TI MSP50C605

MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
D
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Advanced, Integrated Speech Synthesizer
for High-Quality Sound.
Operates up to 12.32 MHz (Performs up to
12 MIPS)
Single Chip Solution For Up to 37 Minutes
of Speech (Using 2.36 Mb of Onboard
Program Plus Data ROM)
Supports High-Quality Synthesis
Algorithms Such as MELP, CELP, LPC,
ADPCM, and Polyphonic Music
Simultaneous Speech Plus Music
Capabilities
Very Low-Power Operation, Ideal For
Hand-Held Devices.
Low-Voltage Operation, Sustainable by
Three Batteries
Reduced Power Stand-By Modes, Less
Than 10 µA in Deep-Sleep Mode
D
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640-Word RAM
32 I/O Pins Consisting of
– 24 General-Purpose Bit Configurable I/O
– 8 Inputs With Programmable Pullup
Resistors and a Dedicated Interrupt
(Key-Scan)
Direct Speaker Driver, 32 Ω (PDM)
One-bit Comparator With Edge-Detection
Interrupt Service
Resistor-Trimmed Oscillator or 32.768 kHz
Crystal Reference Oscillator
Serial Scan Port for In-Circuit Emulation
and Diagnostics
The MSP50C605 Is Sold in Die Form or
100-Pin PJM Package.
An Emulator Device Is Available in a
Ceramic Package for Development
description
The MSP50C605 is a low-cost, mixed-signal processor that combines a speech synthesizer, general-purpose
I/O, onboard ROM, and direct speaker drive in a single package. The computational unit utilizes a powerful new
DSP which gives the MSP50C605 unprecedented speed and computational flexibility compared with previous
devices of its type. The MSP50C605 supports a variety of speech and audio coding algorithms, providing a
range of options with respect to speech duration and sound quality.
The device consists of a micro-DSP core, embedded program, and data memory, and a self-contained clock
generation system. General-purpose periphery is comprised of 32 bits of partially configurable I/O.
The core processor is a general-purpose 16-bit microcontroller with DSP capability. The basic core block
includes computational unit (CU), data address unit, program address unit, two timers, eight level interrupt
processor, and several system and control registers. The core processor gives the MSP50C605 break-point
capability in emulation.
The processor is Harvard type for efficient DSP algorithm execution. It requires separate program and data
memory blocks to permit simultaneous access. The ROM has a protection scheme to prevent third-party
pirating. It is configured in 32K 17-bit words.
The total ROM space is divided into three areas: 1) The lower 2K words are reserved by Texas Instruments for
the purposes of a built-in self-test 2) The upper 30K words are for user program/data 3) Additional 1.83 Mb data
ROM provides data for up to 37 minutes of speech.
The data memory is internal static RAM. The RAM is configured in 640 17-bit words. All memories are designed
to consume minimum power at a given system clock and algorithm acquisition frequency.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
description (continued)
A flexible clock generation system enables the software to control the clock over a wide frequency range. The
implementation uses a phase-locked loop (PLL) circuit that drives the processor clock at a selectable frequency
between the minimum and maximum achievable. Selectable frequencies for the processor clock are spaced
apart in 65.536 kHz steps. The PLL clock-reference is also selectable; either a resistor-trimmed oscillator or a
crystal-referenced oscillator may be used. Internal and external clock sources are controlled separately to
provide different levels of power management.
The periphery consists of three 8-bit wide general-purpose I/O ports and one 8-bit wide dedicated input port.
The bidirectional I/O can be configured under software control as either high-impedance inputs or as totem-pole
outputs. They are controlled via addressable I/O registers. The input-only port has a programmable pullup
option (70-kΩ minimum resistance) and a dedicated service interrupt. These features make the input port
especially useful as a key-scan interface.
A simple one-bit comparator is also included in the periphery. The comparator is enabled by a control register,
and its pin access is shared with two pins in one of the general-purpose I/O ports. Rounding out the MSP50C605
periphery is a built-in pulse-density-modulated DAC (digital-to-analog converter) with direct speaker-drive
capability. The functional block diagram gives an overview of the MSP50C605 functionality.
functional block diagram
SCANIN
SCANOUT
SCANCLK
VSS
VDD
4
5
Power
Scan Interface
(EP)ROM
Break Point
Emulation
OTP Program
Serial Comm.
