MOTOROLA MCM63P737K

Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Advance Information
Freescale Semiconductor, Inc...
128K x 36 and 256K x 18 Bit
Pipelined BurstRAM
Synchronous Fast Static RAM
Order this document
by MCM63P737K/D
MCM63P737K
MCM63P819K
The MCM63P737K and MCM63P819K are 4M–bit synchronous fast static
RAMs designed to provide a burstable, high performance, secondary cache. The
MCM63P737K (organized as 128K words by 36 bits) and the MCM63P819K
(organized as 256K words by 18 bits) integrate input registers, an output register,
a 2–bit address counter, and high speed SRAM onto a single monolithic circuit
for reduced parts count in cache data RAM applications. Synchronous design
allows precise cycle control with the use of an external clock (K).
Addresses (SA), data inputs (DQx), and all control signals except output
enable (G), sleep mode (ZZ), and linear burst order (LBO) are clock (K)
controlled through positive–edge–triggered noninverting registers.
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst
addresses can be generated internally by the MCM63P737K and MCM63P819K
(burst sequence operates in linear or interleaved mode dependent upon the state
of LBO) and controlled by the burst address advance (ADV) input pin.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (K) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
Synchronous byte write (SBx), synchronous global write (SGW), and synchronous write enable (SW) are provided to allow writes to either individual bytes or
to all bytes. The bytes are designated as “a”, “b”, etc. SBa controls DQa, SBb
controls DQb, etc. Individual bytes are written if the selected byte writes SBx are
asserted with SW. All bytes are written if either SGW is asserted or if all SBx and
SW are asserted.
For read cycles, pipelined SRAMs output data is temporarily stored by an
edge–triggered output register and then released to the output buffers at the next
rising edge of clock (K).
The MCM63P737K and MCM63P819K operate from a 3.3 V core power
supply and all outputs operate on a 2.5 V or 3.3 V power supply. All inputs and
outputs are JEDEC standard JESD8–5 compatible.
TQ PACKAGE
TQFP
CASE 983A–01
ZP PACKAGE
PBGA
CASE 999–02
• MCM63P737K / MCM63P819K–166 = 3.5 ns Access / 6 ns Cycle (166 MHz)
MCM63P737K / MCM63P819K–150 = 3.8 ns Access / 6.7 ns Cycle (150 MHz)
MCM63P737K / MCM63P819K–133 = 4 ns Access / 7.5 ns Cycle (133 MHz)
• 3.3 V +10%, –5% Core Power Supply, 2.5 V or 3.3 V I/O Supply
• ADSP, ADSC, and ADV Burst Control Pins
• Selectable Burst Sequencing Order (Linear/Interleaved)
• Single–Cycle Deselect Timing
• Internally Self–Timed Write Cycle
• Byte Write and Global Write Control
• Sleep Mode (ZZ)
• JEDEC Standard 100–Pin TQFP and 119–Pin PBGA Packages
This document contains information on a new product. Specifications and information herein are subject to change without notice.
REV 1
1/24/00

Motorola, Inc. 2000
MOTOROLA
FAST SRAM
For More Information On This Product,
Go to: www.freescale.com
MCM63P737K•MCM63P819K
1
Freescale Semiconductor, Inc.
FUNCTIONAL BLOCK DIAGRAM
LBO
ADV
K
ADSC
BURST
COUNTER
K2
2
17/18
128K x 36 / 256K x 18
ARRAY
CLR
ADSP
2
SA
SA1
SA0
ADDRESS
REGISTER
17/18
15/16
SGW
Freescale Semiconductor, Inc...
SW
SBa
SBb
WRITE
REGISTER
a
36/18
36/18
WRITE
REGISTER
b
4/2
SBc*
SBd*
DATA–OUT
REGISTER
K
WRITE
REGISTER
d*
K2
SE1
SE2
SE3
DATA–IN
REGISTER
WRITE
REGISTER
c*
ENABLE
REGISTER
K
ENABLE
REGISTER
G
DQa – DQd/
DQa–DQb
ZZ
* Valid only for MCM63P737K.
MCM63P737K•MCM63P819K
2
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
DQc
DQc
DQc
VDDQ
VSS
DQc
DQc
DQc
DQc
VSS
VDDQ
DQc
DQc
NC
VDD
NC
VSS
DQd
DQd
VDDQ
VSS
DQd
DQd
DQd
DQd
VSS
VDDQ
DQd
DQd
DQd
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
80
1
79
2
78
3
77
4
76
5
75
6
74
7
73
8
72
9
71
10
70
11
69
12
68
13
67
14
66
15
65
16
64
17
63
18
62
19
61
20
60
21
59
22
58
23
57
24
56
25
55
26
54
27
53
28
52
29
51
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
DQb
DQb
DQb
VDDQ
VSS
DQb
DQb
DQb
DQb
VSS
VDDQ
DQb
DQb
VSS
NC
VDD
ZZ
DQa
DQa
VDDQ
VSS
DQa
DQa
DQa
DQa
VSS
VDDQ
DQa
DQa
DQa
A
B
C
D
1
2
3
4
5
6
7
VDDQ
SA
SA
ADSP
SA
SA VDDQ
NC
SE2
SA
ADSC
SA
SE3
NC
NC
SA
SA
VDD
SA
SA
NC
DQc
DQc
VSS
NC
VSS
DQb
DQb
DQc
DQc
VSS
SE1
VSS
DQb
DQb
VDDQ
DQc
VSS
G
VSS
DQb VDDQ
DQc
DQc
SBc
ADV
SBb
DQb
DQb
DQc
DQc
VSS
SGW
VSS
DQb
DQb
VDDQ VDD
NC
VDD
NC
VDD VDDQ
E
F
G
H
J
K
DQd
DQd
VSS
K
VSS
DQa
DQa
DQd
DQd
SBd
NC
SBa
DQa
DQa
VDDQ DQd
VSS
SW
VSS
DQa VDDQ
L
M
N
P
R
DQd
DQd
VSS
SA1
VSS
DQa
DQa
DQd
DQd
VSS
SA0
VSS
DQa
DQa
NC
SA
LBO
VDD
NC
SA
NC
NC
NC
SA
SA
SA
NC
ZZ
VDDQ
NC
NC
NC
NC
NC
VDDQ
T
U
LBO
SA
SA
SA
SA
SA1
SA0
NC
NC
VSS
VDD
NC
NC
SA
SA
SA
SA
SA
SA
SA
Freescale Semiconductor, Inc...
