51a
V
VLVD1
VM[2:0] = 001b
2.85
2.92
2.99b
V
VLVD2
VM[2:0] = 010b
2.95
3.02
3.09
V
VM[2:0] = 011b
3.06
3.13
3.20
V
VM[2:0] = 100b
4.37
4.48
4.55
V
VM[2:0] = 101b
4.50
4.64
4.75
V
VM[2:0] = 110b
4.62
4.73
4.83
V
VM[2:0] = 111b
4.71
4.81
4.95
V
VLVD3
VLVD4
VLVD5
VLVD6
VLVD7
Vdd Value for PUMP Trip
VPUMP0
VM[2:0] = 000b
2.45
2.55
2.62c
V
VPUMP1
VM[2:0] = 001b
2.96
3.02
3.09
V
VPUMP2
VM[2:0] = 010b
3.03
3.10
3.16
V
VM[2:0] = 011b
3.18
3.25
VM[2:0] = 100b
4.54
4.64
VM[2:0] = 101b
4.62
4.73
VM[2:0] = 110b
4.71
4.82
VM[2:0] = 111b
4.89
5.00
VPUMP3
VPUMP4
VPUMP5
VPUMP6
VPUMP7
a.
b.
c.
d.
d
3.32
4.74
4.83
4.92
5.12
V
V
V
V
V
Always greater than 50 mV above VPPOR (PORLEV = 00) for falling supply.
Always greater than 50 mV above VPPOR (PORLEV = 01) for falling supply.
Always greater than 50 mV above VLVD0.
Always greater than 50 mV above VLVD3.
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3.3.6
3. Electrical Specifications
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-12. DC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
VddIWRITE
Supply Voltage for Flash Write Operations
2.70
–
–
V
IDDP
Supply Current During Programming or Verify
–
5
25
mA
VILP
Input Low Voltage During Programming or Verify
–
–
0.8
V
VIHP
Input High Voltage During Programming or Verify
2.2
–
–
V
IILP
Input Current when Applying Vilp to P1[0] or P1[1] During
Programming or Verify
–
–
0.2
mA
Driving internal pull-down resistor.
IIHP
Input Current when Applying Vihp to P1[0] or P1[1] During
Programming or Verify
–
–
1.5
mA
Driving internal pull-down resistor.
VOLV
Output Low Voltage During Programming or Verify
–
–
Vss + 0.75 V
VOHV
Output High Voltage During Programming or Verify
Vdd - 1.0
–
Vdd
V
FlashENPB
Flash Endurance (per block)
50,000
–
–
–
Erase/write cycles per block.
1,800,0000
–0
–0
–0
Erase/write cycles.0
10
–
–
Years
FlashENT
Flash Endurance
FlashDR
Flash Data Retention
(total)a
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of
25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (and so forth to limit the total number of cycles to 36x50,000 and that no single block ever
sees more than 50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to
the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3.4
3. Electrical Specifications
AC Electrical Characteristics
3.4.1
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only..
Table 3-13. 5V and 3.3V AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FIMO24
Internal Main Oscillator Frequency for 24 MHz
23.4
24
24.6a,b,c
MHz
Trimmed for 5V or 3.3V operation using
factory trim values. See Figure 3-1b on
page 14. SLIMO mode = 0.
FIMO6
Internal Main Oscillator Frequency for 6 MHz
5.75
6
6.35a,b,c
MHz
Trimmed for 3.3V operation using factory
trim values. See Figure 3-1b on page 14.
SLIMO mode = 1.
FCPU1
CPU Frequency (5V Nominal)
0.93
24
24.6a,b
MHz
24 MHz only for SLIMO mode = 0.
FCPU2
CPU Frequency (3.3V Nominal)
0.93
12
12.3b,c
MHz
FBLK5
Digital PSoC Block Frequency0(5V Nominal)
0
48
49.2a,b,d
MHz
FBLK33
Digital PSoC Block Frequency (3.3V Nominal)
0
24
24.6b,d
MHz
F32K1
Internal Low Speed Oscillator Frequency
15
32
64
kHz
Jitter32k
32 kHz RMS Period Jitter
–
100
200
ns
Jitter32k
32 kHz Peak-to-Peak Period Jitter
–
1400
–
ns
TXRST
External Reset Pulse Width
10
–
–
µs
DC24M
24 MHz Duty Cycle
40
50
60
%
Step24M
24 MHz Trim Step Size
–
50
–
kHz
Fout48M
48 MHz Output Frequency
46.8
48.0
49.2a,c
MHz
Jitter24M1
24 MHz Peak-to-Peak Period Jitter (IMO)
–
300
FMAX
Maximum frequency of signal on row input or row output.
