TL331 www.ti.com ......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008 SINGLE DIFFERENTIAL COMPARATOR FEATURES 1 • • • Single Supply or Dual Supplies Wide Range of Supply Voltage . . . 2 V to 36 V Low Supply-Current Drain Independent of Supply Voltage . . . 0.4 mA Typ Low Input Bias Current . . . 25 nA Typ Low Input Offset Voltage . . . 2 mV Typ Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . ±36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS • • • • • • DBV PACKAGE (TOP VIEW) IN− VCC−/GND IN+ 1 5 VCC 4 OUT 2 3 DESCRIPTION/ORDERING INFORMATION This device consists of a single voltage comparator that is designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies is 2 V to 36 V and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The output can be connected to other open-collector outputs to achieve wired-AND relationships. ORDERING INFORMATION (1) TA VIO(max) AT 25°C –40°C to 85°C 5 mV SOT-23 – DBV –40°C to 105°C 5 mV SOT-23 – DBV (1) (2) (3) PACKAGE (2) ORDERABLE PART NUMBER Reel of 3000 TL331IDBVR Reel of 250 TL331IDBVT Reel of 3000 TL331KDBVR Reel of 250 TL331KDBVT TOP-SIDE MARKING (3) T1I_ T1K_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. The actual top-side marking has one additional character that designates the wafer fab/assembly site. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2008, Texas Instruments Incorporated TL331 SLVS238F – AUGUST 1999 – REVISED JULY 2008 ......................................................................................................................................................... www.ti.com LOGIC DIAGRAM IN+ OUT IN− SCHEMATIC VCC 80-µA Current Regulator 10 µA 60 µA 10 µA 80 µA IN+ COMPONENT COUNT OUT Epi-FET Diodes Resistors Transistors 1 2 1 20 IN− GND Note: Current values shown are nominal. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage (2) 36 V VID Differential input voltage (3) ±36 V VI Input voltage range (either input) VO Output voltage 36 V IO Output current 20 mA –0.3 V to 36 V Duration of output short-circuit to ground (4) θJA Package thermal impedance TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) 2 Unlimited (5) (6) 206°C/W 150°C –65°C to 150°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground. Differential voltages are at IN+ with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 1999–2008, Texas Instruments Incorporated Product Folder Link(s): TL331 TL331 www.ti.com ......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008 ELECTRICAL CHARACTERISTICS at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS (1) TA (2) 25°C VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = VIC(min) IIO Input offset current VO = 1.4 V IIB Input bias current VO = 1.4 V VICR Common-mode input voltage range (3) AVD Large-signal differential voltage amplification IOH High-level output current TYP MAX 2 5 Full range 9 25°C 5 Full range –25 Full range VCC = 15 V, VO = 1.4 V to 11.4 V, RL ≥ 15 kΩ to VCC 0 to VCC – 1.5 Full range 0 to VCC – 1.5 50 VOH = 5 V, VID = 1 V 25°C VOH = 30 V, VID = 1 V Full range IOL = 4 mA, VID = –1 V IOL Low-level output current VOL = 1.5 V, VID = 1 V 25°C ICC Supply current RL = ∞, VCC = 5 V 25°C UNIT mV nA nA V 200 V/mV 0.1 25°C Low-level output voltage –250 –400 25°C 25°C 50 250 25°C VOL (1) (2) (3) MIN 150 Full range 50 nA 1 µA 400 700 6 mV mA 0.4 0.7 mA All characteristics are measured with zero common-mode input voltage, unless otherwise specified. Full range TA is –40°C to 85°C for I-suffix devices and –40°C to 105°C for K-suffix devices. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage. SWITCHING CHARACTERISTICS VCC = 5 V, TA = 25°C PARAMETER Response time (1) (2) TEST CONDITIONS RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1) (2) TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT µs CL includes probe and jig capacitance. The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Submit Documentation Feedback Copyright © 1999–2008, Texas Instruments Incorporated Product Folder Link(s): TL331 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~ T1IL ~ T1IS) TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~ T1IL ~ T1IS) TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~ T1IL ~ T1IS) TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~ T1IL ~ T1IU) TL331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~ T1IL ~ T1IU) TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1I3 ~ T1IG ~ T1IL ~ T1IU) TL331KDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) TL331KDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (3) 11-Apr-2013 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. 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OTHER QUALIFIED VERSIONS OF TL331 : • Automotive: TL331-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TL331IDBVR SOT-23 DBV 5 3000 180.0 8.4 TL331IDBVR SOT-23 DBV 5 3000 180.0 TL331IDBVR SOT-23 DBV 5 3000 178.0 TL331IDBVT SOT-23 DBV 5 250 TL331KDBVR SOT-23 DBV 5 TL331KDBVR SOT-23 DBV 5 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 28-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL331IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 TL331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 TL331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0 TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331KDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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