AN2051 Multilayer Chip Antenna for 2.4GHz Wireless Communication 技术：＋８６ １５８－１０６２－２７０５ 销售：＋８６ １３１－４６７１－３３３１ RainSun Corporation http://www.rainsun.com 1 of 9 Jan, 2008 Ver.2.2 AN2051 Multilayer Chip Antenna ◆ Features y Light weight and low profile 5.05mm(L)X2.0mm(W)X1.07mm(H) y Omni‐directional in azimuth y Lead (Pb) Free ◆ Applications y 2.4GHz wireless communications y 2.4GHz Modules y Bluetooth System y 802.11b/g Wireless LAN System Specifications Center frequency Peak gain Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth Azimuth beamwidth Polarization RainSun Corporation http://www.rainsun.com 2.45GHz 0.5dBi ‐40 ~ +85 °C ‐40 ~ +85 °C 2.0 (max) 50 Ohm 2W (max) 110MHz Omni‐directional Linear 2 of 9 Jan, 2008 Ver.2.2 Pin configuration Top view 1 2 Pin No Pin assignment 1 Feed termination 2 Feed point mark 3 Solder termination 3 Dimensions RainSun Corporation http://www.rainsun.com Symbol Dimensions (mm) A 5.05 ± 0.10 B 2.00 ± 0.10 C 0.50 ± 0.05 H 1.07 ± 0.20 3 of 9 Jan, 2008 Ver.2.2 Recommended Test Board Pattern Bottom view Top view 50 Ohm Transmission line Ground Plane SMA connector Unit : mm Board thickness : 0.6mm Board material : FR4 Fig-1 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board dimension and it’s layout is the same as Fig‐1. RainSun Corporation http://www.rainsun.com 4 of 9 Jan, 2008 Ver.2.2 Typical Electrical Characteristics Return loss Smith Chart Marker data: 1 : f=2.389 GHz 2 : f=2.450 GHz 3 : f=2.504 GHz RainSun Corporation http://www.rainsun.com 5 of 9 Jan, 2008 Ver.2.2 Typical Radiation Patterns 2.45 GHz H‐Plane 2.45 GHz E‐Plane RainSun Corporation http://www.rainsun.com 6 of 9 Jan, 2008 Ver.2.2 Typical Soldering Profile for Lead‐free Process Peak temp 340°C Temperature ( °C ) 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max Temperature ( °C ) 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation http://www.rainsun.com 7 of 9 Jan, 2008 Ver.2.2 Packing Blister Tape Specifications Symbol Dimension Tolerance Unit W 12.00 ± 0.30 mm P1 4.00 ± 0.10 mm P2 5.50 ± 0.10 mm P3 1.75 ± 0.10 mm P4 4.00 ± 0.10 mm P5 2.00 ± 0.10 mm D 1.50 ± 0.10 mm T1 5.40 ± 0.10 mm T2 0.30 ± 0.05 mm T3 2.40 ± 0.10 mm T4 1.40 ± 0.10 mm RainSun Corporation http://www.rainsun.com 8 of 9 Jan, 2008 Ver.2.2 Reel Specifications Quantity Tape Width Per Reel (mm) 3,000 12 RainSun Corporation http://www.rainsun.com A (mm) C (mm) B (mm) E (mm) W (mm) W1 (mm) 180±1 13.0±0.2 62±0.5 2.2±0.5 12±0.5 16±0.2 9 of 9 Jan, 2008 Ver.2.2