INFINEON V23839-R36-L55

Fiber Optics
V23839-R3x-L55
iSFF - Intelligent Small Form Factor
1.25 Gigabit Ethernet (1000 Base-SX)
4.25/2.125/1.0625 Gbit/s Fibre Channel (400/200/100-M5/M6-SN-I)
Multimode 850 nm Transceiver with LC™ Connector
Preliminary Data Sheet
Features
• Based on Small Form Factor (SFF) MSA1)
• Fully SFF-8472 compatible
• Incorporating Intelligent – Digital Diagnostic
Monitoring Interface
• Internal calibration implementation
• Excellent EMI performance
• Separate and common chassis/signal ground
module concepts available
• 2x7 footprint
• RJ-45 style LC™ connector system
• Single power supply (3.3 V)
• Extremely low power consumption of 530 mW typical
• Small size for high port density
• UL-94 V-0 certified
• ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7)
• According to FCC (Class B) and EN 55022
• For distances of up to 860 m (50 µm fiber)
• Laser safety according to Class 1 FDA and IEC
• Internally AC/AC coupled
• Operating temperature range of –20°C to 85°C
• iSFF evaluation kit available upon request
1)
File: 1145
MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFF Transceivers.
LC™ is a trademark of Lucent.
Part Number
Chassis/Signal Grounding Concept
V23839-R35-L55
Common
V23839-R36-L55
Separated
Preliminary Product Information
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V23839-R3x-L55
Pin Configuration
Pin Configuration
Tx
MS
HL
D B 10 9 8 7 6
HL
TOP VIEW
Rx
C A 1 2 3 4 5
MS
HL
HL
File: 1344
Figure 1
iSFF Transceiver Electrical Pin Layout
Preliminary Product Information
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V23839-R3x-L55
Pin Configuration
Pin Description
Pin No.
Name
Logic Level
Function
1
N/A
Receiver Ground
2
VEER
VCCR
N/A
Receiver Power
3
SD
LVTTL
Signal Detect1) 5)
4
RD–
LVPECL
Inv. Received Data Out2)
5
RD+
LVPECL
Received Data Out2)
6
N/A
Transmitter Power
7
VCCT
VEET
N/A
Transmitter Ground
8
TxDis
LVTTL
Transmitter Disable3)
9
TD+
LVPECL
Transmit Data In4)
10
TD–
LVPECL
Inv. Transmit Data In4)
A
SDA
LVTTL
2-wire Data Interface5)
B
SCL
LVTTL
2-wire Clock Interface5)
C
Rate Select6)
LVTTL
1 & 2 or 2 & 4 Gbit/s7)
D
Tx Fault
LVTTL
Transmitter Fault5)
MS
MS
N/A
Mounting Studs8)
HL
HL
N/A
Housing Leads9)
1)
2)
3)
4)
5)
6)
7)
8)
9)
Normal operation: Logic 1 output, represents that light is present at receiver input.
Fault condition: Logic 0 output.
AC coupled inside transceiver. Must be terminated with 100 Ω differential at the user SERDES.
A logic 0 switches the transmitter on. A logic 1 switches the transmitter off.
AC coupled and 100 Ω differential termination inside the transceiver.
Should be pulled up on host board to VCC by 4.7 - 10 kΩ.
Not implemented.
In accordance to SFF Committee SFF-8079 Draft.
Mounting Studs are provided for transceiver mechanical attachment to the circuit board. They also provide an
optional connection of the transceiver to the equipment chassis ground.
The transceiver Housing Leads are provided for additional signal grounding. The holes in the circuit board must
be included and be tied to signal ground (see EMI Recommendations).
Preliminary Product Information
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V23839-R3x-L55
Description
Description
The Infineon Fibre Channel multimode transceiver – part of Infineon iSFF family – is
compatible to the Physical Medium Depend (PMD) sublayer and baseband medium,
type 1000 Base-SX (short wavelength) as specified in IEEE Std 802.3 and Fibre Channel
FC-PI-2 (Rev. 5.0) 400-M5-SN-I, 400-M6-SN-I for 4.25 Gbit/s,
FC-PI-2 (Rev. 5.0) 200-M5-SN-I, 200-M6-SN-I for 2.125 Gbit/s, and
FC-PI-2 (Rev. 5.0) 100-M5-SN-I, 100-M6-SN-I for 1.0625 Gbit/s.
The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™
connector.
Preliminary Product Information
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V23839-R3x-L55
Description
Link Length as Defined by IEEE and Fibre Channel Standards
Fiber Type
Reach
min.1)
max.2)
50 µm, 2000 MHz*km
0.5
860
50 µm, 500 MHz*km
0.5
500
50 µm, 400 MHz*km
0.5
450
62.5 µm, 200 MHz*km
0.5
300
62.5 µm, 160 MHz*km
0.5
250
50 µm, 500 MHz*km
2
550
50 µm, 400 MHz*km
2
500
62.5 µm, 200 MHz*km
2
275
62.5 µm, 160 MHz*km
2
220
50 µm, 2000 MHz*km
0.5
500
50 µm, 500 MHz*km
0.5
300
50 µm, 400 MHz*km
0.5
260
62.5 µm, 200 MHz*km
0.5
150
62.5 µm, 160 MHz*km
0.5
120
50 µm, 2000 MHz*km
0.5
270
50 µm, 500 MHz*km
0.5
150
50 µm, 400 MHz*km
0.5
130
62.5 µm, 200 MHz*km
0.5
70
62.5 µm, 160 MHz*km
0.5
55
Unit
at 1.0625 Gbit/s
meters
at 1.25 Gbit/s
meters
at 2.125 Gbit/s
meters
at 4.25 Gbit/s
1)
2)
meters
Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is
supported.
