TI TUSB1106-Q1

TUSB1106-Q1
SCAS916 – AUGUST 2011
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ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVERS
Check for Samples: TUSB1106-Q1
FEATURES
•
1
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•
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•
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Qualified for Automotive Applications
Compatible With Universal Serial Bus
Specification Rev. 2.0
Transmit and Receive Serial Data at Both
Full-Speed (12-Mbit/s) and Low-Speed
(1.5-Mbit/s) Data Rates
Integrated Bypassable 5-V to 3.3-V Voltage
Regulator for Powering Via USB VBUS
VBUS Disconnection Indication Through VP and
VM
Used as USB Device Transceiver or USB Host
Transceiver
Stable RCV Output During SE0 Condition
Two Single-Ended Receivers With Hysteresis
Low-Power Operation, Ideal for Portable
Equipment
Support I/O Voltage Range From 1.65 V to
3.6 V
Available in a Thin Shrink Small-Outline
Package [TSSOP (PW)]
PW PACKAGE
(TOP VIEW)
V p u(3 .3)
1
16 V C C (5 .0 )
SO FTCO N
2
15 V reg (3 .3 )
OE
3
14 V M O
R CV
4
13 V PO
VP
5
12 D +
VM
6
11 D −
S U S PN D
7
10 S PE E D
GN D
8
9
V C C (I /O )
DESCRIPTION
The TUSB1106-Q1 universal serial bus (USB) transceiver is compliant with the Universal Serial Bus Specification
Rev. 2.0. This device can transmit and receive serial data at both full-speed (12-Mbit/s) and low-speed
(1.5-Mbit/s) data rates. The TUSB1106-Q1 can be used as USB device transceiver or USB host transceiver.
The device allows USB application-specific ICs (ASICs) and programmable logic devices (PLDs), with
power-supply voltages from 1.65 V to 3.6 V, to interface with the physical layer (PHY) of the universal serial bus.
It has an integrated 5-V to 3.3-V voltage regulator for direct powering via the USB supply VBUS.
The TUSB1106-Q1 allows only differential input mode and is available in a PW package.
The TUSB1106-Q1 is ideal for portable electronic devices such as mobile phones, personal digital assistants,
information appliances, and digital still cameras.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE (1)
TSSOP – PW
(2)
Reel of 2000
ORDERABLE PART NUMBER
TUSB1106IPWRQ1
TOP-SIDE MARKING
TU1106I
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TUSB1106-Q1
SCAS916 – AUGUST 2011
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FUNCTIONAL BLOCK DIAGRAM
TUSB1106-Q1
2
A.
Connect to D– for low-speed operation and to D+ for high-speed operation.
B.
Pin function depends on device type.
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TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
OE
3
I
Output enable (CMOS level with respect to VCC(I/O), active LOW). Enables the transceiver to
transmit data on the USB bus input pad. Push pull, CMOS.
RCV
4
O
Differential data receiver (CMOS level with respect to VCC(I/O)). Driven LOW when input
SUSPND is HIGH. The output state of RCV is preserved and stable during an SE0 condition
output pad. Push pull, 4-mA output drive, CMOS.
VP
5
O
Single-ended D+ receiver (CMOS level with respect to V). For external detection of single-ended
zero (SE0), error conditions, speed of connected device. Driven HIGH when no supply voltage
is connected to VCC(5.0) and Vreg(3.3) output pad. Push pull, 4-mA output drive, CMOS.
VM
6
O
Single-ended D– receiver (CMOS level with respect to VCC(I/O)). For external detection of
single-ended zero (SE0), error conditions, speed of connected device. Driven HIGH when no
supply voltage is connected to VCC(5.0) and Vreg(3.3) output pad. Push pull, 4-mA output drive,
CMOS.
SUSPND
7
I
Suspend (CMOS level with respect to VCC(I/O)). A HIGH level enables low-power state while the
USB bus is inactive and drives output RCV to a LOW-level input pad. Push pull, CMOS.
I
Mode (CMOS level with respect to VCC(I/O)). A HIGH level enables the differential input mode
(VPO, VMO), whereas a LOW level enables a single-ended input mode (VO, FSE0). See Table
5 and Table 6 input pad. Push pull, CMOS.
