SCLS541A − SEPTEMBER 2003 − REVISED APRIL 2008 D Qualified for Automotive Applications D ESD Protection Exceeds 1500 V Per D D DW PACKAGE (TOP VIEW) MIL-STD-883, Method 3015; Exceeds 150 V Using Machine Model (C = 200 pF, R = 0) Inputs Are TTL-Voltage Compatible Latch-Up Performance Exceeds 250 mA Per JESD 17 OE 1D 2D 3D 4D 5D 6D 7D 8D GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q LE description/ordering information The SN74AHCT573 is an octal transparent D-type latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is low, the Q outputs are latched at the logic levels of the D inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. ORDERING INFORMATION{ TA ORDERABLE PART NUMBER PACKAGE‡ TOP-SIDE MARKING −40°C to 125°C SOIC − DW Tape and reel SN74AHCT573QDWRQ1 AHCT573QQ1 † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS541A − SEPTEMBER 2003 − REVISED APRIL 2008 logic diagram (positive logic) OE LE 1 11 C1 1D 2 19 1D 1Q To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX 4.5 5.5 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage 0.8 V Input voltage 0 5.5 V VO IOH Output voltage 0 V High-level output current VCC −8 mA IOL ∆t/∆v Low-level output current 8 mA 20 ns/V High-level input voltage 2 Input transition rise or fall rate V V TA Operating free-air temperature −40 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS541A − SEPTEMBER 2003 − REVISED APRIL 2008 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH IOH = −50 mA IOH = −8 mA 4.5 V VOL IOL = 50 mA IOL = 8 mA 4.5 V II IOZ VI = 5.5 V or GND VO = VCC or GND ICC VI = 5.5 V or GND, IO = 0 ∆ICC† One input at 3.4 V, Other inputs at VCC or GND 5.5 V Ci VI = VCC or GND VO = VCC or GND MIN 4.4 TA = 25°C TYP MAX MIN 4.5 MAX UNIT 4.4 3.94 V 3.8 0.1 0.1 0.36 0.44 0 V to 5.5 V ±0.1 ±1 mA 5.5 V ±0.25 ±2.5 mA 5.5 V 4 40 mA 1.35 1.5 mA 5V 2.5 10 V pF Co 5V 3 † This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC. pF timing requirements over recommended operating free-air temperature range, Vcc = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = 25°C MIN MAX MIN MAX UNIT tw Pulse duration, LE high 5 5 ns tsu Setup time, data before LE↓ 3.5 3.5 ns th Hold time, data after LE↓ 1.5 1.5 ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL D Q CL = 15 pF tPLH tPHL LE Q CL = 15 pF tPZH tPZL OE Q CL = 15 pF tPHZ tPLZ OE Q CL = 15 pF tPLH tPHL D Q CL = 50 pF tPLH tPHL LE Q CL = 50 pF tPZH tPZL OE Q CL = 50 pF tPHZ tPLZ OE Q CL = 50 pF tsk(o) CL = 50 pF POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN TA = 25°C TYP MAX MIN MAX 4.2 6 1 6.5 5.1 7 1 9 4.7 6.5 1 7.5 5.6 7.5 1 9 4.1 6.5 1 7 5.5 7.5 1 10 5.5 8 1 11 5.4 8 1 9.5 5.2 7 1 7.5 6.1 8 1 10 5.7 7.5 1 8.5 6.6 8.5 1 10 5.1 7.5 1 8 6.5 8.5 1 11 6.7 9 1 12 6.4 9 1 10.5 1.5 UNIT ns ns ns ns ns ns ns ns ns 3 SCLS541A − SEPTEMBER 2003 − REVISED APRIL 2008 operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, TYP f = 1 MHz UNIT 16 pF PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL 1.5 V tPLZ ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPZH tPLH 50% VCC 3V Output Control VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device SN74AHCT573QDWRQ1 Status (1) ACTIVE Package Type Package Drawing SOIC DW Pins Package Qty Eco Plan 20 TBD (2) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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