19-2654; Rev 2; 12/10 KIT ATION EVALU E L B A AVAIL 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP Features The MAX1169 is a low-power, 16-bit successiveapproximation analog-to-digital converter (ADC). The device features automatic power-down, an on-chip 4MHz clock, a +4.096V internal reference, and an I2C-compatible 2-wire serial interface capable of both fast and high-speed modes. o High-Speed Serial Interface 400kHz Fast Mode 1.7MHz High-Speed Mode The MAX1169 operates from a single supply and consumes 5mW at the maximum conversion rate of 58.6ksps. AutoShutdown™ powers down the device between conversions, reducing supply current to less than 50µA at a 1ksps throughput rate. The option of a separate digital supply voltage allows direct interfacing with +2.7V to +5.5V digital logic. The MAX1169 performs a unipolar conversion on its single analog input using its internal 4MHz clock. The full-scale analog input range is determined by the internal reference or by an externally applied reference voltage ranging from 1V to VAVDD. The four address select inputs (ADD0 to ADD3) allow up to 16 MAX1169 devices on the same bus. o Internal +4.096V Reference I2C-Compatible o +4.75V to +5.25V Single Supply o +2.7V to +5.5V Adjustable Logic Level o External Reference: 1V to VAVDD o Internal 4MHz Conversion Clock o 58.6ksps Sampling Rate o AutoShutdown Between Conversions o Low Power 5.0mW at 58.6ksps 4.2mW at 50ksps 2.0mW at 10ksps 0.23mW at 1ksps 3µW in Shutdown o Small 14-Pin TSSOP Package The MAX1169 is packaged in a 14-pin TSSOP and operates over an extended temperature range. Refer to the MAX1069 data sheet for a 14-bit device in a pincompatible package. Applications Hand-Held Portable Applications Ordering Information PART TEMP RANGE PINPACKAGE INL (LSB) MAX1169BEUD+ -40°C to +85°C 14 TSSOP ±2 +Denotes a lead(Pb)-free/RoHS-compliant package. Medical Instruments Pin Configuration Battery-Powered Test Equipment Solar-Powered Remote Systems Received-Signal-Strength Indicators System Supervision TOP VIEW DGND 1 14 ADD3 SCL 2 13 REF SDA 3 12 REFADJ ADD2 4 MAX1169 11 AGNDS ADD1 5 10 AIN ADD0 6 9 AGND DVDD 7 8 AVDD TSSOP AutoShutdown is a trademark of Maxim Integrated Products, Inc. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX1169 General Description MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP ABSOLUTE MAXIMUM RATINGS AVDD to AGND.........................................................-0.3V to +6V DVDD to DGND ........................................................-0.3V to +6V AGND to DGND.....................................................-0.3V to +0.3V AGNDS to AGND...................................................-0.3V to +0.3V AIN, REF, REFADJ to AGND ..................-0.3V to (VAVDD + 0.3V) SCL, SDA, ADD_ to DGND.......................................-0.3V to +6V Maximum Current into Any Pin............................................50mA Continuous Power Dissipation (TA = +85°C) 14-Pin TSSOP (derate 9.1mW/°C above +85°C) .........864mW Operating Temperature Ranges MAX1169_EUD ................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VAVDD = +4.75V to +5.25V, VDVDD = +2.7V to +5.5V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ±2 LSB 0.7 1.7 LSB 2 5 mV DC ACCURACY (Note 1) Resolution 16 Relative Accuracy (Note 2) INL MAX1169B Differential Nonlinearity DNL MAX1169B, no missing codes 16-bit NMC Offset Error Offset-Error Temperature Coefficient Bits 1.0 Gain Error (Note 3) ±0.25 Gain Temperature Coefficient ppm/°C ±0.5 %FSR 0.1 ppm/°C 90 dB DYNAMIC PERFORMANCE (fIN(sine wave) = 1kHz, VIN = VREF(P-P), fSAMPLE = 58.6ksps) Signal-to-Noise Plus Distortion SINAD 86 Total Harmonic Distortion THD Spurious-Free Dynamic Range SFDR 92 105 dB Signal-to-Noise Ratio SNR 87 90 dB Full-Power Bandwidth FPBW Full-Linear Bandwidth Up to the 5th harmonic -102 -90 dB -3dB point 4 MHz SINAD > 81dB 33 kHz Fast mode 7.1 7.5 High-speed mode 5.8 6 CONVERSION RATE (Figure 11) Conversion Time (SCL Stretched Low) Throughput Rate (Note 4) tCONV f SAMPLE Internal Clock Frequency fCLK Track/Hold Acquisition Time tACQ Aperture Delay, Figure 11c (Note 6) 2 tAD Fast mode 19 High-speed mode 58.6 4 (Note 5) 1100 μs ksps MHz ns Fast mode 50 High-speed mode 30 _______________________________________________________________________________________ ns 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP (VAVDD = +4.75V to +5.25V, VDVDD = +2.7V to +5.5V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER Aperture Jitter, Figure 11c SYMBOL tAJ CONDITIONS MIN TYP Fast mode 100 High-speed mode 100 MAX UNITS ps ANALOG INPUT (AIN) Input Voltage Range VAIN On/off-leakage current, VAIN = 0V or VAVDD, no clock, f SCL = 0 Input Leakage Current Input Capacitance 0 ±0.01 CIN VREF V ±10 μA 35 pF INTERNAL REFERENCE (bypass REFADJ with 0.1μF to AGND and REF with 10μF to AGND) REF Output Voltage VREF Reference Temperature Coefficient TCREF Reference Short-Circuit Current IREFSC 4.056 TA = -40°C to +85°C 