CYUSB301X EZ-USB® FX3: SuperSpeed USB Controller Features ■ ■ ■ ■ ■ Universal serial bus (USB) integration ❐ USB 3.0 and USB 2.0 peripherals compliant with USB 3.0 specification 1.0 ❐ 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 ❐ High-speed On-The-Go (HS-OTG) host and peripheral compliant with OTG Supplement Version 2.0 ❐ Thirty-two physical endpoints ❐ Support for battery charging Spec 1.1 and accessory charger adaptor (ACA) detection General Programmable Interface (GPIF™ II) ❐ Programmable 100-MHz GPIF II enables connectivity to a wide range of external devices ❐ 8-, 16-, and 32-bit data bus ❐ As many as16 configurable control signals Fully accessible 32-bit CPU ❐ ARM926EJ core with 200-MHz operation ❐ 512-KB or 256-KB embedded SRAM Additional connectivity to the following peripherals 2 ❐ I C master controller at 1 MHz 2 ❐ I S master (transmitter only) at sampling frequencies of 32 kHz, 44.1 kHz, and 48 kHz ❐ UART support of up to 4 Mbps ❐ SPI master at 33 MHz Selectable clock input frequencies ❐ 19.2, 26, 38.4, and 52 MHz ❐ 19.2-MHz crystal input support Cypress Semiconductor Corporation Document Number: 001-52136 Rev. *N • ■ Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off ■ Independent power domains for core and I/O ❐ Core operation at 1.2 V 2 ❐ I S, UART, and SPI operation at 1.8 to 3.3 V 2 ❐ I C operation at 1.2 V ■ Package option ❐ 121-ball, 10- × 10-mm, 0.8-mm pitch Pb-free ball grid array (BGA) ❐ 131-ball, 4.7- × 5.1-mm, 0.4-mm pitch wafer-level chip scale package (WLCSP) ■ EZ-USB® software and development kit (DVK) for easy code development Applications ■ Digital video camcorders ■ Digital still cameras ■ Printers ■ Scanners ■ Video capture cards ■ Test and measurement equipment ■ Surveillance cameras ■ Personal navigation devices ■ Medical imaging devices ■ Video IP phones ■ Portable media players ■ Industrial cameras 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised May 31, 2013 TDO TCK TMS TDI Logic Block Diagram TRST# CYUSB301X FSLC[0] FSLC[1] FSLC[2] JTAG CLKIN CLKIN_32 Embedded SRAm (512 kB/ 256 KB) XTALIN ARM926EJ -S XTALOUT HS/FS/LS OTG Host OTG_ID SSRX - DQ[31:0]/ DQ[15:0] PMODE[2:0] 32 EPs GPIF™ II HS/FS Peripheral SSRX + USB INTERFACE SS Peripheral CTL[12:0] SSTX SSTX + D+ D- INT# RESET # EZ-Dtect™ I2S_MSCLK I2S_SD I2S_WS MOSI I2S I2S_CLK SCK MISO SSN SPI RTS RX TX I2C_SDA I2C_SCL Document Number: 001-52136 Rev. *N CTS UART I2C Page 2 of 45 CYUSB301X Contents Functional Overview ..........................................................4 Application Examples ....................................................4 USB Interface ......................................................................5 OTG ...............................................................................5 ReNumeration ...............................................................6 EZ-Dtect ........................................................................6 VBUS Overvoltage Protection .......................................6 Carkit UART Mode ........................................................6 GPIF II ..................................................................................7 CPU ......................................................................................7 JTAG Interface ....................................................................8 Other Interfaces ..................................................................8 UART Interface ..............................................................8 I2C Interface ..................................................................8 I2S Interface ..................................................................8 SPI Interface ..................................................................8 Boot Options .......................................................................9 Reset ....................................................................................9 Hard Reset ....................................................................9 Soft Reset ......................................................................9 Clocking ..............................................................................9 32-kHz Watchdog Timer Clock Input ...........................10 Power .................................................................................10 Power Modes ..............................................................10 Configuration Options .....................................................13 Digital I/Os .........................................................................13 GPIOs .................................................................................13 System-level ESD .............................................................13 Pin Configurations ...........................................................13 Document Number: 001-52136 Rev. *N Pin Description .................................................................15 Absolute Maximum Ratings ............................................22 Operating Conditions .......................................................22 DC Specifications .............................................................22 AC Timing Parameters .....................................................24 GPIF II Timing .............................................................24 Slave FIFO Interface ...................................................27 Synchronous Slave FIFO Write Sequence Description ...............................................28 Asynchronous Slave FIFO Read Sequence Description ...............................................29 Asynchronous Slave FIFO Write Sequence Description ...............................................30 Serial Peripherals Timing ............................................33 Reset Sequence ................................................................38 Package Diagram ..............................................................39 Ordering Information ........................................................41 Ordering Code Definitions ...........................................41 Acronyms ..........................................................................42 Document Conventions ...................................................42 Units of Measure .........................................................42 Document History Page ...................................................43 Sales, Solutions, and Legal Information ........................45 Worldwide Sales and Design Support .........................45 Products ......................................................................45 PSoC Solutions ...........................................................45 Page 3 of 45 CYUSB301X Functional Overview FX3 contains 512 KB or 256 KB of on-chip SRAM (see Ordering Information on page 41) for code and data. EZ-USB FX3 also provides interfaces to connect to serial peripherals such as UART, SPI, I2C, and I2S. Cypress’s EZ-USB FX3 is the next-generation USB 3.0 peripheral controller, providing integrated and flexible features. FX3 comes with application development tools. The software development kit comes with application examples for accelerating time to market. FX3 has a fully configurable, parallel, general programmable interface called GPIF II, which can connect to any processor, ASIC, or FPGA. GPIF II is an enhanced version of the GPIF in FX2LP, Cypress’s flagship USB 2.0 product. It provides easy and glueless connectivity to popular interfaces, such as asynchronous SRAM, asynchronous and synchronous address data multiplexed interfaces, and parallel ATA. FX3 complies with the USB 3.0 v1.0 specification and is also backward compatible with USB 2.0. It also complies with the Battery Charging Specification v1.1 and USB 2.0 OTG Specification v2.0. FX3 has integrated the USB 3.0 and USB 2.0 physical layers (PHYs) along with a 32-bit ARM926EJ-S microprocessor for powerful data processing and for building custom applications. It implements an architecture that enables 375-MBps data transfer from GPIF II to the USB interface. Application Examples In a typical application (see Figure 1), FX3 functions as a coprocessor and connects to an external processor, which manages system-level functions. Figure 2 shows a typical application diagram when FX3 functions as the main processor. An integrated USB 2.0 OTG controller enables applications in which FX3 may serve dual roles; for example, EZ-USB FX3 may function as an OTG Host to MSC as well as HID-class devices. Figure 1. EZ-USB FX3 as a Coprocessor External Processor (Example:text MCU/CPU/ ASIC/FPGA) GPIF II Power Subsystem XTALOUT XTALIN Crystal * EZ- USB FX3 ( ARM9 Core) USB Port USB Host Serial Interfaces ( example: I2C) * A clock input may be provided on the CLKIN pin instead of a crystal input External Serial Peripheral (Example:: EEPROM) Note 1. Assuming that GPIF II is configured for a 32-bit data bus (available with certain part numbers; see Ordering Information on page 41), synchronous interface operating at 100 MHz. This number also includes protocol overheads. Document Number: 001-52136 Rev. *N Page 4 of 45 CYUSB301X Figure 2. EZ-USB FX3 as Main Processor External Slave Device (Example: Image sensor) GPIF II XTALIN XTALOUT Crystal * EZ-USB FX3 (ARM9 Core) USB Port USB Host I2C * A clock input may be provided on the CLKIN pin instead of a crystal input EEPROM Figure 3. USB Interface Signals EZ-USB FX3 FX3 complies with the following specifications and supports the following features: ■ Supports USB peripheral functionality compliant with USB 3.0 Specification Revision 1.0 and is also backward compatible with the USB 2.0 Specification. ■ Complies with OTG Supplement Revision 2.0. It supports High-Speed, Full-Speed, and Low-Speed OTG