MODE
GND
8
Ground supply
VCC(I/O)
9
Supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not connected, the D+ and
D– pins are in 3-state. This supply pin is independent of VCC(5.0) and Vreg(3.3) and must never
exceed the Vreg(3.3) voltage.
SPEED
10
I
D–
11
AI/O
Negative USB data bus connection (analog, differential). For low-speed mode, connect to pin
Vpu(3.3) via a 1.5-kΩ resistor.
D+
12
AI/O
Positive USB data bus connection (analog, differential). For full-speed mode, connect to pin
Vpu(3.3) via a 1.5-kΩ resistor.
VPO/VO
VPO
I
Driver data (CMOS level with respect to VCC(I/O), Schmitt trigger). See Driving Function table.
Push pull, CMOS.
I
Driver data (CMOS level with respect to VCC(I/O), Schmitt trigger). See Driving Function table.
Push pull, CMOS.
13
VMO/FSE0
Speed selection (CMOS level with respect to VCC(I/O)). Adjusts the slew rate of differential data
outputs D+ and D– according to the transmission speed. Input pad, push pull, CMOS.
LOW – low speed (1.5 Mbit/s)
HIGH – full speed (12 Mbit/s)
VMO
14
Vreg(3.3)
15
Internal regulator option. Regulated supply-voltage output (3 V to 3.6 V) during 5-V operation. A
decoupling capacitor of at least 0.1 mF is required for the regulator bypass option. Used as a
supply-voltage input for
3.3 V ± 10% operation.
VCC(5.0)
16
Internal regulator option. Supply-voltage input (4 V to 5.5 V). Can be connected directly to USB
supply VBUS regulator bypass option. Connect to Vreg(3.3).
Vpu(3.3)
1
Pullup supply voltage (3.3 V ± 10%). Connect an external 1.5-kΩ resistor on D+ (full speed) or
D– (low speed). Pin function is controlled by input SOFTCON.
SOFTCON = LOW – Vpu(3.3) floating (high impedance), ensures zero pullup current
SOFTCON = HIGH – Vpu(3.3) = 3.3 V, internally connected to Vreg(3.3)
SOFTCON
2
I
Software-controlled USB connection. A HIGH level applies 3.3 V to pin Vpu(3.3), which is
connected to an external 1.5-kΩ pullup resistor. This allows USB connect/disconnect signaling
to be controlled by software input pad. Push pull, CMOS.
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FUNCTIONAL DESCRIPTION
Function Selection
FUNCTION TABLE
SUSPND
OE
D+, D–
RCV
VP, VM
L
L
Driving and receiving
Active
Active
Normal driving (differential receiver active)
L
H
Receiving (1)
Active
H
H
(1)
(2)
(3)
L
H
Driving
High-Z
(1)
FUNCTION
Active
Receiving
Inactive
(2)
Active
Driving during suspend (3) (differential receiver inactive)
Inactive
(2)
Active
Low-power state
Signal levels on D+ and D– are determined by other USB devices and external pullup/pulldown resistors.
In suspend mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always LOW. Out of suspend (K), signaling is
detected via the single-ended receivers VP and VM.
During suspend, the slew-rate control circuit of low-speed operation is disabled. The D+ and D– lines are still driven to their intended
states, without slew-rate control. This is permitted because driving during suspend is used to signal remote wakeup by driving a K signal
(one transition from idle to K state) for a period of 1 ms to 15 ms.
Operating Functions
Driving Function (Pin OE = L)
Using Differential Input Data Interface
DATA STATE
VMO
VPO
DATA
LOW SPEED
FULL SPEED
L
L
SE0
X
X
H
L
Differential logic 0
J
K
L
H
Differential logic 1
K
J
H
H
Illegal state
X
X
Table 1. Receiving Function (Pin OE = H)
DATA STATE
RCV
VP (1)
VM (1)
LOW
SPEED
FULL
SPEED
Differential
logic 0
L
L
H
J
K
Differential
logic 1
H
H
L
K
J
L
L
X
X
D+, D–
SE0
(1)
(2)
RCV*
(2)
VP = VM = H indicates the sharing mode (VCC(5.0) and Vreg(3.3) are
disconnected).
RCV* denotes the signal level on output RCV just before SE0 state
occurs. This level is stable during the SE0 period.