Maximum reach as defined by IEEE and Fibre Channel Standards. Longer reach possible depending upon link
implementation.
Preliminary Product Information
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V23839-R3x-L55
Description
The Infineon iSFF multimode transceiver is a single unit comprised of a transmitter, a
receiver, and an LC™ receptacle.
This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45
style backpanels for high end datacom and telecom applications while providing the
advantages of fiber optic technology.
The module is designed for low cost SAN, LAN, Fibre Channel and Gigabit Ethernet
applications. It can be used as the network end device interface in mainframes,
workstations, servers, and storage devices, and in a broad range of network devices
such as bridges, routers, hubs, and local and wide area switches.
This transceiver operates at 1.0625 Gbit/s / 1.25 Gbit/s / 2.125 Gbit/s / 4.25 Gbit/s from
a single power supply (+3.3 V). The 100 Ω differential data inputs and outputs are
CML compatible.
Functional Description of iSFF Transceiver
This transceiver is designed to transmit serial data via multimode cable.
Tx Fault
Automatic
Shut-Down
Tx Disable
Tx Coupling Unit
TD+
TD−
Laser
Driver
e/o
Laser
Power
Control
o/e
Multimode Fiber
Monitor
SD
Rx Coupling Unit
RD+
RD−
Limiting
Amp
TIA
o/e
Rate Select 1)
MOD-DEF(2)
MOD-DEF(1)
1) Not
Digital Diagnostic
Monitoring Interface
implemented
EEPROM
Alarm and
Warning Flags
File: 1368
Figure 2
Functional Diagram
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Description
The receiver component converts the optical serial data into CML compatible electrical
data (RD+ and RD–). The Signal Detect (SD) shows whether an optical signal is present.
The transmitter converts CML compatible electrical serial data (TD+ and TD–) into
optical serial data. Data lines are differentially 100 Ω terminated.
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging. The power control uses
the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a
controlling signal, to prevent the laser power from exceeding the operating limits.
Single fault condition is ensured by means of an integrated automatic shutdown circuit
that disables the laser when it detects laser fault to guarantee the laser Eye Safety.
The transceiver contains a supervisory circuit to control the power supply. This circuit
makes an internal reset signal whenever the supply voltage drops below the reset
threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage
has risen above the reset threshold. During this time the laser is inactive.
A low signal on TxDis enables transmitter. If TxDis is high or not connected the
transmitter is disabled.
An enhanced Digital Diagnostic Monitoring Interface (Intelligent) has been incorporated
into the Infineon SFF transceiver. This allows real time access to transceiver operating
parameters, based on the SFF-8472.
This transceiver features Internal Calibration. Measurements are calibrated over
operating temperature and voltage and must be interpreted as defined in SFF-8472.
The transceiver generates this diagnostic data by digitization of internal analog signals
monitored by a new diagnostic Integrated Circuit (IC).
This diagnostic IC has inbuilt sensors to include alarm and warning thresholds. These
threshold values are set during device manufacture and therefore allow the user to
determine when a particular value is outside of its operating range.
Alarm and Warning Flags are given. Alarm Flags indicate conditions likely to be
associated with an inoperational link and cause for immediate action. Warning Flags
indicate conditions outside the normally guaranteed bounds but not necessarily causes
of immediate link failures.
These enhanced features are in addition to the existing SFF features provided by the
manufacturer i.e. serial number and other vendor specific data.
The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a
2 wire, serial interface at the 8 bit address 1010000X (A0h).
The Digital Diagnostic Monitoring Interface makes use of the 8 bit address 1010001X
(A2h), so the originally defined serial ID memory map remains unchanged and is
therefore backward compatible.
Preliminary Product Information
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V23839-R3x-L55
Description
Digital Diagnostic Monitoring Parameters
Parameter
Accuracy SFF-8472
Accuracy Actual
Tx Optical Power
±3 dB
±3 dB
Rx Optical Power
±3 dB
±3 dB
Bias Current
±10%
±10%
Power Supply Voltage
±3%
±3%
Transceiver Temperature
±3°C
±3°C
Regulatory Compliance (EMI)
Feature
Standard
Comments
ESD:
Electrostatic Discharge
to the Electrical Pins
EIA/JESD22-A114-B
(MIL-STD 883D
method 3015.7)
Class 1C
Immunity:
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
With a field strength of 10 V/m,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
transceiver performance between
the specification limits.