dual-role device capability. As a peripheral, FX3 is capable of SuperSpeed, High-Speed, and Full-Speed. As a host, it is capable of High-Speed, Full-Speed, and Low-Speed. ■ Supports Carkit Pass-Through UART functionality on USB D+/D– lines based on the CEA-936A specification. ■ Supports up to 16 IN and 16 OUT endpoints. ■ Supports the USB 3.0 Streams feature. It also supports USB Attached SCSI (UAS) device-class to optimize mass-storage access performance. ■ ■ As a USB peripheral, FX3 supports UAS, USB Video Class (UVC), Mass Storage Class (MSC), and Media Transfer Protocol (MTP) USB peripheral classes. As a USB peripheral, all other device classes are supported only in pass-through mode when handled entirely by a host processor external to the device. VBATT VBUS OTG_ID SSRXSSRX+ SSTXSSTX+ DD+ USB Interface USB Interface OTG FX3 is compliant with the OTG Specification Revision 2.0. In OTG mode, FX3 supports both A and B device modes and supports Control, Interrupt, Bulk, and Isochronous data transfers. FX3 requires an external charge pump (either standalone or integrated into a PMIC) to power VBUS in the OTG A-device mode. The Target Peripheral List for OTG host implementation consists of MSC- and HID-class devices. FX3 does not support Attach Detection Protocol (ADP). As an OTG host, FX3 supports MSC and HID device classes. Note When the USB port is not in use, disable the PHY and transceiver to save power. Document Number: 001-52136 Rev. *N Page 5 of 45 CYUSB301X OTG Connectivity VBUS Overvoltage Protection In OTG mode, FX3 can be configured to be an A, B, or dual-role device. It can connect to the following: The maximum input voltage on FX3's VBUS pin is 6 V. A charger can supply up to 9 V on VBUS. In this case, an external overvoltage protection (OVP) device is required to protect FX3 from damage on VBUS. Figure 4 shows the system application diagram with an OVP device connected on VBUS. Refer to Table 7 for the operating range of VBUS and VBATT. ■ HNP-capable host ■ OTG device POWER SUBSYSTEM ReNumeration Because of FX3's soft configuration, one chip can take on the identities of multiple distinct USB devices. EZ-Dtect FX3 supports USB Charger and accessory detection (EZ-Dtect). The charger detection mechanism complies with the Battery Charging Specification Revision 1.1. In addition to supporting this version of the specification, FX3 also provides hardware support to detect the resistance values on the ID pin. FX3 can detect the following resistance ranges: ■ Less than 10 ■ Less than 1 k ■ 65 k to 72 k ■ 35 kto 39 k ■ 99.96 k to 104.4 k (102 k2%) ■ 119 k to 132 k ■ Higher than 220 k ■ 431.2 k to 448.8 k (440 k2%) EZ-USB FX3 1 OVP device 2 USB Connector When first plugged into USB, FX3 enumerates automatically with the Cypress Vendor ID (0x04B4) and downloads firmware and USB descriptors over the USB interface. The downloaded firmware executes an electrical disconnect and connect. FX3 enumerates again, this time as a device defined by the downloaded information. This patented two-step process, called ReNumeration, happens instantly when the device is plugged in. VIO5 OTG host AVDD VDD ■ Figure 4. System Diagram with OVP Device For VBUS VIO4 HNP-capable USB peripheral CVDDQ ■ VIO3 SRP-capable USB peripheral VIO2 ■ VIO1 Targeted USB peripheral U3TXVDDQ ■ U3RXVDDQ ACA device SSRXSSRX+ SSTXSSTX+ DD+ 3 4 5 6 7 8 9 VBUS OTG_ID USB-Port ■ GND Carkit UART Mode The USB interface supports the Carkit UART mode (UART over D+/D–) for non-USB serial data transfer. This mode is based on the CEA-936A specification. In the Carkit UART mode, the output signaling voltage is 3.3 V. When configured for the Carkit UART mode, TXD of UART (output) is mapped to the D– line, and RXD of UART (input) is mapped to the D+ line. In the Carkit UART mode, FX3 disables the USB transceiver and D+ and D– pins serve as pass-through pins to connect to the UART of the host processor. The Carkit UART signals may be routed to the GPIF II interface or to GPIO[48] and GPIO[49], as shown in Figure 5 on page 7. In this mode, FX3 supports a rate of up to 9600 bps. FX3's charger detects a dedicated wall charger, Host/Hub charger, and Host/Hub. Document Number: 001-52136 Rev. *N Page 6 of 45 CYUSB301X Figure 5. Carkit UART Pass-through Block Diagram Ctrl Carkit UART Pass-through UART_ TXD TXD UART_RXD RXD RXD(DP) USB-Port ( ) Carkit UART Pass-through Interface on GPIF II Carkit UART Pass-through Interface on GPIOs MUX DP GPIO[48] (UART_TX) USB PHY DM GPIO[49] ( UART_RX) GPIF II The high-performance GPIF II interface enables functionality similar to, but more advanced than, FX2LP’s GPIF and Slave FIFO interfaces. Note Access to all 32 buffers is also supported over the slave FIFO interface. For details, contact Cypress Applications Support. Figure 6. Slave FIFO Interface SLCS# The GPIF II is a programmable state machine that enables a flexible interface that may function either as a master or slave in industry-standard or proprietary interfaces. Both parallel and serial interfaces may be implemented with GPIF II. PKTEND FLAGB FLAGA External Processor Here are a list of GPIF II features: ■ Functions as master or slave ■ Provides 256 firmware programmable states ■ Supports 8-bit, 16-bit, and 32-bit parallel data bus ■ Enables interface frequencies up to 100 MHz ■ Supports 14 configurable control pins when a 32- bit data bus is used. All control pins can be either input/output or bidirectional. ■ Supports 16 configurable control pins when a 16/8 data bus is used. All control pins can be either input/output or bi-directional. GPIF II state transitions are based on control input signals. The control output signals are driven as a result of the GPIF II state transitions. The INT# output signal can be controlled by GPIF II. Refer to the GPIFII Designer tool. The GPIF II state machine’s behavior is defined by a GPIF II descriptor. The GPIF II descriptor is designed such that the required interface specifications are met. 8 kB of memory (separate from the 512 kB of embedded SRAM) is dedicated to the GPIF II waveform where the GPIF II descriptor is stored in a specific format. Cypress’s GPIFII Designer Tool enables fast development of GPIF II descriptors and includes examples for common interfaces. Example implementations of GPIF II are the asynchronous slave FIFO and synchronous slave FIFO interfaces. Slave FIFO interface The Slave FIFO interface signals are shown in Figure 6. This interface allows an external processor to directly access up to four buffers internal to FX3. Further details of the Slave FIFO interface are described on page 27. Document Number: 001-52136 Rev. *N TXD(DM) A[1:0] D[31:0] EZ-USB FX3 SLWR# SLRD# SLOE# Note: Multiple Flags may be configured. CPU FX3 has an on-chip 32-bit, 200-MHz ARM926EJ-S core CPU. The core has direct access to 16 kB of Instruction Tightly Coupled Memory (TCM) and 8 kB of Data TCM. The ARM926EJ-S core provides a JTAG interface for firmware debugging. FX3 offers the following advantages: ■ Integrates 512 KB of embedded SRAM for code and data and 8 kB of Instruction cache and Data cache. ■ Implements efficient and flexible DMA connectivity between the various peripherals (such as, USB, GPIF II, I2S, SPI, UART), requiring firmware only to configure data accesses between peripherals, which are then managed by the DMA fabric. ■ Allows easy application development on industry-standard development tools for ARM926EJ-S. Examples of the FX3 firmware are available with the Cypress EZ-USB FX3 Development Kit. Software APIs that can be ported to an external processor are available with the Cypress EZ-USB FX3 Software Development Kit. Page 7 of 45 CYUSB301X JTAG Interface I2C Interface FX3’s JTAG interface has a standard five-pin interface to connect to a JTAG debugger in order to debug firmware through the CPU-core's on-chip-debug circuitry. FX3’s I2C interface is compatible with the I2C Bus Specification Revision 3. This I2C interface is capable of operating only as I2C master; therefore, it may be used to communicate with other I2C slave devices. For example, FX3 may boot from an EEPROM connected to the I2C interface, as a selectable boot option. Industry-standard debugging tools for the ARM926EJ-S core can be used for the FX3 application development. Other Interfaces FX3 supports the following serial peripherals: ■ UART ■ I2C 2 ■I S ■ SPI The SPI, UART, and I2S interfaces are multiplexed on the serial peripheral port. The CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) on page 15 shows details of how these interfaces are multiplexed. Note that when GPIF II is configured for a 32-bit data bus width (CYUSB3012 and CYUSB3014), only the UART interface is available on GPIO[53] to GPIO[56]. UART Interface The UART interface of FX3 supports full-duplex communication. It includes the signals noted in Table 1. Table 1. UART Interface Signals Signal TX RX CTS RTS Description Output signal Input signal Flow control Flow control The UART is capable of generating a range of baud rates, from 300 bps to 4608 Kbps, selectable by the firmware. If flow control is enabled, then FX3's UART only transmits data when the CTS input is asserted. In addition to this, FX3’s UART asserts the RTS output signal, when it is ready to receive data. Document Number: 001-52136 Rev. *N FX3’s I2C Master Controller also supports multi-master mode functionality. The power supply for the I2C interface is VIO5, which is a separate power domain from the other serial peripherals. This gives the I2C interface the flexibility to operate at a different voltage than the other serial interfaces. The I2C controller supports bus frequencies of 100 kHz, 400 kHz, and 1 MHz. When VIO5 is 1.2 V, the maximum operating frequency supported is 100 kHz. When VIO5 is 1.8 V, 