VISHAY AEC-Q101-002

MSE1PB, MSE1PD, MSE1PG, MSE1PJ
www.vishay.com
Vishay General Semiconductor
Surface Mount ESD Capability Rectifier
FEATURES
•
•
•
•
®
eSMP Series
•
•
Top View
Bottom View
•
•
MicroSMP
Very low profile - typical height of 0.65 mm
Available
Ideal for automated placement
Oxide planar chip junction
Low forward voltage drop, low leakage
current
ESD capability
Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
AEC-Q101 qualified
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912

MECHANICAL DATA
PRIMARY CHARACTERISTICS
IF(AV)
1.0 A
VRRM
100 V, 200 V, 400 V, 600 V
IFSM
20 A
VF at IF = 1.0 A
0.925 V
IR
1 μA
TJ max.
175 °C
Package
MicroSMP
Diode variations
Single die
Case: MicroSMP
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3 - halogen-free, RoHS-compliant, and
automotive grade
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Polarity: Color band denotes the cathode end
TYPICAL APPLICATIONS
General purpose, polarity protection, and rail-to-rail
protection in both consumer and automotive applications.
MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
MSE1PB
MSE1PD
MSE1PG
MSE1PJ
SB
SD
SG
SJ
100
200
400
600
UNIT
Max. repetitive peak reverse voltage
VRRM
Max. average forward rectified current (fig. 1)
IF(AV)
1.0
A
Peak forward surge current 10 ms single half
sine-wave superimposed on rated load
IFSM
20
A
TJ, TSTG
- 55 to + 175
°C
Operating junction and storage temperature range
V
ELECTRICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
PARAMETER
TEST CONDITIONS
IF = 0.5 A
Max. instantaneous forward voltage
IF = 1.0 A
IF = 0.5 A
IF = 1.0 A
SYMBOL
TA = 25 °C
VF (1)
TA = 125 °C
TA = 25 °C
IR (2)
TYP.
MAX.
0.940
-
1.016
1.1
0.834
-
0.925
0.98
-
1.0
3.7
50
UNIT
V
μA
Max. reverse current
Rated VR
Typical reverse recovery time
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
trr
780
-
ns
Typical junction capacitance
4.0 V, 1 MHz
CJ
5
-
pF
TA = 125 °C
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width  40 ms
Revision: 14-Aug-13
Document Number: 89067
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSE1PB, MSE1PD, MSE1PG, MSE1PJ
www.vishay.com
Vishay General Semiconductor
THERMAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Typical thermal resistance
MSE1PB
MSE1PD
MSE1PG
RJA (1)
110
RJL (1)
30
RJC (1)
40
MSE1PJ
UNIT
°C/W
Note
(1) Thermal resistance from junction to ambient and junction to lead mounted on PCB with 6.0 mm x 6.0 mm copper pad areas. R
JL is measured
at the terminal of cathode band.
IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS
(TA = 25 °C, unless otherwise noted)
STANDARD
TEST TYPE
TEST CONDITIONS
SYMBOL
CLASS
VALUE
AEC-Q101-001
Human body model (contact mode)
C = 100 pF, R = 1.5 k
H3B
> 8 kV
AEC-Q101-002
Machine model (contact mode)
C = 200 pF, R = 0 
M4
> 400 V
JESD22-A114
Human body model (contact mode)
C = 100 pF, R = 1.5 k
3B
> 8 kV
JESD22-A115
Machine model (contact mode)
C = 200 pF, R = 0 
C
> 400 V
Human body model (contact mode)
C = 150 pF, R = 330 
4
> 8 kV
Human body model (air-discharge mode) (1)
C = 150 pF, R = 330 
4
> 15 kV
IEC 61000-4-2 (2)
VC
Notes
(1) Immunity to IEC 61000-4-2 air discharge mode has a typical performance > 30 kV
(2) System ESD standard
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
MSE1PJ-M3/89A
0.006
89A
4500
7" diameter plastic tape and reel
MSE1PJHM3/89A (1)
0.006
89A
4500
7" diameter plastic tape and reel
Note
(1) Automotive grade
1.2
1.2
1.0
1.0
D = 0.8
Average Power Loss (W)
Average Forward Rectified Current (A)
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
0.8
0.6
0.4
TL Measured
at the Cathode Band Terminal
0.2
D = 0.5
0.8
D = 0.3
D = 1.0
D = 0.2
0.6
D = 0.1
T
0.4
0.2
0
D = tp/T
tp
0.8
1.0
0
95
105
115
125
135
145
155
165
175
0
0.2
0.4
0.6
1.2
Lead Temperature (°C)
Average Forward Current (A)
Fig. 1 - Forward Current Derating Curve
Fig. 2 - Forward Power Loss Characteristics
Revision: 14-Aug-13
Document Number: 89067
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSE1PB, MSE1PD, MSE1PG, MSE1PJ
www.vishay.com
Vishay General Semiconductor
10
Junction Capacitance (pF)
Instantaneous Forward Current (A)
10
TJ = 175 °C
1
TJ = 25 °C
TJ = 50 °C
TJ = 150 °C
TJ = 75 °C
0.1
TJ = 100 °C
TJ = 125 °C
1
0.01
0
0.4
0.8
1.2
1.6
2.0
2.4
0.1
10
100
Reverse Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 5 - Typical Junction Capacitance
1000
Transient Thermal Impedance (°C/W)
100
Instantaneous Reverse Current (μA)
1
Instantaneous Forward Voltage (V)
TJ = 175 °C
TJ = 150 °C
10
TJ = 125 °C
TJ = 100 °C
1
TJ = 75 °C
0.1
TJ = 25 °C
0.01
20
30
40
50
60
70
80
90
100
10
1
0.01
0.001
10
Junction to Ambient
100
0.1
1
10
100
1000
Percent of Rated Peak Reverse Voltage (%)
t - Pulse Duration (s)
Fig. 4 - Typical Reverse Leakage Characteristics
Fig. 6 - Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
MicroSMP
0.059 (1.50)
0.043 (1.10)
Cathode Band
0.055 (1.40)
0.047 (1.20)
0.030 (0.75)
0.022 (0.55)
0.039 (0.98)
0.031 (0.78)
0.091 (2.30)
0.083 (2.10)
0.106 (2.70)
0.091 (2.30)
0.030 (0.75)
0.022 (0.55)
Mounting Pad Layout
0.079
(2.00)
0.029 (0.73)
0.025 (0.63)
0.043
(1.10)
0.011 (0.27)
0.005 (0.12)
Revision: 14-Aug-13
0.032
(0.80)
0.032
(0.80)
0.020 (0.50)
Document Number: 89067
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000