SA
SA
SE1
SE2
SBd
SBc
SBb
SBa
SE3
VDD
VSS
K
SGW
SW
G
ADSC
ADSP
ADV
SA
SA
MCM63P737K PIN ASSIGNMENTS
100–PIN TQFP
TOP VIEW
119–BUMP PBGA
TOP VIEW
Not to Scale
MOTOROLA FAST SRAM
For More Information On This Product,
Go to: www.freescale.com
MCM63P737K•MCM63P819K
3
Freescale Semiconductor, Inc.
MCM63P737K TQFP PIN DESCRIPTIONS
Pin Locations
Symbol
Type
85
ADSC
Input
Synchronous Address Status Controller: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
READ, WRITE, or chip deselect.
84
ADSP
Input
Synchronous Address Status Processor: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
new READ, WRITE, or chip deselect (exception — chip deselect does
not occur when ADSP is asserted and SE1 is high).
83
ADV
Input
Synchronous Address Advance: Increments address count in
accordance with counter type selected (linear/interleaved).
DQx
I/O
86
G
Input
Asynchronous Output Enable Input:
Low — enables output buffers (DQx pins).
High — DQx pins are high impedance.
89
K
Input
Clock: This signal registers the address, data in, and all control signals
except G, LBO, and ZZ.
31
LBO
Input
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low — linear burst counter.
High — interleaved burst counter.
32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50,
81, 82, 99, 100
SA
Input
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
36, 37
SA1, SA0
Input
Synchronous Address Inputs: These pins must be wired to the two
LSBs of the address bus for proper burst operation. These inputs are
registered and must meet setup and hold times.
93, 94, 95, 96
(a) (b) (c) (d)
SBx
Input
Synchronous Byte Write Inputs: “x” refers to the byte being written
(byte a, b, c, d). SGW overrides SBx.
98
SE1
Input
Synchronous Chip Enable: Active low to enable chip.
Negated high — blocks ADSP or deselects chip when ADSC is
asserted.
97
SE2
Input
Synchronous Chip Enable: Active high for depth expansion.
92
SE3
Input
Synchronous Chip Enable: Active low for depth expansion.
88
SGW
Input
Synchronous Global Write: This signal writes all bytes regardless of the
status of the SBx and SW signals. If only byte write signals SBx are
being used, tie this pin high.
87
SW
Input
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins. If only byte write signals SBx
are being used, tie this pin low.
64
ZZ
Input
Sleep Mode: This active high asynchronous signal places the RAM into
the lowest power mode. The ZZ pin disables the RAMs internal clock
when placed in this mode. When ZZ is negated, the RAM remains in
low power mode until it is commanded to READ or WRITE. Data
integrity is maintained upon returning to normal operation.
NOTE: An internal pull–down is included for compatibility with SRAM
devices that do not support sleep mode. A 100% pin compatibility can
be achieved if ZZ is left open or pulled low.
15, 41, 65, 91
VDD
Supply
Core Power Supply.
4, 11, 20, 27, 54, 61, 70, 77
VDDQ
Supply
I/O Power Supply.
5, 10, 17, 21, 26, 40, 55, 60, 67, 71,
76, 90
VSS
Supply
Ground.
14, 16, 38, 39, 42, 43, 66
NC
—
Freescale Semiconductor, Inc...
(a) 51, 52, 53, 56, 57, 58, 59, 62, 63
(b) 68, 69, 72, 73, 74, 75, 78, 79, 80
(c) 1, 2, 3, 6, 7, 8, 9, 12, 13
(d) 18, 19, 22, 23, 24, 25, 28, 29, 30
MCM63P737K•MCM63P819K
4
Description
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b, c, d).
No Connection: There is no connection to the chip.
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
MCM63P737K PBGA PIN DESCRIPTIONS
Pin Locations
Symbol
Type
4B
ADSC
Input
Synchronous Address Status Controller: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
READ, WRITE, or chip deselect.
4A
ADSP
Input
Synchronous Address Status Processor: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
new READ, WRITE, or chip deselect (exception — chip deselect does
not occur when ADSP is asserted and SE1 is high).
4G
ADV
Input
Synchronous Address Advance: Increments address count in
accordance with counter type selected (linear/interleaved).
DQx
I/O
4F
G
Input
Asynchronous Output Enable Input:
Low — enables output buffers (DQx pins).
High — DQx pins are high impedance.
4K
K
Input
Clock: This signal registers the address, data in, and all control signals
except G, LBO, and ZZ.
3R
LBO
Input
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low — linear burst counter.
High — interleaved burst counter.
2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C,
2R, 6R, 3T, 4T, 5T
SA
Input
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
4N, 4P
SA1, SA0
Input
Synchronous Address Inputs: These pins must be wired to the two
LSBs of the address bus for proper burst operation. These inputs are
registered and must meet setup and hold times.
5L, 5G, 3G, 3L
(a) (b) (c) (d)
SBx
Input
Synchronous Byte Write Inputs: “x” refers to the byte being written
(byte a, b, c, d). SGW overrides SBx.
4E
SE1
Input
Synchronous Chip Enable: Active low to enable chip.
Negated high — blocks ADSP or deselects chip when ADSC is
asserted.