–
–
12.3
MHz
TRAMP
Supply Ramp Time
0
–
–
µs
a.
b.
c.
d.
Refer to the AC Digital Block Specifications below.
Trimmed. Utilizing factory trim values.
ps
4.75V < Vdd < 5.25V.
Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation at 3.3V.
See the individual user module data sheets for information on maximum frequencies for user modules.
Table 3-14. 2.7V AC Chip-Level Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FIMO12
Internal Main Oscillator Frequency for 12 MHz
11.5
120
12.7a,b,c
MHz
Trimmed for 2.7V operation using factory
trim values. See Figure 3-1b on page 14.
SLIMO mode = 1.
FIMO6
Internal Main Oscillator Frequency for 6 MHz
5.5
6
6.35a,b,c
MHz
Trimmed for 2.7V operation using factory
trim values. See Figure 3-1b on page 14.
SLIMO mode = 1.
FCPU1
CPU Frequency (2.7V Nominal)
0.093
3
3.15a,b
MHz
24 MHz only for SLIMO mode = 0.
FBLK27
Digital PSoC Block Frequency (2.7V Nominal)
0
12
12.5a,b,c
MHz
Refer to the AC Digital Block Specifications below.
F32K1
Internal Low Speed Oscillator Frequency
8
32
96
kHz
Jitter32k
32 kHz RMS Period Jitter
–
150
200
ns
Jitter32k
32 kHz Peak-to-Peak Period Jitter
–
1400
–
ns
TXRST
External Reset Pulse Width
10
–
–
µs
FMAX
Maximum frequency of signal on row input or row output.
–
–
12.3
MHz
TRAMP
Supply Ramp Time
0
–
–
µs
a. 2.4V < Vdd < 3.0V.
b. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
c. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on maximum frequency for user modules.
February 25, 2005
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CY8C21x23 Final Data Sheet
3. Electrical Specifications
Jitter24M1
F 24M
Figure 3-3. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter32k
F32K1
Figure 3-4. 32 kHz Period Jitter (ILO) Timing Diagram
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3.4.2
3. Electrical Specifications
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-15. 5V and 3.3V AC GPIO Specifications
Symbol
FGPIO
Description
Min
Typ
Max
Units
Notes
GPIO Operating Frequency
0
–
12
MHz
Normal Strong Mode
TRiseF
Rise Time, Normal Strong Mode, Cload = 50 pF
3
–
18
ns
Vdd = 4.5 to 5.25V, 10% - 90%
TFallF
Fall Time, Normal Strong Mode, Cload = 50 pF
2
–
18
ns
Vdd = 4.5 to 5.25V, 10% - 90%
TRiseS
Rise Time, Slow Strong Mode, Cload = 50 pF
10
27
–
ns
Vdd = 3 to 5.25V, 10% - 90%
TFallS
Fall Time, Slow Strong Mode, Cload = 50 pF
10
22
–
ns
Vdd = 3 to 5.25V, 10% - 90%
Table 3-16. 2.7V AC GPIO Specifications
Symbol
FGPIO
Description
Min
Typ
Max
Units
Notes
GPIO Operating Frequency
0
–
3
MHz
Normal Strong Mode
TRiseF
Rise Time, Normal Strong Mode, Cload = 50 pF
6
–
50
ns
Vdd = 2.4 to 3.0V, 10% - 90%
TFallF
Fall Time, Normal Strong Mode, Cload = 50 pF
6
–
50
ns
Vdd = 2.4 to 3.0V, 10% - 90%
TRiseS
Rise Time, Slow Strong Mode, Cload = 50 pF
18
40
120
ns
Vdd = 2.4 to 3.0V, 10% - 90%
TFallS
Fall Time, Slow Strong Mode, Cload = 50 pF
18
40
120
ns
Vdd = 2.4 to 3.0V, 10% - 90%
90%
GPIO
Pin
10%
TRiseF
TRiseS
TFallF
TFallS
Figure 3-5. GPIO Timing Diagram
February 25, 2005
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CY8C21x23 Final Data Sheet
3.4.3
3. Electrical Specifications
AC Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.
