TB62D901FNG TOSHIBA BiCD Integrated Circuit Silicon Monolithic TB62D901FNG AC/DC Step-Down Conversion Type LED Lighting Driver 1. General The TB62D901FNG is a constant current driver IC ideal for use in the step-down AC/DC conversion type LED lighting applications. The TB62D901FNG features architecture with automatic Off time adjustment control that can be used to achieve minimum LED current variations by the effect of fluctuated input voltage or change of LED forward voltage. The device allows linear dimming or PWM dimming. It has extensive detection functions that are thermal shutdown, over-current detection, over-voltage detection, under-voltage lockout, and current sensing input terminal (ISEN1) open detection. TB62D901FNG SSOP16-P-225-0.65B Weight: 0.07 g (typ.) 2. Application LED lighting 3. Features • Operating supply voltage • Dimming function • Switching frequency • Operation mode • Efficiency • Detection function • IC standby function • Operating temperature • Package : 12V to 30V : Linear dimming (by adjustment of LED peak current) PWM dimming : Adjustable of up to 500kHz (MAX) : Current continuous conduction mode (Automatic OFF time control mode, Fixed off time mode) Critical conduction mode : 90% or more with recommended components : Thermal shutdown (TSD) : Over-current detection (OCP) : Over-voltage detection (OVP) : Under-voltage lockout (UVLO) : ISEN terminal open detection (IOP) : EN signal allows standby mode with 0.8mA (MAX) consumption current : Topr = −40 °C to 105 °C : SSOP16-P-225-0.65B 1 2012-03-12 TB62D901FNG 4. Block Diagram VCC Vref LDO UVLO TSD VREG COMP PWMD RC OFF time Control VSEN EN LD REF COMP R Q MS Gate Driver LOGIC S GATE ISEN2 PGND OSC ISEN2 PGND ISEN OPEN Protection ISEN1 GND 2 2012-03-12 TB62D901FNG 5. Pin Assignment (top view) VCC 1 16 PGND VREG 2 15 GATE MS 3 14 ISEN1 PWMD 4 13 ISEN2 LD 5 12 VSEN RC 6 11 NC EN 7 10 NC GND 8 9 NC 6. Pin Description Pin No 1 2 Pin Name VCC VREG 3 MS I 4 PWMD I 5 6 LD RC I I 7 EN I 8 9 10 11 GND NC NC NC P - 12 VSEN I 13 ISEN2 I 14 ISEN1 I 15 16 GATE PGND O P I/O Function P O Power supply input. Output of the internal regulator. Input to set switching operation mode. GND short-circuit: Continuous mode VREG terminal short-circuit: Critical mode PWM signal input for the PWM dimming. “H" level voltage input: LED lighting current on "L" level voltage input: LED lighting current off Analogue input voltage to set the peak value of the LED current. Analog input to set the ripple range of the LED current. IC enable signal input. “H" level voltage input: Operation mode "L" level voltage input: Standby mode. In standby mode, circuits other than the regulator circuit, the standard voltage circuit, and the UVLO circuit stop operation. Ground. No Connect. Connect to GND No Connect. Connect to GND No Connect. Connect to GND Input for feedback voltage. This input voltage of VSEN determines the OFF time of the control output GATE for external power MOSFET of the step-down driver. Detection terminal for LED current. Connect to the GND side of the current sensing resistor between ISEN1 and GND. Detection terminal for LED current. The peak value of LED current is determined by the resistance connected between ISEN1 terminal and GND. Output for controlling the Gate of the Power MOSFET Power ground for GATE diver. *I/O symbol I: Input, O: Output, P: Power supply 3 2012-03-12 TB62D901FNG 7. I/O Equivalent Circuits Pin No Pin Name 1 VCC Equivalent circuit Pin No Pin Name 8 GND Equivalent circuit VREG VCC 2 VREG 13 PGND PGND GND ISEN2 3 MS 16 ISEN2 5 LD 12 VSEN 6 RC 14 ISEN1 VCC 4 PWMD 15 GATE PGND 7 PGND EN 4 2012-03-12 TB62D901FNG 8. Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Note1 Unit Supply voltage VCC −0.3 to 40 V Input pin voltage (PWMD, LD, RC, EN, and MS) VIN −0.3 to 6.0 V VREG pin voltage VREG −0.3 to 6.0 V Feedback pin voltage (ISEN1 and VSEN) VFB −0.3 to 6.0 V VGATE −0.3 to VCC V Operating temperature Topr −40 to 105 °C Storage temperature Tstg −55 to 150 °C Thermal resistance Rth(j-a) 87.3* Note 2 °C/ W Power dissipation PD 1.43* Note2,3 W GATE pin voltage Note1: Voltage is PGND/GND/ISEN2 referenced. Note2: PCB condition is 76.2×114.3×1.6mm (JEDEC 4 layer substrate) Note3: When ambient temperature is 25°C or more. Every time ambient temperature exceeded 1°C, please decrease 1/Rth(j-a). 9. Operating Condition (Unless otherwise noted, Ta = -40 to 105 °C) Characteristics Symbol Test Conditions Min Typ. Max Unit Operating supply voltage VCC 12 ― 30 V Switching frequency fSW ― ― 500 kHz 0.2 ― 3.8 4.5 ― VREG 1 ― 4.0 VLD1 LD pin input voltage VLD2 VRC1 RC pin input voltage VRC2 VSEN pin input voltage When LED peak current adjustment function is used When LED peak current adjustment peak current adjustment peak current adjustment function is not used When LED function is used When LED function is not used V V 0 ― 0.5 VVSEN1 When using it in automatic OFF time control mode 0.5 ― 3 VVSEN2 When using it in Fixed OFF time mode 4.5 ― VREG V GATE pin output voltage which is the same level as VCC. Please set up VCC in consideration of the Absolute Maximum Ratings of the external power MOSFET 5 2012-03-12 TB62D901FNG 10. Electrical Characteristics (Unless otherwise noted, Ta = 25 °C, VCC=12V) Characteristics Symbol Test Conditions Min Typ. Max Unit ＜Consumption current＞ Operating consumption current ICC(ON) EN=H, PWMD=H, MS=L VVSEN= VREG, VLD=VREG, VRC=0V VISEN1=0V ― 2.0 2.5 Standby consumption current ICC(OFF) EN=L ― 0.5 0.8 VREG IREG IREG=0mA 4.9 ― 5 ― 5.1 2 V mA VUVLO(UP) VUVLO(DOWN) VCC rising VCC falling 10.5 8.0 11 8.5 11.5 9.0 V V IGATE=-100mA IGATE=100mA CL=1nF ― ― ― 5 2.5 15 10 5 30 Ω Ω ns CL=1nF EN=H, PWMD=H, MS=L VVSEN= VREG, VLD=VREG , VRC=0V ― 15 30 ns 3.87 4 4.13 μs 32 1.4 VLD +0.1 VLD -0.0 130 10 35 1.6 VLD +0.4 VLD +0.2 140 20 38 1.8 VLD +0.7 VLD +0.4 150 30 V °C °C VINH 1.5 ― VREG V VINL 0 ― 0.4 V mA ＜Regulator part＞ VREG output voltage VREG maximum output current ＜UVLO part＞ UVLO release voltage UVLO operation voltage ＜GATE Driver part＞ GATE pin source resistance GATE pin sink resistance GATE pin rising time GATE pin falling time MOSFET OFF time RGATEH RGATEL trGATE tfGATE tOFF ＜Detection circuit part＞ OVP operation voltage OCP operation voltage TSD operation temperature TSD hysteresis temperature VOVP VOCP1 VCC pin ISEN pin, VLD=VREG VOCP2 ISEN pin, VLD=0.2V VOCP3 ISEN pin, VLD=3.8V TTSD TTSD(HYS) Temperature rising Temperature falling V ＜Input pin part＞ Input pin high level input voltage (PWMD, EN, and MS) Input pin Low level input voltage (PWMD, EN, and MS) IINH Measurement pin is PWMD, EN, LD, and RC. VIN=VREG, VISEN1=0V ― ― 1 μA IINL Measurement pin is PWMD, EN, MS, LD, and RC. VIN=0V, VISEN1=0V -1 ― ― μA 240 300 360 kΩ Input pin input current MS pin pull down resistance RUP ＜Detection pin part＞ ISEN pin peak voltage Detection blanking time VPEAK1 VLD=VREG VPEAK2 VLD=0.2V to 3.8V tBLK 0.95 1.0 1.05 VLD/1.5 VLD/1.5 VLD/1.5 -0.1 +0.1 250 6 400 550 V ns 2012-03-12 TB62D901FNG 11. Description of Operation 11.1 Standard connection diagram FUSE TB62D901FNG VREG EN VSEN VCC PWMD PWM input LD RC MS GND PGND GATE ISEN1 ISEN2 7 2012-03-12 TB62D901FNG 11.2 Operation modes There are three operation modes, and the modes are set by pins MS and VSEN. Each mode has the different control method resulting in