2B
SE2
Input
Synchronous Chip Enable: Active high for depth expansion.
6B
SE3
Input
Synchronous Chip Enable: Active low for depth expansion.
4H
SGW
Input
Synchronous Global Write: This signal writes all bytes regardless of the
status of the SBx and SW signals. If only byte write signals SBx are
being used, tie this pin high.
4M
SW
Input
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins. If only byte write signals SBx
are being used, tie this pin low.
7T
ZZ
Input
Sleep Mode: This active high asynchronous signal places the RAM into
the lowest power mode. The ZZ pin disables the RAMs internal clock
when placed in this mode. When ZZ is negated, the RAM remains in
low power mode until it is commanded to READ or WRITE. Data
integrity is maintained upon returning to normal operation.
NOTE: An internal pull–down is included for compatibility with SRAM
devices that do not support sleep mode. A 100% pin compatibility can
be achieved if ZZ is left open or pulled low.
4C, 2J, 4J, 6J, 4R
VDD
Supply
Core Power Supply.
1A, 7A, 1F, 7F, 1J, 7J, 1M, 7M, 1U, 7U
VDDQ
Supply
I/O Power Supply.
3D, 5D, 3E, 5E, 3F, 5F, 3H, 5H, 3K, 5K,
3M, 5M, 3N, 5N, 3P, 5P
VSS
Supply
Ground.
1B, 7B, 1C, 7C, 4D, 3J, 5J, 4L, 1R, 5R,
7R, 1T, 2T, 6T, 2U, 3U, 4U, 5U, 6U
NC
—
Freescale Semiconductor, Inc...
(a) 6K, 7K, 6L, 7L, 6M, 6N, 7N, 6P, 7P
(b) 6D, 7D, 6E, 7E, 6F, 6G, 7G, 6H, 7H
(c) 1D, 2D, 1E, 2E, 2F, 1G, 2G, 1H, 2H
(d) 1K, 2K, 1L, 2L, 2M, 1N, 2N, 1P, 2P
MOTOROLA FAST SRAM
Description
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b, c, d).
No Connection: There is no connection to the chip.
For More Information On This Product,
Go to: www.freescale.com
MCM63P737K•MCM63P819K
5
Freescale Semiconductor, Inc.
NC
NC
NC
VDDQ
VSS
NC
NC
DQb
DQb
VSS
VDDQ
DQb
DQb
NC
VDD
NC
VSS
DQb
DQb
VDDQ
VSS
DQb
DQb
DQb
NC
VSS
VDDQ
NC
NC
NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
80
1
79
2
78
3
77
4
76
5
75
6
74
7
73
8
72
9
71
10
70
11
69
12
68
13
67
14
66
15
65
16
64
17
63
18
62
19
61
20
60
21
59
22
58
23
57
24
56
25
55
26
54
27
53
28
52
29
51
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
SA
NC
NC
VDDQ
VSS
NC
DQa
DQa
DQa
VSS
VDDQ
DQa
DQa
VSS
NC
VDD
ZZ
DQa
DQa
VDDQ
VSS
DQa
DQa
NC
NC
VSS
VDDQ
NC
NC
NC
A
B
C
D
1
2
3
4
5
6
7
VDDQ
SA
SA
ADSP
SA
SA VDDQ
NC
SE2
SA
ADSC
SA
SE3
NC
NC
SA
SA
VDD
SA
SA
NC
DQb
NC
VSS
NC
VSS
DQa
NC
NC
DQb
VSS
SE1
VSS
NC
DQa
VDDQ
NC
VSS
G
VSS
DQa VDDQ
NC
DQb
SBb
ADV
VSS
NC
DQa
DQb
NC
VSS
SGW
VSS
DQa
NC
VDDQ VDD
NC
VDD
NC
VDD VDDQ
E
F
G
H
J
K
NC
DQb
VSS
K
VSS
NC
DQa
DQb
NC
VSS
NC
SBa
DQa
NC
VDDQ DQb
VSS
SW
VSS
NC
VDDQ
L
M
N
P
R
DQb
NC
VSS
SA1
VSS
DQa
NC
NC
DQb
VSS
SA0
VSS
NC
DQa
NC
SA
LBO
VDD
NC
SA
NC
NC
SA
SA
NC
SA
SA
ZZ
VDDQ
NC
NC
NC
NC
NC
VDDQ
T
U
LBO
SA
SA
SA
SA
SA1
SA0
NC
NC
VSS
VDD
NC
NC
SA
SA
SA
SA
SA
SA
SA
Freescale Semiconductor, Inc...
SA
SA
SE1
SE2
NC
NC
SBb
SBa
SE3
VDD
VSS
K
SGW
SW
G
ADSC
ADSP
ADV
SA
SA
MCM63P818 PIN ASSIGNMENTS
100–PIN TQFP
TOP VIEW
119–BUMP PBGA
TOP VIEW
Not to Scale
MCM63P737K•MCM63P819K
6
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
MCM63P819K TQFP PIN DESCRIPTIONS
Pin Locations
Symbol
Type
85
ADSC
Input
Synchronous Address Status Controller: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
READ, WRITE, or chip deselect.
84
ADSP
Input
Synchronous Address Status Processor: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
new READ, WRITE, or chip deselect (exception — chip deselect does
not occur when ADSP is asserted and SE1 is high).
83
ADV
Input
Synchronous Address Advance: Increments address count in
accordance with counter type selected (linear/interleaved).
DQx
I/O
86
G
Input
Asynchronous Output Enable Input:
Low — enables output buffers (DQx pins).
High — DQx pins are high impedance.
89
K
Input
Clock: This signal registers the address, data in, and all control signals
except G, LBO, and ZZ.
31
LBO
Input
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low — linear burst counter.
High — interleaved burst counter.
