HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps Data Sheet Description Features These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. • Well defined spatial radiation patterns These LED lamps are untinted, nondiffused, T-13/4 packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy, offering superior high temperature and high moisture resistance performance in outdoor signal and sign applications. The high maximum LED junction tempera ture limit of +130°C enables high temperature operation in bright sunlight conditions. The package epoxy contains both uv-a and uv‑b inhibitors to reduce the effects of long term exposure to direct sunlight. These lamps are available in two package options to give the designer flexibility with device mounting. Benefits • Viewing angles match traffic management sign requirements • Colors meet automotive and pedestrian signal specifications • Superior performance in outdoor environments • Suitable for autoinsertion onto PC boards • Viewing angles: 8°, 15°, 23°, 30° • High luminous output • Colors: 590 nm amber 605 nm orange 615 nm reddish-orange 626 nm red • High operating temperature: TJ led = +130°C • Superior resistance to moisture • Package options: With or without lead stand-offs Applications • Traffic management: Traffic signals Pedestrian signals Work zone warning lights Variable message signs • Commercial outdoor advertising: Signs Marquees • Automotive: Exterior and interior lights Device Selection Guide Typical Viewing Angle 2θ 1/2 (Deg.)[4] Color and Dominant Wavelength (nm), Typ.[3] Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd)[1,2,5] @ 20 mA Min. Max. HLMP-EL08-T0000 HLMP-EL10-T0000 2500 – HLMP-EL08-VY000 HLMP-EL10-VY000 4200 12000 HLMP-EL08-VYK00 4200 12000 HLMP-EL08-WZ000 HLMP-EL10-WZ000 5500 16000 HLMP-EL08-X1K00 HLMP-EL10-X1K00 7200 21000 HLMP-EL08-X1000 HLMP-EL10-X1000 8° Amber 590 Orange 605 21000 5500 16000 HLMP-EJ08-X1000 7200 21000 HLMP-EJ08-Y2000 HLMP-EJ10-X1000 9300 27000 HLMP-EH08-UX000 HLMP-EH10-UX000 3200 9300 HLMP-EH08-WZ000 HLMP-EH10-WZ000 5500 16000 HLMP-EH08-X1000 HLMP-EH10-X1000 7200 21000 HLMP-EH08-Y2000 HLMP-EH10-Y2000 9300 27000 HLMP-EG08-T0000 HLMP-EG10-T0000 Red-Orange 615 7200 HLMP-EJ08-WZ000 2500 – Red 626 HLMP-EG08-VY000 4200 12000 HLMP-EG08-WZ000 HLMP-EG10-WZ000 5500 16000 HLMP-EG08-X1000 HLMP-EG10-X1000 7200 21000 HLMP-EG08-YZ000 9300 16000 HLMP-EG08-Y2000 9300 27000 HLMP-EG10-Y2000 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each intensity bin limit is ± 15%. Device Selection Guide Typical Viewing Angle 2θ 1/2 (Deg.)[4] Color and Dominant Wavelength (nm), Typ.[3] 15° Lamps without Standoffs on Leads (Outline Drawing A) Amber 590 Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd)[1,2,5] @ 20 mA Min. Max. HLMP-EL17-M0000 520 – HLMP-EL15-PS000 880 2500 HLMP-EL15-QSK00 1150 2500 HLMP-EL15-QT000 1150 3200 HLMP-EL15-RU000 1500 4200 HLMP-EL15-TW000 2500 7200 HLMP-EL15-TWK00 2500 7200 HLMP-EL15-UX000 HLMP-EL17-UX000 3200 9300 HLMP-EL15-VY000 HLMP-EL17-VY000 4200 12000 HLMP-EL15-VYK00 4200 12000 HLMP-EL15-VW000 4200 7200 1150 3200 HLMP-EJ15-PS000 880 2500 HLMP-EJ15-RU000 1500 4200 HLMP-EJ15-SV000 1900 5500 Orange 605 HLMP-EL17-TW000 HLMP-EJ17-SV000 HLMP-EH15-QT000 1150 3200 HLMP-EH15-RU000 1500 4200 HLMP-EH15-TW000 HLMP-EH17-TW000 2500 7200 HLMP-EH15-UX000 HLMP-EH17-UX000 3200 9300 HLMP-EG15-N0000 HLMP-EG17-N0000 Red-Orange 615 HLMP-EJ17-QT000 680 – Red 626 HLMP-EG15-PS000 880 2500 HLMP-EG15-QT000 HLMP-EG17-QT000 1150 3200 HLMP-EG15-RU000 HLMP-EG17-RU000 1500 4200 HLMP-EG15-UX000 HLMP-EG17-UX000 3200 9300 HLMP-EG15-TW000 HLMP-EG17-TW000 2500 7200 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each intensity bin limit is ± 15%. Device Selection Guide Typical Viewing Angle 2θ 1/2 (Deg.)[4] Color and Dominant Wavelength (nm), Typ.