2.5 V, or 3.3 V, the operating frequencies supported are 400 kHz and 1 MHz. The I2C controller supports the clock-stretching feature to enable slower devices to exercise flow control. The I2C interface’s SCL and SDA signals require external pull-up resistors. The pull-up resistors must be connected to VIO5. I2S Interface FX3 has an I2S port to support external audio codec devices. FX3 functions as I2S Master as transmitter only. The I2S interface consists of four signals: clock line (I2S_CLK), serial data line (I2S_SD), word select line (I2S_WS), and master system clock (I2S_MCLK). FX3 can generate the system clock as an output on I2S_MCLK or accept an external system clock input on I2S_MCLK. The sampling frequencies supported by the I2S interface are 32 kHz, 44.1 kHz, and 48 kHz. SPI Interface FX3 supports an SPI Master interface on the Serial Peripherals port. The maximum operation frequency is 33 MHz. The SPI controller supports four modes of SPI communication (see SPI Timing Specification on page 36 for details on the modes) with the Start-Stop clock. This controller is a single-master controller with a single automated SSN control. It supports transaction sizes ranging from 4 bits to 32 bits. Page 8 of 45 CYUSB301X Boot Options Clocking FX3 can load boot images from various sources, selected by the configuration of the PMODE pins. Following are the FX3 boot options: FX3 allows either a crystal to be connected between the XTALIN and XTALOUT pins or an external clock to be connected at the CLKIN pin. The XTALIN, XTALOUT, CLKIN, and CLKIN_32 pins can be left unconnected if they are not used. ■ Boot from USB ■ Boot from I2C ■ Boot from SPI (SPI devices supported are M25P16 (16 Mbit), M25P80 (8 Mbit), and M25P40 (4 Mbit)) or their equivalents ■ Boot from GPIF II ASync ADMux mode ■ Boot from GPIF II Sync ADMux mode ■ Boot from GPIF II ASync SRAM mode Crystal frequency supported is 19.2 MHz, while the external clock frequencies supported are 19.2, 26, 38.4, and 52 MHz. Table 2. FX3 Booting Options PMODE[2:0] [2] F00 F01 F11 F0F F1F 1FF 0F1 Boot From Sync ADMux (16-bit) Async ADMux (16-bit) USB boot Async SRAM (16-bit) I2C, On Failure, USB Boot is Enabled I2C only SPI, On Failure, USB Boot is Enabled FX3 has an on-chip oscillator circuit that uses an external 19.2-MHz (±100 ppm) crystal (when the crystal option is used). An appropriate load capacitance is required with a crystal. Refer to the specification of the crystal used to determine the appropriate load capacitance. The FSLC[2:0] pins must be configured appropriately to select the crystal- or clock-frequency option. The configuration options are shown in Table 3. Clock inputs to FX3 must meet the phase noise and jitter requirements specified in Table 4 on page 10. The input clock frequency is independent of the clock and data rate of the FX3 core or any of the device interfaces (including P-Port and S-Port). The internal PLL applies the appropriate clock multiply option depending on the input frequency. Table 3. Crystal/Clock Frequency Selection FSLC[2] FSLC[1] FSLC[0] Crystal/Clock Frequency 0 0 0 19.2-MHz crystal 1 0 0 19.2-MHz input CLK Hard Reset 1 0 1 26-MHz input CLK A hard reset is initiated by asserting the Reset# pin on FX3. The specific reset sequence and timing requirements are detailed in Figure 19 on page 38 and Table 16 on page 38. All I/Os are tristated during a hard reset. 1 1 0 38.4-MHz input CLK 1 1 1 52-MHz input CLK Reset Soft Reset In a soft reset, the processor sets the appropriate bits in the PP_INIT control register. There are two types of Soft Reset: ■ CPU Reset – The CPU Program Counter is reset. Firmware does not need to be reloaded following a CPU Reset. ■ Whole Device Reset – This reset is identical to Hard Reset. ■ The firmware must be reloaded following a Whole Device Reset. Note 2. F indicates Floating. Document Number: 001-52136 Rev. *N Page 9 of 45 CYUSB301X Table 4. FX3 Input Clock Specifications Parameter Specification Description Phase noise Units Min Max 100-Hz offset – –75 dB 1- kHz offset – –104 dB 10-kHz offset – –120 dB 100-kHz offset – –128 dB 1-MHz offset – –130 dB Maximum frequency deviation – 150 ppm Duty cycle 30 70 % Overshoot – 3 % Undershoot – –3 % Rise time/fall time – 3 ns ❐ 32-kHz Watchdog Timer Clock Input ❐ FX3 includes a watchdog timer. The watchdog timer can be used to interrupt the ARM926EJ-S core, automatically wake up the FX3 in Standby mode, and reset the ARM926EJ-S core. The watchdog timer runs a 32-kHz clock, which may be optionally supplied from an external source on a dedicated FX3 pin. The firmware can disable the watchdog timer. Requirements for the optional 32-kHz clock input are listed in Table 5. ■ Table 5. 32-kHz Clock Input Requirements Parameter Min Max Units Duty cycle 40 60 % Frequency deviation – ±200 ppm Rise time/fall time – 200 ns FX3 supports the following power modes: ■ Normal mode: This is the full-functional operating mode. The internal CPU clock and the internal PLLs are enabled in this mode. ❐ Normal operating power consumption does not exceed the sum of ICC Core max and ICC USB max (see Table 7 for current consumption specifications). ❐ The I/O power supplies VIO2, VIO3, VIO4, and VIO5 can be turned off when the corresponding interface is not in use. VIO1 cannot be turned off at any time if the GPIF II interface is used in the application. ■ Low-power modes (see Table 6 on page 11): ❐ Suspend mode with USB 3.0 PHY enabled (L1) ❐ Suspend mode with USB 3.0 PHY disabled (L2) ❐ Standby mode (L3) ❐ Core power-down mode (L4) FX3 has the following power supply domains: IO_VDDQ: This is a group of independent supply domains for digital I/Os. The voltage level on these supplies is 1.8 V to 3.3 V. FX3 provides six independent supply domains for digital I/Os listed as follows (see Table 7 for details on each of the power domain signals): ❐ VIO1: GPIF II I/O ❐ VIO2: IO2 ❐ VIO3: IO3 2 ❐ VIO4: UART-/SPI/I S 2 ❐ VIO5: I C and JTAG (supports 1.2 V to 3.3 V) Document Number: 001-52136 Rev. *N VBATT/VBUS: This is the 3.2-V to 6-V battery power supply for the USB I/O and analog circuits. This supply powers the USB transceiver through FX3's internal voltage regulator. VBATT is internally regulated to 3.3 V. Power Modes Power ■ CVDDQ: Clock VDD: This is the supply voltage for the logic core. The nominal supply-voltage level is 1.2 V. This supplies the core logic circuits. The same supply must also be used for the following: • AVDD: This is the 1.2-V supply for the PLL, crystal oscillator, and other core analog circuits • U3TXVDDQ/U3RXVDDQ: These are the 1.2-V supply voltages for the USB 3.0 interface. Page 10 of 45 CYUSB301X Table 6. Entry and Exit Methods for Low-Power Modes Low-Power Mode Suspend Mode with USB 3.0 PHY Enabled (L1) Characteristics ■ The power consumption in this mode does not exceed ISB1 ■ USB 3.0 PHY is enabled and is in U3 mode (one of the suspend modes defined by the USB 3.0 specification). This one block alone is operational with its internal clock while all other clocks are shut down ■ All I/Os maintain their previous state ■ Power supply for the wakeup source and core power must be retained. All other power domains can be turned on/off individually ■ Suspend Mode with USB 3.0 PHY Disabled (L2) Methods of Entry ■ ■ Firmware executing on ARM926EJ-S core can put FX3 into suspend mode. For example, on USB suspend condition, firmware may decide to put FX3 into suspend mode External Processor, through the use of mailbox registers, can put FX3 into suspend mode The states of the configuration registers, buffer memory, and all internal RAM are maintained ■ All transactions must be completed before FX3 enters Suspend mode (state of outstanding transactions are not preserved) ■ The firmware resumes operation from where it was suspended (except when woken up by RESET# assertion) because the program counter does not reset ■ The power consumption in this mode does not exceed ISB2 ■ USB 3.0 PHY is disabled and the USB interface is in suspend mode ■ The clocks are shut off. The PLLs are disabled ■ All I/Os maintain their previous state ■ USB interface maintains the previous state ■ ■ Firmware executing on ARM926EJ-S core can put FX3 into suspend mode. For example, on USB suspend condition, firmware may decide to put FX3 into suspend mode External Processor, through the use of mailbox registers can put FX3 into suspend mode Methods of Exit ■ D+ transitioning to low or high ■ D- transitioning to low or high ■ Impedance change on OTG_ID pin ■ Resume condition on SSRX± ■ Detection of VBUS ■ Level detect on UART_CTS (programmable polarity) ■ GPIF II interface assertion of CTL[0] ■ Assertion of RESET# ■ D+ transitioning to low or high ■ D- transitioning to low or high ■ Impedance change on OTG_ID pin ■ Resume condition on SSRX± ■ Detection of VBUS ■ Power supply for the wakeup source and core power must be retained. All other power domains can be turned on/off individually ■ Level detect on UART_CTS (programmable polarity) ■ The states of the configuration registers, buffer memory and all internal RAM are maintained ■ GPIF II interface assertion of CTL[0] ■ Assertion of RESET# ■ All transactions must be completed before FX3 enters Suspend mode (state of outstanding transactions are not preserved) ■ The firmware resumes operation from where it was suspended (except when woken up by RESET# assertion) because the program counter does not reset Document Number: 001-52136 Rev. *N Page 11 of 45 CYUSB301X Table 6. Entry and Exit Methods for Low-Power Modes (continued) Low-Power Mode Standby Mode (L3) Core Power Down Mode (L4) Characteristics ■ The power consumption in this mode does not exceed ISB3 ■ All configuration register settings and program/data RAM contents are preserved. However, data