SYNC
TEST
32k x (16 + 1) bit
Test-Area
(reserved)
0x0000 to
0x07FF
User ROM
0x0800 to
0x7FEF
INT vectors
0x7FF0 to
0x7FFF
DAC
DACM
32 Ω PDM
0x30
Instr. Decoder
PCU
RESET
CU
Initialization
Logic
TIMER1
OSC Reference
TIMER2
Resistor
Trimmed
32 kHz nominal
OSCIN
or
or
OSCOUT
PLL
2
PLL Filter
Prog. Counter Unit
Computational Unit
PRD1
0x3A
TIM1
0x3B
PRD2
0x3E
TIM2
0x3F
+
Data
Control
E port I/O
Gen. Control
0x38
Data
Control
Interrupt Processor
FLAG
MASK
0x39
0x38
Data Mem. Addr.
RAM 640 x 17 bit
(data)
0x000 to
0x027F
• DALLAS, TEXAS 75265
8
–
D port I/O
0x3D
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PC0–7
0x10
0x14
Comparator
1 bit: PD5 vs PD4
Clock Control
DMAU
Crystal
Referenced
32.768 kHz
C port I/O
Data
Control
Core
DACP
224K bytes
Data ROM
PD0–7
0x18
0x1C
PE0–7
0x20
0x24
F port INPUT
Data
8
8
PF0–7
0x28
8
MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
pin assignments
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
VDD
V DD1
SCANOUT
TEST
SYNC
SYNCLK
SCANIN
RESET
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
PLL
OSCIN
OSCOUT
VSS
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
NC
NC
NC
NC
DACM
VDD3
DACP
VDD
PF7
PF6
PF5
PF4
PF3
PF2
PF1
PF0
VSS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
VSS3
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
VDD2
VSS
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
NC
PJM PACKAGE
(TOP VIEW)
NC – No internal connection
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3
MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
Terminal Functions
NAME
PIN NO.
PAD NO.
I/O
DESCRIPTION
Input/Output Ports
PC0 – PC7
89 – 82
8–1
I/O
Port C general-purpose I/O
PD0 – PD7
PE0 – PE7
PF0 – PF7
(1 Byte)
99 – 92
18 – 11
I/O
Port D general-purpose I/O
(1 Byte)
46 – 39
48 – 41
I/O
Port E general-purpose I/O
(1 Byte)
16 – 9
31 – 24
I
Port F key-scan input
(1 Byte)
Pins PD4 and PD5 may be dedicated to the comparator function, if the comparator enable bit is set.
Refer to Section 3.3, Comparator, for details.
Scan Port Control Signals
SCANIN
37
39
I
Scan port data input
SCANOUT
33
35
O
Scan port data output
SCANCLK
36
38
I
Scan port clock
SYNC
35
37
I
Scan port synchronization
TEST
34
36
I
C605: test modes
The scan port pins must be bonded out on any MSP50C605 production board.
Consult the Important Note regarding Scan Port Bond Out, see Chapter 7 in the MSP50C614 User’s Guide (SPSU014).
Reference Oscillator Signals
OSCOUT
49
51
O
Resistor/crystal reference out
OSCIN
48
50
I
Resistor/crystal reference in
PLL
47
49
O
Phase-lock-loop filter
DACP
7
22
O
Digital-to-analog plus output (+)
DACM
5
20
O
Digital-to-analog minus output (–)
RESET
38
40
I
Initialization
VSS
17, 50, 90,
100†
32, 52, 9,
19†
Ground
VDD
6†, 8, 31,
32, 91
21†, 23,
33, 34, 10
Processor power (+)
Digital-to-Analog Sound Output
Initialization
Power Signals
† The VSS and VDD connections service the DAC circuitry. Their pins tend to sustain a higher current draw. A dedicated decoupling capacitor across
these pins is therefore required.
4
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MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 7 V
Supply current, IDD (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VDD + 0.3 V
Storage temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30°C to 125°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Unless otherwise noted, all voltages are measured with respect to VSS .
2. The total supply current includes the current out of all the I/O pins as well as the operating current of the device.
recommended operating conditions
MIN
Supply voltage (with respect to VSS), VDD
CPU clock rate (as programmed), f(CPU)
Load resistance between DACP and DACM, R(DAC)
MAX
UNIT
3
5.2
64
12,320
kHz
V
70
°C
Ω
32
Operating free-air temperature, TA
Device functionality
0
timing requirements
MIN
t(RESET)
t1(WIDTH)
Reset low pulse width, while VDD is within specified limits
MAX
UNIT
100
Pulse width required prior to a negative transition at pin...PD3, PD5, or PF0...PF7‡
Pulse width required prior to a positive transition at pin...PD2 or PD4†
t2(WIDTH)
‡ While these pins are being used as interrupt inputs.
