Amplifier, Distributed Power 4.0—18.0 GHz MAAPGM0052-DIE 903210 — Preliminary Information Features ♦ ♦ ♦ ♦ 0.5 Watt Saturated Output Power Level Variable Drain Voltage (5-10V) Operation GaAs MSAG™ Process Proven Manufacturability and Reliability No Airbridges Polyimide Scratch Protection No Hydrogen Poisoning Susceptibility Description The MAAPGM0052-Die is a 2-stage distributed power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™) Process, each device is 100% RF tested on wafer to ensure performance compliance. Primary Applications M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VDD = 8V, IDQ ≈ 500 mA2, Pin = 17 dBm, Rg ≈ 100Ω Parameter 1. 2. Symbol Typical Units Bandwidth f 4.0-18.0 GHz Output Power POUT 26.0 dBm 1dB Compression Point P1dB 25 dBm Small Signal Gain G 13 dB Noise Figure NF 6.0 dB Input VSWR VSWR 1.4:1 Output VSWR VSWR 1.5:1 Gate Supply Current IGG 4 mA Drain Supply Current IDD 600 mA TB = MMIC Base Temperature Adjust VGG between –2.4 and –1.0V to achieve IDQ indicated. 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power 4.0—18.0 GHz MAAPGM0052-DIE 903210 — Preliminary Information Maximum Operating Conditions 3 Parameter Symbol Absolute Maximum Units Input Power PIN 22.0 dBm Drain Supply Voltage VDD +12.0 V Gate Supply Voltage VGG -3.0 V Quiescent Drain Current (No RF, 40% Idss) IDQ 630 mA PDISS 4.8 W Junction Temperature TJ 180 °C Storage Temperature TSTG -55 to +150 °C 310 °C Quiescent DC Power Dissipated (No RF) Die Attach Temperature 3. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may result in performance outside the guaranteed limits. Recommended Operating Conditions Characteristic Symbol Min Typ Max Unit Drain Supply Voltage VDD 4.0 8.0 10.0 V Gate Supply Voltage VGG -2.4 -1.8 -1.0 V Input Power PIN 17.0 20.0 dBm 150 °C Junction Temperature TJ Thermal Resistance ΘJC MMIC Base Temperature TB 18.6 °C/W Note 4 °C 4. Maximum MMIC Base Temperature = 150°C —ΘJC* VDD * IDQ Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 8 V. 3. Adjust VGG to set IDQ. 4. Set RF input. 5. Power down sequence in reverse. Turn VGG off last. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power 4.0—18.0 GHz MAAPGM0052-DIE 903210 — Preliminary Information 50 20 6 Gain 5V 8V 10V 45 40 Input VSWR Output VSWR 5 Output Power (dBm) 15 35 30 4 25 10 20 3 15 5 10 2 5 0 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 0 1 3 4 5 6 7 Frequency (GHz) 8 9 10 11 12 13 14 15 16 17 18 19 Frequency (GHz) Figure 2. Small Signal Gain and VSWR at VD=5V. Figure 1. Output Power vs. Frequency and Drain Voltage at Pin=15dBm. 50 50 5V 8V 10V 45 5V 8V 10V 45 40 40 35 35 30 30 25 25 20 20 15 15 10 10 5 5 0 0 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 4 5 6 7 8 9 10 11 12 13 14 15 16 Frequency (GHz) Frequency (GHz) Figure 3. Saturated Output Power vs. Frequency and Drain Voltage. Figure 4. 1dB Compression Point vs. Frequency and Drain Voltage. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. 17 18 • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power 4.0—18.0 GHz MAAPGM0052-DIE 903210 — Preliminary Information 1.0 50 45 40 10GHz 35 18GHz 10GHz 15GHz 0.8 15GHz 18GHz 0.7 30 0.6 25 0.5 20 0.4 15 0.3 10 0.2 5 0.1 0.0 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 0 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Input Power (dBm) Input Power (dBm) Figure 5. Output Power vs. Input Power and Frequency at VD=8V. Figure 6. RF Drain Current vs. Input Power and Frequency at VD=8V. 20 19 20 20 5V Gain 8V Gain 10V Gain 5V NF 8V NF 10V NF 18 16 16 14 14 12 12 10 10 8 8 6 6 4 4 2 2 0 Noise Figure (dB) 18 Gain (dB) 6GHz 0.9 6GHz 0 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Frequency (GHz) Figure 7. Gain and Noise Figure vs. Frequency and Drain Voltage at 25% IDSS. 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power 4.0—18.0 GHz MAAPGM0052-DIE 903210 — Preliminary Information Mechanical Information Chip Size: 3.000 x 3.000 x 0.075 mm (118 x 118 x 3 mils) 3.000mm 0.137mm 3.000mmm 2.838mm VD GND:G GN D:G GND:G OUT 2.268mm GND:G GND:G G: DN G G ND:G GND:G IN .0467mm GND :G GND:G VG_B GND:G 0 2.843mm 1.744mm 0 Figure 8. Die Layout Chip edge to bond pad dimensions are shown to the center of the bond pad. Bond Pad Dimensions Pad Size (μm) Size (mils) RF In and Out 100 x 150 4x6 DC Drain Supply Voltage VDD 150 x 150 6x6 DC Gate Supply Voltage VG_B 150 x 150 6x6 5 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Distributed Power 4.0—18.0 GHz MAAPGM0052-DIE 903210 — Preliminary Information Assembly and Bonding Diagram VDD 0.1 μF 100 pF VD GND:G G ND:G RFOUT GND:G OUT GND:G G ND:G G : DNG G ND:G RFIN GND:G IN G ND:G GND:G VG_B GND:G RG = 100Ω 100 pF VGG 0.1 μF Figure 9. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW testing. Assembly Instructions: Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.