4.136 ±35 4.056 For small adjustments, from 4.096V 4.096 V ppm/°C 10 REFADJ Output Voltage REFADJ Input Range 4.096 mA 4.136 ±60 V mV EXTERNAL REFERENCE (REFADJ = AVDD) Pull REFADJ high to disable the internal bandgap reference and reference buffer REFADJ Buffer Disable Voltage VAVDD - 0.1 V REFADJ Buffer Enable Voltage Reference Input Voltage Range (Note 7) REF Input Current VREF = +4.096V, VIN = VREF(P-P), f IN(sine wave) = 1kHz, f SAMPLE = 58.6ksps 27 VREF = +4.096V, shutdown 0.1 IREF 1.0 VAVDD - 0.4 V VAVDD V μA DIGITAL INPUTS/OUTPUTS (SCL, SDA) Input High Voltage VIH Input Low Voltage VIL Input Hysteresis 0.7 VDVDD 0.3 VDVDD 0.1 VDVDD VHYST Input Current I IN Input Capacitance CIN Output Low Voltage VOL V V ±10 15 I SINK = 3mA V μA pF 0.4 V ADDRESS SELECT INPUTS (ADD3, ADD2, ADD1, ADD0) Input High Voltage 0.7 VDVDD V 0.3 VDVDD Input Low Voltage Input Hysteresis 0.1 VDVDD V V _______________________________________________________________________________________ 3 MAX1169 ELECTRICAL CHARACTERISTICS (continued) MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP ELECTRICAL CHARACTERISTICS (continued) (VAVDD = +4.75V to +5.25V, VDVDD = +2.7V to +5.5V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP Input Current Input Capacitance MAX UNITS ±10 μA 15 pf POWER REQUIREMENTS (AVDD, AGND, DVDD, DGND) Analog Supply Voltage AVDD Digital Supply Voltage DVDD 4.75 2.7 f SAMPLE = 58.6ksps 1.8 Internal reference f SAMPLE = 10ksps (powered down between conversions, f SAMPLE = 1ksps R/W = 0) Shutdown Analog Supply Current IAVDD Internal reference (always on, R/W = 1) External reference (REFADJ = AVDD) Digital Supply Current IDVDD PSRR V 5.5 V 2.5 0.7 40 0.4 5 f SAMPLE = 58.6ksps 1.8 2.5 f SAMPLE = 10ksps 1.4 f SAMPLE = 1ksps 1.1 Shutdown 0.4 5 f SAMPLE = 58.6ksps 0.90 1.8 f SAMPLE = 10ksps 0.36 f SAMPLE = 1ksps 40 Shutdown 0.4 5 f SAMPLE = 58.6ksps 260 400 f SAMPLE = 10ksps 65 f SAMPLE = 1ksps 6 Shutdown Power-Supply Rejection Ratio 5.25 VAVDD = 5V ±5%, full-scale input (Note 8) mA μA mA μA mA μA μA 0.2 5 5 16 LSB/V 400 kHz TIMING CHARACTERISTICS FOR 2-WIRE FAST MODE (Figure 1a and Figure 2) Serial Clock Frequency f SCL Bus Free Time Between a STOP and a START Condition tBUF 1.3 μs tHD, STA 0.6 μs Hold Time for Start Condition Low Period of the SCL Clock tLOW 1.3 μs High Period of the SCL Clock tHIGH 0.6 μs Setup Time for a Repeated START Condition (Sr) t SU, STA 0.6 μs Data Hold Time tHD, DAT Data Setup Time t SU, DAT (Note 9) 0 900 100 ns ns Rise Time of Both SDA and SCL Signals, Receiving tR (Note 10) 20 + 0.1CB 300 ns Fall Time of SDA Transmitting tF (Note 10) 300 ns Setup Time for STOP Condition Capacitive Load for Each Bus t SU, STO CB 20 + 0.1CB 0.6 400 pF 50 ns Pulse Width of Spike Suppressed 4 t SP _______________________________________________________________________________________ μs 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP (VAVDD = +4.75V to +5.25V, VDVDD = +2.7V to +5.5V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10μF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 1.7 MHz TIMING CHARACTERISTICS FOR 2-WIRE HIGH-SPEED MODE (Figure 1b and Figure 2) Serial Clock Frequency f SCLH Hold Time (Repeated) Start Condition (Note 11) tHD, STA 160 ns Low Period of the SCL Clock tLOW 320 ns High Period of the SCL Clock tHIGH 120 ns Setup Time for a Repeated START Condition t SU, STA 160 ns Data Hold Time tHD, DAT Data Setup Time t SU, DAT (Note 9) 0 150 10 ns ns Rise Time of SCL Signal (Current Source Enabled) tRCL (Note 10) 10 80 ns Rise Time of SCL Signal After Acknowledge Bit tRCL1 (Note 10) 20 160 ns Fall Time of SCL Signal tFCL (Note 10) 20 80 ns Rise Time of SDA Signal tRDA (Note 10) 20 160 ns tFDA (Note 10) 20 160 ns Fall Time of SDA Signal Setup Time for STOP Condition Capacitive Load for Each Bus Pulse Width of Spike Suppressed t SU, STO CB 160 t SP ns 400 pF 10 ns Note 1: DC accuracy is tested at VAVDD = +5.0V and VDVDD = +3.0V. Performance at power-supply tolerance limits is guaranteed by power-supply rejection test. Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range and offset have been calibrated. Note 3: Offset nullified. Note 4: One sample is achieved every 18 clocks in continuous conversion mode: ⎛ 18 clocks ⎞ fSAMPLE = ⎜ + t CONV ⎟ ⎝ fSCL ⎠ -1 Note 5: The track/hold acquisition time is two SCL cycles as illustrated in Figure 11: ⎛ 1 ⎞ t ACQ = 2 × ⎜ ⎟ ⎝ fSCL ⎠ Note 6: A filter on SDA and SCL delays the sampling instant and suppresses noise spikes less than 10ns in high-speed mode and 50ns in fast mode. Note 7: ADC performance is limited by the converter’s noise floor, typically 225μVP-P. Note 8: PSRR = 2N ⎡⎣ VFS (5.25V)-VFS (4.75V) ⎤⎦ × VREF 5.25V - 4.75V where N is the number of bits (16). _______________________________________________________________________________________ 5 MAX1169 ELECTRICAL CHARACTERISTICS (continued) MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP ELECTRICAL CHARACTERISTICS (continued) (VAVDD = +4.75V to +5.25V, VDVDD = +2.7V to +5.5V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10μF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) Note 9: A master device must provide a data hold time for SDA (referred to VIL of SCL) in order to bridge the undefined region of SCL’s falling edge (see Figure 1). Note 10: CB = total capacitance of one bus line in pF. tR and tF measured between 0.3 VDVDD and 0.7 VDVDD. Note 11: fSCL must meet the minimum clock low time plus the rise/fall times. A. F/S-MODE I2C SERIAL INTERFACE TIMING tR tF SDA tSU,DAT tHD,DAT tLOW tBUF tHD,STA tSU,STA tSU,STO SCL tHD,STA tHIGH tR tF S Sr A P B. HS-MODE I2C SERIAL INTERFACE TIMING S tFDA tRDA SDA tHD,DAT tSU,DAT SCL tBUF tHD,STA tSU,STA tLOW tSU,STO tHIGH tHD,STA tRCL tFCL tRCL1 S Sr A P HS-MODE PARAMETERS ARE MEASURED FROM 30% TO 70%. Figure 1. I2C Serial Interface Timing VDD IOL = 3mA DIGITAL I/O VOUT 400pF IOH = 0mA Figure 2. Load Circuit 6 _______________________________________________________________________________________ S F/S-MODE 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP 1.73 VDVDD = 3V 820 500 800 790 TA = +85°C TA = +70°C TA = +25°C TA = 0°C TA = -40°C 1.67 1.65 IAVDD (nA) IAVDD (μA) 1.69 TA = +85°C TA = +70°C TA = +25°C TA = 0°C TA = -40°C 780 770 1.63 400 300 4.95 5.05 5.15 5.25 100 0 4.75 4.85 VAVDD (V) 4.95 5.05 5.15 4.85 4.95 240 5.15 5.25 DIGITAL SHUTDOWN CURRENT vs. DIGITAL SUPPLY VOLTAGE 350 MAX1169 toc04 VAVDD = 5V 5.05 VAVDD (V) VAVDD (V) 280 260 4.75 5.25 DIGITAL SUPPLY CURRENT vs. DIGITAL SUPPLY VOLTAGE 300 VAVDD = 5V fSAMPLE = 0 R/W = 0 TA = -40°C 250 TA = +85°C IDVDD (nA) IDVDD (μA) 220 200 180 TA = 0°C 200 TA = +25°C 150 TA = +70°C TA = -40°C 160 100 TA = +85°C 140 50 120 0 100 3.1 3.5 3.9 4.3 4.7 5.1 2.7 5.5 3.1 3.5 3.9 4.3 4.7 VDVDD (V) VDVDD (V) OFFSET ERROR vs. TEMPERATURE GAIN ERROR vs. TEMPERATURE 0.008 MAX1169 toc06 800 600 0.006 GAIN ERROR (% FSR) 400 200 0 -200 5.5 0.004 0.002 0 -0.002 -400 -0.004 -600 -0.006 -800 5.1 MAX1169 toc07 2.7 OFFSET ERROR (μV) 4.85 TA = +85°C TA = +70°C TA = +25°C TA = 0°C TA = -40°C 200 760 4.75 VDVDD = 3V fSAMPLE = 0 R/W = 0 600 810 1.71 IAVDD (mA) 700 MAX1169 toc03 VDVDD = 3V MAX1169 toc02 830 MAX1169 toc01 1.75 ANALOG SHUTDOWN CURRENT vs. ANALOG SUPPLY VOLTAGE ANALOG SUPPLY CURRENT vs. ANALOG SUPPLY VOLTAGE (EXTERNAL REFERENCE) MAX1169 toc05 ANALOG SUPPLY CURRENT vs. ANALOG SUPPLY VOLTAGE (INTERNAL REFERENCE) -0.008 -40 -15 10 35 TEMPERATURE (°C) 60 85 -40 -15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 7 MAX1169 Typical Operating Characteristics (VDVDD = +3.0V, VAVDD = +5.0V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10μF, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VDVDD = +3.0V, VAVDD = +5.0V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10μF, TA = +25°C, unless otherwise noted.) SUPPLY CURRENT vs. CONVERSION RATE (HIGH-SPEED MODE, EXTERNAL REFERENCE) SUPPLY CURRENT vs. CONVERSION RATE (HIGH-SPEED MODE, INTERNAL REFERENCE) 1200 1000 IAVDD, R/W = 0 800 600 IAVDD, R/W = 1 OR 0 600 500 400 300 IDVDD, R/W = 1 OR 0 100 200 0 0 0 10 20 30 40 50 60 0 70 10 20 30 40 50 60 70 CONVERSION RATE (ksps) CONVERSION RATE (ksps) SUPPLY CURRENT vs. CONVERSION RATE (FAST MODE, INTERNAL REFERENCE) SUPPLY CURRENT vs. CONVERSION RATE (FAST MODE, EXTERNAL REFERENCE) IAVDD, R/W = 1 1400 1200 1000 IAVDD, R/W = 0 800 600 600 EXTERNAL REFERENCE, fSCL = 400kHz 500 SUPPLY CURRENT (μA) INTERNAL REFERENCE, fSCL = 400kHz 1600 MAX1169 toc10 1800 IAVDD, R/W = 1 OR 0 400 300 200 IDVDD, R/W = 1 OR 0 400 IDVDD, R/W = 1 OR 0 200 100 0 0 0 5 10 15 CONVERSION RATE (ksps) 8 700 200 IDVDD, R/W = 1 OR 0 400 MAX1169 toc09 IAVDD, R/W = 1 1400 MAX1169 toc11 SUPPLY CURRENT (μA) 1600 EXTERNAL REFERENCE, fSCL = 1.7MHz 800 SUPPLY CURRENT (μA) INTERNAL REFERENCE, fSCL = 1.7MHz 1800 900 MAX1169 toc08 2000 SUPPLY CURRENT (μA) MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP 20 25 0 5 10 15 20 CONVERSION RATE (ksps) _______________________________________________________________________________________ 25 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP INTERNAL REFERENCE VOLTAGE vs. REF LOAD INTERNAL +4.096V REFERENCE VOLTAGE vs. ANALOG SUPPLY VOLTAGE TA = +85°C 4.090 TA = +70°C MAX1169 toc13 VDVDD = 3V 4.095 4.20 MAX1169 toc12 4.100 fSCL = 0 INTERNAL REFERENCE MODE LOAD APPLIED TO REF 4.15 VREF (V) VREF (V) 4.10 TA = +25°C 4.05 4.085 TA = 0°C 4.00 4.080 3.95 TA = -40°C 3.90 4.075 4.85 4.95 5.05 5.15 1 2 3 4 5 6 VAVDD (V) IREF (mA) EXTERNAL REFERENCE CURRENT vs. EXTERNAL REFERENCE VOLTAGE EXTERNAL REFERENCE CURRENT AND REFERENCE VOLTAGE vs. VREFADJ AIN = AGNDS 30 25 20 19ksps fSCL = 400kHz 15 20 4.20 10 4.15 IREFADJ 0 4.10 -10 10 4.25 AIN = AGNDS IREFADJ (μA) 58.6ksps fSCL = 1.7MHz MAX1169 toc15 30 MAX1169 toc14 35 IREF (μA) 0 5.25 VREF (V) 4.75 4.05 VREF -20 5 0 4.00 -30 0 1 2 3 VREF (V) 4 5 6 3.95 3.95 4.00 4.05 4.10 4.15 4.20 4.25 VREFADJ (V) _______________________________________________________________________________________ 9 MAX1169 Typical