Power-Supply Configurations
The TUSB1106-Q1 can be used with different power-supply configurations, which can be dynamically changed.
An overview is given in Table 3.
• Normal mode – Both VCC(I/O) and VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected. For 5-V operation, VCC(5.0) is
connected to a 5-V source (4 V to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB
connections. For 3.3-V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3-V source (3 V to 3.6 V).
VCC(I/O) is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of
the external circuit.
• Disable mode – VCC(I/O) is not connected, VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected. In this mode, the
internal circuits of the TUSB1106-Q1 ensure that the D+ and D– pins are in 3-state and the power
consumption drops to the low-power (suspended) state level. Some hysteresis is built into the detection of
VCC(I/O) lost.
• Sharing mode – VCC(I/O) is connected, (VCC(5.0) and Vreg(3.3)) are not connected. In this mode, the D+ and D–
pins are made 3-state and the TUSB1106-Q1 allows external signals of up to 3.6 V to share the D+ and D–
4
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lines. The internal circuits of the TUSB1106-Q1 ensure that virtually no current (maximum 10 μA) is drawn via
the D+ and D– lines. The power consumption through VCC(I/O) drops to the low-power (suspended) state level.
Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is
built into the detection of Vreg(3.3) lost.
Table 2. Pin States in Disable or Sharing Mode
PINS
DISABLE-MODE STATE
VCC(5.0)/Vreg(3.3)
Not present
VCC(I/O)
Not present
1.65-V to 3.6-V input
Vpu(3.3)
High impedance (off)
High impedance (off)
D+, D–
High impedance
High impedance
VP, VM
Invalid (1)
H
(2)
L
RCV
Invalid
Inputs (VO/VPO, FSE0/VMO, SPEED,
SUSPND, OE, SOFTCON)
(1)
(2)
SHARING-MODE STATE
5-V input/3.3-V output, 3.3-V input/3.3-V input
High impedance
High impedance
High impedance or driven LOW
High impedance or driven LOW
Table 3. Power-Supply Configuration Overview
(1)
VCC(5.0) or Vreg(3.3)
VCC(I/O)
CONFIGURATION
Connected
Connected
Normal mode
SPECIAL CHARACTERISTICS
Connected
Not connected
Disable mode
D+, D–, and Vpu(3.3) are in high impedance.
VP, VM, and RCV are invalid. (1)
Not connected
Connected
Sharing mode
D+, D–, and Vpu(3.3) are in high impedance.
VP and VM are driven HIGH. RCV is driven LOW.
High impedance or driven LOW
Power-Supply Input Options
The TUSB1106-Q1 has two power-supply input options.
• Internal regulator – VCC(5.0) is connected to 4 V to 5.5 V. The internal regulator is used to supply the internal
circuitry with 3.3 V (nominal). Vreg(3.3) becomes a 3.3-V output reference.
• Regulator bypass – VCC(5.0) and Vreg(3.3) are connected to the same supply. The internal regulator is bypassed
and the internal circuitry is supplied directly from the Vreg(3.3) power supply. The voltage range is
3 V to 3.6 V to comply with the USB specification.
The supply-voltage range for each input option is specified in Table 4.
