VISHAY 15ETL06

VS-15ETL06SPbF, VS-15ETL06-1PbF
Vishay Semiconductors
Ultralow VF Hyperfast Rectifier for
Discontinuous Mode PFC, 15 A FRED Pt®
FEATURES
• Benchmark ultralow forward voltage drop
• Hyperfast recovery time
• Low leakage current
D2PAK
• 175 °C operating junction temperature
TO-262
Base
cathode
2
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
2
• Halogen-free according to IEC 61249-2-21
definition
• Compliant to RoHS directive 2002/95/EC
• AEC-Q101 qualified
3
1
3
Anode
1
N/C
N/C
Anode
DESCRIPTION
VS-15ETL06-1PbF
VS-15ETL06SPbF
State of the art, ultralow VF, soft-switching hyperfast
rectifiers optimized for Discontinuous (Critical) Mode (DCM)
Power Factor Correction (PFC).
The minimized conduction loss, optimized stored charge
and low recovery current minimize the switching losses and
reduce over dissipation in the switching element and
snubbers.
The device is also intended for use as a freewheeling diode
in power supplies and other power switching applications.
PRODUCT SUMMARY
Package
TO-263AB (D2PAK), TO-262AA
IF(AV)
15 A
VR
600 V
VF at IF
1.05 V
trr (typ.)
60 ns
TJ max.
175 °C
Diode variation
Single die
APPLICATIONS
AC/DC SMPS 70 W to 400 W
e.g. laptop and printer AC adaptors, desktop PC, TV and
monitor, games units and DVD ac-to-dc power supplies.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
UNITS
600
V
Peak repetitive reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 154 °C
15
Non-repetitive peak surge current
IFSM
TJ = 25 °C
250
Peak repetitive forward current
IFM
30
TJ, TStg
- 65 to 175
Operating junction and storage temperatures
A
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
SYMBOL
VBR,
VR
TEST CONDITIONS
MIN.
TYP.
MAX.
600
-
-
IF = 15 A
-
0.99
1.05
IF = 15 A, TJ = 150 °C
-
0.85
0.92
VR = VR rated
-
0.1
10
TJ = 150 °C, VR = VR rated
-
15
120
IR = 100 μA
UNITS
V
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
CT
VR = 600 V
-
20
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8.0
-
nH
Document Number: 94005
Revision: 23-Jun-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
μA
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VS-15ETL06SPbF, VS-15ETL06-1PbF
Vishay Semiconductors
Ultralow VF Hyperfast Rectifier for
Discontinuous Mode PFC, 15 A FRED Pt®
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
-
60
120
IF = 15 A, dIF/dt = 100 A/μs, VR = 30 V
-
190
270
TJ = 25 °C
-
220
-
-
320
-
-
19
-
-
26
-
TJ = 25 °C
-
2.2
-
TJ = 125 °C
-
4.3
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
- 65
-
175
°C
Thermal resistance,
junction to case per leg
RthJC
-
1.0
1.3
Thermal resistance,
junction to ambient per leg
RthJA
Typical socket mount
-
-
70
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and
greased
-
0.5
-
-
2.0
-
-
0.07
-
oz.
-
12
(10)
kgf · cm
(lbf · in)
Reverse recovery time
trr
TEST CONDITIONS
TJ = 125 °C
Peak recovery current
IRRM
Reverse recovery charge
Qrr
TJ = 25 °C
TJ = 125 °C
IF = 15 A
dIF/dt = 200 A/μs
VR = 390 V
UNITS
ns
A
μC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
Weight
6.0
(5.0)
Mounting torque
Marking device
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Case style D2PAK
15ETL06S
Case style TO-262
15ETL06-1
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
°C/W
g
Document Number: 94005
Revision: 23-Jun-10
VS-15ETL06SPbF, VS-15ETL06-1PbF
Ultralow VF Hyperfast Rectifier for
Vishay Semiconductors
Discontinuous Mode PFC, 15 A FRED Pt®
100
TJ = 175 °C
TJ = 150 °C
TJ = 25 °C
10
1
0.4
IR - Reverse Current (µA)
IF - Instantaneous Forward
Current (A)
100
TJ = 175 °C
10
TJ = 150 °C
TJ = 125 °C
1
TJ = 100 °C
TJ = 75 °C
0.1
TJ = 50 °C
0.01
TJ = 25 °C
0.001
0.6
0.8
1.0
1.2
1.4
1.6
0
100
200
300
400
500
600
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
100
TJ = 25 °C
10
0
100
200
300
400
500
600
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
PDM
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
1
.
