STMICROELECTRONICS STPS3045DJF

STPS3045DJF
Power Schottky rectifier
Features
■
Low forward voltage drop
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low thermal resistance
■
Avalanche capability specified
■
Thin package: 1 mm
■
ECOPACK®2 compliant component
A
K
A
K
K
Description
Schottky rectifier suited for switch mode power
supply and high frequency DC to DC converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency
inverters, free-wheeling and polarity protection
applications.
A
A
PowerFLAT 5x6
STPS3045DJF
Its low profile was especially designed to be used
in applications with space-saving constraints.
Table 1.
Device summary
Symbol
Value
IF(AV)
30 A
VRRM
45 V
Tj (max)
150 °C
VF(typ)
0.41 V
TM: PowerFLAT is a trademark of STMicroelectronics
May 2011
Doc ID 16758 Rev 3
1/7
www.st.com
7
Characteristics
1
STPS3045DJF
Characteristics
Table 2.
Absolute ratings (limiting values, anode terminals short circuited)
Symbol
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
Unit
45
V
45
A
Average forward current
Tc = 95 °C, δ = 0.5
30
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
Tc = 25 °C
200
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
Tj
Storage temperature range
12500
W
-65 to + 175
°C
150
°C
Value
Unit
2.5
°C/W
Maximum operating junction temperature (1)
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Parameter
Junction to case
Static electrical characteristics (anode terminals short circuited)
Symbol
Parameter
Test Conditions
IR(1)
Reverse leakage current
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 15 A
Min.
Typ.
Max.
Unit
-
-
300
µA
-
20
80
mA
-
-
0.56
-
0.41
0.46
-
-
0.64
-
0.50
0.56
V
IF = 30 A
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.43 x IF(AV) + 0.00433 IF2(RMS)
2/7
Value
IF(AV)
Tstg
1.
Parameter
Doc ID 16758 Rev 3
STPS3045DJF
Figure 1.
24
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
35
δ=1
δ = 0.5
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
Rth(j-a) = Rth(j-c)
30
20
δ = 0.2
16
25
δ = 0.1
δ = 0.05
20
12
T
15
δ = tp / T
8
tp
10
T
4
5
δ = tp / T
IF(AV)(A)
tp
Tamb(°C)
0
0
0
5
Figure 3.
10
15
20
25
30
35
0
40
Normalized avalanche power
derating versus pulse duration
25
Figure 4.
PARM(tp)
PARM(1 µs)
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25 °C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
Figure 5.
220
Tj(°C)
tp(µs)
0.1
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
Figure 6.
1.0
200
0.9
180
0.8
160
0.7
140
50
75
100
125
150
Relative variation of thermal
impedance, junction to case,
versus pulse duration
Zth(j-c)/Rth(j-c)
0.6
Tc = 25 °C
120
0.5
100
Tc = 75 °C
80
0.3
60
40
0.4
Tc = 125 °C
IM
20
0
1.E-03
0.2
Single pulse
0.1
t
δ = 0.5
t(s)
1.E-02
1.E-01
1.E+00
0.0
1.E-05
Doc ID 16758 Rev 3
tp(s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
3/7
Characteristics
Figure 7.
1.E+02
STPS3045DJF
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8.
IR(mA)
10000
Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
F = 1 MHz
Vosc = 30 mVRMS
T = 25 °C
Tj = 150 °C
1.E+01
Tj = 125 °C
j
Tj = 100 °C
1.E+00
Tj = 75 °C
1000
Tj = 50 °C
1.E-01
Tj = 25 °C
1.E-02
VR(V)
1.E-03
5
Figure 9.
60
VR(V)
100
0
10
15
20
25
30
35
40
45
Forward voltage drop versus
forward current
1
10
100
Figure 10. Thermal resistance, junction to
ambient, versus copper surface
under tab
IFM(A)
250
Rth(j-a)(°C/W)
Epoxy printed board FR4,
copper thickness = 35 µm
55
50
200
Tj = 125 °C
(Maximum values)
45
40
150
35
30
Tj = 125 °C
(Typical values)
25
100
20
Tj = 25 °C
(Maximum values)
15
10
5
VFM(V)
0
0.0
4/7
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
50
Scu(cm²)
0
0
1
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STPS3045DJF
Package information
●
Epoxy meets UL94,V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
PowerFLAT 5x6 dimensions
Dimensions
Ref.
Min.
D2
E2
K
e
b
A2
Inches
Max.
Min.
Typ.
Max.
A
0.80
1.00
0.031
0.039
A1
0.02
0.05
0.001
0.002
b
D
Typ.
A2
L
A
A1
Millimeters
0.25
0.30
0.50
D
D2
0.010
0.012
5.20
4.11
0.020
0.205
4.31
0.162
0.170
e
1.27
0.050
E
6.15
0.242
E
E2
3.50
3.70
0.138
0.146
L
0.50
0.80
0.020
0.031
K
1.275
1.575
0.050
0.062
Figure 11. Footprint (dimensions in mm)
5.35
4.41
3.86
4.33
6.29
2
Package information
0.98
0.95
0.62
1.27
Doc ID 16758 Rev 3
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Ordering information
STPS3045DJF
Figure 12. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
1.75
4.0
0.30
0.20
5.30
12.0
5.5
Ø 1.5
R 0.50
6.30
8.0
1.20
All dimensions are typical values in mm
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
STPS3045DJF-TR
PS30 45
PowerFLAT 5x6
Weight Base qty Delivery mode
95 mg
3000
Tape and reel
Revision history
Table 7.
6/7
User direction of unreeling
Document revision history
Date
Revision
Changes
09-Nov-2009
1
First issue.
05-Jul-2010
2
Replace Power QFN with PowerFLAT.
20-May-2011
3
Updated package graphics and marking in Table 6. Added
Figure 12.
Doc ID 16758 Rev 3
STPS3045DJF
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