32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50,
80, 81, 82, 99, 100
SA
Input
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
36, 37
SA1, SA0
Input
Synchronous Address Inputs: These pins must be wired to the two
LSBs of the address bus for proper burst operation. These inputs are
registered and must meet setup and hold times.
93, 94
(a) (b)
SBx
Input
Synchronous Byte Write Inputs: “x” refers to the byte being written
(byte a, b). SGW overrides SBx.
98
SE1
Input
Synchronous Chip Enable: Active low to enable chip.
Negated high — blocks ADSP or deselects chip when ADSC is
asserted.
97
SE2
Input
Synchronous Chip Enable: Active high for depth expansion.
92
SE3
Input
Synchronous Chip Enable: Active low for depth expansion.
88
SGW
Input
Synchronous Global Write: This signal writes all bytes regardless of the
status of the SBx and SW signals. If only byte write signals SBx are
being used, tie this pin high.
87
SW
Input
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins. If only byte write signals SBx
are being used, tie this pin low.
64
ZZ
Input
Sleep Mode: This active high asynchronous signal places the RAM into
the lowest power mode. The ZZ pin disables the RAMs internal clock
when placed in this mode. When ZZ is negated, the RAM remains in
low power mode until it is commanded to READ or WRITE. Data
integrity is maintained upon returning to normal operation.
NOTE: An internal pull–down is included for compatibility with SRAM
devices that do not support sleep mode. A 100% pin compatibility can
be achieved if ZZ is left open or pulled low.
Freescale Semiconductor, Inc...
(a) 58, 59, 62, 63, 68, 69, 72, 73, 74
(b) 8, 9, 12, 13, 18, 19, 22, 23, 24
Description
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b).
15, 41, 65, 91
VDD
Supply
Core Power Supply.
4, 11, 20, 27, 54, 61, 70, 77
VDDQ
Supply
I/O Power Supply.
5, 10, 17, 21, 26, 40, 55, 60, 67, 71,
76, 90
VSS
Supply
Ground.
1, 2, 3, 6, 7, 14, 16, 25, 28, 29, 30, 38,
39, 42, 43, 51, 52, 53, 56, 57, 66, 75,
78, 79, 95, 96
NC
—
MOTOROLA FAST SRAM
No Connection: There is no connection to the chip.
For More Information On This Product,
Go to: www.freescale.com
MCM63P737K•MCM63P819K
7
Freescale Semiconductor, Inc.
MCM63P819K PBGA PIN DESCRIPTIONS
Pin Locations
Symbol
Type
4B
ADSC
Input
Synchronous Address Status Controller: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
READ, WRITE, or chip deselect.
4A
ADSP
Input
Synchronous Address Status Processor: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
new READ, WRITE, or chip deselect (exception — chip deselect does
not occur when ADSP is asserted and SE1 is high).
4G
ADV
Input
Synchronous Address Advance: Increments address count in
accordance with counter type selected (linear/interleaved).
DQx
I/O
4F
G
Input
Asynchronous Output Enable Input:
Low — enables output buffers (DQx pins).
High — DQx pins are high impedance.
4K
K
Input
Clock: This signal registers the address, data in, and all control signals
except G, LBO, and ZZ.
3R
LBO
Input
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low — linear burst counter.
High — interleaved burst counter.
2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C,
2R, 6R, 2T, 3T, 5T, 6T
SA
Input
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
4N, 4P
SA1, SA0
Input
Synchronous Address Inputs: These pins must be wired to the two
LSBs of the address bus for proper burst operation. These inputs are
registered and must meet setup and hold times.
5L, 3G
(a) (b)
SBx
Input
Synchronous Byte Write Inputs: “x” refers to the byte being written
(byte a, b). SGW overrides SBx.
4E
SE1
Input
Synchronous Chip Enable: Active low to enable chip.
Negated high — blocks ADSP or deselects chip when ADSC is
asserted.
2B
SE2
Input
Synchronous Chip Enable: Active high for depth expansion.
6B
SE3
Input
Synchronous Chip Enable: Active low for depth expansion.
4H
SGW
Input
Synchronous Global Write: This signal writes all bytes regardless of the
status of the SBx and SW signals. If only byte write signals SBx are
being used, tie this pin high.
4M
SW
Input
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins. If only byte write signals SBx
are being used, tie this pin low.
7T
ZZ
Input
Sleep Mode: This active high asynchronous signal places the RAM into
the lowest power mode. The ZZ pin disables the RAMs internal clock
when placed in this mode. When ZZ is negated, the RAM remains in
low power mode until it is commanded to READ or WRITE. Data
integrity is maintained upon returning to normal operation.
NOTE: An internal pull–down is included for compatibility with SRAM
devices that do not support sleep mode. A 100% pin compatibility can
be achieved if ZZ is left open or pulled low.
Freescale Semiconductor, Inc...
(a) 6D, 7E, 6F, 7G, 6H, 7K, 6L, 6N, 7P
(b) 1D, 2E, 2G, 1H, 2K, 1L, 2M, 1N, 2P
Description
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b).
4C, 2J, 4J, 6J, 4R
VDD
Supply
Core Power Supply.
1A, 7A, 1F, 7F, 1J, 7J, 1M, 7M, 1U, 7U
VDDQ
Supply
I/O Power Supply.
3D, 5D, 3E, 5E, 3F, 5F, 5G, 3H, 5H, 3K,
5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P
VSS
Supply
Ground.
1B, 7B, 1C, 7C, 2D, 4D, 7D, 1E, 6E, 2F,
1G, 6G, 2H, 7H, 3J, 5J, 1K, 6K, 2L, 4L,
7L, 6M, 2N, 7N, 1P, 6P, 1R, 5R, 7R, 1T,
4T, 2U, 3U, 4U, 5U, 6U
NC
—
MCM63P737K•MCM63P819K
8
No Connection: There is no connection to the chip.