in the buffers or other parts of the data path, if any, is not guaranteed. Therefore, the external processor should take care that the data needed is read before putting FX3 into this Standby Mode ■ The program counter is reset after waking up from Standby ■ GPIO pins maintain their configuration ■ Crystal oscillator is turned off ■ Internal PLL is turned off ■ USB transceiver is turned off ■ ARM926EJ-S core is powered down. Upon wakeup, the core re-starts and runs the program stored in the program/data RAM ■ Power supply for the wakeup source and core power must be retained. All other power domains can be turned on/off individually ■ The power consumption in this mode does not exceed ISB4 ■ Core power is turned off ■ All buffer memory, configuration registers, and the program RAM do not maintain state. After exiting this mode, reload the firmware ■ In this mode, all other power domains can be turned on/off individually Document Number: 001-52136 Rev. *N Methods of Entry ■ ■ Firmware executing on ARM926EJ-S core or external processor configures the appropriate register Turn off VDD Methods of Exit ■ Detection of VBUS ■ Level detect on UART_CTS (Programmable Polarity) ■ GPIF II interface assertion of CTL[0] ■ Assertion of RESET# ■ Reapply VDD ■ Assertion of RESET# Page 12 of 45 CYUSB301X Configuration Options Configuration options are available for specific usage models. Contact Cypress Applications or Marketing for details. Digital I/Os FX3 has internal firmware-controlled pull-up or pull-down resistors on all digital I/O pins. An internal 50-k resistor pulls the pins high, while an internal 10-k resistor pulls the pins low to prevent them from floating. The I/O pins may have the following states: ■ Tristated (High-Z) ■ Weak pull-up (via internal 50 k) ■ Pull-down (via internal 10 k) ■ Hold (I/O hold its value) when in low-power modes ■ The JTAG TDI, TMC, and TRST# signals have fixed 50-k internal pull-ups, and the TCK signal has a fixed 10-k pull-down resistor. Similarly, any unused pins on the serial peripheral interfaces may be configured as GPIOs. See Pin Configurations for pin configuration options. All GPIF II and GPIO pins support an external load of up to 16 pF for every pin. EMI FX3 meets EMI requirements outlined by FCC 15B (USA) and EN55022 (Europe) for consumer electronics. FX3 can tolerate reasonable EMI, conducted by the aggressor, outlined by these specifications and continue to function as expected. System-level ESD FX3 has built-in ESD protection on the D+, D–, and GND pins on the USB interface. The ESD protection levels provided on these ports are: All unused I/Os should be pulled high by using the internal pull-up resistors. All unused outputs should be left floating. All I/Os can be driven at full-strength, three-quarter strength, half-strength, or quarter-strength. These drive strengths are configured separately for each interface. GPIOs EZ-USB enables a flexible pin configuration both on the GPIF II and the serial peripheral interfaces. Any unused control pins (except CTL[15]) on the GPIF II interface can be used as GPIOs. ■ ±2.2-KV human body model (HBM) based on JESD22-A114 Specification ■ ±6-KV contact discharge and ±8-KV air gap discharge based on IEC61000-4-2 level 3A ■ ± 8-KV Contact Discharge and ±15-KV Air Gap Discharge based on IEC61000-4-2 level 4C. This protection ensures the device continues to function after ESD events up to the levels stated in this section. The SSRX+, SSRX–, SSTX+, and SSTX– pins only have up to ±2.2-KV HBM internal ESD protection. Pin Configurations Figure 7. FX3 121-ball BGA Ball Map (Top View) A 1 2 3 4 5 6 7 8 9 10 11 U3VSSQ U3RXVDDQ SSRXM SSRXP SSTXP SSTXM AVDD VSS DP DM NC TRST# B VIO4 FSLC[0] R_USB3 FSLC[1] U3TXVDDQ CVDDQ AVSS VSS VSS VDD C GPIO[54] GPIO[55] VDD GPIO[57] RESET# XTALIN XTALOUT R_USB2 OTG_ID TDO D GPIO[50] GPIO[51] GPIO[52] GPIO[53] GPIO[56] CLKIN_32 CLKIN VSS E GPIO[47] VSS VIO3 GPIO[49] GPIO[48] FSLC[2] TDI TMS F VIO2 GPIO[45] GPIO[44] GPIO[41] GPIO[46] TCK GPIO[2] G VSS GPIO[42] GPIO[43] GPIO[30] GPIO[25] GPIO[22] GPIO[21] H VDD GPIO[39] GPIO[40] GPIO[31] GPIO[29] GPIO[26] GPIO[20] GPIO[24] I2C_GPIO[58] I2C_GPIO[59] VIO5 O[60] VDD VBATT VBUS GPIO[5] GPIO[1] GPIO[0] VDD GPIO[15] GPIO[4] GPIO[3] VSS GPIO[7] GPIO[6] VIO1 J GPIO[38] GPIO[36] GPIO[37] GPIO[34] GPIO[28] GPIO[16] GPIO[19] GPIO[14] GPIO[9] GPIO[8] VDD K GPIO[35] GPIO[33] VSS VSS GPIO[27] GPIO[23] GPIO[18] GPIO[17] GPIO[13] GPIO[12] GPIO[10] L VSS VSS VSS GPIO[32] VDD VSS VDD INT# VIO1 GPIO[11] VSS Document Number: 001-52136 Rev. *N Page 13 of 45 CYUSB301X Figure 8. FX3 131-Ball CSP Ball Map (Bottom View) 12 11 10 A VSS VSS SSRXM B GPIO[55] VIO4 SSRXP C GPIO[56] VIO3 U3RXVDDQ D GPIO[49] GPIO[50] 9 8 7 6 5 4 3 2 1 SSTXM FSLC[0] AVSS AVDD DP VSS DM VDD R_USB3 SSTXP FSLC[2] XTALIN XTALOUT NC R_USB2 NC VDD U3VSSQ U3TXVDDQ CVDDQ CLKIN_32 CLKIN VSS OTG_ID TDO TRST# VDD I2C_GPIO[58 ] VIO5 TCK I2C_GPIO[59 ] VSS GPIO[53] GPIO[54] RESET# TMS E GPIO[57] GPIO[48] GPIO[51] GPIO[52] O[60] VSS VSS VSS VSS GPIO[3] VBATT VBUS F VSS GPIO[46] GPIO[47] FSLC[1] TDI VDD VDD VDD VDD GPIO[4] GPIO[1] GPIO[0] G VIO2 GPIO[43] GPIO[44] GPIO[45] VSS VSS VDD VSS GPIO[9] GPIO[7] GPIO[6] GPIO[2] H VSS GPIO[40] GPIO[41] GPIO[42] GPIO[39] VSS GPIO[20] GPIO[18] GPIO[14] GPIO[12] GPIO[8] VIO1 J VIO2 GPIO[38] GPIO[37] GPIO[36] GPIO[31] GPIO[27] GPIO[25] GPIO[22] GPIO[19] GPIO[15] GPIO[10] GPIO[5] K GPIO[35] GPIO[34] GPIO[33] GPIO[32] GPIO[28] GPIO[26] GPIO[16] GPIO[21] INT# GPIO[24] GPIO[11] VSS L VDD VSS VDD GPIO[30] GPIO[29] VIO1 GPIO[23] VSS VIO1 GPIO[17] GPIO[13] VSS Note No ball is populated at location A9 Document Number: 001-52136 Rev. *N Page 14 of 45 CYUSB301X Pin Description Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) BGA WLCSP I/O Name Description GPIF II (VIO1 Power Domain) GPIF II Interface Slave FIFO Interface F10 F1 VIO1 I/O GPIO[0] DQ[0] DQ[0] F9 F2 VIO1 I/O GPIO[1] DQ[1] DQ[1] F7 G1 VIO1 I/O GPIO[2] DQ[2] DQ[2] G10 E3 VIO1 I/O GPIO[3] DQ[3] DQ[3] G9 F3 VIO1 I/O GPIO[4] DQ[4] DQ[4] F8 J1 VIO1 I/O GPIO[5] DQ[5] DQ[5] H10 G2 VIO1 I/O GPIO[6] DQ[6] DQ[6] H9 G3 VIO1 I/O GPIO[7] DQ[7] DQ[7] J10 H2 VIO1 I/O GPIO[8] DQ[8] DQ[8] J9 G4 VIO1 I/O GPIO[9] DQ[9] DQ[9] DQ[10] K11 J2 VIO1 I/O GPIO[10] DQ[10] L10 K2 VIO1 I/O GPIO[11] DQ[11] DQ[11] K10 H3 VIO1 I/O GPIO[12] DQ[12] DQ[12] K9 L2 VIO1 I/O GPIO[13] DQ[13] DQ[13] J8 H4 VIO1 I/O GPIO[14] DQ[14] DQ[14] DQ[15] G8 J3 VIO1 I/O GPIO[15] DQ[15] J6 K6 VIO1 I/O GPIO[16] PCLK CLK K8 L3 VIO1 I/O GPIO[17] CTL[0] SLCS# K7 H5 VIO1 I/O GPIO[18] CTL[1] SLWR# J7 J4 VIO1 I/O GPIO[19] CTL[2] SLOE# H7 H6 VIO1 I/O GPIO[20] CTL[3] SLRD# G7 K5 VIO1 I/O GPIO[21] CTL[4] FLAGA G6 J5 VIO1 I/O GPIO[22] CTL[5] FLAGB K6 L6 VIO1 I/O GPIO[23] CTL[6] GPIO H8 K3 VIO1 I/O GPIO[24] CTL[7] PKTEND# G5 J6 VIO1 I/O GPIO[25] CTL[8] GPIO H6 K7 VIO1 I/O GPIO[26] CTL[9] GPIO K5 J7 VIO1 I/O GPIO[27] CTL[10] GPIO J5 K8 VIO1 I/O GPIO[28] CTL[11] A1 H5 L8 VIO1 I/O GPIO[29] CTL[12] A0 G4 L9 VIO1 I/O GPIO[30] PMODE[0] PMODE[0] H4 J8 VIO1 I/O GPIO[31] PMODE[1] PMODE[1] L4 K9 VIO1 I/O GPIO[32] PMODE[2] PMODE[2] L8 K4 VIO1 I/O INT# INT#/CTL[15] CTL[15] C5 D8 CVDDQ I RESET# RESET# RESET# Note 3. When GPIF II is configured for the 32-bit data bus width, GPIO[50]-GPIO[52] may be configured as GPIOs or I2S, and GPIO[53] to GPIO[56] may be configured as GPIOs or UART interface only. Document Number: 001-52136 Rev. *N Page 15 of 45 CYUSB301X Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) (continued) BGA WLCSP I/O Name Description IO2 (VIO2 Power Domain) GPIF II (32-bit data mode) K2 K10 VIO2 I/O GPIO[33] DQ[16] GPIO J4 K11 VIO2 I/O GPIO[34] DQ[17] GPIO K1 K12 VIO2 I/O GPIO[35] DQ[18] GPIO J2 J9 VIO2 I/O GPIO[36] DQ[19] GPIO J3 J10 VIO2 I/O GPIO[37] DQ[20] GPIO J1 J11 VIO2 I/O GPIO[38] DQ[21] GPIO H2 H8 VIO2 I/O GPIO[39] DQ[22] GPIO H3 H11 VIO2 I/O GPIO[40] DQ[23] GPIO GPIO F4 H10 VIO2 I/O GPIO[41] DQ[24] G2 H9 VIO2 I/O GPIO[42] DQ[25] GPIO G3 G11 VIO2 I/O GPIO[43] DQ[26] GPIO F3 G10 VIO2 I/O GPIO[44] DQ[27] GPIO F2 G09 VIO2 I/O GPIO[45] GPIO IO3 (VIO3 Power Domain) GPIO + SPI GPIO + UART GPIO only GPIF II - 32b + I2S + UART[3] GPIO + I2S UART + SPI + I2S F5 F11 VIO3 I/O GPIO[46] GPIO GPIO GPIO DQ[28] GPIO UART_RT S E1 F10 VIO3 I/O GPIO[47] GPIO GPIO GPIO DQ[29] GPIO UART_CT S E5 E11 VIO3 I/O GPIO[48] GPIO GPIO GPIO DQ[30] GPIO UART_TX E4 D12 VIO3 I/O GPIO[49] GPIO GPIO GPIO DQ[31] GPIO UART_R X D1 D11 VIO3 I/O GPIO[50] GPIO GPIO GPIO I2S_CLK GPIO I2S_CLK D2 E10 VIO3 I/O GPIO[51] GPIO GPIO GPIO I2S_SD GPIO I2S_SD D3 E9 VIO3 I/O GPIO[52] GPIO GPIO GPIO I2S_WS GPIO I2S_WS D4 D10 VIO4 I/O GPIO[53] SPI_SCK UART_RTS GPIO UART_RTS GPIO SPI_SCK C1 D9 VIO4 I/O GPIO[54] SPI_SSN UART_CTS GPIO UART_CTS I2S_CLK SPI_SSN C2 B12 VIO4 I/O GPIO[55] SPI_MISO UART_TX GPIO UART_TX I2S_SD SPI_MIS O D5 C12 VIO4 I/O GPIO[56] SPI_MOSI UART_RX GPIO UART_RX I2S_WS SPI_MOS I C4 E12 VIO4 I/O GPIO[57] GPIO GPIO GPIO I2S_MCLK I2S_MCL K I2S_MCL K C9 C3 VBUS/ VBATT I OTG_ID A3 A10 U3RXVD DQ I SSRXM SSRX- A4 B10 U3RXVD DQ I SSRXP SSRX+ A6 A8 U3TXVD DQ O SSTXM SSTX- A5 B8 U3TXVD DQ O SSTXP SSTX+ IO4 (VIO4) Power Domain USB Port (VBATT/VBUS Power Domain) OTG_ID USB Port (U3TXVDDQ/U3RXVDDQ Power Domain) Document Number: 001-52136 Rev. *N Page 16 of 45 CYUSB301X Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) (continued) BGA WLCSP I/O Name Description USB Port (VBATT/VBUS Power Domain) A9 A4 VBUS/V BATT I/O DP D+ A10 A2 VBUS/V BATT I/O DM D– B4 NC No connect B2 NC A11 No connect Crystal/Clocks (CVDDQ Power Domain) B2 A7 CVDDQ I FSLC[0] C6 B6 AVDD I/O XTALIN FSLC[0] XTALIN C7 B5 AVDD I/O XTALOUT XTALOUT B4 F9 CVDDQ I FSLC[1] FSLC[1] FSLC[2] E6 B7 CVDDQ I FSLC[2] D7 C5 CVDDQ I CLKIN CLKIN D6 C6 CVDDQ I CLKIN_32 CLKIN_32 D9 D6 VIO5 I/O I2C_GPIO[58] I2C_SCL D10 D2 VIO5 I/O I2C_GPIO[59] I2C_SDA I2C and JTAG (VIO5 Power