ESD7C3.3DT5G SERIES Transient Voltage Suppressors Micro-Packaged Diodes for ESD Protection The ESD7C3.3DT5G Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications. Specification Features: http://onsemi.com PIN 1. CATHODE 2. CATHODE 3. ANODE 1 3 2 •Low Capacitance 6.2 pF to 13 pF •Low Clamping Voltage •Small Body Outline Dimensions: MARKING DIAGRAM 0.047” x 0.047” (1.20 mm x 1.20 mm) •Low Body Height: 0.020″ (0.5 mm) •Stand-off Voltage: 3.3 V, 5 V •Low Leakage •Response Time < 1 ns •ESD Rating of Class 3 (> 16 kV) per Human Body Model •IEC61000-4-2 Level 4 ESD Protection •These are Pb-Free Devices L5 M SOT-723 CASE 631AA L5 M ORDERING INFORMATION Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Symbol Contact Air ⎪ PD Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance Junction-to-Ambient RqJA Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) Device Package Shipping† ESD7CxxDT5G SOT-723 (Pb-Free) 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS IEC 61000-4-2 (ESD) = Specific Device Code = Date Code *Date Code orientation and/or position may vary depending upon manufacturing location. Mechanical Characteristics: CASE: Void‐free, transfer‐molded, thermosetting plastic Rating 1 Value Unit ±8.0 ±15 kV DEVICE MARKING INFORMATION 240 1.9 525 mW mW/°C °C/W TJ, Tstg -55 to +150 °C TL 260 °C See specific marking information in the device marking column of the table on page 2 of this data sheet. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. © Semiconductor Components Industries, LLC, 2008 April, 2008 - Rev. 2 1 Publication Order Number: ESD7C3.3D/D ESD7C3.3DT5G SERIES ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) IF Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR Working Peak Reverse Voltage Test Current IF Forward Current VF Forward Voltage @ IF Ppk Peak Power Dissipation V IR VF IT Breakdown Voltage @ IT IT C VC VBR VRWM Maximum Reverse Leakage Current @ VRWM IPP Max. Capacitance @VR = 0 and f = 1 MHz *See Application Note AND8308/D for detailed explanations of datasheet parameters. Uni-Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 1.1 V Max. @ IF = 10 mA) VRWM (V) IR (mA) @ VRWM VBR (V) @ IT (Note 2) IT C (pF) (Note 3) C (pF) (Note 3) VC Per IEC61000-4-2 (Note 4) Device Device Marking Max Max Min mA Typ Max ESD7C3.3DT5G L5 3.3 1.0 5.0 1.0 12 13 ESD7C5.0DT5G L4 5.0 0.5 11 1.0 6.0 6.2 2. 3. 4. 5. Figures 1 and 2 See Below (Note 5) VBR is measured with a pulse test current IT at an ambient temperature of 25°C. Capacitance of one diode at f = 1 MHz, VR = 0 V, TA = 25°C. For test procedure see Figures 3 and 4 and Application Note AND8307/D. ESD7C5.0DT5G shown below. Other voltages available upon request. Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000-4-2 Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000-4-2 http://onsemi.com 2 ESD7C3.3DT5G SERIES IEC61000-4-2 Waveform IEC 61000-4-2 Spec. Ipeak Level Test Voltage (kV) First Peak Current (A) Current at 30 ns (A) Current at 60 ns (A) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 100% 90% I @ 30 ns I @ 60 ns 10% tP = 0.7 ns to 1 ns Figure 3. IEC61000-4-2 Spec ESD Gun Oscilloscope TVS 50 W Cable 50 W Figure 4. Diagram of ESD Test Setup The following is taken from Application Note AND8308/D - Interpretation of Datasheet Parameters for ESD Devices. systems such as cell phones or laptop computers it is not clearly defined in the spec how to specify a clamping voltage at the device level. ON Semiconductor has developed a way to examine the entire voltage waveform across the ESD protection diode over the time domain of an ESD pulse in the form of an oscilloscope screenshot, which can be found on the datasheets for all ESD protection diodes. For more information on how ON Semiconductor creates these screenshots and how to interpret them please refer to AND8307/D. ESD Voltage Clamping For sensitive circuit elements it is important to limit the voltage that an IC will be exposed to during an ESD event to as low a voltage as possible. The ESD clamping voltage is the voltage drop across the ESD protection diode during an ESD event per the IEC61000-4-2 waveform. Since the IEC61000-4-2 was written as a pass/fail spec for larger http://onsemi.com 3 ESD7C3.3DT5G SERIES PACKAGE DIMENSIONS SOT-723 CASE 631AA-01 ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. -XD A b1 -Y3 E 1 e HE L 2 b 2X 0.08 (0.0032) X Y DIM A b b1 C D E e HE L C MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.15 0.21 0.27 0.25 0.31 0.37 0.07 0.12 0.17 1.15 1.20 1.25 0.75 0.80 0.85 0.40 BSC 1.15 1.20 1.25 0.15 0.20 0.25 INCHES MIN NOM MAX 0.018 0.020 0.022 0.0059 0.0083 0.0106 0.010 0.012 0.015 0.0028 0.0047 0.0067 0.045 0.047 0.049 0.03 0.032 0.034 0.016 BSC 0.045 0.047 0.049 0.0059 0.0079 0.0098 SOLDERING FOOTPRINT* 0.40 0.0157 0.40 0.0157 1.0 0.039 0.40 0.0157 0.40 0.0157 0.40 0.0157 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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