For More Information On This Product,
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MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
TRUTH TABLE (See Notes 1 Through 5)
Address
Used
SE1
SE2
SE3
ADSP
ADSC
ADV
G3
DQx
Write 2, 4
Deselect
None
1
X
X
X
0
X
X
High–Z
X
Deselect
None
0
X
1
0
X
X
X
High–Z
X
Deselect
None
0
0
X
0
X
X
X
High–Z
X
Deselect
None
X
X
1
1
0
X
X
High–Z
X
Deselect
None
X
0
X
1
0
X
X
High–Z
X
Begin Read
External
0
1
0
0
X
X
X
High–Z
X
Begin Read
Freescale Semiconductor, Inc...
Next Cycle
External
0
1
0
1
0
X
X
High–Z
READ
Continue Read
Next
X
X
X
1
1
0
1
High–Z
READ
Continue Read
Next
X
X
X
1
1
0
0
DQ
READ
Continue Read
Next
1
X
X
X
1
0
1
High–Z
READ
Continue Read
Next
1
X
X
X
1
0
0
DQ
READ
Suspend Read
Current
X
X
X
1
1
1
1
High–Z
READ
Suspend Read
Current
X
X
X
1
1
1
0
DQ
READ
Suspend Read
Current
1
X
X
X
1
1
1
High–Z
READ
Suspend Read
Current
1
X
X
X
1
1
0
DQ
READ
Begin Write
External
0
1
0
1
0
X
X
High–Z
WRITE
Continue Write
Next
X
X
X
1
1
0
X
High–Z
WRITE
Continue Write
Next
1
X
X
X
1
0
X
High–Z
WRITE
Suspend Write
Current
X
X
X
1
1
1
X
High–Z
WRITE
Suspend Write
Current
1
X
X
X
1
1
X
High–Z
WRITE
NOTES:
1. X = don’t care. 1 = logic high. 0 = logic low.
2. Write is defined as either 1) any SBx and SW low or 2) SGW is low.
3. G is an asynchronous signal and is not sampled by the clock K. G drives the bus immediately (tGLQX) following G going low.
4. On write cycles that follow read cycles, G must be negated prior to the start of the write cycle to ensure proper write data setup times. G must
also remain negated at the completion of the write cycle to ensure proper write data hold times.
ASYNCHRONOUS TRUTH TABLE
Operation
ZZ
G
I/O Status
Read
L
L
Data Out (DQx)
Read
L
H
High–Z
Write
L
X
High–Z
Deselected
L
X
High–Z
Sleep
H
X
High–Z
4th Address (Internal)
LINEAR BURST ADDRESS TABLE (LBO = VSS)
1st Address (External)
2nd Address (Internal)
3rd Address (Internal)
X . . . X00
X . . . X01
X . . . X10
X . . . X11
X . . . X01
X . . . X10
X . . . X11
X . . . X00
X . . . X10
X . . . X11
X . . . X00
X . . . X01
X . . . X11
X . . . X00
X . . . X01
X . . . X10
4th Address (Internal)
INTERLEAVED BURST ADDRESS TABLE (LBO = VDD)
1st Address (External)
2nd Address (Internal)
3rd Address (Internal)
X . . . X00
X . . . X01
X . . . X10
X . . . X11
X . . . X01
X . . . X00
X . . . X11
X . . . X10
X . . . X10
X . . . X11
X . . . X00
X . . . X01
X . . . X11
X . . . X10
X . . . X01
X . . . X00
MOTOROLA FAST SRAM
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MCM63P737K•MCM63P819K
9
Freescale Semiconductor, Inc.
WRITE TRUTH TABLE
SGW
SW
SBa
SBb
SBc
(See Note 1)
SBd
(See Note 1)
Read
H
H
X
X
X
X
Read
H
L
H
H
H
H
Write Byte a
H
L
L
H
H
H
Write Byte b
H
L
H
L
H
H
Write Byte c (See Note 1)
H
L
H
H
L
H
Write Byte d (See Note 1)
H
L
H
H
H
L
Write All Bytes
H
L
L
L
L
L
Write All Bytes
L
X
X
X
X
X
Cycle Type
NOTE:
1. Valid only for MCM63P737K.
Freescale Semiconductor, Inc...
ABSOLUTE MAXIMUM RATINGS (See Note 1)
Rating
Power Supply Voltage
Symbol
Value
Unit
VDD
VSS – 0.5 to 4.6
V
VDDQ
VSS – 0.5 to VDD
V
Vin, Vout
VSS – 0.5 to
VDD + 0.5
V
Input Voltage (Three–State I/O)
VIT
VSS – 0.5 to
VDDQ + 0.5
V
Output Current (per I/O)
Iout
±20
mA
Package Power Dissipation
PD
1.6
W
Tbias
–10 to 85
°C
Tstg
–55 to 125
°C
I/O Supply Voltage
Input Voltage Relative to VSS for
Any Pin Except VDD
Temperature Under Bias
Storage Temperature
Notes
This device contains circuitry to protect the
inputs against damage due to high static voltages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maximum rated voltages to this high–impedance
circuit.
2
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. Power dissipation capability is dependent upon package characteristics and use
environment. See Package Thermal Characteristics.