Domain) E7 F8 VIO5 I TDI TDI C10 C2 VIO5 O TDO TDO B11 C1 VIO5 I TRST# TRST# E8 D5 VIO5 I TMS TMS F6 D3 VIO5 I TCK TCK D11 E8 VIO5 O O[60] Charger detect output E10 E2 PWR VBATT B10 B1 PWR VDD A1 PWR VDD Power A1 C9 PWR U3VSSQ E11 E1 PWR VBUS D8 C4 PWR VSS H11 H1 PWR VIO1 E2 K1 PWR VSS L9 L4 PWR VIO1 G1 L5 PWR VSS L7 PWR VIO1 F1 G11 L1 PWR VSS J12 PWR VIO2 H12 PWR VSS G12 PWR VIO2 E3 C11 PWR VIO3 L1 F12 PWR VSS B1 B11 PWR VIO4 L6 A11 PWR VSS A12 PWR VSS B6 C7 PWR CVDDQ B5 C8 PWR U3TXVDDQ A2 C10 PWR U3RXVDDQ C11 D4 PWR VIO5 Document Number: 001-52136 Rev. *N Page 17 of 45 CYUSB301X Table 7. CYUSB3012 and CYUSB3014 Pin List (GPIF II with 32-bit Data Bus Width) (continued) BGA WLCSP I/O Name L11 A3 PWR VSS Description A7 A5 PWR AVDD B7 A6 PWR AVSS C3 F4 PWR VDD B8 D1 PWR VSS E9 F5 PWR VDD B9 E4 PWR VSS F11 F6 PWR VDD E5 PWR VSS F7 PWR VDD E6 PWR VSS GND E7 PWR VSS GND H1 G6 PWR VDD L7 D7 PWR VDD J11 L10 PWR VDD L5 L12 PWR VDD K4 H7 PWR VSS L3 G7 PWR VSS K3 L11 PWR VSS L2 G8 PWR VSS A8 G5 PWR VSS GND Precision Resistors C8 B3 VBUS/V BATT I/O R_usb2 Precision resistor for USB 2.0 (Connect a 6.04 k±1% resistor between this pin and GND) B3 B9 U3TXVD DQ I/O R_usb3 Precision resistor for USB 3.0 (Connect a 200 ±1% resistor between this pin and GND) Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) Pin I/O Name Description GPIF II (VIO1 Power Domain) GPIF II Interface Slave FIFO Interface F10 VIO1 I/O GPIO[0] DQ[0] DQ[0] F9 VIO1 I/O GPIO[1] DQ[1] DQ[1] F7 VIO1 I/O GPIO[2] DQ[2] DQ[2] G10 VIO1 I/O GPIO[3] DQ[3] DQ[3] G9 VIO1 I/O GPIO[4] DQ[4] DQ[4] F8 VIO1 I/O GPIO[5] DQ[5] DQ[5] H10 VIO1 I/O GPIO[6] DQ[6] DQ[6] H9 VIO1 I/O GPIO[7] DQ[7] DQ[7] J10 VIO1 I/O GPIO[8] DQ[8] DQ[8] J9 VIO1 I/O GPIO[9] DQ[9] DQ[9] K11 VIO1 I/O GPIO[10] DQ[10] DQ[10] L10 VIO1 I/O GPIO[11] DQ[11] DQ[11] K10 VIO1 I/O GPIO[12] DQ[12] DQ[12] K9 VIO1 I/O GPIO[13] DQ[13] DQ[13] J8 VIO1 I/O GPIO[14] DQ[14] DQ[14] G8 VIO1 I/O GPIO[15] DQ[15] DQ[15] Document Number: 001-52136 Rev. *N Page 18 of 45 CYUSB301X Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) (continued) I/O Name J6 Pin VIO1 I/O GPIO[16] PCLK Description CLK K8 VIO1 I/O GPIO[17] CTL[0] SLCS# SLWR# K7 VIO1 I/O GPIO[18] CTL[1] J7 VIO1 I/O GPIO[19] CTL[2] SLOE# H7 VIO1 I/O GPIO[20] CTL[3] SLRD# G7 VIO1 I/O GPIO[21] CTL[4] FLAGA G6 VIO1 I/O GPIO[22] CTL[5] FLAGB K6 VIO1 I/O GPIO[23] CTL[6] GPIO H8 VIO1 I/O GPIO[24] CTL[7] PKTEND# G5 VIO1 I/O GPIO[25] CTL[8] GPIO H6 VIO1 I/O GPIO[26] CTL[9] GPIO K5 VIO1 I/O GPIO[27] CTL[10] GPIO J5 VIO1 I/O GPIO[28] CTL[11] A1 H5 VIO1 I/O GPIO[29] CTL[12] A0 G4 VIO1 I/O GPIO[30] PMODE[0] PMODE[0] H4 VIO1 I/O GPIO[31] PMODE[1] PMODE[1] L4 VIO1 I/O GPIO[32] PMODE[2] PMODE[2] L8 VIO1 I/O INT# INT#/CTL[15] CTL[15] C5 CVDDQ I RESET# RESET# RESET# IO2 (VIO2 Power Domain) K2 VIO2 I/O GPIO[33] GPIO J4 VIO2 I/O GPIO[34] GPIO K1 VIO2 I/O GPIO[35] GPIO J2 VIO2 I/O GPIO[36] GPIO J3 VIO2 I/O GPIO[37] GPIO J1 VIO2 I/O GPIO[38] GPIO H2 VIO2 I/O GPIO[39] GPIO H3 VIO2 I/O GPIO[40] GPIO F4 VIO2 I/O GPIO[41] GPIO G2 VIO2 I/O GPIO[42] GPIO G3 VIO2 I/O GPIO[43] GPIO F3 VIO2 I/O GPIO[44] GPIO F2 VIO2 I/O GPIO[45] GPIO IO3 (VIO3 Power Domain) F5 VIO3 I/O GPIO[46] GPIO E1 VIO3 I/O GPIO[47] GPIO E5 VIO3 I/O GPIO[48] GPIO E4 VIO3 I/O GPIO[49] GPIO D1 VIO3 I/O GPIO[50] GPIO GPIO GPIO I2S_CLK GPIO D2 VIO3 I/O GPIO[51] GPIO GPIO GPIO I2S_SD GPIO I2S_CLK I2S_SD D3 VIO3 I/O GPIO[52] GPIO GPIO GPIO I2S_WS GPIO I2S_WS IO4 (VIO4) Power Domain D4 VIO4 I/O GPIO[53] SPI_SCK UART_RTS GPIO UART_RTS GPIO SPI_SCK C1 VIO4 I/O GPIO[54] SPI_SSN UART_CTS GPIO UART_CTS I2S_CLK SPI_SSN C2 VIO4 I/O GPIO[55] SPI_MISO UART_TX GPIO UART_TX UART_TX SPI_MISO D5 VIO4 I/O GPIO[56] SPI_MOSI UART_RX GPIO UART_RX UART_RX SPI_MOSI Document Number: 001-52136 Rev. *N Page 19 of 45 CYUSB301X Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) (continued) Pin C4 VIO4 I/O Name I/O GPIO[57] Description GPIO GPIO GPIO I2S_MCLK I2S_MCLK I2S_MCLK USB Port (VBATT/VBUS Power Domain) C9 VBUS/ VBATT I OTG_ID OTG_ID A3 U3RXVDDQ I SSRXM SSRX- A4 U3RXVDDQ I SSRXP SSRX+ A6 U3TXVDDQ O SSTXM SSTX- A5 U3TXVDDQ O SSTXP USB Port (U3TXVDDQ/U3RXVDDQ Power Domain) SSTX+ USB Port (VBATT/VBUS Power Domain) A9 VBUS/VBATT I/O DP D+ A10 VBUS/VBATT I/O DM D– A11 NC No connect Crystal/Clocks (CVDDQ Power Domain) B2 CVDDQ I FSLC[0] FSLC[0] C6 AVDD I/O XTALIN XTALIN C7 AVDD I/O XTALOUT XTALOUT B4 CVDDQ I FSLC[1] FSLC[1] E6 CVDDQ I FSLC[2] FSLC[2] D7 CVDDQ I CLKIN CLKIN D6 CVDDQ I CLKIN_32 CLKIN_32 I2C and JTAG (VIO5 Power Domain) D9 VIO5 I/O I2C_GPIO[58] I2C_SCL D10 VIO5 I/O I2C_GPIO[59] I2C_SDA E7 VIO5 I TDI TDI C10 VIO5 O TDO TDO B11 VIO5 I TRST# TRST# E8 VIO5 I TMS TMS F6 VIO5 I TCK TCK D11 VIO5 O O[60] Charger detect output E10 PWR VBATT B10 PWR VDD A1 PWR U3VSSQ E11 PWR VBUS D8 PWR VSS H11 PWR VIO1 E2 PWR VSS L9 PWR VIO1 G1 PWR VSS VIO2 Power F1 PWR G11 PWR VSS E3 PWR VIO3 L1 PWR VSS B1 PWR VIO4 L6 PWR VSS Document Number: 001-52136 Rev. *N Page 20 of 45 CYUSB301X Table 8. CYUSB3011 and CYUSB3013 Pin List (GPIF II with 16-bit Data Bus Width) (continued) I/O Name B6 Pin PWR CVDDQ B5 PWR U3TXVDDQ A2 PWR U3RXVDDQ C11 PWR VIO5 L11 PWR VSS A7 PWR AVDD B7 PWR AVSS C3 PWR VDD B8 PWR VSS E9 PWR VDD B9 PWR VSS F11 PWR VDD H1 PWR VDD L7 PWR VDD J11 PWR VDD L5 PWR VDD K4 PWR VSS L3 PWR VSS K3 PWR VSS L2 PWR VSS A8 PWR VSS Description Precision Resistors C8 VBUS/VBATT I/O R_usb2 Precision resistor for USB 2.0 (Connect a 6.04 k±1% resistor between this pin and GND) B3 U3TXVDDQ I/O R_usb3 Precision resistor for USB 3.0 (Connect a 200 ±1% resistor between this pin and GND) Document Number: 001-52136 Rev. *N Page 21 of 45 CYUSB301X Absolute Maximum Ratings ■ Exceeding maximum ratings may shorten the useful life of the device. Latch-up current .........................................................> 200 mA Storage temperature .................................... –65 °C to +150 °C Ambient temperature with power supplied (Industrial) ............................ –40 °C to +85 °C Ambient temperature with power supplied (Commercial) ............................. 0 °C to +70 °C Supply voltage to ground potential VDD, AVDDQ ......................................................................1.25 V VIO1,VIO2, VIO3, VIO4, VIO5 ............................................. ...3.6 V U3TXVDDQ, U3RXVDDQ .............................................. .....1.25 V DC input voltage to any input pin ........................... .VCC + 0.3 V ± 6-KV contact discharge, ± 8-KV air gap discharge based on IEC61000-4-2 level 3A, ± 8-KV contact discharge, and ± 15-KV air gap discharge based on IEC61000-4-2 level 4C Maximum output short-circuit current for all I/O configurations. (Vout = 0 V) ........................ –100 mA Operating Conditions TA (ambient temperature under bias) Industrial ........................................................ –40 °C to +85 °C Commercial ....................................................... 0 °C to +70 °C VDD, AVDDQ, U3TXVDDQ, U3RXVDDQ Supply voltage ..................................................1.15 V to 1.25 V VBATT supply voltage ...............................................3.2 V to 6 V DC voltage applied to outputs in high Z state ............................................ VCC + 0.3 V (VCC is the corresponding I/O voltage) VIO1, VIO2, VIO3, VIO4, CVDDQ Static discharge voltage ESD protection levels: VIO5 supply voltage ............................................ 1.15 V to 3.6 V ■ ± 2.2-KV HBM based on JESD22-A114 ■ Additional ESD protection levels on D+, D–, and GND pins, and serial peripheral pins Supply voltage ......................................................1.7 V to 3.6 V DC Specifications Min Max Units VDD Parameter Core voltage supply Description 1.15 1.25 V AVDD Analog voltage supply 1.15 1.25 V 1.2-V typical VIO1 GPIF II I/O power supply domain 1.7 3.6 V 1.8-, 2.5-, and 3.3-V typical VIO2 IO2 power supply domain 1.7 3.6 V 1.8-, 2.5-, and 3.3-V typical VIO3 IO3 power supply domain 1.7 3.6 V 1.8-, 2.5-, and 3.3-V typical VIO4 UART/SPI/I2S power supply domain 1.7 3.6 V 1.8-, 2.5-, and 3.3-V typical VBATT USB voltage supply 3.2 6 V 3.7-V typical VBUS USB voltage supply 4.0 6 V 5-V typical U3TXVDDQ USB 3.0 1.2-V supply 1.15 1.25 V 1.2-V typical. A 22-µF bypass capacitor is required on this power supply. U3RXVDDQ USB 3.0 1.2-V supply 1.15 1.25 V 1.2-V typical. A 22-µF bypass capacitor is required on this power supply. CVDDQ Clock voltage supply 1.7 3.6 V 1.8-, 3.3-V typical 2 VIO5 I C and JTAG voltage supply VIH1 Input HIGH voltage 1 VIH2 Input HIGH voltage 2 VIL Input LOW voltage VOH Output HIGH voltage Document Number: 001-52136 Rev. *N Notes 1.2-V typical 1.15 3.6 V 1.2-, 1.8-, 2.5-, and 3.3-V typical 0.625 × VCC VCC + 0.3 V For 2.0 V VCC 3.6 V (except USB port).VCC is the corresponding I/O voltage supply. VCC – 0.4 VCC + 0.3 V For 1.7 V VCC 2.0 V (except USB port).VCC is the corresponding I/O voltage supply. –0.3 0.25 × VCC V VCC is the corresponding I/O voltage supply. 