2
2
ns
1/FCPU
1/FCPU
t(RESET)
t(RESET)
Figure 1. Initialization Timing Diagram
t1(WIDTH (PD3, PD5, or F port))
t1(WIDTH)
t2(WIDTH (PD2, or PD4))
t2(WIDTH)
Figure 2. MSP50C605 External Interrupt Pin Pulse Width Requirements t1WIDTH and t2WIDTH
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5
MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
dc electrical characteristics, TA = 0°C – 70°C
PARAMETER
TEST CONDITIONS
VDD = 3 V
RESET
Threshold
changes
VDD = 5.2 V
VIH
VIL
High level input
High-level
voltage
Low-level
Low
level input
voltage
MIN
TYP†
Positive going threshold
2.4
Negative going threshold
1.8
Hysteresis
0.6
Positive going threshold
3.3
Negative going threshold
2.9
Hysteresis
0.4
MAX
V
V
VDD = 3 V
VDD = 4.5 V
2
3
3
4.5
VDD = 5.2 V
VDD = 3 V
3.5
5.2
0
1
VDD = 4.5 V
VDD = 5.2 V
0
1.5
0
1.7
IOH¶
High-level output
current per pin of
I/O port
IOL¶
Low-level output
current per pin of
I/O port
IOH (DAC)
High-level output
DAC current
VOH = 4 V
IOL (DAC)
Low-level output
DAC current
VOL = 0.5 V
Ilkg
Input leakage
current
Excludes OSCIN
Standby current
RESET is low
Operating current
VDD = 4.5 V,
VDD = 4.5 V,
FCLOCK = 12.32 MHz
DAC off,
ARM set,
OSC disabled
0.05
Supply current
VDD = 4.5 V,
VDD = 4.5 V,
DAC off,
ARM set,
OSC enabled
40
60
DAC off,
ARM clear,
OSC enabled
60
100
Vref = 1 to 4.25 V
25
50
I(STANDBY)
IDD‡
I(SLEEP-deep)
I(SLEEP-mid)
I(SLEEP-light)
VOH = 4 V
VDD = 4.5 V
VIO
Input offset
voltage
VDD = 4.5 V,
R(PULLUP)
F port pullup
resistance
VDD = 5 V
∆f(RTO
ti )
(RTO-trim)
Trim deviation
∆f(RTO
lt)
(RTO-volt)
Voltage deviation
∆f(RTO
t
)
(RTO-temp)
Temperature
deviation
∆f(RTO
(RTO-res))
Resistance
deviation
VOL = 0.5 V
0.05
RRTO = 470 kΩ,
VDD = 4.5 V, TA = 25°C,
fRTO = 8.192 MHz (PLL setting = 7 Ch)§
RRTO = 470 kΩ,
VDD = 3.5 to 5.2 V,
fRTO = 8.192 MHz (PLL setting = 7 Ch)§
TA = 25°C,
RRTO = 470 kΩ,
VDD = 4.5 V, TA = 0 to 70°C,
fRTO = 8.192 MHz (PLL setting = 7 Ch)§
VDD = 4.5 V,
TA = 25°C,
ROSC = 470 kΩ at ± 1%,
fRTO = 8.192 MHz (PLL setting = 7 Ch)§
V
mA
5
mA
–10
mA
20
mA
1
µA
10
µA
mA
10
150
± 1%
V
–2
15
70
UNIT
µA
mV
kΩ
± 3%
± 1.5%
1 5%
± 0.03
0 03
%/°C
± 1%
† Typical voltage and current measurements taken at25°C25°C
‡ Operating current assumes all inputs are tied to either VSS or VDD with no input currents due to programmed pullup resistors. The DAC output
and other outputs are open circuited.
§ The best trim value is selected at nominal temperature and voltage but the deviation due to the trim error is ignored.
¶ Cannot exceed 15 mA total per internal VDD pin. Port A, B share 1 internal VDD pin; Port C, D share 1 internal VDD.
6
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MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
external component absolute values
PARAMETER
R(RTO)
RTO external resistance
C(PLL)
PLL external capacitance
TEST CONDITIONS
TA = 25°C,
TA = 25°C,
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MAX
UNIT
1% tolerance
MIN
470
kΩ
10% tolerance
3300
pF
7
MSP50C605
MIXED-SIGNAL PROCESSOR
SPSS025B– FEBRUARY 2000 – REVISED FEBRUARY 2001
MECHANICAL DATA
PJM (R-PQFP-G100)
PLASTIC QUAD FLATPACK
0,38
0,22
0,65
80
0,13 M
51
50
81
12,35 TYP
100
14,20
13,80
17,45
16,95
31
1
30
0,16 NOM
18,85 TYP
20,20
19,80
23,45
22,95
2,90
2,50
Gage Plane
0,25
0,25 MIN
0°– 7°
1,03
0,73
Seating Plane
0,10
3,40 MAX
4040022 / B 03/95
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-022
8
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Copyright  2001, Texas Instruments Incorporated