PACKAGE THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Notes
RθJA
40
25
°C/W
1, 2
Junction to Board (Bottom)
RθJB
17
°C/W
3
Junction to Case (Top)
RθJC
9
°C/W
4
RθJA
38
22
°C/W
1, 2
Junction to Board (Bottom)
RθJB
14
°C/W
3
Junction to Case (Top)
RθJC
5
°C/W
4
TQFP
Junction to Ambient (@ 200 lfm)
Single–Layer Board
Four–Layer Board
PBGA
Junction to Ambient (@ 200 lfm)
Single–Layer Board
Four–Layer Board
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
MCM63P737K•MCM63P819K
10
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MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
DC OPERATING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V +10%, –5%, TA = 0° to 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS AND DC CHARACTERISTICS (Voltages Referenced to VSS = 0 V)
Parameter
Symbol
Min
Typ
Max
Unit
VDD
3.135
3.3
3.465
V
I/O Supply Voltage
VDDQ
2.375
2.5
2.9
V
Input Low Voltage
VIL
–0.3*
—
0.7
V
Input High Voltage
VIH
1.7
—
VDD + 0.3**
V
Input High Voltage I/O Pins
VIH2
1.7
—
VDDQ + 0.3**
V
Output Low Voltage (IOL = 2 mA)
VOL
—
—
0.7
V
Output High Voltage (IOH = –2 mA)
VOH
1.7
—
—
V
VDD
3.135
3.3
3.465
V
VDDQ
3.135
3.3
VDD
V
Input Low Voltage
VIL
–0.5*
—
0.8
V
Input High Voltage
VIH
2
—
VDD + 0.5***
V
Input High Voltage I/O Pins
VIH2
2
—
VDDQ + 0.5***
V
Output Low Voltage (IOL = 8 mA)
VOL
—
—
0.4
V
Output High Voltage (IOH = –4 mA)
VOH
2.4
—
—
V
2.5 V I/O SUPPLY
Supply Voltage
Freescale Semiconductor, Inc...
3.3 V I/O SUPPLY
Supply Voltage
I/O Supply Voltage
* Undershoot: VIL > –1.0 V for t < 20% tKHKH.
** Overshoot: VIH/VIH2 < VDD/VDDQ + 1.0 V (not to exceed 3.6 V) for t < 20% tKHKH.
*** Overshoot: VIH/VIH2 < VDD/VDDQ + 1.0 V (not to exceed 4.6 V) for t < 20% tKHKH.
SUPPLY CURRENTS
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Input Leakage Current (0 V ≤ Vin ≤ VDD)
Ilkg(I)
—
—
±1
µA
1
Output Leakage Current (0 V ≤ Vin ≤ VDDQ)
Ilkg(O)
—
—
±1
µA
IDDA
—
—
500/430
470/400
450/380
mA
2, 3, 4
CMOS Standby Supply Current (Device Deselected, Freq = 0,
VDD = Max, All Inputs Static at CMOS Levels)
ISB2
—
—
30
mA
5, 6
Sleep Mode Supply Current (Device Deselected, Freq = Max,
VDD = Max, All Other Inputs Static at CMOS Levels,
ZZ ≥ VDD – 0.2 V)
IZZ
—
—
15
mA
1, 5, 6
TTL Standby Supply Current (Device Deselected, Freq = 0,
VDD = Max, All Inputs Static at TTL Levels)
ISB3
—
—
35
mA
5, 7
Clock Running (Device Deselected,
Freq = Max, VDD = Max, All Inputs
Toggling at CMOS Levels)
MCM63P737K / 819K–166
MCM63P737K / 819K–150
MCM63P737K / 819K–133
ISB4
—
—
185/170
175/160
160/145
mA
5, 6
Static Clock Running
(Device Deselected,
Freq = Max,VDD = Max, All Inputs
Static at TTL Levels)
MCM63P737K / 819K–166
MCM63P737K / 819K–150
MCM63P737K / 819K–133
ISB5
—
—
75/65
70/60
65/55
mA
5, 7
AC Supply Current (Device Selected,
All Outputs Open, Freq = Max)
Includes VDD Only
MCM63P737K / 819K–166
MCM63P737K / 819K–150
MCM63P737K / 819K–133
NOTES:
1. LBO and ZZ pins have an internal pull–up and pull–down, respectively; and will exhibit leakage currents of ±5 µA.
2. Reference AC Operating Conditions and Characteristics for input and timing.
3. All addresses transition simultaneously low (LSB) then high (MSB).
4. Data states are all zero.
5. Device is deselected as defined by the Truth Table.
6. CMOS levels for I/Os are VIT ≤ VSS + 0.2 V or ≥ VDDQ – 0.2 V. CMOS levels for other inputs are Vin ≤ VSS + 0.2 V or ≥ VDD – 0.2 V.
7. TTL levels for I/Os are VIT ≤ VIL or ≥ VIH2. TTL levels for other inputs are Vin ≤ VIL or ≥ VIH.
MOTOROLA FAST SRAM
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MCM63P737K•MCM63P819K
11
Freescale Semiconductor, Inc.
CAPACITANCE (f = 1.0 MHz, TA = 0 to 70°C, Periodically Sampled Rather Than 100% Tested)
Symbol
Min
Typ
Max
Unit
Input Capacitance
Parameter
Cin
—
4
5
pF
Input/Output Capacitance
CI/O
—
7
8
pF
AC OPERATING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V +10%, –5%, TA = 0 to 70°C, Unless Otherwise Noted)
Input Timing Measurement Reference Level . . . . . . . . . . . . . . . 1.5 V
Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 3.0 V
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . 1.0 V/ns (20% to 80%)
Output Timing Reference Level . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 V
Output Load . . . . . . . . . . . . . . See Figure 2 Unless Otherwise Noted
READ/WRITE CYCLE TIMING (See Notes 1 and 2)
Freescale Semiconductor, Inc...