[3] 23° Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd)[1,2,5] @ 20 mA Min. Max. HLMP-EL24-L0000 HLMP-EL26-L0000 400 – HLMP-EL24-MQ000 520 1500 HLMP-EL24-NR000 680 1900 HLMP-EL24-PS000 880 2500 HLMP-EL24-QR000 1150 1900 HLMP-EL24-QRK00 1150 1900 HLMP-EL24-QS400 1150 2500 HLMP-EL24-QT000 HLMP-EL26-QT000 1150 3200 HLMP-EL24-RU000 HLMP-EL26-RU000 1150 4200 HLMP-EL24-RUK00 1150 4200 HLMP-EL24-SV000 1900 5500 HLMP-EL24-SUK00 1900 4200 HLMP-EL24-SU400 1900 4200 HLMP-EL24-SVK00 1900 5500 HLMP-EL24-TW000 2500 7200 HLMP-EL26-PS000 HLMP-EL26-SV000 HLMP-EL26-TW000 HLMP-EL24-TWK00 2500 7200 Orange 605 HLMP-EJ24-QT000 1150 3200 Red-Orange 615 HLMP-EH24-PS000 880 2500 HLMP-EH24-QT000 1150 3200 HLMP-EH24-RU000 1500 4200 HLMP-EH24-SV000 HLMP-EH26-SV000 1900 5500 Red 626 HLMP-EH26-PS000 HLMP-EG24-M0000 HLMP-EG26-M0000 520 – HLMP-EG24-PS000 HLMP-EG26-PS000 880 2500 HLMP-EG24-QT000 1150 4200 HLMP-EG24-RU000 1500 4200 HLMP-EG26-RU000 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each intensity bin limit is ± 15%. Device Selection Guide Typical Viewing Angle 2θ 1/2 (Deg.)[4] Color and Dominant Wavelength (nm), Typ.[3] 30° Amber 590 Lamps without Standoffs on Leads (Outline Drawing A) Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd)[1,2,5] @ 20 mA Min. Max. HLMP-EL30-K0000 HLMP-EL32-K0000 310 – 520 1500 680 1900 HLMP-EL30-MQ000 HLMP-EL32-NR000 HLMP-EL30-PQ000 880 1500 HLMP-EL30-PR400 880 1900 HLMP-EL30-PS000 880 2500 HLMP-EL30-PSK00 880 2500 HLMP-EL30-QT000 1150 3200 HLMP-EL30-QTK00 1150 3200 HLMP-EL30-ST000 1900 3200 HLMP-EL30-SU400 1900 4200 HLMP-EL30-SUK00 1900 4200 HLMP-EL30-STK00 1900 3200 HLMP-EL30-SV000 1900 5500 HLMP-EL30-SVK00 1900 5500 HLMP-EJ30-NR000 680 1900 HLMP-EJ30-PS000 HLMP-EJ32-PS000 880 2500 Orange 605 Red-Orange 615 HLMP-EL32-PS000 HLMP-EL32-QT000 HLMP-EL32-SV000 HLMP-EH30-MQ000 HLMP-EH32-MQ000 520 1500 HLMP-EH30-NR000 HLMP-EH32-NR000 680 1900 HLMP-EH30-PS000 HLMP-EH32-PS000 880 2500 HLMP-EH30-QT000 HLMP-EH32-QT000 1150 4200 HLMP-EH30-RU000 HLMP-EH32-RU000 1500 4200 HLMP-EG30-K0000 HLMP-EG32-K0000 270 – Red 626 HLMP-EG30-KN000 310 880 HLMP-EG30-MQ000 520 1500 HLMP-EG30-NQ000 680 1500 HLMP-EG30-NR000 680 1900 HLMP-EG30-PQ000 880 1500 HLMP-EG30-PR000 880 1900 HLMP-EG30-PS000 880 2500 HLMP-EG30-QT000 1150 3200 HLMP-EG32-MQ000 HLMP-EG32-NR000 HLMP-EG32-QT000 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ1/2 is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each intensity bin limit is ± 15%. Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin; Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin Selections 0: No color bin limitation 4: Amber color bin 4 only K: Amber color bins 2 and 4 only Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Viewing Angle & Lead Stand Offs 08: 8 deg without lead stand offs 10: 8 deg with lead stand offs 15: 15 deg without lead stand offs 17: 15 deg with lead stand offs 24: 23 deg without lead stand offs 26: 23 deg with lead stand offs 30: 30 deg without lead stand offs 32: 30 deg with lead stand offs Color G: 626 nm Red H: 615 nm Red-Orange J: 605 nm Orange L: 590 nm Amber Package E: 5 mm Round Note: Please refer to AB 5337 for complete information on part numbering system. Package Dimensions A B 5.00 ± 0.20 (0.197 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 1.14 ± 0.20 (0.045 ± 0.008) 8.71 ± 0.20 (0.343 ± 0.008) d 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) CATHODE FLAT CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. LEADS ARE MILD STEEL, SOLDER DIPPED. 3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS. NOTES: 4. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE. 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS. 3. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE. PART NO. d HLMP-XX10 12.37 ± 0.25 (0.487 ± 0.010) 12.42 ± 0.25 (0.489 ± 0.010) HLMP-XX17 HLMP-XX26 12.52 ± 0.25 (0.493 ± 0.010) HLMP-XX32 11.96 ± 0.25 (0.471 ± 0.010) Absolute Maximum Ratings at TA = 25°C DC Forward Current[1,2,3] . .................................................................................... 50 mA Peak Pulsed Forward Current[2,3] . ......................................................................100 mA Average Forward Current[3] . ................................................................................. 30 mA Reverse Voltage (IR = 100 µA)......................................................................................... 5 V LED Junction Temperature........................................................................................ 130°C Operating Temperature..........................................................................-40°C to +100°C Storage Temperature...............................................................................-40°C to +100°C Notes: 1. Derate linearly as shown in Figure 4. 