STMICROELECTRONICS STPS5L60SY

STPS5L60-Y
Automotive power Schottky rectifier
Datasheet − production data
Features
■
Negligible switching losses
■
Low forward voltage drop for higher efficiency
■
Low thermal resistance
■
Avalanche capability specified
■
AEC-Q101 qualified
■
ECOPACK®2 compliant component
A
K
SMC
STPS5L60SY
Description
Power Schottky rectifier suited for switch mode
power supplies and high frequency inverters.
This device is intended for use in low voltage
output for small battery chargers and battery
protection in automotive applications.
March 2012
This is information on a product in full production.
Table 1.
Doc ID 022951 Rev 1
Device summary
IF(AV)
5A
VRRM
60 V
Tj (max)
150 °C
VF (max)
0.53 V
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7
Characteristics
STPS5L60-Y
1
Characteristics
Table 2.
Absolute ratings (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
Forward rms current
15
A
5
A
Average forward current
IFSM
Surge non repetitive forward
current
Half wave, single phase
tp = 10 ms
150
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
4000
W
Storage temperature range
-65 to +175
°C
Operating junction temperature(1)
-40 to +150
°C
10000
V/µs
Tstg
Tj
dV/dt
dPtot
--------------dTj
1.
Tl = 100 °C δ = 0.5
IF(AV)
<
Critical rate of rise of reverse voltage (rated VR, Tj = 25 °C)
1
-------------------------Rth ( j – a )
Table 3.
condition to avoid thermal runaway for a diode on its own heatsink
Thermal parameters
Symbol
Rth (j-l)
Table 4.
Symbol
Parameter
Junction to leads
Value
Unit
15
°C/W
Static electrical characteristics
Parameter
Tests conditions
Min.
Typ.
Tj = 25 °C
IR
(1)
VF (1)
Reverse leakage current
Forward voltage drop
Tj = 100 °C
10
25
Tj = 125 °C
40
100
Tj = 25 °C
0.47
0.52
0.43
0.49
0.42
0.48
Tj = 100 °C
Unit
0.22
VR = VRRM
IF = 5 A
Tj = 125 °C
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.39 x IF(AV) + 0.028x IF2(RMS)
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Max.
Doc ID 022951 Rev 1
mA
V
STPS5L60-Y
Figure 1.
Characteristics
Conduction losses versus average Figure 2.
current
PF(av)(W)
3.5
δ = 0.05
δ = 0.1
δ = 0.2
6
δ = 0.5
Average forward current versus
ambient temperature (δ = 0.5)
IF(av)(A)
Rth(j-a)=Rth(j-l)
3.0
5
δ=1
2.5
4
2.0
3
SMC
Rth(j-a)=90°C/W
1.5
2
1.0
T
T
1
0.5
IF(av)(A)
δ=tp/T
0.0
0.0
0.5
Figure 3.
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
δ=tp/T
tp
tp
Tamb(°C)
0
5.5
6.0
Normalized avalanche power
derating versus pulse duration
25
0
Figure 4.
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM (t j )
PARM (25°C)
PARM (t p )
PARM (1µs)
1
1
0.1
0.01
t p (µs)
0.001
0.01
0.1
1
Tj (°C)
10
100
1000
0
25
Figure 5.
14
Non repetitive surge peak forward
current versus overload duration
(maximum values)
50
Figure 6.
IM(A)
75
100
125
150
Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a)/Rth(j-a)
1.0
SMC
0.9
12
SMC
0.8
10
0.7
Ta=25 °C
8
0.6
0.5
6
Ta=75 °C
0.4
0.3
4
Ta=125 °C
2
IM
0
1.E-03
0.2
0.1
t
δ =0.5
tp(s)
t(s)
1.E-02
1.E-01
1.E+00
0.0
1.E-01
Doc ID 022951 Rev 1
1.E+00
1.E+01
1.E+02
1.E+03
3/7
Characteristics
Figure 7.
1.E+03
STPS5L60-Y
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 8.
IR(mA)
1000
Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
F=1MHz
Vosc=30mV
Tj=25°C
Tj=150°C
1.E+02
Tj=125°C
1.E+01
Tj=100°C
Tj=75°C
1.E+00
Tj=50°C
1.E-01
Tj=25°C
1.E-02
VR(V)
VR(V)
100
1.E-03
0
Figure 9.
5.0
5
10
15
20
25
30
35
40
45
50
55
1
60
Forward voltage drop versus
forward current (low level)
50
IFM(A)
Tj=125°C
(Maximum values)
45
4.5
Tj=125°C
(Maximum values)
4.0
40
35
3.5
Tj=125°C
(Typical values)
30
Tj=125°C
(Typical values)
3.0
100
Figure 10. Forward voltage drop versus
forward current (high level)
IFM(A)
2.5
25
2.0
20
Tj=25°C
(Maximum values)
1.5
Tj=25°C
(Maximum values)
15
1.0
10
0.5
5
VFM(V)
0.0
0.00
10
VFM(V)
0
0.05 0.10
0.15 0.20
0.25
0.30 0.35
0.40 0.45
0.50 0.55
0.60
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
(epoxy printed board FR4, copper thickness = 35 µm)
Rth(j-a)(°C/W)
100
SMC
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0
4/7
0.5
1.0
1.5
2.0
2.5
3.0
Doc ID 022951 Rev 1
3.5
4.0
4.5
5.0
1.6
STPS5L60-Y
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
SMC dimensions
Dimensions
Ref.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b(1)
2.90
3.20
0.114
0.126
(1)
0.15
0.40
0.006
0.016
D
5.55
6.25
0.218
0.246
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
L
0.75
1.50
0.030
0.059
c
E
A1
C
A2
E2
L
b
Inches
Min.
E1
D
Millimeters
1. Dimensions b and c apply to plated leads
Figure 12. Footprint, dimensions in mm (inches)
1.54
(0.061)
5.11
(0.201)
1.54
(0.061)
3.14
(0.124)
8.19
(0.322)
Doc ID 022951 Rev 1
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Ordering information
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS5L60SY
S56Y
SMC
0.245 g
2500
Tape and reel
Revision history
Table 7.
6/7
STPS5L60-Y
Document revision history
Date
Revision
29-Mar-2012
1
Description of Changes
Initial issue
Doc ID 022951 Rev 1
STPS5L60-Y
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