MCM63P737K–166
MCM63P819K–166
Parameter
Symbol
MCM63P737K–150
MCM63P819K–150
MCM63P737K–133
MCM63P819K–133
Min
Max
Min
Max
Min
Max
Unit
Notes
Cycle Time
tKHKH
6
—
6.7
—
7.5
—
ns
Clock High Pulse Width
tKHKL
2.4
—
2.6
—
3
—
ns
3
Clock Low Pulse Width
tKLKH
2.4
—
2.6
—
3
—
ns
3
Clock Access Time
tKHQV
—
3.5
—
3.8
—
4
ns
Output Enable to Output Valid
tGLQV
—
3.5
—
3.5
—
3.8
ns
Clock High to Output Active
tKHQX1
0
—
0
—
0
—
ns
Clock High to Output Change
4, 5
tKHQX2
1.5
—
1.5
—
1.5
—
ns
4
Output Enable to Output Active
tGLQX
0
—
0
—
0
—
ns
4, 5
Output Disable to Q High–Z
tGHQZ
—
3.5
—
3.5
—
3.8
ns
4, 5
Clock High to Q High–Z
tKHQZ
1.5
3.5
1.5
3.5
1.5
3.5
ns
4, 5
Setup Times:
Address
ADSP, ADSC, ADV
Data In
Write
Chip Enable
tADKH
tADSKH
tDVKH
tWVKH
tEVKH
1.5
—
1.5
—
1.5
—
ns
Hold Times:
Address
ADSP, ADSC, ADV
Data In
Write
Chip Enable
tKHAX
tKHADSX
tKHDX
tKHWX
tKHEX
0.5
—
0.5
—
0.5
—
ns
NOTES:
1. Write is defined as either any SBx and SW low or SGW is low. Chip Enable is defined as SE1 low, SE2 high, and SE3 low whenever ADSP
or ADSC is asserted.
2. All read and write cycle timings are referenced from K or G.
3. In order to reduce test correlation issues and to reduce the effects of application specific input edge rate variations on correlation between
data sheet parameters and actual system performance, FSRAM AC parametric specifications are always specified at VDDQ/2. In some
design exercises, it is desirable to evaluate timing using other reference levels. Since the maximum test input edge rate is known and is
given in the AC Test Conditions section of the data sheet as 1 V/ns, one can easily interpolate timing values to other reference levels.
4. This parameter is sampled and not 100% tested.
5. Measured at ±200 mV from steady state.
OUTPUT
Z0 = 50 Ω
RL = 50 Ω
1.5 V
Figure 1. AC Test Load
MCM63P737K•MCM63P819K
12
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MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
2400
CLOCK ACCESS TIME DELAY (ps)
2200
OUTPUT
CL
2000
1800
1600
1400
1200
1000
800
600
400
200
0
Freescale Semiconductor, Inc...
0
20
40
60
80
100
LUMPED CAPACITANCE, CL (pF)
Figure 2. Lumped Capacitive Load and Typical Derating Curve
OUTPUT LOAD
OUTPUT
BUFFER
TEST POINT
UNLOADED RISE AND FALL TIME MEASUREMENT
INPUT
WAVEFORM
OUTPUT
WAVEFORM
2.4
2.4
0.6
0.6
2.4
2.4
0.6
0.6
tr
tf
NOTES:
1. Input waveform has a slew rate of 1 V/ns.
2. Rise time is measured from 0.6 to 2.4 V unloaded.
3. Fall time is measured from 2.4 to 0.6 V unloaded.
Figure 3. Unloaded Rise and Fall Time Characterization
MOTOROLA FAST SRAM
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MCM63P737K•MCM63P819K
13
MCM63P737K•MCM63P819K
14
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Q(n)
B
SINGLE READ
tKHQX1
A
Q(A)
Q(B)
tKHQX2
t KHQV
tKHKL
NOTE: E low = SE2 high and SE3 low.
W low = SGW low and/or SW and SBx low.
DESELECTED
tKHQZ
DQx
G
W
E
SE1
ADV
ADSC
ADSP
SA
K
tKHKH
Q(B+2)
BURST READ
Q(B+1)
tGHQZ
Q(B+3)
BURST WRAPS AROUND
tKLKH
Q(B)
ADSP, SA
SE2, SE3
IGNORED
READ/WRITE CYCLES
D(C)
C
D(C+2)
BURST WRITE
D(C+1)
Freescale Semiconductor, Inc...
D(C+3)
D
SINGLE READ
tGLQX
Q(D)
t GLQV
Freescale Semiconductor, Inc.
MOTOROLA FAST SRAM
tZZREC
I ZZ
For More Information On This Product,
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IDD
ZZ
DQ
G
W
E
ADV
ADDR
ADS
K
NORMAL OPERATION
MOTOROLA FAST SRAM
NOTE: ADS low = ADSC low or ADSP low.
ADS high = both ADSC, ADSP high.
E low = SE1 low, SE2 high, SE3 low.
IZZ (max) specifications will not be met if inputs toggle.
tZZQZ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
tZZS
NO READS OR
WRITES ALLOWED
IN SLEEP MODE
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
NO NEW READS OR
WRITES ALLOWED
SLEEP MODE TIMING
Freescale Semiconductor, Inc...
NORMAL OPERATION
Freescale Semiconductor, Inc.
MCM63P737K•MCM63P819K
15
Freescale Semiconductor, Inc.
APPLICATION INFORMATION
Freescale Semiconductor, Inc...
SLEEP MODE
A sleep mode feature, the ZZ pin, has been implemented
on the MCM63P737K and MCM63P819K. It allows the system designer to place the RAM in the lowest possible power
condition by asserting ZZ. The Sleep Mode Timing diagram
shows the different modes of operation: Normal Operation,
No READ/WRITE Allowed, and Sleep Mode. Each mode has
its own set of constraints and conditions that are allowed.
Normal Operation: All inputs must meet setup and hold
times prior to sleep and t ZZREC nanoseconds after recovering from sleep. Clock (K) must also meet cycle, high,
and low times during these periods. Two cycles prior to
sleep, initiation of either a read or write operation is not
allowed.
No READ/WRITE: During the period of time just prior to
sleep and during recovery from sleep, the assertion of either
ADSC, ADSP, or any write signal is not allowed. If a write
operation occurs during these periods, the memory array
may be corrupted. Validity of data out from the RAM can not
be guaranteed immediately after ZZ is asserted (prior to
being in sleep).