Table 4. Power-Supply Input Options
INPUT OPTION
VCC(5.0)
VREG(3.3)
VCC(I/O)
Internal regulator
Supply input for internal regulator
(4 V to 5.5 V)
Voltage-reference output
(3.3 V, 300 μA)
Supply input for digital I/O pins
(1.65 V to 3.6 V)
Regulator bypass
Connected to Vreg(3.3) with
maximum voltage drop of 0.3 V
(2.7 V to 3.6 V)
Supply input
(3 V to 3.6 V)
Supply input for digital I/O pins
(1.65 V to 3.6 V)
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC(5.0)
Supply voltage range
–0.5
6
V
VI(I/O)
Supply voltage range
–0.5
4.6
V
VCCreg(3.3)
Regulated voltage range
–0.5
4.6
V
VI
DC input voltage
–0.5
VCC(I/O) + 0.5
V
IIK
Input clamp current
Tstg
Storage temperature range
(1)
VI = –1.8 V to 5.4 V
–40
100
mA
125
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
VCC(5.0)
Supply voltage, internal regulator option
5-V operation
4
5
5.5
V
VCCreg(3.3)
Supply voltage, regulator bypass option
3.3-V operation
3
3.3
3.6
V
VCC(I/O)
I/O supply voltage
1.65
3.6
V
VI
I/O supply voltage
0
VCC(I/O)
V
VI/O
Input voltage on analog I/O pins (D+, D–)
0
3.6
V
Tc
Junction temperature
–40
85
°C
6
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UNIT
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STATIC ELECTRICAL CHARACTERISTICS – SUPPLY PINS
over recommended ranges of operating free-air temperature and supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Vreg(3.3)
Regulated
supply-voltage output
Internal regulator option, Iload ≤ 300 μA (1)
ICC
Operating supply current
Full-speed transmitting and receiving at 12 Mbit/s,
CL = 50 pF on D+ and D– (3)
ICC(I/O)
Operating I/O supply current
Full-speed transmitting and receiving at 12 Mbit/s (3)
ICC(idle)
Supply current during
full-speed idle and SE0
Full-speed idle:
VD+ > 2.7 V, VD– < 0.3 V
SE0:
VD+ < 0.3 V, VD– < 0.3 V (4)
ICC(I/O)(static)
Static I/O supply current
Full-speed idle, SE0 or suspend
ICC(susp)
Suspend supply current
SUSPND = HIGH (4)
Disable-mode supply current
VCC(I/O) not connected
ICC(I/O)(sharing)
Sharing-mode I/O
supply current
VCC(5.0) or Vreg(3.3) not connected
IDx(sharing)
Sharing-mode load current
on D+ and D–
VCC(5.0) or Vreg(3.3) not connected,
SOFTCON = LOW, VDx = 3.6 V
Vreg(3.3)th
Regulated supply-voltage
detection threshold
1.65 V ≤ VCC(I/O) ≤ Vreg(3.3),
2.7 V ≤ Vreg(3.3) ≤ 3.6 V
Vreg(3.3)hys
Regulated supply-voltage
detection hysteresis
VCC(I/O) = 1.8 V
VCC(I/O)th
I/O supply-voltage
detection threshold
Vreg(3.3) = 2.7 V to 3.6 V
I/O supply-voltage
detection hysteresis
Vreg(3.3) = 3.3 V
(1)
(2)
(3)
(4)
(5)
3
(4)
ICC(dis)
VCC(I/O)hys
(2)
TYP MAX
3.3
3.6
6
8
mA
2.3
2.5
mA
500
μA
10
22
μA
10
22
μA
10
22
μA
10
22
μA
10
μA
Supply lost
during power down
Supply detect
during power up (5)
V
0.8
V
2.4
0.45
Supply lost
during power down
Supply detect
during power up
UNIT
V
0.5
V
1.4
0.45
V
Iload includes the pullup resistor current via Vpu(3.3).
In suspend mode, the typical voltage is 2.8 V.
Maximum value is characterized only, not tested in production.
Excluding any load current and Vpu(3.3)/Vsw source current to the 1.5-kΩ and 15-kΩ pullup and pulldown resistors (200 μA typ)
When VCC(I/O) < 2.7 V, the minimum value for Vreg(3.3)th (present) is 2 V.