Emission:
FCC 47 CFR Part 15,
Radiated Field Strength Class B
CISPR 22
EN 55022 Class B
Preliminary Product Information
8
Noise frequency range:
30 MHz to 18 GHz
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V23839-R3x-L55
Description
(13.97) *)
.550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
Figure 3
File: 1501
Transceiver Pitch
Preliminary Product Information
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V23839-R3x-L55
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min.
Unit
max.
Operating Case Temperature
VID max
VIDpk-pk
TS
TC
Storage Relative Humidity
RHs
5
95
%
Operating Relative Humidity
RHo
5
85
%
Supply Voltage
4
V
Data Output Current
VCC max
Idata
50
mA
Receiver Optical Input Power
RxP max
3
dBm
Hand Lead Soldering Temp/Time
260/10
°C/s
Wave Soldering Temp/Time
260/10
°C/s
Aqueous Wash Pressure
< 110
psi
Data Input Voltage
Differential Data Input Voltage Swing
Storage Ambient Temperature
VCC+0.5
V
5
V
–40
85
°C
–20
85
°C
Exceeding any one of these values may permanently destroy the device.
Preliminary Product Information
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V23839-R3x-L55
Technical Data
Electrical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C)
Parameter
Symbol
Values
Unit
min.
typ.
max.
2.97
3.3
3.63
V
In-rush Current
VCC–VEE
IIR max
30
mA
Power Dissipation
P
400
900
mW
Differential Data Input Voltage
Swing2)
VIDpk-pk
500
3200
mV
Tx Disable Voltage
TxDis
2
VCC
V
Tx Enable Voltage
TxEn
VEE
0.8
V
Tx Fault High Voltage
TxFH
2.4
VCC
V
Tx Fault Low Voltage
TxFL
VEE
0.5
V
Supply Current3)
ITx
150
mA
Differential Data Output Voltage VODpk-pk 500
Swing 4)
1000
mV
Signal Detect High
SDH
2.4
VCC
V
Signal Detect Low
SDL
VEE
0.5
V
Rate Select 1 / 2 Gbit/s5) 6)
RSLOW
2
VCC
V
Rate Select 2 / 4 Gbit/s5) 6)
RSHIGH
VEE
0.8
V
Contributed Deterministic Jitter
DJ-CRx
23.5
ps
Contributed Total Jitter
TJ-CRx
61.8
ps
Jitter (pk-pk)7)
JRx
45
ps
Common
Supply Voltage
1)
Transmitter
100
Receiver
Power Supply Noise Rejection8) PSNR
Supply Current 3)
1)
2)
3)
4)
5)
6)
7)
9)
100
IRx
80
mVpp
90
mA
Measured with MSA recommended supply filter network (Figure 8). Maximum value above that of the steady
state value.
Internally AC coupled. Typical 100 Ω differential input impedance.
MSA defines maximum current at 300 mA.
Internally AC coupled. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of
50 mV should be added.
In accordance to SFF Committee SFF-8079 Draft.
Not implemented.
Jitter (pk-pk) is measured using a 27–1 NRZ PRBS and a Digital Communications Analyzer.
Preliminary Product Information
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V23839-R3x-L55
Technical Data
8)
9)
Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter
network (Figure 8) in place. A change in sensitivity of less than 1 dB can be typically expected.
Supply current excluding Rx output load.
Preliminary Product Information
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V23839-R3x-L55
Technical Data
Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C)
Parameter
Symbol
Values
min.
typ.
Unit
max.
Transmitter
Optical Modulation Amplitude 1)
@ 4.25 Gbit/s
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
OMA
Launched Power (Average)2)
PO
–8.5
Extinction Ratio (Dynamic)3)
ER
9
Center Wavelength
λC
830
Spectral Width (rms)
µW
247
196
156
–4
dBm
dB
860
nm
σI
0.85
nm
Relative Intensity Noise
RIN
–118
dB/Hz
Contributed Deterministic Jitter
DJ-CTx
28.2
ps
Contributed Total Jitter
TJ-CTx
59.8
ps
Jitter (pk-pk)
JTx
45
ps
Rise Time5)
tR-Tx
tF-Tx
90
ps
90
ps
4)
Fall Time5)
850
Receiver6)
Min. Optical Modulation
Amplitude 7)
@ 4.25 Gbit/s
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
OMA
Average Received Power
PR
PIN
Sensitivity (Average Power)8)
@ 1.25 Gbit/s
Stressed Receiver Sensitivity
50 µm Fiber9)
@ 4.25 Gbit/s
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
@ 1.25 Gbit/s10)
Preliminary Product Information
µW
61
49
31
0
dBm
–19
dBm
138
96
55
–13.5
µW
µW
µW
dBm
SPIN
50 µm
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V23839-R3x-L55
Technical Data
Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = –20°C to 85°C) (cont’d)
Parameter
Symbol
Values
min.