the different GATE output to the external power MOSFET. Table 1 Operation Mode Comparison Output of GATE to Control the Power MOS (M1) OFF time On time Pin Settings Operation mode MS l VSEN VREG 1 Fixed OFF time mode GND 2 Automatic OFF time control mode GND 3 Critical mode VREG It is determined by voltage detection in ISEN1 pin It is determined by It is determined by voltage voltage detection in detection in VSEN pin ISEN1 pin It is determined by detecting It is determined by voltage detection in 0 mA of LED current in ISEN1 pin VSEN pin It is fixed at 4μs (TYP.). (when VRC=0V) Connected to the secondary side of the transformer Connected to the secondary side of the transformer 11.2.1 Fixed Off time mode LED current ILED in path A is detected as the voltage on the current-sense resistor RSET on the ISEN1 input. When I LED rises to the set peak current I LEDP , M1 is turned off. And M1 is turned on again after turned off a period of time, for example, 4 μs (Typ.) when VRC is 0 V. The peak current can be set with the input voltage to LD pin. (Please refer to 12.2, Figure for details). The off period can be set by an applied voltage to the RC pin. (Please refer to 12.3, Figure for details). VIN of the LEDs is referred to the unregulated diode bridge rectified DC voltage that can fluctuate considerably. The influence of the input voltage (VIN) change on the LED current can be reduced to the minimum by this control system. This mode can be implemented with fewer components. ILED route A ILED route B VIN 4us (TYP) 4us (TYP) 4us (TYP) 4us (TYP) 4us (TYP) 4us (TYP) 4us (TYP) 4us (TYP) 4us (TYP) M1 is ON VGATE M1 is OFF L Peak current ILEDP VSEN VREG MS GATE VGATE M1 ISEN1 ISEN2 RSET ILED Route where ILED flows A B A B A B A B A B A B A B A B A B A Figure 1. Fixed Off-Time Control 8 2012-03-12 TB62D901FNG 11.2.2 Automatic OFF Time Control Mode ILED route A ILED route B VIN TOFF TOFF TOFF TOFF TOFF TOFF TOFF TOFF TOFF M1 is ON VGATE M1 is OFF Peak current set at pin LD and sensed at pin ISEN1 VSEN MS ILED GATE ISEN1 ISEN2 VGATE M1 Pathes where ILED flows A B A B A B A B A B A B A B A B A B A RSET Figure 2 Automatic Off-Time Control When LED current ILED in path A, which is detected at the ISEN1 pin, rises to the set peak current, M1 is turned off. And M1 is turned on again after the OFF period of M1 (tOFF) (refer to Figure 2). The peak current is set by an applied voltage to the LD pin. (Please refer to 12.2 for details). tOFF is determined by the voltage on inputs VSEN and RC.(Please refer to 12.3, Figure 3 and 8 for details.). In the example of Figure 2, the voltage at VSEN pin is generated by the secondary side of the transformer and the input voltage of RC pin. Secondary side voltage is stabilized by total Vf of LED. It is recommended that the voltage generated on the secondary side is divided by resistors and to keep the voltage applied to VSEN pin at around 1V. The Off time of M1 is adjusted automatically when Vf of the LED and the free wheeling diode are changed due to the temperature characteristics and the change of the voltage applied to VSEN pin (compared to 1 V) is detected. Figure 3. OFF time vs. VSEN when VRC<0.5V Please use the IC by inputting a voltage to the VSEN pin in the range of 0.5V to 3.0V or 4.5V to VREG. In this mode, the dependence of the LED current on the input voltage VIN and Vf are reduced. 