MA-COM MA03501D

RO-P-DS-3004 - -
MA03501D
X-Band Gain/Phase Control MMIC
8.0 –11.0 GHz
Features
♦
♦
♦
♦
♦
8.0-11.0 GHz Serial Input Control MMIC
8.0 to 11.0 GHz Operation
6-bit Phase Shifter and 5-bit Attenuator
Serial Control Input
50 Ω Input and Output Impedance
Self-Aligned MSAG® MESFET Process
Primary Applications
♦ Radar Systems
Description
The MA03501D is a serial control input phase shifter/
attenuator/buffer amplifier MMIC. The on-chip serial to
parallel converter circuitry allows for control of the 6
phase and 5 attenuation bits using a single TTL/CMOS
compatable input. This product is fully matched to 50
ohms on both the input and output.
Each device is 100% RF tested on wafer to ensure
performance compliance. The part is fabricated using
M/A-COM’s repeatable, high performance and highly
reliable GaAs Multifunction Self-Aligned Gate (MSAG®)
MESFET Process.
Electrical Characteristics: TB = 25°C1, Z0 = 50Ω, VDD = 5V, VGG = -4V, VEE = -4.0
Parameter
Symbol
Minimum
Bandwidth
f
8.0
Gain
Gn
13
1-dB Compression Point
P1dB
Input Return Loss
IRL
Output Return Loss
ORL
Typical
18
Maximum
Units
11.0
GHz
22.5
dB
21
dBm
10
16
dB
10
16
dB
Attenuation Range (5-bits, 0.75dB step)
23
dB
RMS Attenuation Error (Uncorrected)
0.2
dB
0.75 dB Attenuator Bit
0.5
0.8
1.0
dB
1.5 dB Attenuator Bit
1.0
1.5
2.0
dB
3 dB Attenuator Bit
2.4
3.0
3.6
dB
6 dB Attenuator Bit
5.0
6.0
7.0
dB
12 dB Attenuator Bit
10.8
12
13.2
dB
1. TB = MMIC Base Temperature
RO-P-DS-3004 - -
X-Band Serial Input Gain/Phase Control MMIC
2/7
MA03501D
Electrical Characteristics: TB = 25°C, Z0 = 50Ω, VDD = 5V, VGG = -4V, VEE = -4.0
Parameter
Symbol
Minimum
Typical
Maximum
Units
Phase Shift Range (6 bits, 5.6 degree step)
354
Deg
RMS Phase Error (Uncorrected)
2
Deg
5.6 Degree Bit
4.0
5.3
7.0
Deg
11.25 Degree Bit
8.0
11.0
13.0
Deg
22.5 Degree Bit
19.0
22.0
24.0
Deg
45 Degree Bit
40.0
44.0
47.0
Deg
90 Degree Bit
85.0
90.0
95.0
Deg
180 Degree Bit
170
180
190
Deg
Gain Variation over all Phase Shifter settings
+/-1.0
dB
Output Third Order Intercept Point
OTOI
26
dBm
Noise Figure
NF
10
dB
Drain Supply Current
IDD
Gate Supply Current
Digital Power Supply Current
160
275
500
mA
IGG
1
10
mA
IEE
10
20
mA
Input Logic High Current
0.5
mA
Input Logic Low Current
0.1
mA
Timing Delay-Enable Signal to Bit Change
25
nS
Absolute Maximum Conditions 1
Parameter
Symbol
Absolute Maximum
Units
Input Power
PIN
12
dBm
Drain Supply Voltage
VDD
8.0
V
Gate Supply Voltage
VGG
-6.0
V
Quiescent Drain Current (No RF)
IDQ
500
mA
Quiescent DC Power Dissipated (No RF)
PDISS
2.5
W
Digital Power Supply Voltage
VEE
-6.0
V
Junction Temperature
Tj
180
°C
Storage Temperature
TSTG
-55 to +150
°C
1. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may
result in performance outside the guaranteed limits.
Specifications subject to change without notice.