Stressed Receiver Sensitivity
62.5 µm Fiber9)
@ 4.25 Gbit/s
@ 2.125 Gbit/s
@ 1.0625 Gbit/s
@ 1.25 Gbit/s10)
SPIN
SD Assert Level 11)
PSDA
PSDD
PSDA
–PSDD
SD Deassert Level 11)
SD Hysteresis11)
12
6)
7)
8)
9)
10)
11)
dBm
dB
ORL
5)
–23
1
Optical Return Loss
4)
µW
µW
µW
dBm
dBm
770
3)
148
109
67
–12.5
–30
λC
2)
max.
62.5 µm
Input Center Wavelength
1)
typ.
Unit
850
860
nm
dB
Fibre Channel PI Standard. Typical OMA values based on –6 dBm launched power (average) and 15 dB
extinction ratio.
Into multimode fiber, 62.5 µm or 50 µm diameter.
For GbE applications only.
Jitter (pk-pk) is measured using a 27–1 NRZ PRBS and a Digital Communications Analyzer.
Measured at nominal data rate. These are unfiltered 20% - 80% values.
Receiver characteristics are measured with a worst case reference laser.
Fibre Channel PI Standard.
Average optical power at which the BER is 1x10–12. Measured with a 27–1 NRZ PRBS and ER = 9 dB.
Measured at the given Stressed Receiver Eye Closure Penalty and DCD component given in Fibre Channel
PI Standard (2.03/2.18 dB & 40/80 ps).
Measured with a transmit signal having a 9 dB extinction ratio.
See Figure 4.
Preliminary Product Information
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V23839-R3x-L55
Technical Data
1
SD Level
0
SD Deassert
(Maximum)
SD
deassertion
range
Hysteresis
(Minimum)
SD
persistence
SD
assertion
range
SD Assert
(Minimum)
Received Optical
Power Level
[dBm]
SD / Hysteresis
(Typical)
File: 1523
Figure 4
Preliminary Product Information
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V23839-R3x-L55
Technical Data
Timing of Control and Status I/O
Parameter
Symbol
Values
min.
Unit
Condition
max.
Tx Disable
Assert Time
t_off
10
µs
Time from rising edge of Tx
Disable to when the optical
output falls below 10% of
nominal
Tx Disable
Negate Time
t_on
1
ms
Time from falling edge of Tx
Disable to when the modulated
optical output rises above 90%
of nominal
Time to Initialize, t_init
Including Reset
of Tx Fault
300
ms
From power on or negation of
Tx Fault using Tx Disable
Tx Fault Assert
Time
t_fault
100
µs
Time from fault to Tx Fault on
Tx Disable to
Reset
t_reset
µs
Time Tx Disable must be held
high to reset Tx Fault
SD Assert Time
t_SD_on
100
µs
Time from SD state to Rx SD
assert
SD Deassert
Time
t_SD_off
100
µs
Time from non-SD state to
Rx SD deassert
Preliminary Product Information
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V23839-R3x-L55
Technical Data
I/O Timing of Soft Control and Status Functions
Parameter
Symbol
Max.
Value
Unit
Condition
Tx Disable assert
time
t_off
100
ms
Time from Tx Disable bit set1)
until optical output falls below
10% of nominal
Tx Disable deassert t_on
time
100
ms
Time from Tx Disable bit
cleared until optical output
rises above 90% of nominal
Time to initialize,
including reset of
Tx Fault
300
ms
Time from power on or
negation of Tx Fault using
Tx Disable until transmitter
output is stable2)
Tx Fault assert time t_fault
100
ms
Time from fault to Tx Fault bit
set
SD assert time
t_SD_on
100
ms
Time from SD state to Rx SD
bit set
SD deassert time
t_SD_off
100
ms
Time from non-SD state to
Rx SD bit cleared
Rate select change
time3)
t_rate_sel
100
ms
Time from change of state of
Rate Select bit1) until receiver
bandwidth is in conformance
with appropriate specification
Serial ID clock rate4) f_serial_clock
400
kHz
N/A
Analog parameter
data ready
1000
ms
From power on to data ready,
bit 0 of byte 110 set
300
ms
Time from power on until
module is ready for data
transmission
t_init
t_data
Serial bus hardware t_serial
ready
1)
2)
3)
4)
Measured from falling clock edge after stop bit of write transaction.
See Gigabit Interface Converter (GBIC). SFF-0053, Rev. 5.5, September 27, 2000.
Not implemented.
The maximum clock rate of the serial interface is defined by the I2C bus interface standard.
Preliminary Product Information
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V23839-R3x-L55
Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1 product. It complies with IEC
60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10
and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001.
CLASS 1 LASER PRODUCT
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Note: All adjustments have been made at the factory prior to shipment of the devices.
No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result in voided
product warranty.
Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Emission Data
Wavelength
850 nm
Maximum total output power
(as defined by IEC: 7 mm aperture at 14 mm distance)
709 µW / –1.5 dBm
Beam divergence (full angle) / NA (half angle)
20° / 0.18 rad
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
File: 1401
Figure 5
Required Labels
Laser
Emission
Tx
Top view
Rx
File: 1345
Figure 6
Laser Emission
Preliminary Product Information
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Application Notes
Application Notes
Small Form Factor Pinning Comparison
The drawing below gives you a comparison between the different pinnings 2x5, 2x7,
2x10. Dimension for diameter and distance of additional pins is similar to the existing
dimensions of the other pins.
