Bright View Electronics BVZ-925QT4 Ϯ Description This revolutionary package design allows the lighting designer to reduce the number of LEDs required and provide a more uniform and unique illuminated appearance than with other LED solutions. This is possible through the efficient optical package design and high current capabilities. The low profile package can be easily coupled with reflectors or lenses to efficiently distribute light and provide the desired lit appearance. This product family employs the world's brightest red, red orange, amber, blue, cyan, and green LED materials, which allow designers to match the color of many lighting applications like vehicle signal lamps, specialty lighting, and electronic signs. • Dice Material AlInGaP Red • Light ColorΚ Red Color • Lens ColorΚ Water Transparent Ϯ Features • • • • • • • High Luminance Uniform Color Low Power Consumption Low Thermal Resistance Low Profile Packaged in tubes for use with automatic insertion equipment Pb -free/ RoHS compliant Ϯ Applications • • • • • • Sign and channel letter Cove lighting IR-free decoration lighting Automotive exterior ( stop-tail-turn, CHMSL, mirror side repeat ) Edge-lit signs ( exit, point of sale ) Advertisement and entertainment ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍ˄ʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Outline DimensionsΚ ( mm ) Tolerance : ± 0.25 mm CATHODE 7.62±0.5 ANODE 7.62±0.5 R9.4 3.50±0.5 2.5 5.4 5.0 0.4 1.55 0.76 5.08 5.08±0.3 Ϯ Part Numbering SystemΚ B V Z - 9 2 5 Q T 4 Colloid Code Dice Code / Color Code Outline Package Code Product Code Ϯ Sub Part Numbering : Please also refer to the label on product bags and cartons. ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍ˅ʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Absolute Maximum Ratings at Ta = 25 к PARAMETER symbol MAX. UNIT PD 224 mW Power Dissipation IF 70 mA Continuous Forward Current Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width IFP 100 mA VR Reverse Voltage 5 V Derating Linear From 50к 0.4 mA/к o Ё40 to Ѐ 100 Operating Temperature Range C Topr o Ё55 to Ѐ 100 C Storage Temperature Range Tstg o C Tj LED Junction Temperature 125 o 100 C for 30 sec. Soldering Preheat Temperature o Lead Solder Temperature ( 1.5mm Below Seating Plane ) Tsld 260 C for 5 sec. 1 time. Ϯ Electro-Optical Characteristicsat at Ta = 25 к PARAMETER---- SYMBOL TEST CONDITION MIN. Forward Voltage VF IF=70mA 壇 2.6 3.2 V Reverse Current IR VR= 5V 壇 壇 10 A Peak Emission Wavelength p IF=70mA 壇 640 壇 nm Dominant Wavelength d IF=70mA 壇 630 壇 nm Viewing Angle 2 1/2 IF=70mA 壇 160 壇 Deg. Luminous Intensity / Total Flux IV/V 壇 0.2 壇 cd/lm Thermal Resistance R j-pin 壇 125 壇 к/W ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍˆʳ̂˹ʳ˄˄ VALUES UNIT TYP. MAX. ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Bin Grade Limits ( I F = 70 mA* ) Luminous Intensity / lm Bin Min. Max. D 1.7 2.2 E 2.2 2.8 F 2.8 3.6 G 3.6 4.7 H 4.7 6.0 I 6.0 7.8 ToleranceΚ² 15% Ϯ Bin Grade Limits ( I F = 70 mA* ) Dominant Wavelength / nm Bin Min. Max. QE 622 626 QF 626 630 QG 630 634 QH 634 638 QI 638 642 Please contact our sales department for more information Ϯ Bin Grade Limits ( I F = 70 mA* ) Forward Voltage Bin Min. Max. 20 2.0 2.2 22 2.2 2.4 24 2.4 2.6 26 2.6 2.8 28 2.8 3.0 30 3.0 3.2 Please contact our sales department for more information ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍˇʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Characteristics Data AlInGaP Red LED TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES FIG. 2 Relative Total Flux vs. Forward Current ( Ta = 25 °C ) FIG. 1 Forward Current vs. Forward Voltage ( Ta = 25 °C ) 3.0 2.5 Relative Intensity Forward Current ( mA ) 100 90 80 70 60 50 40 30 20 10 0 2.0 1.5 1.0 0.5 0 1.6 2.1 2.6 3.1 Forward Voltage Vf ( V ) 3.6 FIG. 3 Forward Voltage vs. Temperature Relative Total Flux @ 70mA Forward Voltage @ 70mA 1.0 0.9 0.8 -50 -25 0 25 50 75 2.5 2.0 1.5 1.0 0.5 0 -50 -25 100 125 25 50 75 100 125 FIG. 6 Maximum Forward Current IF-DC Forward Current ( mA ) Forward Intensity @ 70mA 1.0 0.5 ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ 0 Ambient Temperature Ta ( °C ) FIG. 5 Relative Intensity vs. Wavelength ( p ) ( Ta = 25 °C ) 600 650 Wavelength ( nm ) 40 60 80 100 120 140 Forward Current If ( mA ) 3.0 Ambient Temperature Ta ( °C ) 0 550 20 FIG. 4 Relative Intensity vs. Temperature 1.2 1.1 0 80 vs. Temperature 60 40 20 700 ˣ˴˺˸ˍˈʳ̂˹ʳ˄˄ 0 0 20 40 60 80 100 Ambient Temperature Ta ( °C ) 120 ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Radiation CharacteristicΚ 40° 30° 20° 10° Ta=25к 0° 1.0 50° 0.8 0.6 60° 0.4 70° 0.2 80° 0 90° 100° 1.0 0.8 ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ 0.6 0.4 0° 20° ˣ˴˺˸ˍˉʳ̂˹ʳ˄˄ 40° 60° 80° 100° 120° ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Packaging : !