New Product EGF1T Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier FEATURES • Cavity-free glass-passivated junction ® • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • Avalanche surge energy capability d* e t n e Pat • Meets environmental standard MIL-S-19500 * Glass-plastic encapsulation technique is covered by patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846 DO-214BA (GF1) • Meets MSL level 1, per J-STD-020, LF maximum peak of 250 °C • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high voltage rectification of photoflash application. PRIMARY CHARACTERISTICS IF(AV) 1.0 A VRRM 1300 V IFSM 20 A Case: DO-214BA, molded plastic over glass body trr 75 ns Epoxy meets UL 94V-0 flammability rating EAS 15 mJ TJ max. 150 °C Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test, HE3 suffix for high reliability grade (AEC Q101 qualified), meets JESD 201 class 2 whisker test MECHANICAL DATA Polarity: Color band denotes cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code EGF1T UNIT ET Maximum repetitive peak reverse voltage VRRM 1300 V Maximum RMS voltage VRMS 910 V Maximum DC blocking VDC 1300 V Maximum average forward rectified current IF(AV) 1.0 A Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load IFSM 20 A Non-repetitive avalanche energy at TA = 25 °C, IAS = 1 A, L = 30 mH EAS 15 mJ TJ, TSTG - 55 to + 150 °C Operating junction and storage temperature range Document Number: 88904 Revision: 13-May-08 For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 1 New Product EGF1T Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS (1) SYMBOL EGF1T UNIT VF 3.0 V IR 5.0 50 µA 1.0 A TJ = 25 °C Maximum DC reverse current (2) VRM TJ = 25 °C TJ = 125 °C Typical reverse recovery time IF = 0.5 A, IR =1.0 A, Irr = 0.25 A trr 75 ns Typical junction capacitance 4.0 V, 1 MHz CJ 8.0 pF SYMBOL EGF1T UNIT RθJA RθJL 50 20 °C/W Maximum instantaneous forward voltage Notes: (1) Pulse test: 300 µs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER Typical thermal resistance (1) Note: (1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.95 x 0.95" (24 x 24 mm) copper pad areas ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE EGF1T-E3/67A 0.104 67A 1500 7" diameter plastic tape and reel EGF1T-E3/5CA 0.104 5CA 6500 13" diameter plastic tape and reel EGF1THE3/67A (1) 0.104 67A 1500 7" diameter plastic tape and reel EGF1THE3/5CA (1) 0.104 5CA 6500 13" diameter plastic tape and reel Note: (1) Automotive grade AEC Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) 25 Forward Surge Current (A) Average Forward Current (A) 1.5 1.0 0.5 20 15 10 5 0 0 25 50 75 100 125 150 175 1 10 100 TL - Lead Temperature (°C) Number of Cycles Figure 1. Maximum Forward Current Derating Curve Figure 2. Maximum Non-Repetitive Forward Surge Current www.vishay.com 2 For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] Document Number: 88904 Revision: 13-May-08 New Product EGF1T Vishay General Semiconductor 100 Junction Capacitance (pF) Instantaneous Forward Current (A) 100 TJ = 150 °C 10 TJ = 125 °C 1 0.1 TJ = 25 °C 1 0.01 0 0.1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 1 10 100 Instantaneous Forward Voltage (V) Reverse Voltage (V) Figure 3. Typical Instantaneous Forward Characteristics Figure 5. Typical Junction Capacitance Per Leg 100 100 Transient Thermal Impedance (°C/W) Instantaneous Reverse Leakage Current (µA) 10 TJ = 150 °C 10 TJ = 125 °C 1 0.1 TJ = 25 °C 0.01 1 0.1 0.001 10 20 30 40 50 60 70 80 90 10 100 1 10 100 Percent of Rated Peak Reverse Voltage (%) t - Pulse Duration (s) Figure 4. Typical Reverse Leakage Characteristics Figure 6. Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-214BA (GF1) Cathode Band Mounting Pad Layout 0.066 (1.68) 0.040 (1.02) 0.076 (1.93) MAX. 0.066 (1.68) MIN. 0.187 (4.75) 0.167 (4.24) 0.015 (0.38) 0.0065 (0.17) 0.060 (1.52) MIN. 0.108 (2.74) 0.098 (2.49) 0.118 (3.00) 0.100 (2.54) 0.060 (1.52) 0.030 (0.76) Document Number: 88904 Revision: 13-May-08 0.006 (0.152) TYP. 0.220 (5.58) REF. 0.114 (2.90) 0.094 (2.39) 0.226 (5.74) 0.196 (4.98) For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 3 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1