ONSEMI SBR80520LT1G

MBR0520LT1G,
SBR80520LT1G,
MBR0520LT3G,
SBR80520LT3G
Preferred Devices
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
The Schottky Power Rectifier employs the Schottky Barrier
principle with a barrier metal that produces optimal forward voltage
drop−reverse current tradeoff. Ideally suited for low voltage, high
frequency rectification, or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package provides an alternative to the
leadless 34 MELF style package. These state−of−the−art devices have
the following features:
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SCHOTTKY BARRIER
RECTIFIER
0.5 AMPERES, 20 VOLTS
SOD−123
CASE 425
STYLE 1
Features








Guardring for Stress Protection
Very Low Forward Voltage (0.38 V Max @ 0.5 A, 25C)
125C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
AEC−Q101 Qualified and PPAP Capable
SBR8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*


1
B2
M
G
B2 MG
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Mechanical Characteristics




MARKING DIAGRAM
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
ESD Ratings:
 Human Body Model = 3B
 Machine Model = C
ORDERING INFORMATION
Package
Shipping†
MBR0520LT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel **
SBR80520LT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel **
MBR0520LT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel ***
SBR80520LT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel ***
Device
** 8 mm Tape, 7” Reel
*** 8 mm Tape, 13” Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 6
1
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MBR0520LT1/D
MBR0520LT1G, SBR80520LT1G, MBR0520LT3G, SBR80520LT3G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20
V
Average Rectified Forward Current
(Rated VR, TL = 90C)
IF(AV)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Storage Temperature Range
Tstg
−65 to +150
C
Operating Junction Temperature
TJ
−65 to +125
C
dv/dt
1000
V/ms
Voltage Rate of Change (Rated VR)
0.5
5.5
ESD Ratings:
Machine Model = C
Human Body Model = 3B
> 400
> 8000
A
A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Symbol
Value
Unit
Thermal Resistance; Junction−to−Ambient (Note 1)
Characteristic
RqJA
206
C/W
Thermal Resistance; Junction−to−Lead
RqJL
150
C/W
1. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
vF
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 0.1 Amps)
(iF = 0.5 Amps)
IR
Maximum Instantaneous Reverse Current (Note 2)
(VR = 10 V)
(Rated DC Voltage = 20 V)
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2%.
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2
Value
Unit
TJ = 25C
TJ = 100C
0.300
0.385
0.220
0.330
TJ = 25C
TJ = 100C
75 mA
250 mA
5 mA
8 mA
V
mA
10,000
1
TJ = 100C
75C
25C
I R, REVERSE CURRENT (A)

iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
MBR0520LT1G, SBR80520LT1G, MBR0520LT3G, SBR80520LT3G
-25C
0.1
0.01
0.1
0.2
0.3
0.4
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
TJ = 100C
1000
75C
100
0.5
0
Figure 1. Typical Forward Voltage
I R, REVERSE CURRENT (A)

C, CAPACITANCE (pF)
20
25
100
150
100
50
0
5
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
1
-25C
0.1
0.01
25
TJ = +25C
10
0
P F(AV), AVERAGE POWER DISSIPATION (WATT)
1
0.875
DC
0.75
0.625
IPK
= p = SQUARE WAVE
IAV
0.5
5
0.375
10
0.25
20
0.125
0
60
67
74
95 102 109
81
88
LEAD TEMPERATURE (C)
116
5
10
15
20
VR, REVERSE VOLTAGE (VOLTS)
25
Figure 4. Typical Reverse Current
Figure 3. Typical Capacitance
AVERAGE FORWARD CURRENT (AMP)
10
15
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current
200
0
5
123
130
0.35
0.315
TJ = 125C
0.28
SQUARE
WAVE
0.245
IPK
+ 20 10
IAV
0.21
0.175
5
DC
p
0.14
0.105
0.07
0.035
0
0
Figure 5. Current Derating (Lead)
0.5
0.625 0.75 0.875
0.125 0.25 0.375
IF(AV), AVERAGE FORWARD CURRENT (AMP)
Figure 6. Power Dissipation
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3
1
MBR0520LT1G, SBR80520LT1G, MBR0520LT3G, SBR80520LT3G
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
ÂÂÂÂ
ÂÂÂÂ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A1
1
HE
DIM
A
A1
b
c
D
E
HE
L
q
E
2
q
MIN
0.037
0.000
0.020
--0.055
0.100
0.140
0.010
0
INCHES
NOM
0.046
0.002
0.024
--0.063
0.106
0.145
-----
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
--10 
STYLE 1:
PIN 1. CATHODE
2. ANODE
L
b
MILLIMETERS
MIN
NOM
MAX
0.94
1.17
1.35
0.00
0.05
0.10
0.51
0.61
0.71
----0.15
1.60
1.40
1.80
2.54
2.69
2.84
3.56
3.68
3.86
----0.25
--10 
0
C
SOLDERING FOOTPRINT*
ÉÉ
ÉÉ
ÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
ÉÉ
ÉÉ
ÉÉ
SCALE 10:1
1.22
0.048
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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4
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For additional information, please contact your local
Sales Representative
MBR0520LT1/D