NLX2G66 Dual Bilateral Analog Switch / Digital Multiplexer The NLX2G66 is a dual single pole, single throw (SPST) analog switch / digital multiplexer. This single supply voltage IC is designed with a sub−micron CMOS technology to provide low propagation delays (tpd) and ON resistance (RON), while maintaining low power dissipation. This bi−lateral switch can be used with either analog or digital signals that may vary across the full power supply range from VCC to GND. http://onsemi.com MARKING DIAGRAMS Features • • • • • • • • • Wide VCC Operating Range: 1.65 V to 5.5 V OVT up to +5.5 V for Control Pin RON: Typically < 5 W at VCC = 4.5 V and IS = 32 mA Rail−to−Rail Input/Output High Speed, Typical tPD < 1 ns at VCC = 4.5 V and CL = 50 pF High On−Off Output Voltage Ratio High Degree of Linearity Ultra−Small Pb−Free, Halide−Free, RoHS−Compliant Packages ESD Performance: > 5000 V HBM, > 400 V MM 8 1 1 UDFN8 MU SUFFIX CASE 517BY 8 1 UDFN8 MU SUFFIX CASE 517CA 8 1 XX M G • Cell Phones, PDAs, MP3 and other Portable Media Players 1A XX MG G UDFN8 MU SUFFIX CASE 517BZ 8 Typical Applications 1 UQFN8 MU SUFFIX CASE 523AN XXM G 1 XXM G 1 XXM G 1 = Specific Device Code = Date Code = Pb−Free Package (*Note: Microdot may be in either location) 1B 1C PIN ASSIGNMENTS 2A 2B 1A 2C Figure 1. Analog Symbol PIN ASSIGNMENTS VCC 1 1B 1C 2C 2B GND 2A UDFN8 VCC 1C 1 1A 2B 1B 2A 2C GND UQFN8 UDFN8 UQFN8−0.5P Description 1 7 1A 2 6 1B 3 5 2C Control Input (C) Switch 4 4 GND L OFF 5 3 2A H ON 6 2 2B 7 1 1C ORDERING INFORMATION 8 8 VCC See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (Top Views) FUNCTION TABLE This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2013 January, 2013 − Rev. 1 1 Publication Order Number: NLX2G66/D NLX2G66 Table 1. MAXIMUM RATINGS Symbol VCC Rating Value Unit −0.5 to +7.0 V −0.5 to + VCC + 0.5 V −0.5 to +7.0 V Positive DC Supply Voltage VS Switch Input / Output Voltage VI Digital Control Input Voltage IOK I/O port diode current ±50 mA IIK Control input diode current −50 mA II/O Continuous DC Current Through Analog Switch ±100 mA IL Latch−up Current, (Above VCC and below GND at 125°C) ±100 mA Ts Storage Temperature −65 to +150 °C ≥ 5000 > 400 V VESD ESD Withstand Voltage: (Pins 1A, 1B, 2A and 2B) (Pins 1C and 2C) Human Body Model (HBM) Machine Model (MM) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 2. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Min Max Unit 1.65 5.5 V (Pins 1A, 2A, 1B and 2B) GND VCC V (Pins 1C and 2C) GND 5.5 V Positive DC Supply Voltage VS Switch Input / Output Voltage VI Digital Control Input Voltage TA Operating Temperature Range tr, tf Input Transition Rise or Fall Time (ON/OFF Control Input) −55 +125 °C VCC = < 3.0 V 0 20 ns/V VCC = ≥ 3.0 V 0 10 Table 3. ELECTRICAL CHARACTERISTICS Guaranteed Limit 255C Symbol VIH VIL Parameter Condition High−Level Input Voltage, Control Input Low−Level Input Voltage, Control Input VCC Min −555 to 1255C Max Min 1.65 to 1.95 VCC x 0.65 2.3 to 5.5 VCC x 0.7 Max Unit V 1.65 to 1.95 VCC x 0.35 2.3 to 5.5 VCC x 0.30 V II Input Leakage Current, Control Input VI = VCC or GND 5.5 ±0.1 ±1 