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STATIC ELECTRICAL CHARACTERISTICS – DIGITAL PINS
over recommended ranges of operating free-air temperature and supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC(I/O)
VIL
LOW-level input voltage
1.65 V to 3.6 V
VIH
HIGH-level input voltage
1.65 V to 3.6 V
IOL = 100 μA
IOL = 2 mA
IOL = 100 μA
VOL
LOW-level output voltage
IOL = 2 mA
IOL = 100 μA
IOL = 2 mA
IOL = 100 μA
IOL = 2 mA
IOH = 100 μA
IOH = 2 mA
IOH = 100 μA
VOH
HIGH-level output voltage
IOH = 2 mA
IOH = 100 μA
IOH = 2 mA
IOH = 100 μA
IOH = 2 mA
ILI
Input leakage current
CIN
Input capacitance
8
MIN
0.3 VCC(I/O)
0.6 VCC(I/O)
0.4
0.15
0.4
0.4
VCC(I/O) – 0.15
VCC(I/O) – 0.4
1.5
1.25
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V
2.15
1.9
2.85
2.6
–1
Pin to GND
V
0.15
3.3 V ± 0.3 V
3.3 V ± 0.3 V
V
0.15
2.5 V ± 0.2 V
2.5 V ± 0.2 V
V
0.4
1.8 V ± 0.15 V
1.8 V ± 0.15 V
UNIT
0.15
1.65 V to 3.6 V
1.65 V to 3.6 V
MAX
1
μA
3.5
pF
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STATIC ELECTRICAL CHARACTERISTICS – ANALOG I/O PINS
over recommended ranges of operating free-air temperature and supply voltage, VCC = 4 V to 5.5 V or Vreg(3.3) = 3 V to 3.6 V,
VGND = 0 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VDI
Differential input sensitivity
|VI(D+) – VI(D–)|
0.2
VCM
Differential common-mode voltage
Includes VDI range
0.8
2.5
V
VIL
LOW-level input voltage, single-ended receiver
2
0.8
V
VIH
HIGH-level input voltage, single-ended receiver
0.4
Vhys
Hysteresis voltage, single-ended receiver
VOL
LOW-level output voltage
RL = 1.5 kΩ to 3.6 V
VOH
HIGH-level output voltage
RL = 1.5 kΩ to GND
ILZ
OFF-state leakage current
CIN
Transceiver capacitance
Pin to GND
ZDRV
Driver output impedance
Steady-state drive
ZINP
Input impedance
RSW
Internal switch resistance at Vpu(3.3)
VTERM
Termination voltage for upstream port pullup (RPU)
(1)
(2)
(3)
(4)
V
V
2.8 (1)
34 (2)
39
0.7
V
0.3
V
3.6
V
1
μA
25
pF
44
10
3 (3)
(4)
Ω
MΩ
13
Ω
3.6
V
VOH(min) = Vreg(3.3) – 0.2 V
Includes external resistors of 33 Ω ±1% on both D+ and D–
This voltage is available at Vreg(3.3) and Vpu(3.3).
In suspend mode, the minimum voltage is 2.7 V.
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DYNAMIC ELECTRICAL CHARACTERISTICS – ANALOG I/O PINS (D+, D–) (1)
Driver Characteristics, Full-Speed Mode
(2)
over recommended ranges of operating free-air temperature and supply voltage, VCC = 4 V to 5.5 V or Vreg(3.3) = 3 V to 3.6 V,
VCC(I/O) = 1.65 V to 3.6 V, VGND = 0 V, see Table 10 for valid voltage level combinations, TA = –40°C to 85°C
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
tFR
Rise time
CL = 50 pF to 125 pF,
10% to 90% of |VOH – VOL| (see Figure 1)
4
20
ns
tFF
Fall time
CL = 50 pF to 125 pF,
90% to 10% of |VOH – VOL| (see Figure 1)
4
20
ns
FRFM
Differential rise/fall time matching
(tFR/tFF)
Excluding the first transition from idle state
90
111.1
%
VCRS
Output signal crossover voltage
Excluding the first transition from idle state (see Figure 10)
1.3
2
V
(1)
(2)
Test circuit, see Figure 13
Driver timing in low-speed mode is not specified. Low-speed delay timings are dominated by the slow rise/fall times tLR and tLF.
DYNAMIC ELECTRICAL CHARACTERISTICS – ANALOG I/O PINS (D+, D–) (1)
Driver Characteristics, Low-Speed Mode
(2)
over recommended ranges of operating free-air temperature and supply voltage, VCC = 4 V to 5.5 V or Vreg(3.3) = 3 V to 3.6 V,
VCC(I/O) = 1.65 V to 3.6 V, VGND = 0 V, see Table 10 for valid voltage level combinations, TA = –40°C to 85°C
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
75
300
ns
tLR
Rise time
CL = 200 pF to 600 pF,
10% to 90% of |VOH – VOL| (see Figure 1)
tLF
Fall time
CL = 200 pF to 600 pF,
90% to 10% of |VOH – VOL| (see Figure 1)
75
300
ns
LRFM
Differential rise/fall time matching
(tLR/tLF)
Excluding the first transition from idle state
80
125
%
VCRS
Output signal crossover voltage
Excluding the first transition from idle state (see Figure 10)
1.3
2
V
(1)
(2)
Test circuit, see Figure 13
Driver timing in low-speed mode is not specified. Low-speed delay timings are dominated by the slow rise/fall times tLR and tLF.