10
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Document Number: 94005
Revision: 23-Jun-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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VS-15ETL06SPbF, VS-15ETL06-1PbF
Ultralow VF Hyperfast Rectifier for
Discontinuous Mode PFC, 15 A FRED Pt®
180
500
170
400
DC
160
150
Square wave (D = 0.50)
80 % rated VR applied
140
300
200
100
See note (1)
130
0
5
10
15
20
VR = 390 V
TJ = 125 °C
TJ = 25 °C
0
100
25
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
9000
25
8000
RMS Limit
20
IF = 30 A
IF = 15 A
7000
6000
15
Qrr (nC)
Average Power Loss (W)
IF = 30 A
IF = 15 A
trr (ns)
Allowable Case Temperature (°C)
Vishay Semiconductors
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
10
5
DC
5000
4000
3000
2000
1000
0
0
5
10
15
20
25
VR = 390 V
TJ = 125 °C
TJ = 25 °C
0
100
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 6 - Forward Power Loss Characteristics
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 94005
Revision: 23-Jun-10
VS-15ETL06SPbF, VS-15ETL06-1PbF
Ultralow VF Hyperfast Rectifier for
Vishay Semiconductors
Discontinuous Mode PFC, 15 A FRED Pt®
VR = 200 V
0.01 Ω
L = 70 μH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 94005
Revision: 23-Jun-10
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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VS-15ETL06SPbF, VS-15ETL06-1PbF
Vishay Semiconductors
Ultralow VF Hyperfast Rectifier for
Discontinuous Mode PFC, 15 A FRED Pt®
ORDERING INFORMATION TABLE
Device code
VS-
15
E
T
L
06
S
1
2
3
4
5
6
7
1
-
HPP product suffix
2
-
Current rating (15 A)
3
-
E = Single diode
4
-
T = TO-220, D2PAK
5
-
L = Ultralow VF hyperfast recovery
6
-
Voltage rating (06 = 600 V)
7
-
TRL PbF
8
9
S = D2PAK
-1 = TO-262
8
-
None = Tube (50 pieces)
TRL = Tape and reel (left oriented, for D2PAK package)
TRR = Tape and reel (right oriented, for D2PAK package)
9
-
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95014
Part marking information
www.vishay.com/doc?95008
Packaging information
www.vishay.com/doc?95032
SPICE model
www.vishay.com/doc?95270
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 94005
Revision: 23-Jun-10
Outline Dimensions
Vishay High Power Products
D2PAK, TO-262
DIMENSIONS FOR D2PAK in millimeters and inches
Conforms to JEDEC outline D2PAK (SMD-220)
(2)(3)
E
B
Pad layout
A
A
(E)
c2
11.00
MIN.
(0.43)
A
(3) L1
4
9.65
MIN.
(0.38)
(D1) (3)
Detail A
D
H
1
2
17.90 (0.70)
15.00 (0.625)
(2)
3
3.81
MIN.
(0.15)
L2
B
B
2.32
MIN.
(0.08)
A
2 x b2
c
2.64 (0.103)
2.41 (0.096)
(3)
E1
C
View A - A
2xb
± 0.004 M B
0.010 M A M B
Plating
2x e
Base
Metal
(4)
b1, b3
H
Gauge
plane
Seating
plane
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
SYMBOL
MILLIMETERS
MIN.
c1 (4)
(c)
B
0° to 8°
MAX.
L3
Lead tip
A1
L
(b, b2)
L4
Section B - B and C - C
Scale: None
Detail “A”
Rotated 90 °CW
Scale: 8:1
INCHES
MIN.
MAX.
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
A
4.06
4.83
0.160
0.190
D1
6.86
8.00
0.270
0.315
3
A1
0.00
0.254
0.000
0.010
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
4
2.54 BSC
0.100 BSC
H
14.61
15.88
0.575
0.625
4
L
1.78
2.79
0.070
0.110
L1
-
1.65
-
0.066
4
L2
1.27
1.78
0.050
0.070
2
L4
L3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
Document Number: 95014
Revision: 31-Mar-09
e
(7)
0.25 BSC
4.78
5.28
3
0.010 BSC
0.188
0.208
Outline conforms to JEDEC outline TO-263AB
For technical questions concerning discrete products, contact: [email protected]
For technical questions concerning module products, contact: [email protected]
www.vishay.com
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Outline Dimensions
D2PAK, TO-262
Vishay High Power Products
DIMENSIONS FOR TO-262 in millimeters and inches
Modified JEDEC outline TO-262
(Datum A) (2) (3)
E
A
A
c2
B
E
A
(3) L1
Seating
plane
D
1
2 3
C
L2
B
D1 (3)
B
C
L (2)
A
c
3 x b2
3xb
E1
A1
(3)
Section A - A
2xe
Plating
0.010 M A M B
(4)
b1, b3
Base
metal
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
Lead tip
SYMBOL
c1
c
(4)
(b, b2)
Section B - B and C - C
Scale: None
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.06
4.83
0.160
0.190
A1
2.03
3.02
0.080
0.119
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
NOTES
4
4
4
D
8.51
9.65
0.335
0.380
D1
6.86
8.00
0.270
0.315
3
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
e
2.54 BSC
0.100 BSC
L
13.46
14.10
0.530
0.555
L1
-
1.65
-
0.065
L2
3.56
3.71
0.140
0.146
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
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2
2
(6)
3
Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
For technical questions concerning discrete products, contact: [email protected]
For technical questions concerning module products, contact: [email protected]
Document Number: 95014
Revision: 31-Mar-09
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 11-Mar-11
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