mA IS(ON) ON−State Switch Leakage Current VIS = VCC or GND, VI = VIH, VOS = Open 5.5 ±0.1 ±1 mA IS(OFF) OFF−State Switch Leakage Current VIS = VCC and VOS = GND, or VIS = GND and VOS = VCC GND, VI = VIL, 5.5 ±0.1 ±1 mA Quiescent Supply Current VI = VCC or GND 5.5 1.0 10 mA Supply Current Change VI = VCC – 0.6 5.5 500 mA 5 3.0 pF ICC ΔICC CI Control Input Capacitance CI/O(Off) Switch OFF Input / Output Capacitance See Figure 3 5 6.0 pF CI/O(On) Switch ON Input / Output Capacitance See Figure 4 5 13 pF http://onsemi.com 2 NLX2G66 Table 4. SWITCHING CHARACTERISTICS Guaranteed Limit −555 to 1255C Symbol tPLH, tPHL Parameter Condition Propagation Delay, A to B, B to A CL = 30 pF, RL = 1 kΩ CL = 50 pF, RL = 500 Ω TEN (tPZL, tPZH) TDIS (tPLZl, tPHZ) Enable Time, C to Analog Output (A or B) Disable Time, C to Analog Output (A or B) Min Max Unit 1.8 6.5 ns 2.5 3.3 3.3 2.5 5.0 2.2 1.8 10 2.5 6.5 3.3 5.5 5.0 4.9 1.8 9.0 2.5 7.2 3.3 6.5 5.0 6.0 VCC CL = 50 pF, RL = 500 Ω See Figure 6 CL = 50 pF, RL = 500 Ω See Figure 6 ns ns Table 5. ANALOG SWITCH CHARACTERISTICS Symbol RON RON(peak) DRON BW Parameter On−Resistance Peak On−Resistance On−Resistance Mismatch between Switches Bandwidth (f−3dB) 255C −555 to 1255C VCC Typ Min IS = 4 ma 1.65 IS = 8 ma 2.3 IS = 24 ma Max Unit 12 30 W 9 20 3.0 7.5 15 IS = 32 ma 4.5 5.5 13 IS = 4 ma 1.65 74.5 220 IS = 8 ma 2.3 20 75 IS = 24 ma 3.0 11.5 25 IS = 32 ma 4.5 7.5 17 IS = 4 ma 1.65 8.0 IS = 8 ma 2.3 5.0 IS = 24 ma 3.0 3.0 IS = 32 ma 4.5 2.0 1.65 > 270 2.3 > 270 3.0 > 270 4.5 > 270 Conditions VIS = VCC or GND, VI = VIH, See Figure 2 VIS = GND to VCC; VI = VIH, See Figure 2 VIS = GND to VCC; VI = VIH, See Figure 2 RL = 50 W, CL = 5 pF, fIN = Sine Wave See Figure 8 http://onsemi.com 3 W W MHz NLX2G66 Table 5. ANALOG SWITCH CHARACTERISTICS (continued) 255C Symbol ISOOff Parameter Off−Channel Feedthrough Isolation Conditions RL = 600 Ω, CL = 50 pF, fIN = 1 MHz Sine Wave See Figure 9 RL = 50 Ω, CL = 5 pF, fIN = 1 MHz Sine Wave See Figure 9 XTalk Crosstalk Between Switches RL = 600 Ω, CL = 50 pF, fIN = 1 MHz Sine Wave See Figure 10 RL = 50 Ω, CL = 5 pF, fIN = 1 MHz Sine Wave See Figure 10 Feedthrough Noise, Control to Switch THD Total Harmonic Distortion RL = 600 Ω, CL = 50 pF, fIN = 1 MHz Square Wave, tr = tf = 2 ns, See Figure 11 CL = 50 pF, RL = 50 Ω, fIN = 600 Hz to 20 KHz Sine Wave, See Figure 12 VCC Typ Unit 1.65 −70 dB 2.3 −70 3.0 −70 4.5 −70 1.65 −60 2.3 −60 3.0 −60 4.5 −60 1.65 −100 2.3 −100 3.0 −100 4.5 −100 1.65 −90 2.3 −90 3.0 −90 dB 4.5 −90 1.65 10 2.3 10 3.0 10 4.5 15 2.3 0.025 3.0 0.015 4.5 0.01 mVpp % Table 6. POWER DISSIPATION CHARACTERISTICS 255C Symbol Parameter Conditions VCC Typ Unit CPD Power Dissipation Capacitance f = 10 MHz 1.65 8.0 pF 2.3 8.9 3.0 9.6 4.5 10.9 http://onsemi.com 4 NLX2G66 Table 7. DEVICE ORDERING INFORMATION Package Shipping† NLX2G66AMUTCG (In Development) UQFN8−0.5P, 1.6 mm x 1.6 mm (Pb−Free) 3000 / Tape & Reel NLX2G66DMUTAG UDFN8−0.5P, 1.95 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel NLX2G66DMUTCG UDFN8−0.5P, 1.95 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel NLX2G66EMUTCG (In