DYNAMIC ELECTRICAL CHARACTERISTICS – ANALOG I/O PINS (D+, D–) (1)
Driver Timing, Full-Speed Mode
(2)
over recommended ranges of operating free-air temperature and supply voltage, VCC = 4 V to 5.5 V or Vreg(3.3) = 3 V to 3.6 V,
VCC(I/O) = 1.65 V to 3.6 V, VGND = 0 V, see Table 10 for valid voltage level combinations, TA = –40°C to 85°C
(unless otherwise noted)
PARAMETER
tPLH(drv)
tPHL(drv)
tPHZ
tPLZ
tPZH
tPZL
(1)
(2)
10
Driver propagation delay
(VO/VPO, FSE0/VMO to D+, D–)
Driver disable delay (OE to D+, D–)
Driver enable delay (OE to D+, D–)
TEST CONDITIONS
MIN
MAX
LOW to HIGH (see Figure 4)
18
HIGH to LOW (see Figure 4)
18
HIGH to OFF (see Figure 2)
15
LOW to OFF (see Figure 2)
15
OFF to HIGH (see Figure 2)
15
OFF to LOW (see Figure 2)
15
UNIT
ns
ns
ns
Test circuit, see Figure ?
Driver timing in low-speed mode is not specified. Low-speed delay timings are dominated by the slow rise/fall times tLR and tLF.
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DYNAMIC ELECTRICAL CHARACTERISTICS FOR ANALOG I/O PINS (D+, D–) (1)
Receiver Timing, Full-Speed and Low-Speed Mode, Differential Receiver
over recommended ranges of operating free-air temperature and supply voltage, VCC = 4 V to 5.5 V or Vreg(3.3) = 3 V to 3.6 V,
VCC(I/O) = 1.65 V to 3.6 V, VGND = 0 V, see Table 10 for valid voltage level combinations, TA = –40°C to 85°C
(unless otherwise noted)
PARAMETER
tPLH(rcv)
tPHL(rcv)
(1)
TEST CONDITIONS
Propagation delay (D+, D– to RCV)
MIN MAX
LOW to HIGH (see Figure 3)
15
HIGH to LOW (see Figure 3)
15
UNIT
ns
Test circuit, see Figure ?
DYNAMIC ELECTRICAL CHARACTERISTICS FOR ANALOG I/O PINS (D+, D–) (1)
Receiver Timing, Full-Speed and Low-Speed Mode, Single-Ended Receiver
over recommended ranges of operating free-air temperature and supply voltage, VCC = 4 V to 5.5 V or Vreg(3.3) = 3 V to 3.6 V,
VCC(I/O) = 1.65 V to 3.6 V, VGND = 0 V, see Table 10 for valid voltage level combinations, TA = –40°C to 85°C
(unless otherwise noted)
PARAMETER
tPLH(se)
tPHL(se)
(1)
TEST CONDITIONS
Propagation delay (D+, D– to VP, VM)
MIN
MAX
LOW to HIGH (see Figure 3)
18
HIGH to LOW (see Figure 3)
18
UNIT
ns
Test circuit, see Figure 13
tFR,tLR
VOH
1.8 V
tFF,tLF
90%
0.9 V
Logic Input 0.9 V
90%
0V
10%
10%
VOL
MGS96 3
tPZH
tPZL
VOH
VOH − 0.3 V
Differential
Data Lines
VOL
Figure 1. Rise and Fall Times
2.0 V
Differential
Data Lines
tPHZ
tPLZ
VCRS
VOL + 0.3 V
MG S96 6
Figure 2. OE to D+, D–
1.8 V
VCRS
0.8 V
VCRS
tPLH(rcv)
tPLH(se)
VOH
Logic Output
Logic Output 0.9 V
0V
tPHL(rcv)
tPHL(se)
VOH
Differential
Data Lines
0.9 V
0.9 V
VOL
MGS965
Figure 3. D+, D– to RCV, VP, VM
0.9 V
tPLH(drv)
VCRS
tPHL(drv)
VCRS
VOL
MGS9 64
Figure 4. VO/VPO, FSE0/VMO to D+, D–
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APPLICATION INFORMATION
Test Point
33 Ω
500 Ω
D.U.T.
