ONSEMI MC74LCX06DTG

MC74LCX06
Low-Voltage CMOS Hex
Inverter with Open Drain
Outputs
With 5 V − Tolerant Inputs
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The MC74LCX06 is a high performance hex inverter operating
from a 2.3 V to 3.6 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers. These LCX
devices have open drain outputs which provide the ability to set output
levels, or do active−HIGH AND or active−LOW OR functions. A VI
specification of 5.5 V allows MC74LCX06 inputs to be safely driven
from 5.0 V devices.
MARKING
DIAGRAMS
14
14
1
Features
•
•
•
•
•
•
LCX06G
AWLYWW
1
Designed for 2.3 V to 3.6 V VCC Operation
5.0 V Tolerant Inputs/Outputs
14
LVTTL Compatible
LVCMOS Compatible
24 mA Output Sink Capability
14
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
Latchup Performance Exceeds 500 mA
•
• Wired−OR, Wired−AND
• Output Level Can Be Set Externally Without Affecting Speed of
Device
• Functionally Compatible with LCX05
• ESD Performance: Human Body Model >1500 V;
•
SOIC−14
D SUFFIX
CASE 751A
Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
VCC
A3
O3
A4
O4
A5
O5
14
13
12
11
10
9
8
1
2
3
4
5
6
7
A0
O0
A1
O1
A2
O2
GND
1
LCX
06
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
1
A
= Assembly Location
WL, L = Wafer Lot
Y
= Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Figure 1. Pinout: 14−Lead (Top View)
© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 9
1
Publication Order Number:
MC74LCX06/D
MC74LCX06
A0
A1
A2
A3
A4
A5
1
*
2
3
*
4
5
*
6
13
*
12
*
10
*
8
11
9
Table 1. PIN NAMES
O0
O1
Pins
Function
An
On
Data Inputs
Outputs
O2
Table 2. TRUTH TABLE
O3
O4
O5
An
On
L
H
Z
L
* OD
Figure 2. Logic Diagram
MAXIMUM RATINGS
Symbol
Parameter
VCC
DC Supply Voltage
VI
Value
Condition
Unit
−0.5 to +7.0
V
DC Input Voltage
−0.5 ≤ VI ≤ +7.0
V
VO
DC Output Voltage
−0.5 ≤ VO ≤ +7.0
Output in HIGH or LOW State (Note 1)
V
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
+50
VO > VCC
mA
IO
DC Output/Sink Current
+50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
MSL
Moisture Sensitivity
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
ORDERING INFORMATION
Package
Shipping†
MC74LCX06DG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74LCX06DR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74LCX06DTG
TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LCX06DTR2G
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MC74LCX06
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
Operating
Data Retention Only
VI
Input Voltage
VO
Output Voltage
IOL
LOW Level Output Current
Sink
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V
Min
Typ
Max
Unit
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
0
5.5
V
0
VCC
V
+24
+12
+8
mA
−40
+85
°C
0
10
ns/V
(HIGH or LOW State)
VCC = 3.0 V − 3.6 V
VCC = 2.7 V − 3.0 V
VCC = 2.3 V − 2.7 V
DC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C)
Symbol
VIH
Characteristic
HIGH Level Input Voltage (Note 2)
VIL
LOW Level Input Voltage (Note 2)
VOL
LOW Level Output Voltage
IOZ
3−State Output Current
IOFF
Power Off Leakage Current
IIN
Input Leakage Current
ICC
Quiescent Supply Current
DICC
Increase in ICC per Input
Condition
Min
2.3 V ≤ VCC ≤ 2.7 V
1.7
2.7 V ≤ VCC ≤ 3.6 V
2.0
Max
Unit
V
2.3 V ≤ VCC ≤ 2.7 V
0.7
2.7 V ≤ VCC ≤ 3.6 V
0.8
2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA
0.2
VCC = 2.3 V; IOL= 8 mA
0.3
VCC = 2.7 V; IOL= 12 mA
0.4
VCC = 3.0 V; IOL = 16 mA
0.4
V
V
VCC = 3.0 V; IOL = 24 mA
0.55
VCC = 3.6 V, VIN = VIH or VIL,
VOUT = 0 to 3.6 V
±5
mA
VCC = 0, VIN = 3.6 V or VOUT = 3.6 V
10
mA
VCC = 0 to 3.6 V, VIN = 3.6 V or GND
±5
mA
VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V
10
mA
2.3 V ≤ VCC ≤ 3.6 V
One Input at VIH = VCC − 0.6 V
500
mA
2. These values of VI are used to test DC electrical characteristics only.
AC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C)
VCC = 3.3 V ± 0.3 V
CL = 50 pF
Symbol
tPLZ
tPZL
Parameter
Propagation Delay
Input to Output
VCC= 2.7 V
CL = 50 pF
VCC = 2.5 V ± 0.2 V
CL = 30 pF
Min
Max
Min
Max
Min
Max
Unit
0.8
0.8
3.7
3.7
1.0
1.0
4.1
4.1
0.8
0.8
3.5
3.5
ns
ns
DYNAMIC SWITCHING CHARACTERISTICS (TA = +25°C)
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
VOLP
Dynamic LOW Peak Voltage (Note 3)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.9
0.7
V
VOLV
Dynamic LOW Valley Voltage (Note 3)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
−0.8
−0.6
V
3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
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3
MC74LCX06
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
COUT
Output Capacitance
CPD
Power Dissipation Capacitance
Condition
Typical
Unit
VCC = 3.3 V, VI = 0 V or VCC
7
pF
VCC = 3.3 V, VI = 0 V or VCC
8
pF
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
25
pF
VCC
Vmi
An
Vmi
0V
tPZL
On
tPLZ
Vmo
VLZ
VOL
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Table 3. AC WAVEFORMS
VCC
3.3 V $ 0.3 V
2.7 V
2.5 V $ 0.2 V
Vmi
1.5 V
1.5 V
VCC / 2
Vmo
1.5 V
1.5 V
VCC / 2
VLZ
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.15 V
Symbol
VCC
6 V or VCC × 2
R1
PULSE
GENERATOR
DUT
RT
CL
RL
Table 4. TEST CIRCUIT
TEST
SWITCH
tPZL, tPLZ
6V
Open Collector/Drain tPLH and tPHL
6V
tPZH, tPHZ
GND
CL = 50 pF at VCC = 3.3 $ 0.3 V or equivalent (includes jig and
probe capacitance)
CL = 30 pF at VCC = 2.5 $ 0.2 V or equivalent (includes jig and
probe capacitance)
RL = R1 = 500 W or equivalent
RT = ZOUT of pulse generator (typically 50 W)
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4
GND
MC74LCX06
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
MC74LCX06
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE J
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
B
M
M
7
1
G
−T−
0.25 (0.010)
M
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
D 14 PL
F
R X 45 _
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
S
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
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Sales Representative
MC74LCX06/D