Customer Service: Tel. (888)563-3949
Email: [email protected]
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
V 1.00
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3004 - -
X-Band Serial Input Gain/Phase Control MMIC
3/7
MA03501D
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Drain Voltage
VDD
4.0
5.0
6.0
V
Gate Voltage
VGG
-4.5
-4.0
-3.5
V
Digital Power Supply Voltage
VEE
-4.2
-4.0
-3.8
V
Input Logic High Voltage
VIH
3.0
3.5
5.0
V
Input Logic Low Voltage
VIL
0.0
0.0
0.4
V
Clock Frequency
FCLK
Junction Temperature
TJ
150
ºC
MMIC Base Temperature
TB
Note 2
ºC
20
MHz
2. Maximum MMIC Base Temperature = 150°C— 31.8°C/W * VDD * IDQ
Operating Instructions
This device is static sensitive. Please handle
with care. To operate the device, follow these
steps.
1. Apply VGG = -4 V, VEE = -4V, VDD= 0 V.
2. Ramp VDD to desired voltage, typically 5 V.
3. Adjust VGG to set IDQ, (approximately @ –4V).
4. Set RF input.
5. Power down in reverse. Turn gate voltage off
last.
Specifications subject to change without notice.
Customer Service: Tel. (888)563-3949
Email: [email protected]
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
V 1.00
Visit www.macom.com for additional data sheets and product information.
RO-P-DS-3004 - -
X-Band Serial Input Gain/Phase Control MMIC
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MA03501D
Typical Small Signal Characteristics (VDD=5V, VGG=-4V)
22.0
21.0
Gain S21 (dB)
20.0
19.0
18.0
17.0
16.0
15.0
14.0
8.0
8.5
9.0
9.5
10.0
10.5
11.0
Frequency (GHz)
Input and Output Return Loss S11 and S22 (dB)
Figure 1. Gain
-10.0
S22:
-12.0
S11:
-14.0
-16.0
-18.0
-20.0
-22.0
-24.0
8.0
8.5
9.0
9.5
10.0
10.5
11.0
Frequency (GHz)
Figure 2. Input and Output Match
Specifications subject to change without notice.
Customer Service: Tel. (888)563-3949
Email: [email protected]
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
V 1.00
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RO-P-DS-3004 - -
X-Band Serial Input Gain/Phase Control MMIC
5/7
MA03501D
0.45
RMS Attenuation Error (dB)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
8.0
8.5
9.0
9.5
10.0
10.5
11.0
10.5
11.0
Frequency (GHz)
Figure 3. RMS Attenuation Error
4.5
RMS Phase Error (degree)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
8.0
8.5
9.0
9.5
10.0
Frequency (GHz)
Figure 4. RMS Phase Error
Specifications subject to change without notice.
Customer Service: Tel. (888)563-3949
Email: [email protected]
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
V 1.00
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RO-P-DS-3004 - -
X-Band Serial Input Gain/Phase Control MMIC
6/7
MA03501D
Mechanical Information
Chip Size: 5.974 x 3.973 x 0.075 mm
x 157 x 3 mils)
5.974mm.
5.824mm.
0.547mm.
0.152mm.
3.973mm.
3.820mm.
(236
IN
2.485mm.
VEE
+
2.186mm.
CK
1.886mm.
DA
1.586mm.
LD
1.287mm.
GND
0.150mm.
0
VGG
3.222mm.
VDD
0.751mm.
OUT
5.824mm.
0.547mm.
0
Bond Pad Dimensions
Pad
Size (µm)
Size (mils)
RF In and Out
150 x 150
6x6
DC Supply Voltages
150 x 150
6x6
DC Control Voltages
150 x 150
6x6
Specifications subject to change without notice.
Customer Service: Tel. (888)563-3949
Email: [email protected]
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
V 1.00
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RO-P-DS-3004 - -
X-Band Serial Input Gain/Phase Control MMIC
7/7
MA03501D
Assembly and Bonding Diagram
VGG
100 pF
VDD
100 pF
0.1 µF
VDD
VGG
0.1 µF
RFOUT
LD
GND
DA
CK
VEE
IN
OUT
RFIN
3
100 pF
DATA
VEE
0.1 µF
Figure 5. Recommended bonding diagram.
Support circuitry typical of MMIC characterization fixture for CW testing.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
Specifications subject to change without notice.
Customer Service: Tel. (888)563-3949
Email: [email protected]
„ North America: Tel. (800) 366-2266
„ Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
„ Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
V 1.00
Visit www.macom.com for additional data sheets and product information.