1) Not implemented
Top view
Rx
RxVEE
RxVCC
SD
RxD−
RxD+
1
2
3
4
5
Rate Select 1)
SDA
RxVEE
RxVCC
SD
RxD−
RxD+
C
A
1
2
3
4
5
Tx
20
19
18
17
16
15
14
13
12
11
VCCPIN 1
RxVEE 2
RxVEE 3
RxCLK− 4
RxCLK+ 5
RxVEE 6
RxVCC 7
SD 8
RxD− 9
RxD+ 10
PMON+
PMON−
BIASMON+
BIASMON−
TxVEE
TxD−
TxD+
TxDis
TxVEE
TxVCC
D
B
10
9
8
7
6
Tx Fault
SCL
TxD−
TxD+
TxDis
TxVEE
TxVCC
10
9
8
7
6
TxD−
TxD+
TxDis
TxVEE
TxVCC
2 x 10
2x7
2x5
File: 1524
Figure 7
Preliminary Product Information
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Application Notes
EMI Recommendations
To avoid electromagnetic radiation exceeding the required limits set by the standards,
please take note of the following recommendations.
When Gigabit switching components are found on a PCB (e.g. multiplexer,
serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak
radiation; this may also occur at chassis slots other than that of the device itself. Thus
every mechanical opening or aperture should be as small as feasible and its length
carefully considered.
On the board itself, every data connection should be an impedance matched line (e.g.
strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed
symmetrically. Vias should be avoided. Where internal termination inside an IC or a
transceiver is not present, a line terminating resistor must be provided. The decision of
how best to establish a ground depends on many boundary conditions. This decision
may turn out to be critical for achieving lowest EMI performance. At RF frequencies the
ground plane will always carry some amount of RF noise. Thus the ground and VCC
planes are often major radiators inside an enclosure. As a general rule, for small systems
such as PCI cards placed inside poorly shielded enclosures, the common ground
scheme has often proven to be most effective in reducing RF emissions. In a common
ground scheme, the PCI card becomes more equipotential with the chassis ground. As
a result, the overall radiation will decrease. In a common ground scheme, it is strongly
recommended to provide a proper contact between signal ground and chassis ground at
every location where possible. This concept is designed to avoid hotspots which are
places of highest radiation, caused when only a few connections between chassis and
signal grounds exist. Compensation currents would concentrate at these connections,
causing radiation. However, as signal ground may be the main cause for parasitic
radiation, connecting chassis ground and signal ground at the wrong place may result in
enhanced RF emissions.
For example, connecting chassis ground and signal ground at a front
panel/bezel/chassis by means of a fiber optic transceiver may result in a large amount
of radiation especially where combined with an inadequate number of grounding points
between signal ground and chassis ground. Thus the transceiver becomes a single
contact point increasing radiation emissions. Even a capacitive coupling between signal
ground and chassis ground may be harmful if it is too close to an opening or an aperture.
For a number of systems, enforcing a strict separation of signal ground from chassis
ground may be advantageous, providing the housing does not present any slots or other
discontinuities. This separate ground concept seems to be more suitable in large
systems where appropriate shielding measures have also been implemented.
In many situations the question on which ground concept to implement in the design
cannot be easily decided prior to the receipt of first EMI measurement results. Infineon
thus offers both module versions; V23839-Xx5-Xxx for common ground and
V23839-Xx6-Xxx for separate ground concept.
Preliminary Product Information
20
2004-06-25
V23839-R3x-L55
Application Notes
The return path of RF current must also be considered. Thus a split ground plane
between Tx and Rx paths may result in severe EMI problems irrespective of which
module ground concept has been applied.
The bezel opening for a transceiver should be sized so that all contact springs of the
transceiver make good electrical contact with the face plate. Please consider that the
PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. Thus even
the smallest PCBs may have unexpected resonances.