+
50 pF
V
–
MBL142
Figure 5. Load for Enable and Disable Times
A.
V = 0 V for tPZH, tPHZ
B.
V = Vreg(3.3) for tPZL, tPLZ
Test Point
25 pF
D.U.T.
MGS968
Figure 6. Load for VM, VP, and RCV
VPU(3.3)
1.5 kΩ
D.U.T.
D+/D–
33 Ω
CL
15 kΩ
Test Point
Figure 7. Load for D+, D–
12
A.
Full-speed mode: connected to D+
B.
Low-speed mode: Connected to D–
C.
Load capacitance:
•
CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing)
•
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing)
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1.65 V to 3.6 V
3.3 V
0.1 µF
GND
V
V
OE
CC
CC(I/O)
V
reg(3.3)
SPEED
0.1 µF
SOFTCON
V
CC(5.0)
SUSPND
1.5 kW
V
System ASIC
V
GND
pu(3.3)
33 W
RCV
BUS
0.1 µF
GND
D+
VMO/FSE0
33 W
VPO/VO
D–
VP
TUSB1106-Q1
VM
GND
GND
Figure 8. Peripheral-Side (Full-Speed) Regulator Bypass Mode
Peripheral-Side (Full-Speed) Regulator Bypass Mode
This mode is applicable when there is a 3.3-V supply already available on the board. The VBUS pin of the USB
connector, if left unused at the peripheral side, should be terminated with a 0.1-μF capacitor. While operating at
full speed, the 1.5-kΩ resistor must be connected between the D+ line and VPU(3.3) or an external 3.3-V supply.
When the VCC(5.0) and the Vreg(3.3) are connected together, the device operates at regulator bypass mode. This
enables power savings since the regulator is turned off.
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1.65 V to 3.6 V
3.3 V
0.1 µF
GND
V
V
OE
CC
CC(I/O)
V
reg(3.3)
SPEED
0.1 µF
SOFTCON
V
CC(5.0)
SUSPND
GND 1.5 kW
V
V
pu(3.3)
BUS
0.1 µF
System ASIC
RCV
33 W
GND
D+
VMO/FSE0
33 W
VPO/VO
D–
VP
TUSB1106-Q1
VM
GND
GND
Figure 9. Peripheral-Side (Low-Speed) Regulator Bypass Mode
Peripheral-Side (Low-Speed) Regulator Bypass Mode
This mode is applicable when there is a 3.3-V supply already available on the board. The VBUS pin of the USB
connector, if left unused at the peripheral side, should be terminated with a 0.1-μF capacitor. While operating at
low speed, the 1.5-kΩ resistor must to be connected between the D– line and VPU(3.3) or an external 3.3-V
supply. When the VCC(5.0) and the Vreg(3.3) are connected together, the device operates at regulator bypass mode.
This enables power savings since the regulator is turned off.
14
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1.65 V to 3.6 V
0.1 µF
GND
V
V
OE
CC
CC(I/O)
V
reg(3.3)
SPEED
0.1 µF
SOFTCON
V
CC(5.0)
SUSPND
GND
1.5 kW
V
System ASIC
V
0.1 µF
BUS
PU(3.3)
RCV
33 W
VMO/FSE0
D+
VPO/VO
D–
GND
33 W
VP
TUSB1106-Q1
VM
GND
GND
Figure 10. Peripheral-Side (Full-Speed) Internal Regulator Mode
Peripheral-Side (Full-Speed) Internal Regulator Mode
The USB side of the TUSB1106-Q1 can be powered from the VBUS line directly if a 3.3-V supply is not present on
board. In this case, the internal regulator can be used to provide the 3.3-V supply for USB signaling. The VCC(5.0)
is connected to the VBUS, which receives 5-V supply from the host, and generates the 3.3-V output at the Vreg(3.3)
pin. In this mode, it is important that both VCC(5.0) and Vreg(3.3) pins have individual bypass capacitors in the range
of 0.1 μF. Powering VCC(5.0) through the VBUS port of the USB connector realizes significant power saving for
portable applications, such as cell phones, PDAs, etc. In this operating mode, the ICC(5.0) current is fed from the
host. The USB-side power consumption, ICC(5.0) is 4 mA (with the regulator active), as opposed to logic-side
ICC(IO) of 1 mA under full-speed operation. While operating at full speed, the 1.5-kΩ resistor must be connected
between the D+ line and the VPU(3.3) or an external 3.3-V supply.