9 2012-03-12 TB62D901FNG 11.2.3 Critical mode ILED route A ILED route B VIN Recommend to be the voltage of 0.5 V or more It is zero detection control with a VSEN terminal. VSEN M1 is ON VGATE M1 is OFF The peak current is controlled with the ISEN1 terminal. VSEN MS VREG ILED GATE VGATE M1 Route where ILED flows ISEN1 ISEN2 A B A B A B RSET Figure 4 Critical Conduction Mode When ILED in path A detected with the ISEN1 pin rises to the set peak current, M1 is turned off. And M1 is turned on again when VSEN pin, connected to the secondary side of the transformer, detects that ILED in path B becomes 0 mA approximately. The peak current is set by an applied voltage to LD pin. The influence of input voltage (VIN) change and Vf of LED change on the LED current (ILED) can be reduced to the minimum by this control system. In comparing to other modes, the efficiency can be increased and the noise can be reduced in this mode because M1 switching frequency decreases. While the current flows in the ILED path B, it is recommended that the voltage of 0.5 V or more is applied on the VSEN pin. 10 2012-03-12 TB62D901FNG 12. Dimming function This TB62D901FNG incorporates three kinds of dimming function. Table1 2 Operation mode Control Methods Input Pin Signal Type Dimming Results Peak current Ripple current value LED current 1 PWM Dimming PWMD Digital signals 2 Linear Dimming Ripple Dimming LD RC Analogue voltage Analog voltage 3 Dimming Control Mode Comparison PWMD=H: ON PWMD=L: OFF ON Change Fixed ON Fixed Changed Fixed Fixed 12.1 PWM dimming The LED current is turned on and off according to the PWM signal input to the PWMD input pin. When this function is not used, please connect PWMD to the VREG pin. PWM signal ILED Figure 5 PWM Dimming 12.2 Linear Dimming This is a linear dimming by controlling the peak current of LED. The peak current of LED is controlled by VLD the analog voltage applied to the LD pin from which an internal voltage VPEAK is derived to the input of an internal comparator. The comparator to compare VPEAK and the voltage from input ISEN1 of the current sensing resistor RSET. VPEAK is determined by method of applied voltage to LD pin. Table 3 VPEAK setting Input voltage to LD pin VLD VPEAK The LD and the VREG pins are shorten together. (When not using linear dimming by LD input) 1.0V(TYP.) The analog voltage is applied to LD pin. VLD/1.5(TYP.) (VLD needs to be in the range of 0.2V to 3.8V) . VPEAK vs VLD Do not set it in this area 3 2.5 2 VPEAK (V) VLD 1.5 1 0.5 ILED 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 VLD (V) (a) Waveform of LED current vs control voltage VLD (b) The relation between VPEAK and VLD Figure 6 Linear Dimming 11 2012-03-12 TB62D901FNG 12.3 Ripple Dimming This is a linear dimming by controlling the ripple value of LED current. TOFF of M1 is controlled by the analog voltage input to the RC pin. The ripple value of LED current is adjusted by changing TOFF of M1. Table 4 Setting TOFF of M1 Input to RC pin RC pin is connected with the GND. (In case linear dimming by a RC pin isn't applied.) The analog voltage is input to RC pin. TOFF 4μs (TYP.) under the condition that VSEN is 1V. Please refer to the following graph. Please set the input voltage to a RC pin (VRC) in the range of 1.0V to 4.0V. (a) Waveform of operation in adjusting the ripple value by RC pin (b) GATE turn OFF time vs VRC Figure 7 Ripple Dimming VRC=4V VRC=3V VRC=2V VRC=4V VRC=3V VRC=1V VRC=2V VRC=1V Figure 8 Off time Vs VRC VSEN Please use the IC by inputting the voltage to the VSEN pin in the range of 0.5V to 3.0V or 4.5V to VREG. 12 2012-03-12 TB62D901FNG 13. Detection functions There are several built in detection functions, which are summarized in Table 5 Table 5 Detection Modes Detection function Effect Detection point detection level Operation in detection Thermal shutdown (TSD) Prevention of overheating Internal temperature of IC TTSD It stops switching Temperature