GSM2804 Multilayer Chip Antenna for GSM/CDMA/WCDMA Wireless Communication 技术：＋８６ １５８－１０６２－２７０５ 销售：＋８６ １３１－４６７１－３３３１ RainSun Corporation http://www.rainsun.com 1 of 6 OCT, 2012 Ver.1.3 GSM2804 Multilayer Chip Antenna ◆ Features Light weight and low profile 28.0mm(L)X3mm(W)X4mm(H) Omni‐directional in azimuth Lead (Pb) Free ◆ Applications 850/1700~2140 wireless communications Wireless communication Modules Specifications Center frequency Peak gain Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth Azimuth beamwidth Polarization RainSun Corporation http://www.rainsun.com 850~900/1700~2140MHz 1dBi -40 ~ +85 °C -40 ~ +85 °C 2.0 (Max) 50 Ohm 3W (Max) 150/450MHz Omni-directional Linear 2 of 6 OCT, 2012 Ver.1.3 Pin configuration 5 1 2 3 4 Pin No Pin assignment 1 Solder termination 2 Feed termination 3 Solder termination 4 Solder termination 5 Identify Mark (Up side) PCB foot printer RainSun Corporation http://www.rainsun.com 3 of 6 OCT, 2012 Ver.1.3 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board dimension and it’s layout is the same as recommended Test Board. RainSun Corporation http://www.rainsun.com 4 of 6 OCT, 2012 Ver.1.3 Typical Electrical Characteristics RainSun Corporation http://www.rainsun.com 5 of 6 OCT, 2012 Ver.1.3 Typical Soldering Profile for Lead‐free Process Peak temp 340°C 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation http://www.rainsun.com 6 of 6 OCT, 2012 Ver.1.3