Table 3-17. 5V and 3.3V AC Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
TCOMP1
Comparator Mode Response Time, 50 mVpp Signal Centered on Ref
100
ns
TCOMP2
Comparator Mode Response Time, 2.5V Input, 0.5V Overdrive
300
ns
Notes
Table 3-18. 2.7V AC Amplifier Specifications
Symbol
Description
Min
Typ
Max
Units
TCOMP1
Comparator Mode Response Time, 50 mVpp Signal Centered on Ref
600
ns
TCOMP2
Comparator Mode Response Time, 1.5V Input, 0.5V Overdrive
300
ns
3.4.4
Notes
AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-19. 5V and 3.3V AC Digital Block Specifications
Function
Description
Min
Typ
All
Functions
Maximum Block Clocking Frequency (> 4.75V)
Timer
Capture Pulse Width
50a
–
Maximum Frequency, No Capture
–
Maximum Frequency, With or Without Capture
–
Enable Pulse Width
Maximum Frequency, No Enable Input
Maximum Frequency, Enable Input
Max
Units
Notes
49.2
MHz
4.75V < Vdd < 5.25V.
24.6
MHz
3.0V < Vdd < 4.75V.
–
ns
–
49.2
MHz
–
24.6
MHz
50
–
–
ns
–
–
49.2
MHz
–
–
24.6
MHz
Asynchronous Restart Mode
20
–
–
ns
Synchronous Restart Mode
50
–
–
ns
Disable Mode
50
–
–
ns
–
–
49.2
MHz
4.75V < Vdd < 5.25V.
CRCPRS
Maximum Input Clock Frequency
(PRS Mode)
–
–
49.2
MHz
4.75V < Vdd < 5.25V.
CRCPRS
Maximum Input Clock Frequency
(CRC Mode)
–
–
24.6
MHz
SPIM
Maximum Input Clock Frequency
–
–
8.2
MHz
SPIS
Maximum Input Clock Frequency
–
–
4.1
MHz
Width of SS_ Negated Between Transmissions
50
–
–
ns
Transmitter
Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum data rate at 3.08 MHz due to 8 x over
clocking.
Receiver
Maximum Input Clock Frequency
–
–
24.6
MHz
Maximum data rate at 3.08 MHz due to 8 x over
clocking.
Counter
Dead Band
Maximum Block Clocking Frequency (< 4.75V)
4.75V < Vdd < 5.25V.
4.75V < Vdd < 5.25V.
Kill Pulse Width:
Maximum Frequency
Maximum data rate at 4.1 MHz due to 2 x over
clocking.
a. 50 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
February 25, 2005
Document No. 38-12022 Rev. *G
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CY8C21x23 Final Data Sheet
3. Electrical Specifications
Table 3-20. 2.7V AC Digital Block Specifications
Function
Description
Min
All
Functions
Maximum Block Clocking Frequency
Timer
Capture Pulse Width
100a
Maximum Frequency, With or Without Capture
–
Enable Pulse Width
Typ
Max
Units
Notes
12.7
MHz
–
–
ns
–
12.7
MHz
100
–
–
ns
Maximum Frequency, No Enable Input
–
–
12.7
MHz
Maximum Frequency, Enable Input
–
–
12.7
MHz
Asynchronous Restart Mode
20
–
–
ns
Synchronous Restart Mode
100
–
–
ns
Disable Mode
100
–
–
ns
–
–
12.7
MHz
CRCPRS
Maximum Input Clock Frequency
(PRS Mode)
–
–
12.7
MHz
CRCPRS
Maximum Input Clock Frequency
(CRC Mode)
–
–
12.7
MHz
SPIM
Maximum Input Clock Frequency
–
–
6.35
MHz
SPIS
Maximum Input Clock Frequency
–
–
4.1
MHz
Width of SS_ Negated Between Transmissions
100
–
–
ns
Transmitter
Maximum Input Clock Frequency
–
–
12.7
MHz
Maximum data rate at 1.59 MHz due to 8 x over
clocking.
Receiver
Maximum Input Clock Frequency
–
–
12.7
MHz
Maximum data rate at 1.59 MHz due to 8 x over
clocking.
Counter
Dead Band
2.4V < Vdd < 3.0V.
Kill Pulse Width:
Maximum Frequency
Maximum data rate at 3.17 MHz due to 2 x over
clocking.
a. 100 ns minimum input pulse width is based on the input synchronizers running at 12 MHz (84 ns nominal period).