falls by 20°C(TYP.) or more from the detection level Over-current detection (OCP) Prevention of over current caused by short-circuit ISEN1 pin voltage VOCP When it is detected four consecutive times, the OCP operates It stops switching Recycle Power supply or toggle EN VCC pin voltage VUVLO It changes to standby mode. Vcc rises by 2.5V(TYP.) or more from the detection level VCC pin voltage VOVP It stops switching ISEN1 pin voltage VPEAK When it is detected that GATE pin voltage is 0V for an extended period, the IOP operates It stops switching. Under-voltage lockout (UVLO) Over-voltage detection (OVP) ISEN1 pin open detection (IOP) Prevention of malfunction caused by IC supply voltage abnormality Prevention of malfunction caused by IC supply voltage abnormality. Prevention of over-current caused by detecting pin open. Reset condition Recycle Power supply or toggle EN Recycle Power supply or toggle EN FUSE TSD Overheating prevention Input voltage generation TB62D901FNG VREG EN VSEN VCC PWMD PWM input LD RC MS GND PGND IOP Over-current by open-circuit of an ISEN terminal is prevented. GATE ISEN1 ISEN2 UVLO, OVP An IC malfunction by abnormality of an input voltage generation circuit is prevented. OCP Over-current by short of an LED, a transformer and Di is prevented. Figure 9 Detection Overview 13 2012-03-12 TB62D901FNG 13.1 Thermal shutdown function (TSD) This function prevents overheating of IC. When the IC internal temperature reaches 140°C (TYP.) or more, the TSD operates. During TSD, output voltage of the GATE pin becomes 0V. And switching control of power MOSFET is stopped. When the IC temperature falls by 20°C (TYP.) or more from TSD temperature, the normal operation resumes. 13.2 Over-current detection function (OCP) Though LED current is usually controlled to keep the voltage of the ISEN pin (VPEAK) or less, the LED current becomes out-of- control and increases suddenly when the LED, the transformer, and the Diode are short-circuited. OCP prevents this sudden increase. OCP operates when the voltage of the ISEN1 pin becomes VOCP or more for four cycles continuously (It counts from switching of the 2nd shot after power on.). LD S Q R Gate Driver Logic GATE REF VOCP Over-current detection COMP VPEAK Peak current detection ISEN1 COMP RSET Figure 10 OCP Block Diagram When OCP operates, output voltage of the GATE pin becomes 0V. And it moves to the switching stop mode. By recycling power supply or toggling EN (EN=H→L→H), it returns to normal operation mode. Table 6 Setup of VOCP and VPEAK Input to the LD pin LD pin is connected with the pin VREG. (When linear dimming by a LD pin isn't used) The analog voltage is input to LD pin. VOCP VPEAK 1.6V (TYP.) 1.0V (TYP.) VLD +0.2 (TYP.) @VLD=3.8V VLD/1.5 (TYP.) 13.3 Under-voltage lockout function (UVLO) This function prevents a malfunction in IC supply voltage abnormality caused by trouble of an input voltage generation circuit. When input voltage of the VCC pin becomes 8.5V (TYP.) or less which corresponds to UVLO operation voltage, UVLO operates. When UVLO operates, output voltage of the GATE pin becomes 0V. And it moves to standby mode. When If input voltage of the VCC pin rises by 2.5V (TYP.) or more from UVLO operation voltage, normal operation resumes. 14 2012-03-12 TB62D901FNG 13.4 Over-voltage detection function (OVP) This function prevents a malfunction in IC supply voltage abnormality caused by trouble of an input voltage generation circuit. This function becomes effective from switching of the 2nd shot after power supplies. When input voltage of the VCC pin becomes 35V (TYP.) or more which corresponds to OVP operation voltage, OVP operates. When OVP operates, output voltage of the GATE pin becomes 0V. And it moves to switching stop mode. By recycling power supply or toggling EN (EN=H→L→H), normal operation resumes. 