Operating Characteristics (continued) (VDVDD = +3.0V, VAVDD = +5.0V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10μF, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VDVDD = +3.0V, VAVDD = +5.0V, fSCL = 1.7MHz (33% duty cycle), fSAMPLE = 58.6ksps, VREF = +4.096V, external reference applied to REF, REFADJ = AVDD, CREF = 10μF, TA = +25°C, unless otherwise noted.) SPURIOUS-FREE DYNAMIC RANGE vs. FREQUENCY 100 100 1.5 90 80 70 60 50 70 60 50 40 30 40 30 20 10 0 20 10 0 10 -2.0 -2.5 10 100 0 16,384 32,768 FREQUENCY (kHz) DIGITAL OUTPUT CODE TOTAL HARMONIC DISTORTION vs. FREQUENCY SINAD vs. FREQUENCY INTEGRAL NONLINEARITY vs. DIGITAL OUTPUT CODE 100 -30 -40 2.0 1.5 -50 -60 -70 70 60 50 -80 -90 40 30 -100 -110 -120 20 10 0 10 1.0 INL (LSB) SINAD (dB) 90 80 100 0.5 0 -0.5 -1.0 -1.5 -2.0 1 10 FREQUENCY (kHz) 100 0 16,384 32,768 fSAMPLE = 58.6ksps fIN(SINE WAVE) = 1kHz VIN = VREF(P-P) MAX1169 toc22 FFT 0 -20 -40 -60 -80 -100 -120 -140 0 5.86 11.72 17.56 49,152 DIGITAL OUTPUT CODE FREQUENCY (kHz) MAGNITUDE (dB) 65,536 MAX1169 toc21 120 110 MAX1169 toc19 -20 23.44 29.30 FREQUENCY (kHz) 10 49,152 FREQUENCY (kHz) 0 -10 1 0 -1.0 1 100 0.5 -0.5 MAX1169 toc20 1 1.0 DNL (LSB) SFDR (dB) 90 80 SNR (dB) 2.0 MAX1169 toc17 120 110 MAX1169 toc16 120 110 DIFFERENTIAL NONLINEARITY vs. DIGITAL OUTPUT CODE MAX1169 toc18 SIGNAL-TO-NOISE RATIO vs. FREQUENCY THD (dB) MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP ______________________________________________________________________________________ 65,536 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP PIN NAME 1 DGND FUNCTION Digital Ground 2 SCL 3 SDA Clock Input 4 ADD2 Address Select Input 2 5 ADD1 Address Select Input 1 6 ADD0 Address Select Input 0 7 DVDD Digital Power Input. Bypass to DGND with a 0.1μF capacitor. Data Input/Output 8 AVDD Analog Power Input. Bypass to AGND with a 0.1μF capacitor. 9 AGND Analog Ground 10 AIN 11 AGNDS Analog Signal Ground. Negative reference for analog input. Connect to AGND. 12 REFADJ Internal Reference Output and Reference Buffer Input. Bypass to AGND with a 0.1μF capacitor. Connect REFADJ to AVDD to disable the internal bandgap reference and reference-buffer amplifier. 13 REF 14 ADD3 Analog Input Reference Buffer Output and External Reference Input. Bypass to AGND with a 10μF capacitor when using the internal reference. Address Select Input 3 Detailed Description The MAX1169 ADC uses successive-approximation conversion (SAR) techniques and on-chip track-andhold (T/H) circuitry to capture and convert an analog signal to a serial 16-bit digital output. The MAX1169 performs a unipolar conversion on its single analog input using its internal 4MHz clock. The full-scale analog input range is determined by the internal reference or by an externally applied reference voltage ranging from 1V to VAVDD. The flexible 2-wire serial interface provides easy connection to microcontrollers (μCs) and supports data rates up to 1.7MHz. Figure 3 shows the simplified functional diagram for the MAX1169 and Figure 4 shows the typical application circuit. Power Supply To maintain a low-noise environment, the MAX1169 provides separate analog and digital power-supply inputs. The analog circuitry requires a +5V supply and consumes only 900μA at sampling rates up to 58.6ksps. The digital supply voltage accepts voltages from +2.7V to +5.5V to ensure compatibility with low- voltage ASICs. The MAX1169 wakes up in shutdown mode when power is applied irrespective of the AVDD and DVDD sequence. Analog Input and Track/Hold The MAX1169 analog input contains a T/H capacitor, T/H switches, comparator, and a switched capacitor digital-to-analog converter (DAC) (Figure 5). As shown in Figure 11c, the MAX1169 acquisition period is the two clock cycles prior to the conversion period. The T/H switches are normally in the hold position. During the acquisition period, the T/H switches are in the track position and CT/H charges to the analog input signal. Before a conversion begins, the T/H switches move to the hold position retaining the charge on CT/H as a sample of the analog input signal. During the conversion interval, the switched capacitive DAC adjusts to restore the comparator input voltage to zero within the limits of 16-bit resolution. This is equivalent to transferring a charge of 35pF × (VAIN - VAGNDS) from C T/H to the binary weighted capacitive DAC, forming a digital representation of the analog input signal. During the conversion period, the MAX1169 holds SCL low (clock stretching). ______________________________________________________________________________________ 11 MAX1169 Pin Description MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP 6 5 4 14 3 2 CONTROL LOGIC AVDD AGND AIN AGNDS 8 7 DVDD 1 DGND 4MHz INTERNAL OSCILLATOR 9 ADD0 ADD1 ADD2 ADD3 SDA SCL CLOCK 10 T/H 11 IN OUTPUT SHIFT REGISTER SAR ADC OUT REF AV = 1.0 5kΩ +4.096V REFERENCE MAX1169 12 REFADJ 13 REF Figure 3. MAX1169 Simplified Functional Diagram 5.0V 8 