SCBS774 − NOVEMBER 2003
D Controlled Baseline
D
D
D
D
D
D
D
D Bus Hold on Data Inputs Eliminates the
− One Assembly/Test Site, One Fabrication
Site
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With 3.3-V
VCC)
Supports Unregulated Battery Operation
Down To 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
D
D
Need for External Pullup/Pulldown
Resistors
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
PW PACKAGE
(TOP VIEW)
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
description/ordering information
This octal flip-flop is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide
a TTL interface to a 5-V system environment.
The eight flip-flops of the SN74LVTH574 are edge-triggered D-type flip-flops. On the positive transition of the
clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without need for interface or pullup components.
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C
TSSOP − PW
Tape and reel
SN74LVTH574IPWREP
LH574EP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#'
+&%#$ %! # $('%%"#$ (' #,' #'!$ '-"$ $#&!'#$
$#"+"+ .""#/ +&%# (%'$$0 +'$ # '%'$$"*/ %*&+'
#'$#0 "** (""!'#'$
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS774 − NOVEMBER 2003
description/ordering information (continued)
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup
or pulldown resistors with the bus-hold circuitry is not recommended.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
CLK
1
11
C1
1D
2
19
1Q
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS774 − NOVEMBER 2003
recommended operating conditions (see Note 4)
MIN
MAX
2.7
3.6
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
5.5
V
IOH
IOL
High-level output current
−32
mA
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−40
High-level input voltage
2
V
0.8
Low-level output current
Outputs enabled
V
V
64
mA
10
ns/V
µs/V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
II(hold)
UNIT
−1.2
V
VCC = 2.7 V,
VCC = 3 V,
IOH = −8 mA
IOH = −32 mA
IOL = 100 µA
IOL = 24 mA
0.2
VCC = 2.7 V
IOL = 16 mA
IOL = 32 mA
0.4
IOL = 64 mA
VI = 5.5 V
0.55
Control inputs
VCC = 0 or 3.6 V,
VCC = 3.6 V,
Data inputs
VCC = 3.6 V
VCC = 0,
Data inputs
MAX
II = −18 mA
IOH = −100 µA
VCC = 3 V
Ioff
TYP†
VCC = 2.7 V,
VCC = 2.7 V to 3.6 V,
VOL
II
MIN
VCC = 3.6 V‡,
V
2
0.5
V
0.5
10
VI = VCC or GND
VI = VCC
±1
VI = 0
VI or VO = 0 to 4.5 V
−5
VI = 0.8 V
VI = 2 V
VCC = 3 V
VCC−0.2
2.4
1
±100
µA
A
µA
75
µA
−75
±500
VI = 0 to 3.6 V
VO = 3 V
5
µA
−5
µA
±100
µA
IOZH
IOZL
VCC = 3.6 V,
VCC = 3.6 V,
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care
±100
µA
ICC
VCC = 3.6 V, IO = 0, VI = VCC or GND
VO = 0.5 V
Outputs high
0.19
Outputs low
5
Outputs disabled
∆ICC§
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND
Ci
VI = 3 V or 0
VO = 3 V or 0
Co
mA
0.19
0.2
3
mA
pF
7
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS774 − NOVEMBER 2003
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
VCC = 3.3 V
± 0.3 V
MIN
fclock
tw
Clock frequency
tsu
th
Setup time, data before CLK↑
MAX
VCC = 2.7 V
MIN
150
Pulse duration, CLK high or low
Hold time, data after CLK↑
UNIT
MAX
150
MHz
3.3
3.3
ns
2
2.4
ns
0.3
0
ns
switching characteristics over recommended free-air temperature, CL = 50 pF (unless otherwise
noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
MIN
TYP†
VCC = 2.7 V
MAX
150
CLK
Q
OE
Q
OE
Q
† All typical values are at VCC = 3.3 V, TA = 25°C.
4
VCC = 3.3 V
± 0.3 V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
UNIT
MAX
150
MHz
1.8
3
4.5
5.3
1.8
3
4.5
5.3
1.5
3.2
4.8
5.9
1.5
3.5
4.8
5.9
2
3.5
4.8
5.1
2
3.2
4.4
4.4
ns
ns
ns
SCBS774 − NOVEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
2.7 V
Input
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
2.7 V
2.7 V
1.5 V
Input
Output
Control
1.5 V
0V
Output
Waveform 1
S1 at 6 V
(see Note B)
VOH
1.5 V
Output
1.5 V
VOL
VOH
Output
1.5 V
tPLZ
3V
1.5 V
tPZH
tPLH
tPHL
1.5 V
VOL
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPHL
tPLH
1.5 V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LVTH574IPWREP
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/04679-01XE
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVTH574-EP :
SN74LVTH574
• Catalog:
• Military: SN54LVTH574
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
• Military - QML certified for Military and Defense Applications
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVTH574IPWREP
Package Package Pins
Type Drawing
TSSOP
PW
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
6.95
B0
(mm)
K0
(mm)
P1
(mm)
7.1
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVTH574IPWREP
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
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