13.5 ISEN1 input open detection function (IOP) When the ISEN1 pin, which controls on time, is open, the peak current of LED becomes out-of-control. This function prevents an over-current flowing to an LED. The path, in which the detection current of 2μA (TYP.) flows, disappears when the ISEN1 pin is open. And the voltage of ISEN1 pin rises. When the voltage of the ISEN1 pin rises to VPEAK under the condition the t GATE pin voltage is 0V, the IOP operates and it moves to the switching stop mode. By recycling power supply or toggling EN (EN=H→L→H), normal operation resumes. Logic GATE Gate Driver 2µA(TYP) OPEN detection COMP VPEAK ISEN1 RSET Figure 11 ISEN1 open Detection Block Diagram 15 2012-03-12 TB62D901FNG 14. IC power supply In normal operation, the current is supplied from the transformer auxiliary winding. And in starting, the current is supplied from the AC line, and it charges CSTA through startup resistance (RSTA). When the voltage of VCC pin rises above 11V (TYP.) or more, the UVLO is released, and IC starts operation. When the voltage generates in the auxiliary winding of a transformer by switching of power MOSFET, VCC supply from auxiliary winding starts. FUSE When starting, the current is supplied from the AC line, and it charges CSTA. RSTA When regularly operating, the current is supplied from the transformer auxiliary winding. VSEN TB62D901FNG VCC Regulator CSTA When VCC becomes 11V(TYP) or more, IC is driven by the charge voltage of CSTA. GATE ISEN1 Figure 12 The diagram of power supply VCC is supplied by the CSTA charge voltage of the AC line VCC is supplied by the voltage of the transformer auxiliary winding. Charge voltage of CSTA Voltage of the transformer auxiliary winding VCC terminal voltage UVLO release voltage (VUVLO(UP)) UVLO operation voltage (VUVLO(DOWN)) GATE terminal voltage VREG terminal voltage VREG-UVLO release voltage Figure 13 The timing chart of power supply 16 2012-03-12 TB62D901FNG 15. Transition state 15.1 Detection function Power supply ON （The cIrcuits other than the regulator circuit, the standard voltage circuit, and the UVLO circuit stop, and The GATE terminal output is fixed 0V.） TSD OVP OCP IOP PWMD=H PWMD=L Power supply reboot（VCC=0V→more than 11V） EN reboot（EN=H→L→H） When GATE terminal voltage is 0V, VISEN≥VPEAK Power supply reboot（VCC=0V→more than 11V） EN reboot（EN=H→L→H） VISEN1≥VOCP is detected consecutive four times. Power supply reboot（VCC=0V→more than 11V） EN reboot（EN=H→L→H） VCC≥VOVP Tj≤TTSD-TTSD(HYS) Tj≥TTSD EN=L EN=L VCC≥VUVLO(UP) VCC≤VUVLO(DOWN) VCC≤VUVLO(DOWN) EN=H EN=L Setting UVLO PWMD The GATE terminal output is fixed 0V. Figure 14 Detection States Transition When two or more fault conditions occur, the IC will not switch unless the each reset condition is completed. 17 2012-03-12 TB62D901FNG 15.2 GATE control 1. OFF time fixed mode Figure 15 States Transition in Fixed Off time Mode 2. OFF time automatic adjustment mode Figure 16 States Transition in Adaptive Off time Mode 3. Critical mode Figure 17 States Transition in Critical Mode 18 2012-03-12 TB62D901FNG 16. Application diagram 19 2012-03-12 TB62D901FNG 17. Package dimension Unit: mm Weight: 0.07 g (typ.) 20 2012-03-12 TB62D901FNG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 21 2012-03-12 TB62D901FNG [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 22 2012-03-12 TB62D901FNG RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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