0.9 × VCC – V IOH (max) = –100 µA tested at quarter drive strength. VCC is the corresponding I/O voltage supply. Page 22 of 45 CYUSB301X DC Specifications (continued) Min Max Units Notes VOL Parameter Output LOW voltage Description – 0.1 × VCC V IOL (min) = +100 µA tested at quarter drive strength. VCC is the corresponding I/O voltage supply. IIX Input leakage current for all pins except SSTXP/SSXM/SSRXP/SSRXM –1 1 µA All I/O signals held at VDDQ (For I/Os with a pull-up or pull-down resistor connected, the leakage current increases by VDDQ/Rpu or VDDQ/RPD IOZ Output High-Z leakage current for all pins except SSTXP/ SSXM/ SSRXP/SSRXM –1 1 µA All I/O signals held at VDDQ ICC Core Core and analog voltage operating current – 200 mA Total current through AVDD, VDD ICC USB USB voltage supply operating current – 60 mA ISB1 Total suspend current during suspend mode with USB 3.0 PHY enabled (L1) – – mA Core current: 1.5 mA I/O current: 20 µA USB current: 2 mA For typical PVT (typical silicon, all power supplies at their respective nominal levels at 25 °C.) ISB2 Total suspend current during suspend mode with USB 3.0 PHY disabled (L2) – – mA Core current: 250 µA I/O current: 20 µA USB current: 1.2 mA For typical PVT (Typical silicon, all power supplies at their respective nominal levels at 25 °C.) ISB3 Total standby current during standby mode (L3) – – µA Core current: 60 µA I/O current: 20 µA USB current: 40 µA For typical PVT (typical silicon, all power supplies at their respective nominal levels at 25 °C.) ISB4 Total standby current during core power-down mode (L4) – – µA Core current: 0 µA I/O current: 20 µA USB current: 40 µA For typical PVT (typical silicon, all power supplies at their respective nominal levels at 25 °C.) VRAMP Voltage ramp rate on core and I/O supplies 0.2 50 VN Noise level permitted on VDD and I/O supplies – 100 mV Max p-p noise level permitted on all supplies except AVDD VN_AVDD Noise level permitted on AVDD supply – 20 mV Max p-p noise level permitted on AVDD Document Number: 001-52136 Rev. *N V/ms Voltage ramp must be monotonic Page 23 of 45 CYUSB301X AC Timing Parameters GPIF II Timing Figure 9. GPIF II Timing in Synchronous Mode tC LK H tC LKL C LK tC LK tC O tLZ - [31:0] DQ tD S tD O H tLZ tD O H D ata 2 ( O U T) D ata 1 ( O U T) D ata ( IN) tS tH Z tC O E tD H tH C TL(IN) tC TLO tC O H C TL ( O U T) Table 9. GPIF II Timing Parameters in Synchronous Mode [4] Parameter Description Min Max Units Frequency Interface clock frequency – 100 MHz tCLK Interface clock period 10 – ns tCLKH Clock high time 4 – ns tCLKL Clock low time 4 – ns tS CTL input to clock setup time 2 – ns tH CTL input to clock hold time 0.5 – ns tDS Data in to clock setup time 2 – ns tDH Data in to clock hold time 0.5 – ns tCO Clock to data out propagation delay when DQ bus is already in output direction – 8 ns tCOE Clock to data out propagation delay when DQ lines change to output from tristate and valid data is available on the DQ bus - 9 tCTLO Clock to CTL out propagation delay – 8 ns tDOH Clock to data out hold 2 – ns tCOH Clock to CTL out hold 0 – ns tHZ Clock to high-Z – 8 ns tLZ Clock to low-Z 0 – ns Note 4. All parameters guaranteed by design and validated through characterization. Document Number: 001-52136 Rev. *N Page 24 of 45 CYUSB301X Figure 10. GPIF II Timing in Asynchronous Mode tDS/ tAS tDH/tAH DATA IN DATA/ ADDR tCHZ CTL# (I/P , ALE/ DLE) tCTLassert_DQlatch tCTLdeassert_DQlatch tAA/tDO tCHZ/tOEHZ tCLZ/ tOELZ DATA OUT DATA OUT CTL# (I/P, non ALE/ DLE tCTLdeassert tCTLassert tCTLalpha ALPHA O/P tCTLbeta BETA O/P 1 tCTLassert tCTLdeassert 1 tCTL# (O/P) 1. n is an integer >= 0 tDST tDHT DATA/ ADDR tCTLdeassert_DQassert tCTLassert_DQassert CTL# I/P (non DLE/ALE) Figure 11. GPIF II Timing in Asynchronous DDR Mode tDS tCTLdeassert_DqlatchDDR tCTLassert_DQlatchDDR CTL# (I/P) tDS tDH tDH DATA IN Document Number: 001-52136 Rev. *N Page 25 of 45 CYUSB301X Table 10. GPIF II Timing in Asynchronous Mode[5, 6] Note The following parameters assume one state transition Parameter Description Min Max Units tDS Data In to DLE setup time. Valid in DDR async mode. 2.3 – ns tDH Data In to DLE hold time. Valid in DDR async mode. 2 – ns tAS Address In to ALE setup time 2.3 – ns tAH Address In to ALE hold time 2 – ns tCTLassert CTL I/O asserted width for CTRL inputs without DQ input association and for outputs. 7 – ns tCTLdeassert CTL I/O deasserted width for CTRL inputs without DQ input association and for outputs. 7 – ns tCTLassert_DQassert CTL asserted pulse width for CTL inputs that signify DQ inputs valid at the asserting edge but do not employ in-built latches (ALE/DLE) for those DQ inputs. 20 – ns tCTLdeassert_DQassert CTL deasserted pulse width for CTL inputs that signify DQ input valid at the asserting edge but do not employ in-built latches (ALE/DLE) for those DQ inputs. 7 – ns tCTLassert_DQdeassert CTL asserted pulse width for CTL inputs that signify DQ inputs valid at the deasserting edge but do not employ in-built latches (ALE/DLE) for those DQ inputs. 7 – ns tCTLdeassert_DQdeassert CTL deasserted pulse width for CTL inputs that signify DQ inputs valid at the deasserting edge but do not employ in-built latches (ALE/DLE) for those DQ inputs. 20 – ns tCTLassert_DQlatch CTL asserted pulse width for CTL inputs that employ in-built latches (ALE/DLE) to latch the DQ inputs. In this non-DDR case, in-built latches are always close at the deasserting edge. 7 – ns tCTLdeassert_DQlatch CTL deasserted pulse width for CTL inputs that employ in-built latches (ALE/DLE) to latch the DQ inputs. In this non-DDR case, in-built latches always close at the deasserting edge. 10 – ns tCTLassert_DQlatchDDR CTL asserted pulse width for CTL inputs that employ in-built latches (DLE) to latch the DQ inputs in DDR mode. 10 – ns tCTLdeassert_DQlatchDDR CTL deasserted pulse width for CTL inputs that employ in-built latches (DLE) to latch the DQ inputs in DDR mode. 10 – ns tAA DQ/CTL input to DQ output time when DQ change or CTL change needs to be detected and affects internal updates of input and output DQ lines. – 30 ns tDO CTL to data out when the CTL change merely enables the output flop update whose data was already established. – 25 ns tOELZ CTL designated as OE to low-Z. Time when external devices should stop driving data. 0 – ns tOEHZ CTL designated as OE to high-Z 8 8 ns tCLZ CTL (non-OE) to low-Z. Time when external devices should stop driving data. 0 – ns tCHZ CTL (non-OE) to high-Z 30 30 ns tCTLalpha CTL to alpha change at output – 25 ns tCTLbeta CTL to beta change at output – 30 ns tDST Addr/data setup when DLE/ALE not used 2 – ns tDHT Addr/data hold when DLE/ALE not used 20 – ns Notes 5. All parameters guaranteed by design and validated through characterization. 6. "alpha" output corresponds to "early output" and "beta" corresponds to "delayed output". Please refer to the GPIFII Designer Tool for the use of these outputs. Document Number: 001-52136 Rev. *N Page 26 of 45 CYUSB301X Slave FIFO Interface PCLK), the new data value is present. N is the first data value read from the FIFO. To have data on the FIFO data bus, SLOE must also be asserted. Synchronous Slave FIFO Sequence Description ■ FIFO address is stable and SLCS is asserted The same sequence of events is shown for a burst read. ■ SLOE is asserted. SLOE is an output-enable only, whose sole function is to drive the data bus. ■ SLRD is asserted ■ The FIFO pointer is updated on the rising edge of the PCLK, while the SLRD is asserted. This starts the propagation of data from the newly addressed location to the data bus. After a propagation delay of tco (measured from the rising edge of Note For burst mode, the SLRD# and SLOE# are asserted during the entire duration of the read. When SLOE# is asserted, the data bus is driven (with data from the previously addressed FIFO). For each subsequent rising edge of PCLK, while the SLRD# is asserted, the FIFO pointer is incremented and the next data value is placed on the data bus. Figure 12. Synchronous Slave FIFO Read Mode Synchronous Read Cycle Timing tCYC PCLK tCH tCL 2-cycle latency from SLRD to data 3- cycle latency from addr to data SLCS tAS tAH FIFO ADDR An tRDS Am tRDH SLRD SLOE 2 cycle latency from SLRD to FLAG t CFLG FLAGA (dedicated thread Flag for An) ( 1 = Not Empty0 = Empty) t CFLG FLAGB (dedicated thread Flag for Am) ( 1 = Not Empty0= Empty) tOELZ Data Out High-Z tOEZ Data driven:DN (An) tCDH tOELZ DN+1 (An) tOEZ tCO DN (Am) DN+1 (Am) DN+2 (Am) SLWR (HIGH) Document Number: 001-52136 Rev. *N Page 27 of 45 CYUSB301X Synchronous Slave FIFO Write Sequence Description ■ FIFO address is stable and the signal SLCS# is asserted ■ External master or peripheral outputs the data to the data bus ■ SLWR# is asserted ■ While the SLWR# is asserted, data is written to the FIFO and on the rising edge of the PCLK, the FIFO pointer is incremented ■ The FIFO flag is updated after a delay of t WFLG from the rising edge of the clock edge of PCLK. The FIFO pointer is updated on each rising edge of PCLK. Short Packet: A short packet can be committed to the USB host by using the PKTEND#. The external device or processor should be designed to assert the PKTEND# along with the last word of data and SLWR# pulse corresponding to the last word. The FIFOADDR lines must be held constant during the PKTEND# assertion. The same sequence of events is also shown for burst write Zero-Length Packet: The external device or processor can signal a Zero-Length Packet (ZLP) to FX3 simply by asserting PKTEND#, without asserting SLWR#. SLCS# and address must be driven as shown in Figure 13 on page 28. Note For the burst mode, SLWR# and SLCS# are asserted for the entire duration, during which all the required data values are written. In this burst write mode, after the SLWR# is asserted, the data on the FIFO data bus is written to the FIFO on every rising FLAG Usage: The FLAG signals are monitored for flow control by the external processor. FLAG signals are outputs from FX3 that may be configured to show empty, full, or partial status for a dedicated thread or the current thread that is addressed. Figure 13. Synchronous Slave FIFO Write Mode Synchronous Write Cycle Timing tCYC PCLK tCH tCL SLCS tAS tAH Am An FIFO ADDR tWRS tWRH SLWR 3 cycle latency from SLWR# to FLAG t CFLG FLAGA dedicated thread FLAG for An (1 = Not Full 0= Full) 3 cycle latency from SLWR # to FLAG tCFLG FLAGB current thread FLAG for Am (1 = Not Full 0= Full) Data IN tDS tDH High-Z tDS tDH DN(Am) DN(An) tDH DN+1(Am) DN+2(Am) tPES tPEH PKTEND SLOE (HIGH) Synchronous ZLP Write Cycle Timing tCYC PCLK tCH tCL SLCS tAS tAH An FIFO ADDR SLWR (HIGH) tPES tPEH