STPS3045C-Y Automotive power Schottky rectifier Features A1 ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low thermal resistance ■ Avalanche rated ■ AEC-Q101 qualified K A2 K A2 A1 D2PAK STPS3045CGY Description This device is a dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Table 1. Packaged in D2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. May 2011 Doc ID 17264 Rev 1 Device summary IF(AV) 2 x 15 A VRRM 45 V Tj (max) 175 °C VF (max) 0.57 V 1/7 www.st.com 7 Characteristics 1 STPS3045C-Y Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Parameter Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms voltage 30 A 10 30 A Per diode Per device IF(AV) Average forward current δ = 0.5 TC = 155 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 220 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 6000 W -65 to +175 °C -40 to +175 °C 10000 V/µs Storage temperature range Tstg Tj Maximum operating junction temperature dV/dt 1. Value dPtot --------------dTj < (1) Critical rate of rise reverse voltage 1 -------------------------Rth ( j – a ) Table 3. condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance parameters Symbol Parameter Rth (j-c) Junction to case Rth (c) Coupling Per diode Total Value Unit 1.60 0.85 ° C/W 0.10 ° C/W When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 4. Symbol IR (1) Static electrical characteristics (per diode) Parameter Tests conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 125 °C VF (1) Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM IF = 15 A IF = 30 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.01 IF2(RMS) 2/7 Doc ID 17264 Rev 1 Min. Typ. Max. Unit - - 200 µA - 11 40 mA - 0.5 0.57 - - 0.84 - 0.65 0.72 V STPS3045C-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current (per diode) Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) PF(AV)(W) 18 12 δ = 0.1 δ = 0.05 11 δ = 0.2 δ = 0.5 16 10 9 14 δ=1 12 8 7 10 6 8 5 4 Rth(j-a)=15°C/W 6 T T 3 4 2 1 δ=tp/T IF(AV)(A) 2 tp 0 δ=tp/T tp Tamb(°C) 0 0 2 4 Figure 3. 6 8 10 12 14 16 18 20 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25°C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. IM(A) 50 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-c)/Rth(j-c) 200 1.0 180 0.9 160 0.8 140 0.7 120 0.6 δ = 0.5 100 0.5 TC=75°C 80 TC=100°C 60 40 TC=125°C IM 0.4 δ = 0.2 0.3 δ = 0.1 T 0.2 Single pulse t 20 δ=0.5 0.1 t(s) 1.E-03 tp(s) δ=tp/T 0.0 0 1.E-02 1.E-01 1.E+00 1.E-03 Doc ID 17264 Rev 1 1.E-02 1.E-01 tp 1.E+00 3/7 Characteristics Figure 7. STPS3045C-Y Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. IR(µA) Junction capacitance versus reverse voltage applied (typical values, per diode) C(nF) 1.E+05 10000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1.E+04 Tj=125°C Tj=100°C 1.E+03 Tj=75°C 1.E+02 1000 Tj=50°C 1.E+01 Tj=25°C 1.E+00 VR(V) VR(V) 100 1.E-01 0 5 Figure 9. 10 15 20 25 30 35 40 1 45 Forward voltage drop versus forward current (maximum values, per diode) 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under tab IFM(A) Rth(j-a)(°C/W) 1000 80 Epoxy printed circuit board, copper thickness = 35 µm 70 Tj=125°C (maximum values) 60 100 50 Tj=125°C (typical values) 40 Tj=25°C (maximum values) 10 30 20 10 S(cm²) VFM(V) 0 1 0.0 4/7 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 Doc ID 17264 Rev 1 5 10 15 20 25 30 35 40 STPS3045C-Y 2 Package information Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Package dimensions D2PAK Table 5. Dimensions Ref. A E C2 L2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 11. Footprint dimensions (in millimeters) 16.90 10.30 5.08 1.30 8.90 Doc ID 17264 Rev 1 3.70 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3045CGY-TR STPS3045CGY D2PAK 1.48 g 1000 Tape and reel Revision history Table 7. 6/7 STPS3045C-Y Document revision history Date Revision 24-May-2011 1 Changes Initial release. Doc ID 17264 Rev 1 STPS3045C-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17264 Rev 1 7/7