GPS1003 Multilayer Chip Antenna for GPS (Advanced Information) 技术：＋８６ １５８－１０６２－２７０５ 销售：＋８６ １３１－４６７１－３３３１ RainSun Corporation http://www.rainsun.com 1 of 9 Jun, 2006 Ver.2.1 GPS1003 Multilayer Chip Antenna ◆ Features y Light weight and low profile 10.0mm(L)X3.0mm(W)X1.47mm(H) y Omni‐directional in azimuth y Lead (Pb) Free ◆Applications y1575MHz wireless communications yGPS (Global Positioning System) Specifications Center frequency Peak gain Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth Azimuth beamwidth Polarization RainSun Corporation http://www.rainsun.com 1575MHz 4.3 dBi (Typ) ‐40 ~ +85 °C ‐40 ~ +100 °C 1.5 (Max) 50 Ohm 3W (Max) 150MHz (Typ) Omni‐directional Linear 2 of 9 Jun, 2006 Ver.2.1 Pin configuration 1 2 Pin No Pin assignment 1 Feed termination 2 Feed point mark 3 Solder termination 3 Dimensions Symbol Dimensions(mm) A 10.0±0.1 B 3.0±0.1 C 0.5 ±0.1 H 1.47±0.20 Recommended PCB foot print RainSun Corporation http://www.rainsun.com Symbol Dimensions(mm) D 1.4 E 3.0 F 10.0 3 of 9 Jun, 2006 Ver.2.1 Recommended Test Board Pattern Top view Bottom view Ground Plane 50 Ohm Transmission line Unit : mm SMA connector Board thickness 0.8mm Board material:FR4 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board and it’s layout is the same as recommended Test Board. RainSun Corporation http://www.rainsun.com 4 of 9 Jun, 2006 Ver.2.1 Typical Electrical Characteristics Return loss Smith Chart Marker data: 1 : f=1.481 GHz 2 : f=1.575 GHz 3 : f=1.687 GHz RainSun Corporation http://www.rainsun.com 5 of 9 Jun, 2006 Ver.2.1 Typical Radiation Patterns RainSun Corporation http://www.rainsun.com 6 of 9 Jun, 2006 Ver.2.1 Typical Soldering Profile for Lead‐free Process Peak temp 340°C Temperature ( °C ) 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max Temperature ( °C ) 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation http://www.rainsun.com 7 of 9 Jun, 2006 Ver.2.1 Packing Blister Tape Specifications Symbol Dimension Tolerance Unit W 24.0 ± 0.30 mm P1 8.0 ± 0.10 mm P2 11.5 ± 0.10 mm P3 1.75 ± 0.10 mm P4 4.0 ± 0.10 mm P5 2.0 ± 0.10 mm D1 1.5 ± 0.10 mm D2 1.5 ± 0.10 mm T1 10.6 ± 0.10 mm T2 0.3 ± 0.05 mm T3 3.3 ± 0.10 mm T4 1.9 ± 0.10 mm Notes 1. Possible product displacement in pocket. 2. P0 pitch tolerance over any 10 pitches is ± 0.2mm RainSun Corporation http://www.rainsun.com 8 of 9 Jun, 2006 Ver.2.1 Reel Specifications Quantity Per Reel Tape Width (mm) A (mm) C (mm) N (mm) W1 (mm) W2 (mm) 3,000 24 330±0.1 13.0±0.5 100±0.1 24±0.2 28.8±0.2 RainSun Corporation http://www.rainsun.com 9 of 9 Jun, 2006 Ver.2.1