2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024. 3. Operating at currents below 1 mA is not recommended. Please contact your local representative for further information. Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Amber (ld = 590 nm) 2.02 Orange (ld = 605 nm) VF 1.98 2.4 V Red-Orange (ld = 615 nm) 1.94 Red (ld = 626 nm) 1.90 IF = 20 mA Reverse Voltage IF = 100 µA VR 5 20 V Peak Wavelength: Amber (ld = 590 nm) 592 Orange (ld = 605 nm) lPEAK 609 nm Red-Orange (ld = 615 nm) 621 Red (ld = 626 nm) 635 Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth ∆l1/2 17 nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Speed of Response ts 20 ns Exponential Time Constant, e-t/ts Capacitance VF = 0, f = 1 MHz C 40 pF Thermal Resistance RqJ-PIN 240 °C/W LED Junction-to-Cathode Lead Luminous Efficacy[1] Amber (ld = 590 nm) Orange (ld = 605 nm) hv Red-Orange (ld = 615 nm) Red (ld = 626 nm) 480 370 lm/W 260 150 Emitted Luminous Power/Emitted Radiant Power 500mlm IF = 20 mA Luminous Flux jv Luminous Efficiency [2] he Amber Orange Red-Orange Red Note: Emitted Luminous 12 lm/W Flux/Electrical Power 13 13 13 1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 2. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 1.0 100 RED-ORANGE AMBER 80 RED 70 CURRENT – mA RELATIVE INTENSITY ORANGE 90 0.5 60 RED 50 40 AMBER 30 20 10 0 550 600 650 0 1.0 700 WAVELENGTH – nm Figure 1. Relative intensity vs. peak wavelength 55 50 IF – FORWARD CURRENT – mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2.5 2.0 1.5 1.0 0.5 45 40 35 30 25 20 15 10 5 0 0 20 40 0 60 20 40 60 80 100 120 TA – AMBIENT TEMPERATURE – °C IF – DC FORWARD CURRENT – mA Figure 4. Maximum forward current vs. ambient temperature Figure 3. Relative luminous intensity vs. forward current 1 NORMALIZED INTENSITY – % 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 01. 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT – DEGREES Figure 5. Representative spatial radiation pattern for 8° viewing angle lamps 2.0 2.5 Figure 2. Forward current vs. forward voltage 3.0 0 1.5 VF – FORWARD VOLTAGE – V 60 90 3.0 1 NORMALIZED INTENSITY – % 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 30 60 90 120 150 180 ANGULAR DISPLACEMENT – DEGREES Figure 6. Representative spatial radiation pattern for 15° viewing angle lamps 1 NORMALIZED INTENSITY – % 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -100 -50 0 50 100 ANGULAR DISPLACEMENT – DEGREES Figure 7. Representative spatial radiation pattern for 23° viewing angle lamps 1 NORMALIZED INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 8. Representative spatial radiation pattern for 30° viewing angle lamps 10 90 Intensity Bin Limits RELATIVE LOP (NORMALIZED AT 25°C) 10 (mcd at 20 mA) ORANGE RED RED-ORANGE AMBER 1 0.1 -50 -25 0 25 50 75 JUNCTION TEMPERATURE – °C Figure 9. Relative light output vs. junction temperature 100 125 150 Bin Name Min. Max. K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 2 21000 27000 Tolerance for each bin limit is ± 15%. Amber Color Bin Limits (nm at 20 mA) Bin Name Min. Max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 Tolerance for each bin limit is ± 0.5 nm. Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 12 CATHODE Note: Electrical connection AllnGaP Devicebetween bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm 0.636 mm (0.018x 0.018 inch) (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm 0.707 mm (0.020x 0.020 inch) (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Figure 10. Recommended wave soldering profile Ammo Pack Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.50 ± 1.00 (0.807 ± 0.039) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) ALL DIMENSIONS IN MILLIMETERS (INCHES). 0.70 ± 0.20 (0.0276 ± 0.0079) A VIEW A–A NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF. 13 ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + O AG ES AV LOGI O HN E OD AN TEC E OD TH CA – ANODE LEAD LEAVES THE BOX FIRST. C ER TH MO L BE LA NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label 14 (1P) PART #: Part Number RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) OR (ii) Color bin incorporate with VF Bin (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4368EN AV02-0373EN - September 2, 2008