AN6520 Multilayer Chip Antenna for 2.4GHz Wireless Communication 技术：＋８６ １５８－１０６２－２７０５ 销售：＋８６ １３１－４６７１－３３３１ RainSun Corporation http://www.rainsun.com 1 of 9 Jun, 2008 Ver.1.1 AN6520 Multilayer Chip Antenna ◆ Features y Light weight and low profile 6.5mm(L)X2.2mm(W)X1.0mm(H) y Omni‐directional in azimuth Lead (Pb) Free ◆ Applications pp y 2.4GHz wireless communications y 2.4GHz Modules y Bluetooth System 802.11b/g Wireless LAN System Specifications Center frequency Peak gain Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth Azimuth beamwidth Polarization RainSun Corporation http://www.rainsun.com 2.45GHz 0.5dBi ‐40 ~ +85 °C ‐40 ~ +85 °C 2.0 (max) 50 Ohm 3W (max) 200MHz Omni‐directional Linear 2 of 9 Jun, 2008 Ver.1.1 Pin configuration Top view 1 2 Pi N Pin No Pi Pin assignment i t 1 Feed termination 2 Feed point mark 3 Solder termination 3 Dimensions Symbol Dimensions(mm) A 6.50 ± 0.10 B 2.20 ± 0.10 C 0.30 ± 0.05 H 1.00 ± 0.20 PCB foot printer p RainSun Corporation http://www.rainsun.com 3 of 9 Jun, 2008 Ver.1.1 Recommended Test Board Pattern Bottom Ground plane 50 Ohm Transmission line Unit : mm Board thickness : 0.6mm Board material : FR4 Fig-1 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board dimension and it The test board dimension and it’ss layout is the same as Fig‐1. RainSun Corporation http://www.rainsun.com 4 of 9 Jun, 2008 Ver.1.1 Typical Electrical Characteristics Return loss Smith Chart Marker data: 1 : f 2 310 GHz 1 : f=2.310 GHz 2 : f=2.451 GHz 3 : f=2.546 GHz RainSun Corporation http://www.rainsun.com 5 of 9 Jun, 2008 Ver.1.1 Typical Radiation Patterns 22.45 GHz H‐Plane 45 GH H Pl vertical 2.45 GHz H‐Plane 2 45 GH H Pl horizontal 2.45 GHz E‐Plane vertical 2.45 GHz E‐Plane horizontal RainSun Corporation http://www.rainsun.com 6 of 9 Jun, 2008 Ver.1.1 Typical Soldering Profile for Lead‐free Process Peak temp 340°C Temperature ( °C ) 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max Teemperature ( °C ) 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation http://www.rainsun.com 7 of 9 Jun, 2008 Ver.1.1 Packing Blister Tape Specifications Symbol Dimension Tolerance Unit W 16.00 ± 0.10 mm E 1.75 ± 0.10 mm F 7.50 ± 0.10 mm D 1.50 + 0.10 0 10 ‐ 0.00 mm D1 1.50 + 0.25 ‐ 0.00 mm P0 4.00 ± 0.10 mm P 8.00 ± 0.10 mm P2 2.00 ± 0.10 mm A0 2.30 ± 0.10 mm B0 6.60 ± 0.10 mm K0 1.30 ± 0.10 mm t 0.30 ± 0.05 mm RainSun Corporation http://www.rainsun.com 8 of 9 Jun, 2008 Ver.1.1 Reel Specifications Quantity Tape Width Per Reell ( (mm) ) 1,500 16 RainSun Corporation http://www.rainsun.com A ( (mm) ) C ( (mm) ) B ( (mm) ) E ( (mm) ) W ( (mm) ) W1 ( (mm) ) 180±1 13.0±0.2 62±0.5 2.2±0.5 16±0.5 20±0.2 9 of 9 Jun, 2008 Ver.1.1