February 25, 2005
Document No. 38-12022 Rev. *G
25
CY8C21x23 Final Data Sheet
3.4.5
3. Electrical Specifications
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25°C
and are for design guidance only.
Table 3-21. 5V AC External Clock Specifications
Symbol
FOSCEXT
Description
Min
Frequency
Typ
Max
Units
0.093
–
24.6
MHz
ns
–
High Period
20.6
–
5300
–
Low Period
20.6
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
Notes
Table 3-22. 3.3V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.093
–
12.3
MHz
Maximum CPU frequency is 12 MHz at 3.3V.
With the CPU clock divider set to 1, the external
clock must adhere to the maximum frequency
and duty cycle requirements.
FOSCEXT
Frequency with CPU Clock divide by 2 or greater
0.186
–
24.6
MHz
If the frequency of the external clock is greater
than 12 MHz, the CPU clock divider must be set
to 2 or greater. In this case, the CPU clock
divider will ensure that the fifty percent duty
cycle requirement is met.
–
High Period with CPU Clock divide by 1
41.7
–
5300
ns
–
Low Period with CPU Clock divide by 1
41.7
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
Table 3-23. 2.7V AC External Clock Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
FOSCEXT
Frequency with CPU Clock divide by 1
0.093
–
6.060
MHz
Maximum CPU frequency is 3 MHz at 2.7V.
With the CPU clock divider set to 1, the external
clock must adhere to the maximum frequency
and duty cycle requirements.
FOSCEXT
Frequency with CPU Clock divide by 2 or greater
0.186
–
12.12
MHz
If the frequency of the external clock is greater
than 3 MHz, the CPU clock divider must be set
to 2 or greater. In this case, the CPU clock
divider will ensure that the fifty percent duty
cycle requirement is met.
ns
–
High Period with CPU Clock divide by 1
83.4
–
5300
–
Low Period with CPU Clock divide by 1
83.4
–
–
ns
–
Power Up IMO to Switch
150
–
–
µs
February 25, 2005
Document No. 38-12022 Rev. *G
26
CY8C21x23 Final Data Sheet
3.4.6
3. Electrical Specifications
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V, 3.3V, or 2.7V at 25°C
and are for design guidance only.
Table 3-24. AC Programming Specifications
Symbol
Description
Min
Typ
Max
Units
Notes
TRSCLK
Rise Time of SCLK
1
–
20
ns
TFSCLK
Fall Time of SCLK
1
–
20
ns
TSSCLK
Data Set up Time to Falling Edge of SCLK
40
–
–
ns
THSCLK
Data Hold Time from Falling Edge of SCLK
40
–
–
ns
FSCLK
Frequency of SCLK
0
–
8
MHz
TERASEB
Flash Erase Time (Block)
–
15
–
ms
TWRITE
Flash Block Write Time
–
30
–
ms
TDSCLK3
Data Out Delay from Falling Edge of SCLK
–
–
50
ns
3.0 ≤ Vdd ≤ 3.6
TDSCLK2
Data Out Delay from Falling Edge of SCLK
–
–
70
ns
2.4 ≤ Vdd ≤ 3.0
3.4.7
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ TA ≤ 85°C, 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, or 2.4V to 3.0V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters
apply to 5V, 3.3V, or 2.7V at 25°C and are for design guidance only.
Table 3-25. AC Characteristics of the I2C SDA and SCL Pins for Vcc ≥ 3.0V
Standard Mode
Symbol
Description
Min
Fast Mode
Max
Min
Max
Units
FSCLI2C
SCL Clock Frequency
0
100
0
400
kHz
THDSTAI2C
Hold Time (repeated) START Condition. After this period,
the first clock pulse is generated.
4.0
–
0.6
–
µs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
1.3
–
µs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
0.6
–
µs
TSUSTAI2C
Set-up Time for a Repeated START Condition
4.7
–
0.6
–
µs
THDDATI2C
Data Hold Time
0
–
0
–
µs
2500
–0
100a
–0
ns0
4.0
–
0.6
–
µs
TSUDATI2C
Data Set-up
TSUSTOI2C
Set-up Time for STOP Condition
TBUFI2C
Bus Free Time Between a STOP and START Condition
4.7
–
1.3
–
µs
TSPI2C
Pulse Width of spikes are suppressed by the input filter.
