SN74AHC125Q QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SGDS015 – FEBRUARY 2002 D D D D D D OR PW PACKAGE (TOP VIEW) Q Devices Meet Automotive Performance Requirements Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval EPIC (Enhanced-Performance Implanted CMOS) Process Operating Range 2-V to 5.5-V VCC Latch-Up Performance Exceeds 250 mA Per JESD 17 1OE 1A 1Y 2OE 2A 2Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4Y 3OE 3A 3Y description The SN74AHC125Q is a quadruple bus buffer gate featuring independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is high. When OE is low, the respective gate passes the data from the A input to its Y output. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION –40°C 40°C to 125°C ORDERABLE PART NUMBER PACKAGE† TA TOP-SIDE MARKING SOIC – D Tape and reel SN74AHC125QDR AHC125Q TSSOP – PW Tape and reel SN74AHC125QPWR HA125Q † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74AHC125Q QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SGDS015 – FEBRUARY 2002 logic symbol† 1 1OE 1A EN 2 1 3 4 2OE 2A 3OE 3A 4OE 4A 6 5 1Y 2Y 10 8 9 13 11 12 3Y 4Y † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 1OE 1A 2OE 2A 1 2 3OE 3 1Y 4 5 3A 4OE 6 2Y 4A 10 9 8 3Y 13 12 11 4Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74AHC125Q QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SGDS015 – FEBRUARY 2002 recommended operating conditions (see Note 3) VCC Supply voltage VIH High-level input voltage VCC = 2 V VCC = 3 V VCC = 5.5 V MIN MAX 2 5.5 UNIT V 1.5 V 2.1 3.85 VCC = 2 V VCC = 3 V 0.5 VIL Low-level input voltage VI VO Input voltage 0 5.5 V Output voltage 0 VCC –50 V IOH High-level output current 0.9 VCC = 5.5 V IOL ∆t/∆v 1.65 VCC = 2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V Low-level output current Input transition rise or fall rate V –4 –8 VCC = 2 V VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V 50 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V 100 4 8 20 mA mA mA mA ns/V TA Operating free-air temperature –40 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –50 mA MIN 2V 1.9 2 1.9 2.9 3V 2.9 3 4.4 4.5 IOH = –4 mA 3V 2.58 2.48 IOH = –8 mA 4.5 V 3.94 3.8 IOL = 50 mA VOL IOL = 4 mA ICC Ci TA = 25°C TYP MAX 4.5 V VOH II IOZ MIN VCC IOL = 8 mA VI = 5.5 V or GND VO = VCC or GND VI = VCC or GND, IO = 0 VI = VCC or GND 4.4 UNIT V 2V 0.1 0.1 3V 0.1 0.1 4.5 V 0.1 0.1 3V 0.36 0.5 4.5 V 0.36 0.5 V 0 V to 5.5 V ±0.1 ±1 mA 5.5 V ±0.25 ±2.5 mA 4 40 mA 5.5 V 5V POST OFFICE BOX 655303 MAX • DALLAS, TEXAS 75265 4 10 pF 3 SN74AHC125Q QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SGDS015 – FEBRUARY 2002 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF MIN TA = 25°C TYP MAX MIN MAX 5.6 8 1 9.5 5.6 8 1 9.5 5.4 8 1 9.5 5.4 8 1 9.5 7 9.7 1 11.5 7 9.7 1 11.5 8.1 11.5 1 13 8.1 11.5 1 13 7.9 11.5 1 13 7.9 11.5 1 13 9.5 13.2 1 15 9.5 13.2 1 15 UNIT ns ns ns ns ns ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPZH tPZL OE Y CL = 15 pF tPHZ tPLZ OE Y CL = 15 pF tPLH tPHL A Y CL = 50 pF tPZH tPZL OE Y CL = 50 pF tPHZ tPLZ OE Y CL = 50 pF TA = 25°C MIN TYP MAX MIN MAX 3.8 5.5 1 6.5 3.8 5.5 1 6.5 3.6 5.1 1 6 3.6 5.1 1 6 4.6 6.8 1 8 4.6 6.8 1 8 5.3 7.5 1 8.5 5.3 7.5 1 8.5 5.1 7.1 1 8 5.1 7.1 1 8 6.1 8.8 1 10 6.1 8.8 1 10 MIN MAX UNIT ns ns ns ns ns ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) PARAMETER VOL(P) VOL(V) Quiet output, maximum dynamic VOL VOH(V) VIH(D) Quiet output, minimum dynamic VOH 4.4 High-level dynamic input voltage 3.5 Quiet output, minimum dynamic VOL VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. UNIT 0.8 V –0.8 V V V 1.5 V TYP UNIT operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 14 pF SN74AHC125Q QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS SGDS015 – FEBRUARY 2002 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 50% VCC 50% VCC 0V tPZL tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 20-Mar-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74AHC125QDR NRND SOIC D 14 2500 CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74AHC125QDRG4 NRND SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125QDRG4Q1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC125QPWR ACTIVE TSSOP PW 14 2000 CU NIPDAU Level-1-250C-UNLIM SN74AHC125QPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Pb-Free (RoHS) Pb-Free (RoHS) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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