STMICROELECTRONICS STPS30170DJF

STPS30170DJF
Power Schottky rectifier
Features
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low thermal resistance
■
Avalanche capability specified
■
ECOPACK®2 compliant component
A
K
A
K
K
Description
This Schottky rectifier is designed for switch mode
power supply and high frequency DC to DC
converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency
inverters, free-wheeling and polarity protection
applications.
A
A
PowerFLAT 5x6
STPS30170DJF
Its low profile was especially designed to be used
in applications with space-saving constraints.
Table 1.
Device summary
Symbol
Value
IF(AV)
30 A
VRRM
170 V
Tj (max)
150 °C
VF(typ)
0.65 V
TM: PowerFLAT is a trademark of STMicroelectronics
May 2011
Doc ID 16749 Rev 3
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www.st.com
7
Characteristics
1
STPS30170DJF
Characteristics
Table 2.
Absolute ratings (limiting values, anode terminals short circuited)
Symbol
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
Unit
170
V
45
A
Average forward current
Tc = 80 °C, δ = 0.5
30
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
Tc = 25 °C
200
A
PARM
Repetitive peak avalanche power
tp = 1 µs, Tj = 25 °C
Tj
Storage temperature range
12500
W
-65 to + 175
°C
150
°C
Value
Unit
2.5
°C/W
Maximum operating junction temperature (1)
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Parameter
Junction to case
Static electrical characteristics (anode terminals short circuited)
Symbol
Parameter
Test conditions
IR(1)
Reverse leakage current
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 15 A
Min.
Typ.
Max.
Unit
-
-
15
µA
-
4
12
mA
-
-
0.88
-
0.65
0.70
-
-
0.95
-
0.71
0.79
V
IF = 30 A
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.65 x IF(AV) + 0.0046 IF2(RMS)
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Value
IF(AV)
Tstg
1.
Parameter
Doc ID 16749 Rev 3
STPS30170DJF
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
32
35
24
Rth(j-a) = Rth(j-c)
30
δ = 0.2
20
25
δ = 0.1
20
δ = 0.05
16
IF(AV)(A)
δ=1
δ = 0.5
28
Average forward current versus
ambient temperature (δ = 0.5)
T
15
12
δ = tp / T
tp
10
8
T
5
4
δ = tp / T
IF(AV)(A)
0
tp
Tamb(°C)
0
0
5
Figure 3.
10
15
20
25
30
35
40
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1 µs)
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25 °C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
0.01
0.1
Figure 5.
200
Tj(°C)
tp(µs)
0.001
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
Figure 6.
1.0
180
0.9
160
0.8
140
0.7
120
75
100
125
150
Relative variation of thermal
impedance, junction to case,
versus pulse duration
Zth(j-c)/Rth(j-c)
0.6
100
Tc = 25 °C
80
Tc = 75 °C
60
40
50
0.5
0.4
0.3
Tc = 125 °C
IM
20
0
1.E-03
0.2
0.1
t
δ = 0.5
Single pulse
t(s)
1.E-02
1.E-01
1.E+00
0.0
1.E-05
Doc ID 16749 Rev 3
tp(s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
3/7
Characteristics
Figure 7.
1.E+02
STPS30170DJF
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8.
IR(mA)
C(pF)
1000
1.E+01
Tj = 150 °C
1.E+00
Tj = 125 °C
Junction capacitance versus
reverse voltage applied
(typical values)
F = 1 MHz
Vosc = 30 mVRMS
T = 25 °C
j
Tj = 100 °C
100
1.E-01
Tj = 75 °C
1.E-02
Tj = 50 °C
Tj = 25 °C
1.E-03
VR(V)
0
20
Figure 9.
60
VR(V)
10
1.E-04
40
60
80
100
120
140
160
1
180
Forward voltage drop versus
forward current
10
100
1000
Figure 10. Thermal resistance, junction to
ambient, versus copper surface
under tab
IFM(A)
250
Rth(j-a)(°C/W)
epoxy printed board Fr4,
copper thickness=35 µm
55
50
200
45
Tj = 125 °C
(Maximum values)
40
150
35
30
Tj = 125 °C
(Typical values)
25
100
20
15
Tj = 25 °C
(Maximum values)
10
5
VFM(V)
0
0.0
4/7
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
50
Scu(cm²)
0
0
1
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STPS30170DJF
Package information
●
Epoxy meets UL94,V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
PowerFLAT 5x6 dimensions
Dimensions
Ref.
Min.
D2
E2
K
e
b
A2
Inches
Max.
Min.
Typ.
Max.
A
0.80
1.00
0.031
0.039
A1
0.02
0.05
0.001
0.002
b
D
Typ.
A2
L
A
A1
Millimeters
0.25
0.30
0.50
D
D2
0.010
0.012
5.20
4.11
0.020
0.205
4.31
0.162
0.170
e
1.27
0.050
E
6.15
0.242
E
E2
3.50
3.70
0.138
0.146
L
0.50
0.80
0.020
0.031
K
1.275
1.575
0.050
0.062
Figure 11. Footprint (dimensions in mm)
5.35
4.41
3.86
4.33
6.29
2
Package information
0.98
0.95
0.62
1.27
Doc ID 16749 Rev 3
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Ordering information
STPS30170DJF
Figure 12. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
1.75
4.0
0.30
0.20
5.30
12.0
5.5
Ø 1.5
R 0.50
6.30
8.0
1.20
All dimensions are typical values in mm
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
STPS30170DJF-TR
PS30 170
PowerFLAT 5x6
Weight Base qty Delivery mode
95 mg
3000
Tape and reel
Revision history
Table 7.
6/7
User direction of unreeling
Document revision history
Date
Revision
Changes
06-Nov-2009
1
First issue.
30-Jul-2010
2
Replace Power QFN with PowerFLAT.
20-May-2011
3
Updated package graphics. Updated base quantity and marking in
Table 6. Added Figure 12.
Doc ID 16749 Rev 3
STPS30170DJF
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