–
–
0
50
ns
Time0
Notes
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT ≥ 250 ns must then be met. This will automatically be the case if
the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
February 25, 2005
Document No. 38-12022 Rev. *G
27
CY8C21x23 Final Data Sheet
3. Electrical Specifications
Table 3-26. 2.7V AC Characteristics of the I2C SDA and SCL Pins (Fast Mode not Supported)
Standard Mode
Symbol
Description
Min
Fast Mode
Max
Min
Max
Units
FSCLI2C
SCL Clock Frequency
0
100
–
–
kHz
THDSTAI2C
Hold Time (repeated) START Condition. After this period,
the first clock pulse is generated.
4.0
–
–
–
µs
TLOWI2C
LOW Period of the SCL Clock
4.7
–
–
–
µs
THIGHI2C
HIGH Period of the SCL Clock
4.0
–
–
–
µs
TSUSTAI2C
Set-up Time for a Repeated START Condition
4.7
–
–
–
µs
THDDATI2C
Data Hold Time
0
–
–
–
µs
TSUDATI2C
Data Set-up Time
250
–
–
–
ns
TSUSTOI2C
Set-up Time for STOP Condition
4.0
–
–
–
µs
TBUFI2C
Bus Free Time Between a STOP and START Condition
4.7
–
–
–
µs
TSPI2C
Pulse Width of spikes are suppressed by the input filter.
–
–
–
–
ns
SDA
TLOWI2C
TSUDATI2C
THDSTAI2C
Notes
TSPI2C
TBUFI2C
SCL
Figure 3-6. Definition for Timing for Fast/Standard Mode on Tthe I2C Bus
February 25, 2005
Document No. 38-12022 Rev. *G
28
4. Packaging Information
4. Packaging Information
This chapter illustrates the packaging specifications for the CY8C21x23 PSoC device, along with the thermal impedances for each
package and minimum solder reflow peak temperature.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/support/link.cfm?mr=poddim.
4.1
Packaging Dimensions
PIN 1 ID
4
1
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.150[3.810]
0.157[3.987]
3. REFERENCE JEDEC MS-012
0.230[5.842]
0.244[6.197]
4. PACKAGE WEIGHT 0.07gms
PART #
S08.15 STANDARD PKG.
5
SZ08.15 LEAD FREE PKG.
8
0.189[4.800]
0.196[4.978]
0.010[0.254]
0.016[0.406]
SEATING PLANE
X 45°
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.050[1.270]
BSC
0.004[0.102]
0.0098[0.249]
0°~8°
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85066 *C
Figure 4-1. 8-Lead (150-Mil) SOIC
February 25, 2005
Document No. 38-12022 Rev. *G
29
CY8C21x23 Final Data Sheet
4. Packaging Information
51-85022 *B
Figure 4-2. 16-Lead (150-Mil) SOIC
51-85077 *C
Figure 4-3. 20-Lead (210-MIL) SSOP
February 25, 2005
Document No. 38-12022 Rev. *G
30
CY8C21x23 Final Data Sheet
4. Packaging Information
51-85203 **
Figure 4-4. 24-Lead (4x4) MLF
4.2
Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
Typical θJA *
8 SOIC
186 oC/W
16 SOIC
125 oC/W
20 SSOP
117 oC/W
24 MLF
40 oC/W
* TJ = TA + POWER x θJA
4.3
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 4-2. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature*
Maximum Peak Temperature
8 SOIC
240oC
260oC
16 SOIC
240oC
260oC
20 SSOP
240oC
260oC
24 MLF
240oC
260oC
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5oC
with Sn-Pb or 245+/-5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
February 25, 2005
Document No. 38-12022 Rev. *G
31
5. Ordering Information
The following table lists the CY8C21x23 PSoC device’s key package features and ordering codes.
