LM2904-Q1 DUAL OPERATIONAL AMPLIFIER SLOS414F − MAY 2003 − REVISED APRIL 2008 D Qualified for Automotive Applications D ESD Protection Exceeds 500 V Per D D D D D Open-Loop Differential Voltage Amplification . . . 100 V/mV Typ D Internal Frequency Compensation MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Low Supply-Current Drain Independent of Supply Voltage . . . 0.7 mA Typ Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage: − Non-V Devices . . . ±26 V − V-Suffix Devices . . . ±32 V Low Input Bias and Offset Parameters: − Input Offset Voltage . . . 3 mV Typ − Input Offset Current . . . 2 nA Typ − Input Bias Current . . . 20 nA Typ D OR PW PACKAGE (TOP VIEW) 1OUT 1IN− 1IN+ GND 1 8 2 7 3 6 4 5 VCC 2OUT 2IN− 2IN+ description/ordering information This device consists of two independent, high-gain, frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies is possible as long as the difference between the two supplies is 3 V to 26 V (3 V to 32 V for V-suffix devices), and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily provide the required interface electronics without additional ±5-V supplies. The LM2904Q is manufactured to demanding automotive requirements. ORDERING INFORMATION{ TA −40°C 40°C to 125°C VIOmax AT 25°C MAX VCC 7 mV 26 V SOIC (D) Tape and reel LM2904QDRQ1 2904Q1 7 mV 26 V TSSOP (PW) Tape and reel LM2904QPWRQ1 2904Q1 7 mV 32 V SOIC (D) Tape and reel LM2904VQDRQ1 2904VQ1 7 mV 32 V TSSOP (PW) Tape and reel LM2904VQPWRQ1 2904VQ1 2 mV 32 V SOIC (D) Tape and reel LM2904AVQDRQ1 2904AVQ 2 mV 32 V TSSOP (PW) Tape and reel LM2904AVQPWRQ1 2904AVQ PACKAGE‡ ORDERABLE PART NUMBER TOP-SIDE MARKING † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 LM2904-Q1 DUAL OPERATIONAL AMPLIFIER SLOS414F − MAY 2003 − REVISED APRIL 2008 symbol (each amplifier) IN+ + IN− − OUT schematic (each amplifier) VCC+ ≈6-µA Current Regulator ≈6-µA Current Regulator ≈100-µA Current Regulator OUT IN− ≈50-µA Current Regulator IN+ GND (or VCC−) To Other Amplifier COMPONENT COUNT Epi-FET Diodes Resistors Transistors Capacitors 2 POST OFFICE BOX 655303 1 2 7 51 2 • DALLAS, TEXAS 75265 LM2904-Q1 DUAL OPERATIONAL AMPLIFIER SLOS414F − MAY 2003 − REVISED APRIL 2008 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC (see Note 1): Non-V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 V V-suffix devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 V Differential input voltage, VID (see Note 2): Non-V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±26 V V-suffix devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±32 V Input voltage range, VI (either input): Non-V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 26 V V-suffix devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 32 V Duration of output short circuit (one amplifier) to ground at (or below) 25°C free-air temperature (VCC ≤ 15 V) (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Package thermal impedance, θJA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground terminal. 2. Differential voltages are at IN+ with respect to IN−. 3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 LM2904-Q1 DUAL OPERATIONAL AMPLIFIER SLOS414F − MAY 2003 − REVISED APRIL 2008 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS† PARAMETER VIO aV IO Non A devices Non-A A suffix devices A-suffix Average temperature coefficient of input offset voltage Input offset current VO = 1.4 14V aI IO Average temperature coefficient of input offset current IIB Input bias current IB Drift VICR VO = 1.4 14V VOL High-level High level output voltage Low-level output voltage 7 Full range Full range 7 25°C 2 Full range VCC = MAX, Non-V devices RL = 2 kΩ VCC = MAX, V-suffix devices RL = 2 kΩ RL ≥ 10 kΩ RL ≥ 10 kΩ RL ≤ 10 kΩ 2 mV µV/°C 50 300 5 Full range 50 nA 150 Full range 10 25°C −20 pA/°C −250 −500 50 25°C 0 to VCC−1.5 Full range 0 to VCC−2 25°C VCC−1.5 VCC = 5 V to MAX UNIT 4 Full range RL ≥ 10 kΩ VOH 3 10 Full range Common mode input voltage range Common-mode MAX 1 25°C V suffix devices V-suffix TYP§ Full range 25°C Non V devices Non-V IIO MIN 25°C VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 14V Input offset voltage TA‡ nA pA/°C V 22 Full range 23 24 V 26 Full range 27 28 25°C 25 100 Full range 15 Full range 5 20 mV AVD Large signal differential Large-signal voltage amplification VCC = 15 V, VO = 1 V to 11 V, RL = ≥ 2 kΩ CMRR Common-mode rejection ratio VCC = 5 V to MAX, VIC = VICR(min) 25°C 65 80 dB kSVR Supply-voltage rejection ratio (∆VDD/∆VIO) VCC = 5 V to MAX 25°C 65 100 dB VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB VCC = 15 V V, VID = 1 V V, VO = 0 IO Output current VCC = 15 V V, VID = −1 1V V, VO = 15 V VID = −1 V, IOS Short-circuit output current ICC Supply current (two amplifiers) VO = 200 mV VCC at 5 V, GND at −5 V, VO = 0 VO = 2.5 V, No load VCC = MAX, VO = 0.5 VCC, No load † 25°C −20 Full range −10 25°C 10 Full range 5 25°C 12 25°C Full range V/mV −30 mA 20 µA 40 ±40 ±60 0.7 1.2 1 2 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for non-V devices and 32 V for V-suffix devices. ‡ Full range is −40°C to 125°C for LM2904Q.S § All typical values are at T = 25°C. A 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LM2904-Q1 DUAL OPERATIONAL AMPLIFIER SLOS414F − MAY 2003 − REVISED APRIL 2008 operating conditions, VCC = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT 0.3 V/µs SR Slew rate at unity gain RL = 1 MΩ, CL = 30 pF, VI = ±10 V (see Figure 1) B1 Unity-gain bandwidth RL = 1 MΩ, CL = 20 pF (see Figure 1) 0.7 MHz Vn Equivalent input noise voltage RS = 100 Ω, VI = 0 V, f = 1 kHz (see Figure 2) 40 nV/√Hz VCC+ − VI VO + CL VCC− RL Figure 1. Unity-Gain Amplifier 900 Ω VCC+ 100 Ω VI = 0 V RS − VO + VCC− Figure 2. Noise-Test Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LM2904AVQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904AVQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904AVQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904AVQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904VQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904VQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904VQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904VQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 20-Oct-2011 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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