Preliminary Product Information
21
2004-06-25
V23839-R3x-L55
Application Notes
EEPROM Serial ID Memory Contents (A0h), V23839-R35-L55
Addr. Hex ASCII Name/Description
Addr. Hex ASCII Name/Description
0
1
02
04
Identifier
Extended identifier
32
33
47
6D
G
m
2
07
Connector
34
62
b
3
4
00
00
Transceiver optical
compatibility
35
36
48
00
H
5
00
37
00
6
7
8
9
10
11
01
40
40
0C
15
01
Encoding
38
39
40
41
42
43
03
19
56
32
33
38
V
2
3
8
12
2B
BR, nominal
44
33
3
13
00
Reserved
45
39
9
14
00
Length (9 µm) - km
46
2D
-
15
00
Length (9 µm)
47
52
R
16
0F
Length (50 µm)
48
33
3
17
07
Length (62.5 µm)
49
35
5
18
00
Length (copper)
50
2D
-
19
00
Reserved
51
4C
L
20
21
22
23
49
6E
66
69
I
n
f
i
Vendor name
52
53
54
55
35
35
20
20
5
5
24
25
6E
65
n
e
56
57
42
31
B
1
26
27
6F
6E
o
n
58
59
41
39
A
9
28
29
30
20
46
4F
03
52
00
Wavelength
F
O
60
61
62
31
20
63
21
Check sum of
bytes 0 - 62
Preliminary Product Information
22
Vendor name
Reserved
Vendor OUI
Vendor part number
Vendor revision,
product status
dependent
Reserved
2004-06-25
V23839-R3x-L55
Application Notes
EEPROM Serial ID Memory Contents (A0h), V23839-R35-L55 (cont’d)
Addr. Hex ASCII Name/Description
Addr. Hex ASCII Name/Description
64
65
66
00
1C
00
BR, maximum
96
97
98
20
20
20
67
4B
BR, minimum
99
20
Vendor serial number
100
101
102
103
20
20
20
20
20
20
20
20
20
68
69
70
71
Transceiver signal
options
72
73
74
75
76
20
104
105
106
107
108
77
20
109
20
78
20
110
20
79
20
111
20
80
20
112
20
81
20
113
20
82
20
114
20
83
20
115
20
20
20
20
20
20
20
20
84
85
86
87
88
89
90
20
116
117
118
119
120
121
122
91
20
123
20
92
68
Diagnostic monitoring
type
124
20
93
B0
Enhanced options
125
20
94
01
SFF-8472 compliance
126
20
Low order 8 bits of the
sum of the contents of
all the bytes from byte
64 to byte 94, inclusive
127
128 255
20
00
95
Vendor manufacturing
date code
Preliminary Product Information
23
Vendor specific
EEPROM
Vendor specific.
Reserved for future
use
2004-06-25
V23839-R3x-L55
Application Notes
EEPROM Serial ID Memory Contents (A0h), V23839-R36-L55
Addr. Hex ASCII Name/Description
Addr. Hex ASCII Name/Description
0
1
02
04
Identifier
Extended identifier
32
33
47
6D
G
m
2
07
Connector
34
62
b
3
4
00
00
Transceiver optical
compatibility
35
36
48
00
H
5
00
37
00
6
7
8
9
10
11
01
40
40
0C
15
01
Encoding
38
39
40
41
42
43
03
19
56
32
33
38
V
2
3
8
12
2B
BR, nominal
44
33
3
13
00
Reserved
45
39
9
14
00
Length (9 µm) - km
46
2D
-
15
00
Length (9 µm)
47
52
R
16
0F
Length (50 µm)
48
33
3
17
07
Length (62.5 µm)
49
36
6
18
00
Length (copper)
50
2D
-
19
00
Reserved
51
4C
L
20
21
22
23
49
6E
66
69
I
n
f
i
Vendor name
52
53
54
55
35
35
20
20
5
5
24
25
6E
65
n
e
56
57
44
31
D
1
26
27
6F
6E
o
n
58
59
41
39
A
9
28
29
30
20
46
4F
03
52
00
Wavelength
F
O
60
61
62
31
20
63
24
Check sum of
bytes 0 - 62
Preliminary Product Information
24
Vendor name
Reserved
Vendor OUI
Vendor part number
Vendor revision,
product status
dependent
Reserved
2004-06-25
V23839-R3x-L55
Application Notes
EEPROM Serial ID Memory Contents (A0h), V23839-R36-L55 (cont’d)
Addr. Hex ASCII Name/Description
Addr. Hex ASCII Name/Description
64
65
66
00
1C
00
BR, maximum
96
97
98
20
20
20
67
4B
BR, minimum
99
20
Vendor serial number
100
101
102
103
20
20
20
20
20
20
20
20
20
68
69
70
71
Transceiver signal
options
72
73
74
75
76
20
104
105
106
107
108
77
20
109
20
78
20
110
20
79
20
111
20
80
20
112
20
81
20
113
20
82
20
114
20
83
20
115
20
20
20
20
20
20
20
20
84
85
86
87
88
89
90
20
116
117
118
119
120
121
122
91
20
123
20
92
68
Diagnostic monitoring
type
124
20
93
B0
Enhanced options
125
20
94
01
SFF-8472 compliance
126
20
Low order 8 bits of the
sum of the contents of
all the bytes from byte
64 to byte 94, inclusive
127
128 255
20
00
95
Vendor manufacturing
date code
Preliminary Product Information
25
Vendor specific
EEPROM
Vendor specific.
