TI SN74AHC244-EP

SN74AHC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS486A – MAY 2003 – REVISED JUNE 2003
D
D
D
D
D
D
D
D
D
DW OR PW PACKAGE
(TOP VIEW)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of
–55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
EPIC (Enhanced-Performance Implanted
CMOS) Process
Operating Range 2-V to 5.5-V VCC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds 1500 V Per
MIL-STD-833, Method 3015; Exceeds 150 V
Using Machine Model (C = 200 pF, R = 0)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
description/ordering information
This octal buffer/driver is designed specifically to improve the performance and density of 3-state
memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74AHC244 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PACKAGE‡
TA
–55°C
55°C to 125°C
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC – D
Tape and reel
SN74AHC244MDWREP
AHC244MEP
TSSOP – PW
Tape and reel
SN74AHC244MPWREP
AHC244EP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74AHC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS486A – MAY 2003 – REVISED JUNE 2003
FUNCTION TABLE
(each 4-bit buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic symbol†
1OE
1A1
1A2
1A3
1A4
1
EN
2OE
18
2
4
16
6
14
12
8
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
EN
11
9
13
7
15
5
17
3
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
POST OFFICE BOX 655303
19
11
9
13
7
15
5
17
3
• DALLAS, TEXAS 75265
2Y1
2Y2
2Y3
2Y4
2Y1
2Y2
2Y3
2Y4
SN74AHC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS486A – MAY 2003 – REVISED JUNE 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 3 V
High-level input voltage
VCC = 5.5 V
VCC = 2 V
VIL
VI
VO
IOH
Low-level input voltage
∆t/∆v
MAX
2
5.5
UNIT
V
1.5
V
2.1
3.85
0.5
0.9
VCC = 3 V
VCC = 5.5 V
V
1.65
Input voltage
0
5.5
V
Output voltage
0
VCC
–50
mA
VCC = 2 V
VCC = 3.3 V ± 0.3 V
High-level output current
VCC = 5 V ± 0.5 V
VCC = 2 V
IOL
MIN
Low-level output current
Input transition rise or fall rate
–4
–8
50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
4
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
100
8
20
V
mA
mA
mA
ns/V
TA
Operating free-air temperature
–55
125
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74AHC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS486A – MAY 2003 – REVISED JUNE 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
MIN
TA = 25°C
TYP
MAX
MIN
2V
1.9
2
1.9
3V
2.9
3
2.9
4.5 V
4.4
4.5
4.4
IOH = –4 mA
3V
2.58
2.48
IOH = –8 mA
4.5 V
3.94
3.8
PARAMETER
TEST CONDITIONS
IOH = –50 mA
VOH
IOL = 50 mA
VOL
IOL = 4 mA
II
IOZ
ICC
Ci
Co
IOL = 8 mA
VI = 5.5 V or GND
VO = VCC or GND,
VI = VCC or GND,
VI (OE) = VIL or VIH
IO = 0
VI = VCC or GND
VO = VCC or GND
VCC
MAX
UNIT
V
2V
0.1
0.1
3V
0.1
0.1
4.5 V
0.1
0.1
3V
0.36
0.5
V
4.5 V
0.36
0.5
0 V to 5.5 V
±0.1
±1
mA
5.5 V
±0.25
±2.5
mA
5.5 V
4
40
mA
5V
2
5V
3.5
10
pF
pF
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
4
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A
Y
CL = 15 pF
tPZH
tPZL
OE
Y
CL = 15 pF
tPHZ
tPLZ
OE
Y
CL = 15 pF
tPLH
tPHL
A
Y
CL = 50 pF
tPZH
tPZL
OE
Y
CL = 50 pF
tPHZ
tPLZ
OE
Y
CL = 50 pF
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
TA = 25°C
TYP
MAX
MIN
MAX
5.8
8.4
1
10
5.8
8.4
1
10
6.6
10.6
1
12.5
6.6
10.6
1
12.5
5
9.7
1
11
5
9.7
1
11
8.3
11.9
1
13.5
8.3
11.9
1
13.5
9.1
14.1
1
16
9.1
14.1
1
16
10.3
14
1
16
10.3
14
1
16
UNIT
ns
ns
ns
ns
ns
ns
SN74AHC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS486A – MAY 2003 – REVISED JUNE 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A
Y
CL = 15 pF
tPZH
tPZL
OE
Y
CL = 15 pF
tPHZ
tPLZ
OE
Y
CL = 15 pF
tPLH
tPHL
A
Y
CL = 50 pF
tPZH
tPZL
OE
Y
CL = 50 pF
tPHZ
tPLZ
OE
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
MIN
MAX
3.9
5.5
1
6.5
3.9
5.5
1
6.5
4.7
7.3
1
8.5
4.7
7.3
1
8.5
5
7.2
1
8.5
5
7.2
1
8.5
5.4
7.5
1
8.5
5.4
7.5
1
8.5
6.2
9.3
1
10.5
6.2
9.3
1
10.5
6.7
9.2
1
10.5
6.7
9.2
1
10.5
MIN
TYP
MAX
UNIT
ns
ns
ns
ns
ns
ns
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4)
PARAMETER
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.5
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.2
V
VOH(V)
Quiet output, minimum dynamic VOH
4.8
V
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
3.5
V
1.5
V
TYP
UNIT
8.6
pF
NOTE 4: Characteristics are for surface-mount packages only.
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
5
SN74AHC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS486A – MAY 2003 – REVISED JUNE 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
Input
50% VCC
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
VCC
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
0V
tPZL
VOH
50% VCC
VOL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AHC244MDWREP
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC244MPWREP
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC244MPWREPG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03649-01XE
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
V62/03649-01YE
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AHC244-EP :
SN74AHC244
• Catalog:
SN74AHC244-Q1
• Automotive:
• Military: SN54AHC244
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
- Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Automotive
• Military - QML certified for Military and Defense Applications
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AHC244MDWREP
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74AHC244MPWREP
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AHC244MDWREP
SOIC
DW
20
2000
367.0
367.0
45.0
SN74AHC244MPWREP
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
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