Development) UDFN8−0.4P, 1.6 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel NLX2G66FMUTCG (In Development) UDFN8−0.35P, 1.45 mm x 1.0 mm (Pb−Free) 3000 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLX2G66 PLOTTER POWER SUPPLY - COMPUTER DC PARAMETER ANALYZER + VCC VCC VCC VCC VCC VIH VCC GND VIL A GND Figure 2. On Resistance Test Set−Up VCC Figure 3. Maximum Off−Channel Leakage Current Test Set−Up VCC VCC VCC A N/C VCC VIH TEST POINT GND VCC GND Figure 4. Maximum On−Channel Leakage Current Test Set−Up Figure 5. Propagation Delay Test Set−Up Switch to Position 2 when testing tPLZ and tPZL Switch to Position 1 when testing tPHZ and tPZH VCC TEST POINT VCC VCC 1 A VCC 2 VCC N/C RL N/C VCC 1 CL* GND GND 2 *Includes all probe and jig capacitance. Figure 6. Propagation Delay Output Enable/Disable Test Set−Up Figure 7. Power Dissipation Capacitance Test Set−Up http://onsemi.com 6 NLX2G66 VIS VOS VCC 0.1 mF dB Meter VCC 0.1 mF VCC fin VCC fin VOS dB Meter GND RL GND *Includes all probe and jig capacitance. *Includes all probe and jig capacitance. Figure 8. Maximum On−Channel Bandwidth Test Set−Up Figure 9. Off−Channel Feedthrough Isolation Test Set−Up Figure 10. Crosstalk (between Switches) (VCC)/2 VCC RL RL VCC V VOS IS IN v 1 MHz t r + t + 2 ns f VCC GND GND *Includes all probe and jig capacitance. Figure 11. Feedthrough Noise, ON/OFF Control to Analog Out, Test Set−Up http://onsemi.com 7 NLX2G66 To Distortion Meter (VCC)/2 VIS VCC 0.1 mF RL VCC fin VOS GND *Includes all probe and jig capacitance. Figure 12. Total Harmonic Distortion Test Set−Up VCC XA 50% VCC 50% tPLH tPHL VOH YA 50% VCC VOL Figure 13. Propagation Delay, Analog In to Analog Out Waveforms tr Control tf 90% 50% VCC 10% tPZL VCC tPLZ High Impedance 50% VCC 10% Analog Out 90% 50% VCC tPHZ tPZH VOL VOH High Impedance Figure 14. Propagation Delay, ON/OFF Control http://onsemi.com 8 NLX2G66 PACKAGE DIMENSIONS UQFN8 MU SUFFIX CASE 523AN ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C ÉÉÉ ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ MOLD CMPD EXPOSED Cu E A1 A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 (0.15) SOLDERING FOOTPRINT* DETAIL A OPTIONAL CONSTRUCTION 1.70 0.50 PITCH 8X 8X L3 L 1 e 5 3 0.35 1 DETAIL A 1.70 7 8 8X b 0.10 C A B BOTTOM VIEW 0.05 C 7X 0.25 8X 0.53 NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NLX2G66 PACKAGE DIMENSIONS UDFN8 1.6x1.0, 0.4P CASE 517BY ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 L 8X 0.26 4 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 NOTE 3 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 1 PKG OUTLINE NLX2G66 PACKAGE DIMENSIONS UDFN8 1.45x1.0, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 L 8X 0.22 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 1 PKG OUTLINE NLX2G66 PACKAGE DIMENSIONS UDFN8 1.95x1.0, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 0.49 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 L 8X 0.30 4 1 L1 1.24 8 5 8X BOTTOM VIEW b 0.10 M C A B 0.05 M C 0.54 NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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