Reserved for future
use
2004-06-25
V23839-R3x-L55
Application Notes
Digital Diagnostic Monitoring Interface – Intelligent
Alarm and Warning Thresholds (2-Wire Address A2h)
Address
# Bytes
Name
Description
Value
00 - 01
2
Temp High Alarm
MSB at low address
95°C1)
02 - 03
2
Temp Low Alarm
MSB at low address
–20°C1)
04 - 05
2
Temp High Warning
MSB at low address
90°C1)
06 - 07
2
Temp Low Warning
MSB at low address
–15°C1)
08 - 09
2
Voltage High Alarm
MSB at low address
3.7 V2)
10 - 11
2
Voltage Low Alarm
MSB at low address
2.85 V2)
12 - 13
2
Voltage High Warning
MSB at low address
3.63 V2)
14 - 15
2
Voltage Low Warning
MSB at low address
2.97 V2)
16 - 17
2
Bias High Alarm
MSB at low address
28 mA
18 - 19
2
Bias Low Alarm
MSB at low address
3.1 mA
20 - 21
2
Bias High Warning
MSB at low address
14.8 mA
22 - 23
2
Bias Low Warning
MSB at low address
4.6 mA
24 - 25
2
Tx Power High Alarm
MSB at low address
–3.5 dBm
26 - 27
2
Tx Power Low Alarm
MSB at low address
–8.5 dBm
28 - 29
2
Tx Power High Warning
MSB at low address
–4 dBm
30 - 31
2
Tx Power Low Warning
MSB at low address
–7.5 dBm
32 - 33
2
Rx Power High Alarm
MSB at low address
–4.5 dBm
34 - 35
2
Rx Power Low Alarm
MSB at low address
–16 dBm
36 - 37
2
Rx Power High Warning
MSB at low address
–5 dBm
38 - 39
2
Rx Power Low Warning
MSB at low address
–14 dBm
40 - 55
16
Reserved
Reserved for future
monitored quantities
1)
2)
A delta exists between actual transceiver temperature and value shown as measurement is taken internal to
an IC located on the top side of the iSFF PCB.
Transceiver voltage measured after input filter with typical 0.1 V voltage drop.
Preliminary Product Information
26
2004-06-25
V23839-R3x-L55
Application Notes
Calibration Constants for External Calibration Option (2-Wire Address A2h)
Address
# Bytes
Name
Description
56 - 59
4
Rx_PWR (4)
60 - 63
4
Rx_PWR (3)
Single precision floating point
0
calibration data, Rx optical power. 0
64 - 67
4
Rx_PWR (2)
0
68 - 71
4
Rx_PWR (1)
1
72 - 75
4
Rx_PWR (0)
0
76 - 77
2
Tx_I(Slope)
Fixed decimal (unsigned)
1
calibration data, laser bias current.
78 - 79
2
Tx_I (Offset)
Fixed decimal (signed two’s
complement) calibration data,
laser bias current.
0
80 - 81
2
Tx_PWR (Slope)
Fixed decimal (unsigned)
calibration data, transmitter
coupled output power.
1
82 - 83
2
Tx_PWR (Offset) Fixed decimal (signed two’s
0
complement) calibration data,
transmitter coupled output power.
84 - 85
2
T (Slope)
Fixed decimal (unsigned)
calibration data, internal module
temperature.
1
86 - 87
2
T (Offset)
Fixed decimal (signed two’s
complement) calibration data,
internal module temperature.
0
88 - 89
2
V (Slope)
Fixed decimal (unsigned)
calibration data, internal module
supply voltage.
1
90 - 91
2
V (Offset)
Fixed decimal (signed two’s
complement) calibration data,
internal module supply voltage.
0
92 - 94
3
Reserved
Reserved
95
1
Check sum
Byte 95 contains the low order
8 bits of the sum of bytes 0 - 94.
Preliminary Product Information
27
Value
2004-06-25
V23839-R3x-L55
Application Notes
A/D Values and Status Bits (2-Wire Address A2h)
Byte
Bit
Name
Description
Converted Analog Values. Calibrated 16 Bit Data.
96
All
Temperature MSB
Internally measured module
temperature1)
97
All
Temperature LSB
98
All
VCC MSB
99
All
VCC LSB
100
All
Tx Bias MSB
101
All
Tx Bias LSB
102
All
Tx Power MSB
103
All
Tx Power LSB
104
All
Rx Power MSB
105
All
Rx Power LSB
106
All
Reserved MSB
Reserved for 1st future definition of
digitized analog input
107
All
Reserved LSB
Reserved for 1st future definition of
digitized analog input
108
All
Reserved MSB
Reserved for 2nd future definition of
digitized analog input
109
All
Reserved LSB
Reserved for 2nd future definition of
digitized analog input
Internally measured supply voltage
in transceiver
Internally measured Tx Bias Current
Measured Tx output power
Measured Rx input power
Optional Status/Control Bits
110
7
Tx Disable State2)
Digital state of the Tx Disable Input
Pin
110
6
Soft Tx Disable2)
Read/write bit that allows software
disable of laser. Writing 1 disables
laser
110
5
Reserved
110
4
Rx Rate Select State2)
Digital state of the SFF Rx Rate
Select Input Pin
110
3
Soft Rx Rate Select2)
Read/write bit that allows software
Rx rate select. Writing 1 selects full
bandwidth operation3)
Preliminary Product Information
28
2004-06-25
V23839-R3x-L55
Application Notes
A/D Values and Status Bits (2-Wire Address A2h) (cont’d)
Byte
Bit
Name
Description
110
2
Tx Fault
Digital state of the Tx Fault Output
Pin
110
1
SD
Digital state of the SD Output Pin
110
0
Data_Ready_Bar
Indicates transceiver has achieved
power up and data is ready
111
7-0
Soft Rx Rate Select2)
Rate Select3)
1)
2)
3)
Temperature measurement is performed on an IC located on the top side of the iSFF PCB.
