www.DataSheet4U.com RoHS Compliant MAAPGM0064-DIE Amplifier, Power, 2.0 W 6.5—9.5 GHz Rev — Preliminary Information Features ♦ ♦ ♦ ♦ 2 Watt Saturated Output Power Level Variable Drain Voltage (4-10V) Operation MSAG™ Process High Performance Ceramic Bolt Down Package Description The MAAPGM0064-DIE is a 2-stage 2 W power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Each device is 100% RF tested to ensure performance compliance. The part is fabricated using M/A-COM’s GaAs Multifunction SelfAligned Gate Process. Primary Applications M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors and multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Also Available in: Description Ceramic Package Part Number MAAPGM0064 ♦ ♦ ♦ Multiple Band Point-to-Point Radio SatCom ISM Band SAMPLES Sample Board (Die) Mechanical Sample (Die) MAAP-000064-SMB004 Not Available 1 2 Electrical Characteristics: TB = 40°C , Z0 = 50 Ω, VDD = 8V, IDQ ≈ 600 mA , Pin = 18 dBm, RG ≈ 120Ω Parameter Symbol Typical Units Bandwidth f 6.5-9.5 GHz Output Power POUT 34.5 dBm Power Added Efficiency PAE 30 % 1-dB Compression Point P1dB 32 dBm Small Signal Gain G 20 dB Input VSWR VSWR 1.8:1 Output VSWR VSWR 3.0:1 Gate Supply Current IGG <5 mA Drain Supply Current IDD <1 mA Noise Figure NF 9.5 dB 2f -20 dBc 2 nd Harmonic rd 1 3 Harmonic 3f -45 dBc Output Third Order Intercept OTOI 41 dBm 3rd Order Intermodulation Distortion, Single Carrier Level = 20 dBm IM3 -10 dBm 5th Order Intermodulation Distortion, Single Carrier Level = 20 dBm IM5 -25 dBm 1. TB = MMIC Base Temperature 2. Adjust VGG between –2.6 and –1.2V to achieve specified Idq. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. RoHS Compliant MAAPGM0064-DIE Amplifier, Power, 2.0 W 6.5—9.5 GHz Rev — Preliminary Information Maximum Ratings 3 Parameter Symbol Absolute Maximum Units Input Power PIN 23.0 dBm Drain Supply Voltage VDD +12.0 V Gate Supply Voltage VGG -3.0 V Quiescent Drain Current (No RF, 40% Idss) IDQ 950 mA PDISS 7.9 W Junction Temperature TJ 170 °C Storage Temperature TSTG -55 to +150 °C Quiescent DC Power Dissipated (No RF) 3. Operation beyond these limits may result in permanent damage to the part. Recommended Operating Conditions4 Characteristic Symbol Min Typ Max Unit Drain Supply Voltage VDD 4.0 8.0 10.0 V Gate Supply Voltage VGG -2.4 -2.0 -1.3 V Input Power PIN 18.0 21.0 dBm Thermal Resistance ΘJC 12.4 Package Base Temperature TB °C/W Note 5 °C 4. Operation outside of these ranges may reduce product reliability. 5. MMIC Base Temperature = 170°C — ΘJC* VDD * IDQ Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2.7 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 8.0 V. 3. Adjust VGG to set IDQ, (approximately @ –2.0 V). 4. Set RF input. 5. Power down sequence in reverse. Turn VGG off last. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. RoHS Compliant MAAPGM0064-DIE 45 40 40 35 35 30 30 25 25 20 20 Output Power (dBm) PAE (%) 15 15 10 10 5 5 0 0 6.5 7 7.5 8 8.5 9 9.5 30 4.0 25 3.5 20 3.0 Gain Input VSWR 15 10 2.0 5 1.5 0 1.0 6.5 7.0 7.5 8.0 8.5 9.0 Frequency (GHz) Frequency (GHz) Figure 1. Output Power and Power Added Efficiency vs. Frequency @ PIN=18.0 dBm, VDD=8V, IDQ=600 mA Figure 2. Gain and Input VSWR vs. Frequency (VDD=8 V, IDQ=600 mA) 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. 2.5 Input VSWR 45 Small Signal Gain (dB) Rev — Preliminary Information PAE (%) POUT (dBm) Amplifier, Power, 2.0 W 6.5—9.5 GHz 9.5 • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. RoHS Compliant MAAPGM0064-DIE Amplifier, Power, 2.0 W 6.5—9.5 GHz Rev — Preliminary Information Mechanical Information Chip Size: 2.95 x 2.95 x 0.075 mm (116 x 116 x 3 mils) Figure 3. Die Layout Bond Pad Dimensions Pad Size (μm) Size (mils) RF In and Out 100 x 200 4x8 DC Drain Supply Voltage VDD 200 x 150 8x6 DC Gate Supply Voltage VGG 150 x 150 6x6 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. RoHS Compliant MAAPGM0064-DIE Amplifier, Power, 2.0 W 6.5—9.5 GHz Rev — Preliminary Information Assembly and Bonding Diagram VDD 0.01-0.1 μF 0.01-0.1 μF 100200 pF 100200 pF RFOUT RFIN 100200 pF VGG 40 Ω 100200 pF 0.01-0.1 μF 0.01-0.1 μF Figure 4. Recommended operational configuration. Wire bond as shown. Die Handling: Refer to Application Note AN3016. Assembly Instructions: Die Attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than 7 minutes. Refer to Application Note AN3017 for more detailed information. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.