Sleep Mode: The RAM automatically deselects itself. The
RAM disconnects its internal clock buffer. The external clock
may continue to run without impacting the RAMs sleep
current (IZZ). All inputs are allowed to toggle — the RAM will
not be selected and perform any reads or writes. However, if
inputs toggle, the IZZ (max) specification will not be met.
Note: It is invalid to go from stop clock mode directly into
sleep mode.
NON–BURST SYNCHRONOUS OPERATION
Although this BurstRAM has been designed for high end
MPU–based systems, these SRAMs can be used in other
high speed memory applications that do not require the burst
address feature. Most L2 caches designed with a synchronous interface can make use of the MCM63P737K and
MCM63P819K. The burst counter feature of the BurstRAMs
can be disabled, and the SRAMs can be configured to act
upon a continuous stream of addresses. See Figure 5.
CONTROL PIN TIE VALUES EXAMPLE (H ≥ VIH, L ≤ VIL)
Non–Burst
ADSP
ADSC
ADV
SE1
SE2
LBO
Sync Non–Burst,
Pipelined SRAM
H
L
H
L
H
X
NOTE: Although X is specified in the table as a don’t care, the pin
must be tied either high or low.
K
ADDR
A
B
C
D
E
F
G
H
SE3
W
G
DQ
Q(A)
Q(B)
Q(C)
Q(D)
D(E)
D(F)
READS
D(G)
D(H)
WRITES
Figure 4. Example Configuration as Non–Burst Synchronous SRAM
MCM63P737K•MCM63P819K
16
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MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
ORDERING INFORMATION
(Order by Full Part Number)
MCM
63P737K
63P819K XX
X
X
Motorola Memory Prefix
Blank = Trays, R = Tape and Reel
Part Number
Speed (166 = 166 MHz, 150 = 150 MHz,
133 = 133 MHz)
Package (TQ = TQFP, ZP = PBGA)
MCM63P737KTQ150
MCM63P737KTQ150R
MCM63P737KZP150
MCM63P737KZP150R
MCM63P737KTQ133
MCM63P737KTQ133R
MCM63P737KZP133
MCM63P737KZP133R
MCM63P819KTQ166
MCM63P819KTQ166R
MCM63P819KZP166
MCM63P819KZP166R
MCM63P819KTQ150
MCM63P819KTQ150R
MCM63P819KZP150
MCM63P819KZP150R
MCM63P819KTQ133
MCM63P819KTQ133R
MCM63P819KZP133
MCM63P819KZP133R
Freescale Semiconductor, Inc...
Full Part Numbers — MCM63P737KTQ166
MCM63P737KTQ166R
MCM63P737KZP166
MCM63P737KZP166R
MOTOROLA FAST SRAM
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MCM63P737K•MCM63P819K
17
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
TQ PACKAGE
TQFP
CASE 983A–01
e
4X
0.20 (0.008) H A–B D
2X 30 TIPS
e/2
0.20 (0.008) C A–B D
–D–
80
51
B
50
81
–A–
–X–
X=A, B, OR D
B
E/2
–B–
VIEW Y
E1 E
BASE
METAL
PLATING
Freescale Semiconductor, Inc...
c
31
100
1
30
D1/2
0.13 (0.005)
0.20 (0.008) C A–B D
A
2
0.10 (0.004) C
–H–
–C–
3
SEATING
PLANE
VIEW AB
S
S
0.25 (0.010)
R2
A2
L2
L
L1
GAGE PLANE
VIEW AB
MCM63P737K•MCM63P819K
18
C A–B
S
D
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS D1 AND B1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.45
(0.018).
1
R1
M
SECTION B–B
2X 20 TIPS
A1
c1
b
D/2
D1
D
0.05 (0.002)
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
b1
E1/2
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DIM
A
A1
A2
b
b1
c
c1
D
D1
E
E1
e
L
L1
L2
S
R1
R2
1
2
3
MILLIMETERS
MIN
MAX
–––
1.60
0.05
0.15
1.35
1.45
0.22
0.38
0.22
0.33
0.09
0.20
0.09
0.16
22.00 BSC
20.00 BSC
16.00 BSC
14.00 BSC
0.65 BSC
0.45
0.75
1.00 REF
0.50 REF
0.20
–––
0.08
–––
0.08
0.20
0
7
0
–––
11 13 11 13 INCHES
MIN
MAX
–––
0.063
0.002
0.006
0.053
0.057
0.009
0.015
0.009
0.013
0.004
0.008
0.004
0.006
0.866 BSC
0.787 BSC
0.630 BSC
0.551 BSC
0.026 BSC
0.018
0.030
0.039 REF
0.020 REF
0.008
–––
0.003
–––
0.003
0.008
0
7
0
–––
11 13 11 13 MOTOROLA FAST SRAM
Freescale Semiconductor, Inc.
ZP PACKAGE
7 x 17 BUMP PBGA
CASE 999–02
0.20
4X
119X
E
C
B
D
E2
e
6X
M
A B C
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
D1
16X
M
0.15
7 6 5 4 3 2 1
D2
b
0.3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. ALL DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUM SOLDER BALL
DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
DIM
A
A1
A2
A3
D
D1
D2
E
E1
E2
b
e
e
Freescale Semiconductor, Inc...
E1
TOP VIEW
BOTTOM VIEW
MILLIMETERS
MIN
MAX
–––
2.40
0.50
0.70
1.30
1.70
0.80
1.00
22.00 BSC
20.32 BSC
19.40
19.60
14.00 BSC
7.62 BSC
11.90
12.10
0.60
0.90
1.27 BSC
0.25 A
A3
0.35 A
0.20 A
A
A2
A1
MOTOROLA FAST SRAM
SIDE VIEW
SEATING
PLANE
A
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MCM63P737K•MCM63P819K
19
Freescale Semiconductor, Inc...
Freescale Semiconductor, Inc.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
How to reach us:
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20
MOTOROLAMCM63P737K/D
FAST SRAM