RAM
(Bytes)
Switch Mode
Pump
Temperature
Range
Digital PSoC
Blocks
Analog
Blocks
Digital IO
Pins
Analog
Inputs
Analog
Outputs
XRES Pin
CY8C21123-24SXI
4K
256
No
-40°C to +85°C
4
4
6
4
0
No
8 Pin (150-Mil) SOIC
(Tape and Reel)
CY8C21123-24SXIT
4K
256
No
-40°C to +85°C
4
4
6
4
0
No
16 Pin (150-Mil) SOIC
CY8C21223-24SXI
4K
256
Yes
-40°C to +85°C
4
4
12
8
0
No
16 Pin (150-Mil) SOIC
(Tape and Reel)
CY8C21223-24SXIT
4K
256
Yes
-40°C to +85°C
4
4
12
8
0
No
20 Pin (210-Mil) SSOP
CY8C21323-24PVXI
4K
256
No
-40°C to +85°C
4
4
16
8
0
Yes
20 Pin (210-Mil) SSOP
(Tape and Reel)
CY8C21323-24PVXIT
4K
256
No
-40°C to +85°C
4
4
16
8
0
Yes
24 Pin (4x4) MLF
CY8C21323-24LFXI
4K
256
Yes
-40°C to +85°C
4
4
16
8
0
Yes
24 Pin (4x4) MLF
(Tape and Reel)
CY8C21323-24LFXIT
4K
256
Yes
-40°C to +85°C
4
4
16
8
0
Yes
5.1
Ordering
Code
8 Pin (150-Mil) SOIC
Package
Flash
(Bytes)
CY8C21x23 PSoC Device Key Features and Ordering Information
Ordering Code Definitions
CY 8 C 21 xxx-24xx
Package Type:
PX = PDIP Pb-Free
SX = SOIC Pb-Free
PVX = SSOP Pb-Free
LFX = MLF Pb-Free
AX = TQFP Pb-Free
Thermal Rating:
C = Commercial
I = Industrial
E = Extended
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress MicroSystems
Company ID: CY = Cypress
February 25, 2005
Document No. 38-12022 Rev. *G
32
6. Sales and Service Information
To obtain information about Cypress Semiconductor or PSoC sales and technical support, reference the following information.
Cypress Semiconductor
2700 162nd Street SW, Building D
Lynnwood, WA 98037
Web Sites:
6.1
Phone: 800.669.0557
Facsimile: 425.787.4641
Company Information – http://www.cypress.com
Sales – http://www.cypress.com/aboutus/sales_locations.cfm
Technical Support – http://www.cypress.com/support/login.cfm
Revision History
Document Title:
CY8C21x23 PSoC Mixed-Signal Array Final Data Sheet
Document Number: 38-12022
Revision
ECN #
Issue Date Origin of Change
Description of Change
**
133248
01/28/2004
NWJ
New silicon and document (Revision **).
*A
208900
03/05/2004
NWJ
Add new part, new package and update all ordering codes to Pb-free.
*B
212081
03/18/2004
NWJ
Expand and prepare Preliminary version.
*C
227321
05/19/2004
CMS Team
Update specs., data, format.
*D
235973
See ECN
SFV
Updated Overview and Electrical Spec. chapters, along with 24-pin pinout. Added
CMP_GO_EN register (1,64h) to mapping table.
*E
290991
See ECN
HMT
Update data sheet standards per SFV memo. Fix device table. Add part numbers to
pinouts and fine tune. Change 20-pin SSOP to CY8C21323. Add Reflow Temp. table.
Update diagrams and specs.
*F
301636
See ECN
HMT
DC Chip-Level Specification changes. Update links to new CY.com Portal.
*G
324073
See ECN
HMT
Obtained clearer 16 SOIC package. Update Thermal Impedances and Solder Reflow
tables. Re-add pinout ISSP notation. Fix ADC type-o. Fix TMP register names. Update
Electrical Specifications. Add CY logo. Update CY copyright. Make data sheet Final.
Distribution: External/Public
6.2
Posting: None
Copyrights and Flash Code Protection
Copyrights
© Cypress Semiconductor Corp. 2004-2005. All rights reserved. PSoC™, PSoC Designer™, and Programmable System-on-Chip™ are PSoC-related trademarks of
Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property of the respective corporations.
The information contained herein is subject to change without notice. Cypress Semiconductor assumes no responsibility for the use of any circuitry other than circuitry
embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products
for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of
Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress
Semiconductor against all charges. Cypress Semiconductor products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety
applications, unless pursuant to an express written agreement with Cypress Semiconductor.
Flash Code Protection
Note the following details of the Flash code protection features on Cypress Semiconductor PSoC devices.
Cypress Semiconductor products meet the specifications contained in their particular data sheets. Cypress Semiconductor believes that its PSoC family of products is one
of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress Semiconductor, that can breach
the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress Semiconductor nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
Cypress Semiconductor is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress
Semiconductor are committed to continuously improving the code protection features of our products.
February 25, 2005
© Cypress Semiconductor Corp. 2004-2005 — Document No. 38-12022 Rev. *G
33