PKTEND tCFLG FLAGA dedicated thread FLAG for An (1 = Not Full 0= Full) FLAGB current thread FLAG for Am (1 = Not Full 0= Full) Data IN High-Z SLOE (HIGH) Document Number: 001-52136 Rev. *N Page 28 of 45 CYUSB301X Table 11. Synchronous Slave FIFO Parameters[7] Min Max Units FREQ Parameter Interface clock frequency Description – 100 MHz tCYC Clock period 10 – ns tCH Clock high time 4 – ns tCL Clock low time 4 – ns tRDS SLRD# to CLK setup time 2 – ns tRDH SLRD# to CLK hold time 0.5 – ns tWRS SLWR# to CLK setup time 2 – ns tWRH SLWR# to CLK hold time 0.5 – ns tCO Clock to valid data – 8 ns tDS Data input setup time 2 – ns tDH CLK to data input hold 0.5 – ns tAS Address to CLK setup time tAH CLK to address hold time 2 – ns 0.5 – ns tOELZ tCFLG SLOE# to data low-Z 0 – ns CLK to flag output propagation delay – 8 ns tOEZ SLOE# deassert to Data Hi Z – 8 ns tPES PKTEND# to CLK setup 2 – ns tPEH CLK to PKTEND# hold 0.5 – tCDH CLK to data output hold 2 – ns Note Three-cycle latency from ADDR to DATA/FLAGS Asynchronous Slave FIFO Read Sequence Description In Figure 14, data N is the first valid data read from the FIFO. For data to appear on the data bus during the read cycle, SLOE# must be in an asserted state. SLRD# and SLOE# can also be tied. ■ FIFO address is stable and the SLCS# signal is asserted. ■ SLOE# is asserted. This results in driving the data bus. The same sequence of events is also shown for a burst read. ■ SLRD # is asserted. ■ Data from the FIFO is driven after assertion of SLRD#. This data is valid after a propagation delay of tRDO from the falling edge of SLRD#. Note In the burst read mode, during SLOE# assertion, the data bus is in a driven state (data is driven from a previously addressed FIFO). After assertion of SLRD# data from the FIFO is driven on the data bus (SLOE# must also be asserted). The FIFO pointer is incremented after deassertion of SLRD#. ■ FIFO pointer is incremented on deassertion of SLRD# Note 7. All parameters guaranteed by design and validated through characterization. Document Number: 001-52136 Rev. *N Page 29 of 45 CYUSB301X Figure 14. Asynchronous Slave FIFO Read Mode SLCS tAS tAH An FIFO ADDR tRDl Am tRDh SLRD SLOE tFLG tRFLG FLAGA dedicated thread Flag for An (1=Not empty 0 = Empty) FLAGB dedicated thread Flag for Am (1=Not empty 0 = Empty) tOE tRDO tOH tOE tRDO tRDO tOH tLZ Data Out High-Z DN(An) DN(An) DN(Am) DN+1(Am) DN+2(Am) SLWR (HIGH) Asynchronous Slave FIFO Write Sequence Description ■ FIFO address is driven and SLCS# is asserted ■ SLWR# is asserted. SLCS# must be asserted with SLWR# or before SLWR# is asserted ■ Data must be present on the tWRS bus before the deasserting edge of SLWR# ■ Deassertion of SLWR# causes the data to be written from the data bus to the FIFO, and then the FIFO pointer is incremented ■ The FIFO flag is updated after the tWFLG from the deasserting edge of SLWR. The same sequence of events is shown for a burst write. Short Packet: A short packet can be committed to the USB host by using the PKTEND#. The external device or processor should be designed to assert the PKTEND# along with the last word of data and SLWR# pulse corresponding to the last word. The FIFOADDR lines must be held constant during the PKTEND# assertion. Zero-Length Packet: The external device or processor can signal a zero-length packet (ZLP) to FX3 simply by asserting PKTEND#, without asserting SLWR#. SLCS# and the address must be driven as shown in Figure 15 on page 31. FLAG Usage: The FLAG signals are monitored by the external processor for flow control. FLAG signals are FX3 outputs that can be configured to show empty, full, and partial status for a dedicated address or the current address. Note that in the burst write mode, after SLWR# deassertion, the data is written to the FIFO, and then the FIFO pointer is incremented. Document Number: 001-52136 Rev. *N Page 30 of 45 CYUSB301X Figure 15. Asynchronous Slave FIFO Write Mode Asynchronous Write Cycle Timing SLCS tAS tAH An FIFO ADDR tWRl Am tWRh SLWR tFLG tWFLG FLAGA dedicated thread Flag for An (1=Not Full 0 = Full) tWFLG FLAGB dedicated thread Flag for Am (1=Not Full 0 = Full) tWR S High-Z DATA In tWRH tWR tWRH S DN(Am) DN(An) DN+1(Am) DN+2(Am) tWRPEt PEh PKTEND SLOE (HIGH) tWRPE: SLWR# de-assert to PKTEND deassert = 2ns min (This means that PKTEND should not be be deasserted before SLWR#) Note: PKTEND must be asserted at the same time as SLWR#. Asynchronous ZLP Write Cycle Timing SLCS tAS tAH An FIFO ADDR SLWR (HIGH) tPEl tPEh PKTEND tWFLG FLAGA dedicated thread Flag for An (1=Not Full 0 = Full) FLAGB dedicated thread Flag for Am (1=Not Full 0 = Full) DATA In High-Z SLOE (HIGH) Document Number: 001-52136 Rev. *N Page 31 of 45 CYUSB301X Table 12. Asynchronous Slave FIFO Parameters[8] Parameter Min Max Units SLRD# low 20 – ns tRDh SLRD# high 10 – ns tAS Address to SLRD#/SLWR# setup time 7 – ns tAH SLRD#/SLWR#/PKTEND to address hold time 2 – ns tRFLG SLRD# to FLAGS output propagation delay – 35 ns tRDI Description tFLG ADDR to FLAGS output propagation delay tRDO SLRD# to data valid – 22.5 25 ns tOE OE# low to data valid – 25 ns tLZ OE# low to data low-Z 0 – ns tOH SLOE# deassert data output hold – 22.5 ns tWRI SLWR# low 20 – ns tWRh SLWR# high 10 – ns tWRS Data to SLWR# setup time 7 – ns tWRH SLWR# to Data Hold time 2 – ns tWFLG SLWR#/PKTEND to Flags output propagation delay – 35 ns tPEI PKTEND low 20 – ns tPEh PKTEND high 7.5 – ns tWRPE SLWR# deassert to PKTEND deassert 2 – Note 8. All parameters guaranteed by design and validated through characterization. Document Number: 001-52136 Rev. *N Page 32 of 45 CYUSB301X Serial Peripherals Timing I2C Timing Figure 16. I2C Timing Definition Document Number: 001-52136 Rev. *N Page 33 of 45 CYUSB301X Table 13. I2C Timing Parameters[9] Parameter Description Min Max Units I2C Standard Mode Parameters fSCL SCL clock frequency 0 100 kHz tHD:STA Hold time START condition 4 – µs tLOW LOW period of the SCL 4.7 – µs tHIGH HIGH period of the SCL 4 – µs tSU:STA Setup time for a repeated START condition 4.7 – µs tHD:DAT Data hold time 0 – µs tSU:DAT Data setup time 250 – ns tr Rise time of both SDA and SCL signals – 1000 ns tf Fall time of both SDA and SCL signals – 300 ns tSU:STO Setup time for STOP condition 4 – µs tBUF Bus free time between a STOP and START condition 4.7 – µs tVD:DAT Data valid time – 3.45 µs tVD:ACK Data valid ACK – 3.45 µs tSP Pulse width of spikes that must be suppressed by input filter n/a n/a 0 400 kHz I2C Fast Mode Parameters fSCL SCL clock frequency tHD:STA Hold time START condition 0.6 – µs tLOW LOW period of the SCL 1.3 – µs tHIGH HIGH period of the SCL 0.6 – µs tSU:STA Setup time for a repeated START condition 0.6 – µs tHD:DAT Data hold time 0 – µs tSU:DAT Data setup time 100 – ns tr Rise time of both SDA and SCL signals – 300 ns tf Fall time of both SDA and SCL signals – 300 ns tSU:STO Setup time for STOP condition 0.6 – µs tBUF Bus free time between a STOP and START condition 1.3 – µs tVD:DAT Data valid time – 0.9 µs tVD:ACK Data valid ACK – 0.9 µs tSP Pulse width of spikes that must be suppressed by input filter 0 50 ns Note 9. All parameters guaranteed by design and validated through characterization. Document Number: 001-52136 Rev. *N Page 34 of 45 CYUSB301X Table 13. I2C Timing Parameters[9] (continued) Parameter Description Min Max Units I2 C Fast Mode Plus Parameters (Not supported at I2C_VDDQ=1.2 V) fSCL SCL clock frequency 0 1000 kHz tHD:STA Hold time START condition 0.26 – µs tLOW LOW period of the SCL 0.5 – µs tHIGH HIGH period of the SCL 0.26 – µs tSU:STA Setup time for a repeated START condition 0.26 – µs tHD:DAT Data hold time 0 – µs tSU:DAT Data setup time 50 – ns tr Rise time of both SDA and SCL signals – 120 ns tf Fall time of both SDA and SCL signals – 120 ns tSU:STO Setup time for STOP condition 0.26 – µs tBUF Bus-free time between a STOP and START condition 0.5 – µs tVD:DAT Data valid time – 0.45 µs tVD:ACK Data valid ACK – 0.55 µs tSP Pulse width of spikes that must be suppressed by input filter 0 50 ns I2S Timing Diagram Figure 17. I2S Transmit Cycle tT tTR tTF tTL tTH SCK tThd SA, WS (output) tTd Table 14. I2S Timing Parameters[10] Parameter Description Min Max Units Ttr – ns transmitter cycle LOW period 0.35 Ttr – ns transmitter cycle HIGH period 0.35 Ttr – ns – 0.15 Ttr ns – 0.15 Ttr ns transmitter data hold time 0 – ns transmitter delay time – 0.8tT ns tT I2S transmitter clock cycle tTL I 2S tTH I 2S tTR I 2S transmitter rise time tTF I2S transmitter fall time tThd I 2S tTd I 2S Note tT is selectable through clock gears. Max Ttr is designed for 96-kHz codec at 32 bits to be 326 ns (3.072 MHz). Note 10. All parameters guaranteed by design and validated through characterization. Document Number: 001-52136 Rev. *N Page 35 of 45 CYUSB301X SPI Timing Specification Figure 18. SPI Timing SSN (output) tssnh tsck tlead SCK (CPOL=0, Output) trf twsck SCK (CPOL=1, Output) tsdi MISO (input) tlag twsck thoi MSB LSB td tsdd MOSI (output) tdis tdi v LSB MSB SPI Master Timing for CPHA = 0 SSN (output) SCK (CPOL=0, Output) tssnh tsck tlead twsck trf tlag twsck SCK (CPOL=1, Output) tsdi MISO (input) thoi LSB tdis tdi tdv MOSI (output) MSB LSB MSB SPI Master Timing for CPHA = 1 Document Number: 001-52136 Rev. *N Page 36 of 45 CYUSB301X Table 15. SPI Timing Parameters[11] Min Max Units fop Parameter Operating frequency Description 0 33 MHz tsck Cycle time 30 – ns twsck Clock high/low time 13.5 – ns tsck[12 ]-5 5 ns 0.5 1.5 tsck[12]+5 ns Rise/fall time – 8 ns tsdd Output SSN to valid data delay time – 5 ns tdv Output data valid time – 5 ns tdi Output data invalid 0 – ns tssnh Minimum SSN high time 10 – ns tsdi Data setup time input 8 – ns thoi Data hold time input 0 – ns tdis Disable data output on SSN high 0 – ns tlead SSN-SCK lead time tlag Enable lag time trf 1/2 1.5 tsck[12]+ Notes 11. All parameters guaranteed by design and validated through characterization. 