Ϯ Package Carrier Tape Dimensions : 48.5 0.97 Front Gap :___________ L/N :________ BV P/N BIN :______ Q'ty :______ QA : Side 1.27 Tube Dimension(cm): 1.27* 0.97* 48.5 60PCS / Tube !Ϯ Package Reel Dimensions : 13.5 BOX Dimension(cm): 10.5 * 13.5 * 50.5 100 Tubes / Box 50.5 Box : 6,000PCS Bright View 3 Electronics Co.,Ltd. BVZ-9XXXXX PART NO.: LOT NO.: GRADE: Q'ty X- pcs QA 10.5 X: Bin grade : Wavelength : Vf TYPE Q'TY N,W G,W C.NO ʳʳʳ PCS KGS KGS ʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳʳ 30 52 RE CARTON Dimension(cm): 23*30*52 23 ITEM NO. DEVICE: Q'TY N. W.: G. W.: Y PCS. KGS. KGS. 4 Boxes / Carton Total : 24,000PCS ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍˊʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Reliability Test Items and Conditions (1)TEST ITEMS AND RESULTS Standard Test Conditions Note Test Method JEITA ED-4701 Tsld=260к ̈́ 6к, 5sec. 1 times 300 302 1.6mm from the base of the stopper (Pre-treatment 30к,70%,168hrs.) JEITA ED-4701 Tsld=235 ± 5к, 5sec. 1 time 300 303 over 95% (using flux) 0к ~ 100к 100 cycles 30min. 30min. JEITA ED-4701 -40к ~ 25к ~ 100к ~ 25к 100 cycles 100 105 30min. 5min. 30min. 5min. JEITA ED-4701 25к ~ 65к ~ -10к 10 cycles 200 203 90%RH 24hrs./1cycle JEITA ED-4701 Load 5N (0.5kgf) No noticeable 400 401 0̓ ~ 90° ~ 0° bend 2 times damage JEITA ED-4701 Load 10N (1kgf) No noticeable 400 401 10 ̈́ 1 sec. damage JEITA ED-4701 Ta=100к 1000hrs. 200 201 JEITA ED-4701 Ta=60к, RH=90% 1000hrs. 100 103 JEITA ED-4701 Ta=-40к 1000hrs. 200 202 Ta=25к, IF=30mA 1000hrs. TEST ITEM Resistance to Soldering Heat Solderability Thermal Shock Temperature Cycle Moisture Resistance Cyclic Terminal Strength (bending test) Terminal Strength (pull test) High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Number of Damaged 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 Steady State Operating Life of High Humidity Heat 60к,RH=90%, IF=15mA 500hrs. 0/50 Steady State Operating Life of Low Temperature Ta=-30к, IF=30mA 1000hrs. 0/50 (2)CRITERIA FOR JUDGING DAMAGE Item Symbol Forward Voltage VF Reverse Current IR Luminous Flux ӥV *)U.S.L.:Upper Standard Level ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ Test Conditions IF=30mA VR=5V IF=30mA Criteria for Judgement Max Min U.S.L.*) x 1.1 壇 U.S.L.*) x 2.0 壇 L.S.L.**) x 0.7 壇 **)L.S.L.:Lower Standard Level ˣ˴˺˸ˍˋʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 Ϯ Cautions : (1) Storage ConditionsΚ Ϡ The LEDs should be kept at 30к or less and 60% RH or less and should be used within a year and should be soldered within 168 hours (7days) after opening the package. (2) Heat Generation Ϡ The thermal design of the end product is very important. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. Ϡ The operating current should be decided after considering the ambient maximum temperature of LEDs. (3) Cleaning Ϡ Isopropyl alcohol is recommended to be used as a solvent for cleaning the LEDs. Ϡ Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍˌʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 (4) Soldering Ϡ Bright View LEDs use a copper alloy lead frame which provides a high thermal conductivity. Thermal stress such as soldering heat may reduce the reliability of the product; particular caution should be used to avoid damage prior to and during soldering. The recommended soldering conditions are listed in the following table. Ϡ Although the recommended soldering conditions are specified in the below table, dip or soldering at the lowest possible temperature is desirable. Ϡ When it is necessary to clamp the LEDs to prevent soldering failure, it is important to the mechanical stress on the LEDs. Ϡ Solder the LED no closer than 1.6mm from the base of the stopper. Ϡ Dip soldering and hand solding should not be done more than one time. Ϡ A rapid-rate process is not recommended for cooling the LEDs down from the peak temperatu Ϡ Cut the LED leadframes at room temperature. Cutting the leadframes at high temperature may cause failure of the LEDs. Ϡ Recommended soldering conditions Dip Soldering Hand Soldering Temperature Pre-Heat 350к Max. 120к Max. Soldering Time Pre-Heat Time 3 seconds Max. 60 seconds Max. Position No closer than 1.6 mmSolder Bath Temperatu260к Max. from the base of the Dipping Time 5 seconds Max. Dipping Position stopper. No lower than 1.6 mm from the base of the stopper. ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍ˄˃ʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕ Bright View Electronics BVZ-925QT4 (5) Other Ϡ Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. Ϡ The LED light output is strong enough to injure human eyes. Precaution must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds Ϡ The LEDs described here are intended to be used for ordinary electronic equipment, please consult Bright View's sales department in advance for information on applications. Ϡ The appearance and specifications of the product may be modified for improvement without notice. ˗˴̇˸ˍ˅˃˃ˊ˂ˊ˂˄ˉ ˣ˴˺˸ˍ˄˄ʳ̂˹ʳ˄˄ ˩˸̅̆˼̂́ˀ˕