0.1μF 13 REF 10μF 12 μC 3.0V 7 DVDD 6 ADD0 5 ADD1 4 ADD2 SDA 3 2 SCL AVDD REFADJ VDD 0.1μF RP RP SDA SCL 0.1μF MAX1169 ANALOG SOURCE 10 11 AIN AGNDS AGND 9 ADD3 14 VSS DGND 1 I2C ADDRESS IS 0110111. Figure 4. Typical Application Circuit The time required for the T/H to acquire an input signal is a function of the analog input source impedance. If the input signal source impedance is high, lengthen the acquisition time by reducing fSCL. The MAX1169 provides two SCL cycles (tACQ) in which the track-andhold capacitance must acquire a charge representing the input signal. Minimize the input source impedance (RSOURCE) to allow the track-and-hold capacitance to 12 charge within the allotted time. RSOURCE should be less than 11.3kΩ for fSCL = 400kHz and less than 2kΩ for fSCL = 1.7MHz. RSOURCE is calculated with the following equation: R SOURCE ≤ 2 fSCL × In(2 × 2 N ) × C IN ______________________________________________________________________________________ − RIN 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP To improve the input-signal bandwidth under AC conditions, drive AIN with a wideband buffer (>4MHz) that can drive the ADC’s input capacitance and settle quickly (see the Input Buffer section). An RC filter at AIN reduces the input track-and-hold switching transient by providing charge for CT/H. Analog Input Bandwidth The MAX1169 features input-tracking circuitry with a 4MHz small-signal bandwidth. The 4MHz input bandwidth makes it possible to digitize high-speed transient events and measure periodic signals with bandwidths exceeding the ADC’s sampling rate by using undersampling techniques. Use anti-alias filtering to avoid high-frequency signals being aliased into the frequency band of interest. Analog Input Range and Protection Internal electrostatic discharge (ESD) protection diodes clamp AIN, REF, and REFADJ to AVDD and AGNDS/ AGND (Figure 6). These diodes allow the analog inputs to swing from (VAGND - 0.3V) to (VAVDD + 0.3V) without causing damage to the device. For accurate conversions, the inputs must not go more than 50mV beyond their rails. If the analog inputs exceed 300mV beyond their rails, limit the current to 2mA. Internal Clock The MAX1169 contains an internal 4MHz oscillator that drives the SAR conversion clock. During conversion, SCL is held low (clock stretching). An internal register stores *RSOURCE HOLD AIN HOLD HOLD TRACK TRACK SDA and SCL require pullup resistors (500Ω or greater, Figure 4). Optional resistors (24Ω) in series with SDA and SCL protect the device inputs from high-voltage spikes on the bus lines. Series resistors also minimize crosstalk and undershoot of the bus signals. Bit Transfer One data bit is transferred during each SCL clock cycle. Nine clock cycles are required to transfer the data into or out of the MAX1169. The data on SDA must remain stable during the high period of the SCL clock pulse as changes in SDA while SCL is high are control signals (see the START and STOP Conditions section). Both SDA and SCL idle high. START and STOP Conditions The master initiates a transmission with a START condition (S), a high-to-low transition on SDA with SCL high. The master terminates a transmission with a STOP condition (P), a low-to-high transition on SDA while SCL is high (Figure 7). The STOP condition frees the bus and places all devices in F/S mode (see the Bus Timing section). Use a repeated START condition (Sr) in place of a STOP condition to leave the bus active and in its current timing mode (see the HS Mode section). MAX1169 TRACK ANALOG SIGNAL SOURCE Digital Interface The MAX1169 features an I2C-compatible, 2-wire serial interface consisting of a bidirectional serial data line (SDA) and a serial clock line (SCL). SDA and SCL facilitate bidirectional communication between the MAX1169 and the master at rates up to 1.7MHz. The master (typically a microcontroller) initiates data transfer on the bus and generates SCL. AVDD REF CT/H data when the conversion is in progress. When the MAX1169 releases SCL, the master reads the conversion results at any clock rate up to 1.7MHz (Figure 11). CAPACITIVE DAC AIN MAX1169 REF REFADJ AGNDS AGNDS *MINIMIZE RSOURCE TO ALLOW THE TRACK-AND-HOLD CAPACITANCE (CT/H) TO CHARGE TO THE ANALOG SIGNAL SOURCE VOLTAGE WITHIN THE ALLOTTED TIME (tACQ). Figure 5. Equivalent Input Circuit AGND Figure 6. Internal Protection Diodes ______________________________________________________________________________________ 13 MAX1169 where RSOURCE is the analog input source impedance, fSCL is the maximum system SCL frequency, N is 16 (the number of bits of resolution), CIN is 35pF (the sum of CT/H and input stray capacitance), and RIN is 800Ω (the T/H switch resistances). MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP S Sr P SDA SCL Figure 7. START and STOP Conditions S NOT ACKNOWLEDGE SDA ACKNOWLEDGE SCL 1 2 8 9 Figure 8. Acknowledge Bits Acknowledge Bits Successful data transfers are acknowledged with an acknowledge bit (A) or a not-acknowledge bit (A). Both the master and the MAX1169 (slave) generate acknowledge bits. To generate an acknowledge, the receiving device must pull SDA low before the rising edge of the acknowledge-related clock pulse (ninth pulse) and keep it low during the high period of the clock pulse (Figure 8). To generate a not acknowledge, the receiver allows SDA to be pulled high before the rising edge of the acknowledge-related clock pulse and leaves it high during the high period of the clock pulse. Monitoring the acknowledge bits allows for detection of unsuccessful data transfers. An unsuccessful data transfer happens if a receiving device is busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the master should reattempt communication at a later time. Slave Address A master initiates communication with a slave device by issuing a START condition followed by a slave address byte. As shown in Figure 9, the slave address byte consists of 7 address bits and a read/write bit (R/W). When idle, the MAX1169 continuously waits for a START condition followed by its slave address. When the MAX1169 recognizes its slave address, it acquires the analog input signal and prepares for conversion. The first 3 bits (MSBs) of the slave address have been factory programmed and are always 011. Connecting 14 ADD3–ADD0 to DVDD or DGND, programs the last 4 bits (LSBs) of the slave address high or low. Since the MAX1169 does not require setup or configuration, the least significant bit (LSB) of the address byte (R/W) controls power-down. In external reference mode (REFADJ = AVDD), R/W is a don’t care. In internal reference mode, setting R/W = 1 places the device in normal operation and setting R/W = 0 powers down the internal reference following the conversion (see the Internal Reference Shutdown section). After receiving the address, the MAX1169 (slave) issues an acknowledge by pulling SDA low for one clock cycle. Bus Timing At power-up, the MAX1169 bus timing defaults to fast mode (F/S mode), allowing conversion rates up to 19ksps. The MAX1169 must operate in high-speed mode (HS mode) to achieve conversion rates up to 58.6ksps. Figure 1 shows the bus timing for the MAX1169 2-wire interface. HS Mode At power-up, the MAX1169 bus timing is set for F/S mode. The master selects HS mode by addressing all devices on the bus with the HS mode master code 0000 1XXX (X = don’t care). After successfully receiving the HS mode master code, the MAX1169 issues a not acknowledge, allowing SDA to be pulled high for one clock cycle (Figure 10). After the not acknowledge, the ______________________________________________________________________________________ 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP MAX1169 S 0 SDA 1 ADD3 1 ADD2 ADD1 ADD0 R/W A ACKNOWLEDGE 1 SCL 2 3 4 5 6 7 8 9 Figure 9. MAX1169 Slave Address Byte Sr S SDA 0 0 0 0 1 X X X A 1 2 3 4 5 6 7 8 9 F/S MODE HS MODE Figure 10. F/S-Mode to HS-Mode Transfer MAX1169 is in HS mode. The master must then send a repeated START followed by a slave address to initiate HS mode communication. If the master generates a STOP condition, the MAX1169 returns to F/S mode. Data Byte (Read Cycle) Initiate a read cycle to begin a conversion. A read cycle begins with the master issuing a START condition followed by 7 address bits and 1 read bit (R/W). The standard I2C-compatible interface requires that R/W = 1 to read from a device; however, since the MAX1169 does not require setup or configuration, the read mode is inherent and R/W controls power-down (see the Internal Reference Shutdown section). If the address byte is successfully received, the MAX1169 (slave) issues an acknowledge and begins conversion. As seen in Figure 11, the MAX1169 holds SCL low during conversion. When the conversion is complete, SCL is released and the master can clock data out of the device. The most significant byte of the conversion is available first and contains D15 to D8. The least significant byte contains D7 to D0. Data can be continuously converted as long as the master acknowledges the conversion results. Issuing a not acknowledge frees the bus, allowing the master to generate a STOP or repeated START. Applications Information Power-On Reset When power is first applied, internal power-on reset circuitry activates the MAX1169 in shutdown. When the internal reference is used, allow 12ms for the reference to settle when CREF = 10μF and CREFADJ = 0.1μF. Automatic Shutdown The MAX1169 automatic shutdown reduces the supply current to less than 0.6μA between conversions. The MAX1169 I2C-compatible interface is always active. When the MAX1169 receives a valid slave address, the device powers up. The device is then powered down again when the conversion is complete. The automatic shutdown function does not change with internal or external reference. When the internal reference is chosen, the internal reference remains active between conversions unless internal reference shutdown is requested (see the Internal Reference Shutdown section). Internal Reference Shutdown The R/W bit of the slave address controls the MAX1169 internal reference shutdown. In external reference mode (REFADJ = AVDD), R/W is a don’t care. In internal reference mode, setting R/W = 1 places the device in normal operation and setting R/W = 0 prepares the internal reference for shutdown. ______________________________________________________________________________________ 15 MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP MASTER TO SLAVE SLAVE TO MASTER A. SINGLE CONVERSION 1 7 1 1 S SLAVE ADDRESS R A CLOCK STRETCH 8 1 8 RESULT A RESULT NUMBER OF BITS 1 1 A P OR Sr (MOST SIGNIFICANT BYTE) (LEAST SIGNIFICANT BYTE) tCONV tACQ B. CONTINUOUS CONVERSIONS 1 7 S SLAVE ADDRESS 8 1 1 RESULT #1 CLOCK STRETCH R A 1 8 1 A RESULT #1 A CLOCK STRETCH (MOST SIGNIFICANT BYTE) (LEAST SIGNIFICANT BYTE) tACQ tCONV 1 RESULT #2 A CLOCK STRETCH 1 RESULT #2 A NUMBER OF BITS (MOST SIGNIFICANT BYTE) tACQ 8 8 tCONV 8 1 8 1 RESULT #N A RESULT #N NUMBER OF BITS 1 A P OR Sr (MOST SIGNIFICANT BYTE) (LEAST SIGNIFICANT BYTE) (LEAST SIGNIFICANT BIT) tACQ tCONV C. ACQUISITION DETAIL SDA BIT3 BIT2 BIT1 BIT0 SCL 5 6 7 8 A 9 tACQ ANALOG INPUT TRACK AND HOLD HOLD TRACK CLOCK STRETCH D15 D14 D13 1 2 3 D12 4 tAJ tAD tCONV HOLD Figure 11. Read Cycle If the internal reference is used and R/W = 0, shutdown occurs when the master issues a not-acknowledge bit while reading the conversion results. The internal reference and internal reference buffer are disabled during shutdown, reducing the analog supply current to less than 1μA. A dummy conversion is required to power up the internal reference. The MAX1169 internal reference begins powering up from shutdown on the 9th falling edge of a 16 valid address byte. Allow 12ms for the internal reference to settle before obtaining valid conversion results. Reference Voltage The MAX1169 provides an internal or accepts an external reference voltage. The ADC input range is from VAGNDS to VREF. (See the Transfer Function section.) ______________________________________________________________________________________ 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP MAX1169 Internal Reference The MAX1169 contains an internal 4.096V bandgap reference. This bandgap reference is connected to REFADJ through a 5kΩ resistor. Bypass REFADJ with a 0.1μF capacitor to AGND. The MAX1169 reference buffer has a unity gain to provide +4.096V at REF. Bypass REF with a 10μF capacitor to AGND when the internal reference is used (Figure 12). REF 13 4.096V SAR REF ADC 10μF AV = 1.0 REFADJ 12 MAX1169 The internal reference is adjustable to ±1.5% using the circuit of Figure 13. 0.1μF 5kΩ 4.096V BANDGAP REFERENCE External Reference For external reference operation, disable the internal reference by connecting REFADJ to AVDD. During conversion, an external reference at REF must deliver up to 100μA of DC load current and have an output impedance of less than 10Ω. DGND 1 For optimal performance, buffer the reference through an op amp and bypass REF with a 10μF capacitor. Consider the MAX1169’s equivalent input noise (38μVRMS) when choosing a reference. AGND 9 Figure 12. Internal Reference Transfer Function LSB values. Figure 14 shows the MAX1169 input/output (I/O) transfer function. The MAX1169 has a standard unipolar transfer function with a valid analog input voltage range from VAGNDS to V REF . Output data coding is binary with 1LSB = (VREF/2N) where N is the number of bits (16). Code transitions occur halfway between successive-integer Most applications require an input buffer amplifier to achieve 16-bit accuracy. If the input signal is multiplexed, the input channel should be switched immediately after acquisition, rather than near the end of or Input Buffer 5.0V AVDD 8 MAX1169 0.1μF REF 13 4.096V SAR REF ADC 10μF AV = 1.0 REFADJ 12 68kΩ 100kΩ POTENTIOMETER 0.1μF 5kΩ 4.096V BANDGAP REFERENCE 150kΩ DGND 1 AGND 9 Figure 13. Adjusting the Internal Reference ______________________________________________________________________________________ 17 MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP 1...111 1...110 1...101 1...100 VREF BINARY OUTPUT CODE (LSB) VREF V 1LSB = REF 65536 0...011 0...010 0...001 0...000 0 1 2 3 grounds to the star analog ground. Connect the digital grounds to the star digital ground. Connect the digital ground plane to the analog ground plane at one point. For lowest noise operation, make the ground return to the star ground’s power supply low impedance and as short as possible. High-frequency noise in the AVDD power supply degrades the ADC’s high-speed comparator performance. Bypass AVDD to AGND with a 0.1μF ceramic surface-mount capacitor. Make bypass capacitor connections as short as possible. If the power supply is very noisy, connect a 10Ω resistor in series with AVDD and a 4.7μF capacitor from AVDD to AGND to create a lowpass RC filter. Definitions 65533 65535 INPUT VOLTAGE (LSB) AGNDS Figure 