12. Depends on LAG and LEAD setting in the SPI_CONFIG register. Document Number: 001-52136 Rev. *N Page 37 of 45 CYUSB301X Reset Sequence FX3’s hard reset sequence requirements are specified in this section. Table 16. Reset and Standby Timing Parameters Parameter tRPW Definition Minimum RESET# pulse width tRH Minimum high on RESET# tRR Reset recovery time (after which Boot loader begins firmware download) tSBY Time to enter standby/suspend (from the time MAIN_CLOCK_EN/ MAIN_POWER_EN bit is set) tWU Time to wakeup from standby tWH Minimum time before Standby/Suspend source may be reasserted Conditions Min (ms) Max (ms) Clock Input 1 – Crystal Input 1 – – 5 – Clock Input 1 – Crystal Input 5 – – 1 Clock Input 1 – Crystal Input 5 – – 5 – Figure 19. Reset Sequence VDD ( core ) xVDDQ XTALIN/ CLKIN XTALIN/ CLKIN must be stable before exiting Standby/Suspend Mandatory Reset Pulse tRh tRR Hard Reset RESET # tWH tRPW Standby/ Suspend Source tSBY Standby/Suspend source Is asserted (MAIN_POWER_EN/ MAIN_CLK_EN bit is set) Document Number: 001-52136 Rev. *N tWU Standby/Suspend source Is deasserted Page 38 of 45 CYUSB301X Package Diagram Figure 20. 121-ball FBGA Package Diagram 001-54471 *D Document Number: 001-52136 Rev. *N Page 39 of 45 CYUSB301X Figure 21. 131-ball WLCSP Package Diagram 1 2 3 4 5 6 7 8 9 10 11 12 12 11 10 9 8 A 7 6 5 4 3 2 1 A B B C C D D E E F F G G H H J J K K L L 001-62221 *B Note Underfill is required on the board design. Contact Cypress Applications for details. Document Number: 001-52136 Rev. *N Page 40 of 45 CYUSB301X Ordering Information Table 17. Ordering Information Ordering Code SRAM (kB) GPIF II Data Bus Width Operating Temperature Package Type CYUSB3011-BZXC 256 16-bit 0 °C to +70 °C 121-ball BGA CYUSB3012-BZXC 256 32-bit 0 °C to +70 °C 121-ball BGA CYUSB3013-BZXC 512 16-bit 0 °C to +70 °C 121-ball BGA CYUSB3014-BZXC 512 32-bit 0 °C to +70 °C 121-ball BGA CYUSB3014-BZXI 512 32-bit –40°C to +85°C 121-ball BGA CYUSB3014-FBXCT 512 32-bit 0 °C to +70 °C 131-ball CSP CYUSB3014-FBXIT 512 32-bit –40 °C to +85 °C 131-ball CSP Ordering Code Definitions Document Number: 001-52136 Rev. *N Page 41 of 45 CYUSB301X Acronyms Document Conventions Acronym Description Units of Measure DMA direct memory access HNP host negotiation protocol °C degree Celsius MMC multimedia card µA microamperes MTP media transfer protocol µs microseconds PLL phase locked loop mA milliamperes PMIC power management IC Mbps Megabits per second SD secure digital MBps Megabytes per second SD secure digital MHz mega hertz SDIO secure digital input / output ms milliseconds SLC single-level cell ns nanoseconds SLCS Slave Chip Select ohms SLOE Slave Output Enable pF pico Farad SLRD Slave Read V volts SLWR Slave Write SPI serial peripheral interface SRP session request protocol USB universal serial bus WLCSP wafer level chip scale package Document Number: 001-52136 Rev. *N Symbol Unit of Measure Page 42 of 45 CYUSB301X Document History Page Document Title: CYUSB301X, EZ-USB® FX3: SuperSpeed USB Controller Document Number: 001-52136 Revision ECN ** *A 2669761 2758370 *B 2779196 *C 2823531 *D 3080927 Orig. of Submission Description of Change Change Date VSO/PYRS 03/06/09 New data sheet VSO 09/01/09 Updated the part# from CYX01XXBB to CYUSB3011-BZXI Changed the title from “ADVANCE” to “ADVANCE INFORMATION” In page 1, the second bullet (Flexible Host Interface), add “32-bit, 100 MHz” to first sub bullet. In page 1, changed the second bullet “Flexible Host Interface” to General Programmable Interface”. In page 1, the second bullet (Flexible Host Interface), removed "DMA Slave Support” and "MMC Slave support with Pass through Boot" sub bullets. In page 1, third bullet, changed "50 A with Core Power" to "60 A with Core Power" In page 1, fifth bullet, added "at 1 MHz" In page 1, seventh bullet, added "up to 4MHz" to UART In page 1, Applications Section, move “Digital Still Cameras” to second line. In page 1, Applications Section, added “Machine Vision” and Industrial Cameras” Added ™ to GPIF and FX3. In page 1, updated Logic Block Diagram. In page 2, section of “Functional Overview”, updated the whole section. In page 2, removed the section of “Product Interface” In page 2, removed the section of “Processor Interface (P-Port)” In page 2, removed the section of “USB Interface (U-Port)” In page 2, removed the section of “Other Interfaces” In page 2, added a section of "GPIF II" In page 2, added a section of "CPU" In page 2, added a section of "JTAG Interface" In page 2, added a section of "Boot Options" In page 2, added a section of "ReNumeration" In page 2, added a section of "Power" In the section of “Package”, replaced “West Bridge USB 3.0 Platform” by FX3. In the section of “Package”, added 0.8 mm pitch in front of BGA. Added Pin List (Table 1) VSO/PYRS 09/29/09 Features: Added the thrid bullet “Fully accessible 32-bit ARM9 core with 512kB of embedded SRAM” Added the thrid line “EZ USB™ Software and DVK for easy code development” Table 1: Pin 74, corrected to NC - No Connect. Changed title to EZ-USB™ FX3: SuperSpeed USB Controller OSG 12/08/09 Added data sheet to the USB 3.0 EROS spec 001-51884. No technical updates. OSG 11/08/2010 Changed status from Advance to Preliminary Changed part number from CYUSB3011 to CYUSB3014 Added the following sections: Power, Configuration Options, Digital I/Os, System-level ESD, Absolute Maximum Ratings, AC Timing Parameters, Reset Sequence, Package Diagram Added DC Specifications table Updated feature list Updated Pin List Added support for selectable clock input frequencies. Updated block diagram Updated part number Updated package diagram Document Number: 001-52136 Rev. *N Page 43 of 45 CYUSB301X Document History Page (continued) Document Title: CYUSB301X, EZ-USB® FX3: SuperSpeed USB Controller Document Number: 001-52136 Orig. of Submission Revision ECN Description of Change Change Date *E 3204393 OSG 03/24/2011 Updated Slave FIFO protocol and added ZLP signaling protocol Changed GPIFII asynchronous tDO parameter Changed Async Slave FIFO tOE parameter Changed Async Slave FIFO tRDO parameter Added tCOE parameter to GPIFII Sync mode timing parameters Renamed GPIFII Sync mode tDO to tCO and tDO_ss0 to tCO_ss0 Modified description of GPIFII Sync tCO (previously tDO) parameter Changed tAH(address hold time) parameter in Async Slave FIFO modes to be with respect to rising edge of SLWR#/SLRD# instead of falling edge. Correspondingly, changed the tAH number. Removed 24 bit data bus support for GPIFII. *F 3219493 OSG 04/07/2011 Minor ECN - Release to web. No content changes. *G 3235250 GSZ 04/20/2011 Minor updates in Features. *H 3217917 OSG 04/06/2011 Updated GPIFII Synchronous Timing diagram. Added SPI Boot option. Corrected values of R_USB2 and R_USB3. Corrected TCK and TRST# pull-up/pull-down configuration. Minor updates to block diagrams. Corrected Synchronous Slave FIFO tDH parameter. *I 3305568 DSG 07/07/2011 Minor ECN - Correct ECN number in revision *F. No content changes. *J 3369042 OSG 12/06/2011 Changed tWRPE parameter to 2ns Updated tRR and tRPW for crystal input Added clarification regarding IOZ and IIX Updated Sync SLave FIFO Read timing diagram Updated SPI timing diagram Removed tGRANULARITY parameter Updated I2S Timing diagram and tTd parameter Updated 121-ball FBGA package diagram. Added clarification regarding VCC in DC Specifications table In Power Modes description, stated that VIO1 cannot be turned off at any time if the GPIFII is used in the application Updated Absolute Maximum Ratings Added requirement for by-pass capacitor on U3RXVDDQ and U3TXVDDQ Updated tPEI parameter in Async Slave FIFO timing table Updated Sync Slave FIFO write and read timing diagrams Updated I2C interface tVD:ACK parameter for 1MHz operation Clarified that CTL[15] is not usable as a GPIO Changed datasheet status from Preliminary to Final. *K 3534275 OSG 02/24/2012 Corrected typo in the block diagram. *L 3649782 OSG 08/16/2012 Changed part number to CYUSB301X. Added 256 KB range for embedded SRAM. Updated Functional Overview, Other Interfaces, and Clocking sections. Added Pin List for CYUSB3011 and CYUSB3013 parts. Updated Ordering Information with new part numbers. *M 3848148 OSG 12/20/2012 Updated 121-ball FBGA package diagram to current revision. *N 4016006 OSG 05/31/2013 Updated Features (Added 131-ball WLCSP under Package option). Updated Pin Configurations (Added FX3 131-ball WLCSP Ball Map (Figure 8)). Updated Pin Description (Updated Table 7). Updated Absolute Maximum Ratings (Included Commercial Temperature Range related information). Updated Operating Conditions (Included Commercial Temperature Range related information). Updated Package Diagram (Added 131-ball WLCSP Package Diagram (Figure 21)). Updated Ordering Information (Updated part numbers). Document Number: 001-52136 Rev. *N Page 44 of 45 CYUSB301X Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products PSoC Solutions Automotive Clocks & Buffers Interface cypress.com/go/automotive psoc.cypress.com/solutions cypress.com/go/clocks PSoC 1 | PSoC 3 | PSoC 5 cypress.com/go/interface Lighting & Power Control cypress.com/go/powerpsoc cypress.com/go/plc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing cypress.com/go/touch USB Controllers cypress.com/go/USB Wireless/RF cypress.com/go/wireless © Cypress Semiconductor Corporation, 2009-2013. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-52136 Rev. *N ® Revised May 31, 2013 Page 45 of 45 EZ-USB™ is a trademark and West Bridge is a registered trademark of Cypress Semiconductor Corp. All products and company names mentioned in this document may be the trademarks of their respective holders.