Not implemented.
In accordance to SFF Committee SFF-8079 Draft.
Preliminary Product Information
29
2004-06-25
V23839-R3x-L55
Application Notes
Alarm and Warning Flags (2-Wire Address A2h)
Byte
Bit
Name
Description
112
7
Temp High Alarm
Set when internal temperature
exceeds high alarm level
112
6
Temp Low Alarm
Set when internal temperature is
below low alarm level
112
5
VCC High Alarm
Set when internal supply voltage
exceeds high alarm level
112
4
VCC Low Alarm
Set when internal supply voltage is
below low alarm level
112
3
Tx Bias High Alarm
Set when Tx Bias current exceeds
high alarm level
112
2
Tx Bias Low Alarm
Set when Tx Bias current is below
low alarm level
112
1
Tx Power High Alarm
Set when Tx output power exceeds
high alarm level
112
0
Tx Power Low Alarm
Set when Tx output power is below
low alarm level
113
7
Rx Power High Alarm
Set when received power exceeds
high alarm level
113
6
Rx Power Low Alarm
Set when received power is below
low alarm level
113
5
Reserved Alarm
113
4
Reserved Alarm
113
3
Reserved Alarm
113
2
Reserved Alarm
113
1
Reserved Alarm
113
0
Reserved Alarm
114
All
Reserved
115
All
Reserved
116
7
Temp High Warning
Set when internal temperature
exceeds high warning level
116
6
Temp Low Warning
Set when internal temperature is
below low warning level
116
5
VCC High Warning
Set when internal supply voltage
exceeds high warning level
Preliminary Product Information
30
2004-06-25
V23839-R3x-L55
Application Notes
Alarm and Warning Flags (2-Wire Address A2h) (cont’d)
Byte
Bit
Name
Description
116
4
VCC Low Warning
Set when internal supply voltage is
below low warning level
116
3
Tx Bias High Warning
Set when Tx bias current exceeds
high warning level
116
2
Tx Bias Low Warning
Set when Tx bias current is below
low warning level
116
1
Tx Power High Warning
Set when Tx output power exceeds
high warning level
116
0
Tx Power Low Warning
Set when Tx output power is below
low warning level
117
7
Rx Power High Warning
Set when received power exceeds
high warning level
117
6
Rx Power Low Warning
Set when received power is below
low warning level
117
5
Reserved Warning
117
4
Reserved Warning
117
3
Reserved Warning
117
2
Reserved Warning
117
1
Reserved Warning
117
0
Reserved Warning
118
All
Reserved
119
All
Reserved
Vendor Specific Memory Addresses (2-Wire Address A2h)
Address
# Bytes
Name
Description
120 -127
8
Vendor Specific
Vendor specific
User EEPROM (2-Wire Address A2h)
Address
# Bytes
Name
Description
128 - 247 120
User EEPROM
User writable EEPROM
248 - 255 8
Vendor Specific
Vendor specific control functions
Preliminary Product Information
31
2004-06-25
V23839-R3x-L55
Application Notes
Multimode 850 nm iSFF Transceiver, AC/AC TTL
Host Board
Infineon
iSFF
Transceiver
3.3 V
1 µH
Protocol VCC
10 µF
VCCT
1 µH
0.1 µF
0.1 µF
Protocol VCC
6
xx 1)
VEET
4.7 to
10 kΩ
7
4.7 to
10 kΩ
Tx Disable
Tx Fault
Tx Disable
8
Tx Fault
D
TD–
10
0.1 µF
Laser
Driver
100 Ω
TD+
9
VCCR
2
0.1 µF
Protocol IC
ASIC IC
4.7 to
10 kΩ
10 µF
0.1 µF
xx 1)
VEER
1
RD+
5
0.1 µF
RD–
4
0.1 µF
SD
3
Rate Select 2)
C
Pre-Amp./
Post Amp.
100 Ω
SD
Rate Select 2)
Diagnostic IC / EEPROM
3.3 V
PLD / PAL
4.7 to
10 kΩ
4.7 to
10 kΩ
A
B
SDA
SCL
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal
data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory.
2) Not implemented.
File: 1321
Figure 8
Example iSFF Host Board Schematic and
Recommended Host Board Supply Filtering Network
Preliminary Product Information
32
2004-06-25
V23839-R3x-L55
Package Outlines
Package Outlines
Dimensions in mm
File: 1228
Figure 9
Preliminary Product Information
33
2004-06-25
V23839-R3x-L55
Revision History:
2004-06-25
Previous Version:
2004-02-13
Page
Subjects (major changes since last revision)
4
Description changed
DS2
11, 13, 22, Tables changed
26, 28
18
Eye Safety changed
Table Laser Emission Data changed
32
Figure 8 Host Board Schematic changed
33
Package Outlines changed
Edition 2004-06-25
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.