14. Unipolar Transfer Function after a conversion. This allows more time for the input buffer amplifier to respond to a large step-change in input signal. The input amplifier must have a high enough slew rate to complete the required output voltage change before the beginning of the acquisition time. At the beginning of acquisition, the internal sampling capacitor array connects to AIN (the amplifier output), causing some output disturbance. Ensure that the sampled voltage has settled to within the required limits before the end of the acquisition time. If the frequency of interest is low, AIN can be bypassed with a large enough capacitor to charge the internal sampling capacitor with very little ripple. However, for AC use, AIN must be driven by a wideband buffer (at least 4MHz), which must be stable with the ADC’s capacitive load (in parallel with any AIN bypass capacitor used) and also settle quickly. Refer to Maxim’s website at www.maxim-ic.com for application notes on how to choose the optimum buffer amplifier for your ADC application. Layout, Grounding, and Bypassing Careful printed circuit (PC) board layout is essential for the best system performance. Boards should have separate analog and digital ground planes and ensure that digital and analog signals are separated from each other. Do not run analog and digital (especially clock) lines parallel to one another, or digital lines underneath the device package. Figure 4 shows the recommended system ground connections. Establish an analog ground point at AGND and a digital ground point at DGND. Connect all analog 18 Integral Nonlinearity Integral nonlinearity (INL) is the deviation of the values on an actual transfer function from a straight line. This straight line can be either a best-straight-line fit or a line drawn between the end points of the transfer function once offset and gain errors have been nullified. The MAX1169 INL is measured using the end-point method. Differential Nonlinearity Differential nonlinearity (DNL) is the difference between an actual step width and the ideal value of 1 LSB. A DNL error specification of less than 1 LSB guarantees no missing codes and a monotonic transfer function. Aperture Jitter Aperture jitter (tAJ) is the sample-to-sample variation in the time between the samples (Figure 11). Aperture Delay Aperture delay (tAD) is the time from the falling edge of SCL to the instant when an actual sample is taken (Figure 11). Signal-to-Noise Ratio For a waveform perfectly reconstructed from digital samples, signal-to-noise ratio (SNR) is the ratio of full-scale analog input (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum analogto-digital noise is caused by quantization error only and results directly from the ADC’s resolution (N bits): SNR = ((6.02 N) + 1.76) dB In reality, noise sources besides quantization noise exist, including thermal noise, reference noise, clock jitter, etc. Therefore, SNR is computed by taking the ratio of the RMS signal to the RMS noise, which includes all spectral components minus the fundamental, the first five harmonics, and the DC offset. ______________________________________________________________________________________ 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP Total Harmonic Distortion Total harmonic distortion (THD) is the ratio of the RMS sum of the input signal’s first five harmonics to the fundamental itself, expressed as: ⎛ Signal RMS ⎞ SINAD(db) = 20 × log ⎜ ⎟ ⎝ Noise RMS ⎠ Effective Number of Bits Effective number of bits (ENOB) indicates the global accuracy of an ADC at a specific input frequency and sampling rate. An ideal ADC’s error consists of quantization noise only. With an input range equal to the ADC’s full-scale range, calculate the ENOB as follows: ⎛ SINAD - 1.76 ⎞ ENOB = ⎜ ⎟⎠ ⎝ 6. 02 ⎛ THD = 20 × log ⎜ ⎜ ⎝ where V1 is the fundamental amplitude, and V2 through V5 are the amplitudes of the 2nd- through 5th-order harmonics. Spurious-Free Dynamic Range Spurious-free dynamic range (SFDR) is the ratio of RMS amplitude of the fundamental (maximum signal component) to the RMS value of the next-largest distortion component. Package Information Chip Information PROCESS: BiCMOS V2 2 +V3 2 +V4 2 +V5 2 ⎞ ⎟ V1 ⎟ ⎠ For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 14 TSSOP U14-1 21-0066 90-0113 ______________________________________________________________________________________ 19 MAX1169 Signal-to-Noise Plus Distortion Signal-to-noise plus distortion (SINAD) is the ratio of the fundamental input frequency’s RMS amplitude to RMS equivalent of all other ADC output signals: MAX1169 58.6ksps, 16-Bit, 2-Wire Serial ADC in a 14-Pin TSSOP Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 0 10/02 Initial release 1 12/09 Updated Ordering Information and Electrical Characteristics 1, 2 — 2 12/10 Removed commercial temperature range 1, 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 20 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.