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1.65 V to 3.6 V
0.1 µF
GND
V
V
OE
CC
CC(I/O)
V
reg(3.3)
0.1 µF
SPEED
SOFTCON
GND
V
CC(5.0)
SUSPND
1.5 kW
V
System ASIC
0.1 µF
V
BUS
PU(3.3)
RCV
33 W
GND
D+
VMO/FSE0
33 W
D–
VPO/VO
VP
TUSB1106-Q1
VM
GND
GND
Figure 11. Peripheral-Side (Low-Speed) Internal Regulator Mode
Peripheral-Side (Low-Speed) Internal Regulator Mode
The USB side of the TUSB1106-Q1 can be powered from the VBUS line directly if a 3.3-V supply is not present on
board. In this case, the internal regulator can be used to provide the 3.3-V supply for the USB signaling. The
VCC(5.0) is connected to the VBUS, which receives 5-V supply from the host, and generates the 3.3-V output at the
Vreg(3.3) pin. In this mode, it is important that both VCC(5.0) and Vreg(3.3) pins have individual bypass capacitors in
the range of 0.1 μF. Powering VCC(5.0) through the VBUS port of the USB connector realizes significant power
saving for portable applications, such as cell phones, PDAs, etc. In this operating mode, the ICC(5.0) current is fed
from the host side. The USB-side power consumption, ICC(5.0) is 4 mA (with the regulator active), as opposed to
logic-side ICC(IO) of 1 mA under full-speed operation. While operating at low speed, the 1.5-kΩ resistor must be
connected between the D– line and the VPU(3.3) or an external 3.3-V supply.
16
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1.65 V to 3.6 V
0.1 µF
GND
V
CC(I/O)
5V
5V
0.1 µF
V
reg(3.3)
SOFTCON
CC(5.0)
SUSPND
0.1 µF
V
CC
SPEED
GND
V
V
OE
V
BUS
pu(3.3)
GND
33 W
RCV
D+
System ASIC
VMO/FSE0
33 W
D–
VPO/VO
15 kW
VP
15 kW
TUSB1106-Q1
VM
GND
GND
GND
GND
Figure 12. Host Side (VCC(5.0) Supplied From VBUS Pin)
Host Side (VCC(5.0) Supplied From VBUS Pin)
If there is no 3.3-V supply on board, an external 5-V supply can support the USB-side power needs. When the
VCC(5.0) is connected to an external 5-V supply, the on-chip regulator generates the 3.3-V internal supply rail,
which is used to drive the USB signaling levels at the USB side of the TUSB1106-Q1. The logic-side I/Os can
operate at any voltage range from 1.65 V to 3.6 V.
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1.65 V to 3.6 V
0.1 µF
3.3 V
GND
V
CC(I/O)
OE
V
CC
5V
V
reg(3.3)
SPEED
0.1 µF
SOFTCON
V
CC(5.0)
SUSPND
GND
V
BUS
V
pu(3.3)
33 W
RCV
D+
System ASIC
VMO/FSE0
33 W
D–
VPO/VO
15 kW
15 kW
VP
TUSB1106-Q1
VM
GND
GND
GND
GND
Figure 13. Host-Side (3.3-V Supply Present) Internal Regulator Bypass Mode
Host-Side (3.3-V Supply Present) Internal Regulator Bypass Mode
If a 3.3-V supply supports the USB-side power, VCC(5.0) and Vreg(3.3) must to be tied together and connected to a
3.3-V supply. It also makes the regulator inactive.
18
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Sep-2011
PACKAGING INFORMATION
Orderable Device
TUSB1106IPWRQ1
Status
(1)
Package Type Package
Drawing
ACTIVE
TSSOP
PW
Pins
Package Qty
16
2000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TUSB1106-Q1 :
• Catalog: TUSB1106
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TUSB1106IPWRQ1
Package Package Pins
Type Drawing
TSSOP
PW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TUSB1106IPWRQ1
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
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