ANPEC APL3213

APL3213/A
Li+ Charger Protection IC
Features
General Description
•
Input Over-Voltage Protection
The APL3213/A provide Li+ charger protection against
•
•
Over-Temperature Protection
High Immunity of False Triggering
over-voltage. The IC is designed to monitor input voltage.
When input voltage is over the threshold, the IC removes
•
High Accuracy Protection Thresholds
•
Available in TDFN2x2-8 Package
the power from the charging system by turning off an internal switch. The protection also have deglitch time
•
Lead Free and Green Devices Available
(RoHS Compliant)
•
Compliance to IEC61000-4-2 (Level 4)
against false triggering due to voltage spikes. The
APL3213/A also provide Power-On-Reset (POR) function
and over-temperature protection. The Power-On-Reset
circuit monitors supply voltages to prevent wrong
operations. The over-temperature protection limits the
junction temperature below 140oC in case of short circuit
+8kV (Contact Discharge)
+15kV (Air Discharge)
or overload conditions.
Applications
•
Smart Phones and PDAs
•
Digital Still Cameras
•
Portable Devices
Simplified Application Circuit
5V Adapter or USB
ACIN
OUT
Charger Input
APL3213/A
Pin Configuration
GND
ACIN 1
ACIN 2
ACIN 3
8 OUT
EP
GND 4
7 OUT
6 OUT
5 NC
TDFN2x2-8
(Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Aug., 2011
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APL3213/A
Ordering and Marking Information
Package Code
QB : TDFN2x2-8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL3213/A
Assembly Material
Handling Code
Temperature Range
Package Code
APL3213 QB:
3213
X
X - Date Code
APL3213A QB:
213A
X
X - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VACIN
ACIN Input Voltage (ACIN pin to GND)
-0.3 to 20
V
VOUT
OUT, Pin to GND Voltage
-0.3 to 7
V
IOUT
OUT Output Current
TJ
2
Maximum Junction Temperature
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature,10 Seconds
A
150
o
-65 to 150
o
260
o
C
C
C
Note1: Stresses beyond those listed under ”absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ”recommended operating conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
θJA
Junction to Ambient Thermal Resistance in Free Air (Note 2)
TDFN2x2-8
75
°C/W
Note 2 :θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions
Symbol
Parameter
Range
Unit
APL3213
4.5 to 5.5
V
APL3213A
VACIN
ACIN Input Voltage
4.5 to 5.25
V
IOUT
OUT Output Current
0 to 1.5
A
TJ
Junction Temperature
-40 to 125
°C
TA
Ambient Temperature
-40 to 85
°C
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APL3213/A
Electrical Characteristics
Refer to the typical application circuit. These specifications apply over VACIN=5V, TA= -40~85°C, unless otherwise specified. Typical
values are at TA=25°C.
Symbol
Parameter
APL3213/A
Test Conditions
Unit
Min.
Typ.
Max.
2.4
-
2.8
V
ACIN POR Hysteresis
-
250
-
mV
ACIN Supply Current
-
125
300
µA
-
8
-
ms
POWER-ON-RESET (POR) AND SUPPLY CURRENT
VPOR
ICC
TB(ACIN)
ACIN POR Threshold
Input Power-On Blanking Time
VACIN rising
VACIN rising to VOUT rising
INTERNAL POWER SWITCH AND OUT DISCHARGE RESISTANCE
Power Switch On Resistance
IOUT = 0.6A
-
130
-
mΩ
OUT Discharge Resistance
VOUT = 3V
-
500
-
Ω
5.70
5.85
6.00
V
5.285
5.33
5.38
V
5.28
5.33
5.4
V
INPUT OVER-VOLTAGE PROTECTION (OVP)
APL3213
VOVP
Input OVP Threshold
o
VACIN rising APL3213A, TA=25 C
APL3213A,
TA = -20~60oC
Input OVP Recovery Hysteresis
TON(OVP)
150
250
350
mV
Input OVP Propagation Delay
-
1
-
µs
Input OVP Recovery Time
-
8
-
ms
Over-Temperature Threshold
-
140
-
°C
Over-Temperature Hysteresis
-
20
-
°C
OVER-TEMPERATURE PROTECTION (OTP)
TOTP
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APL3213/A
ACIN Supply Current vs.
POR Threshold vs.
Junction Temperature
Junction Temperature
300
2.8
250
2.7
POR Threshold, VPOR (V)
ACIN Supply Current, IACIN (µA)
Typical Operating Characteristics
200
150
100
50
VACIN Increasing
2.6
2.5
2.4
2.3
0
-50
-25
0
25
50
75
100
VACIN Decreasing
2.2
125
-50
-25
0
Junction Temperature (°
C)
50
75
100
125
Junction Temperature (oC)
Input OVP Threshold vs.
Power Switch On Resistance vs.
Junction Temperature
Junction Temperature
5.40
250
APL3213A
Input Threshold Voltage (mV)
ACIN to OUT On Resistance
Power Switch On Resistance,
RDS,ON (m8 )
25
200
150
100
50
5.35
5.30
VACIN Increasing
5.25
5.20
5.15
5.10
5.05
VACIN Decreasing
5.00
0
-50
-25
0
25
50
75
Junction Temperature
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Aug., 2011
100
125
-50
(oC)
-25
0
25
50
75
100
125
(o
Junction Temperature C)
4
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APL3213/A
Operating Waveforms
Refer to the typical application circuit. The test condition is VACIN= 5V, CACIN= 1µF, COUT=1µF, TA= 25oC unless otherwise
specified.
Normal Power Off
Normal Power On
VACIN
1
VACIN
1
VOUT
2
2
IOUT
3
3
V OUT
IOUT
ROUT =3Ω
ROUT = 3Ω
CH1: VACIN, 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT, 1A/Div, DC
TIME: 2ms/Div
CH3: IOUT , 1A/Div, DC
TIME: 100µs/Div
CH1: VACIN, 2V/Div, DC
OVP at Power Off
OVP at Power On
VACIN
VACIN
1
1
VOUT
VOUT
2
2
IOUT
IOUT
3
3
VACIN= 0 to 12V
VACIN= 12 to 0V
CH1: VACIN, 5V/Div, DC
CH1: VDD, 5V/Div, DC
CH2: VOUT , 2V/Div, DC
CH2: VOUT , 2V/Div, DC
CH3: IOUT , 1A/Div, DC
TIME: 2ms/Div
CH3: IOUT , 1A/Div, DC
TIME: 40ms/Div
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APL3213/A
Operating Waveforms
Refer to the typical application circuit. The test condition is VACIN= 5V, CACIN= 1µF, COUT=1µF, TA= 25oC unless otherwise
specified.
Input Over-Voltage Protection
Recovery from Input OVP
APL3213
APL3213
VACIN
VACIN
1
1
VOUT
IOUT
V OUT
2
2
3
3
IOUT
VACIN = 5 to 12V, ROUT = 3Ω
VACIN = 12 to 5V, ROUT = 3Ω
CH1: VACIN , 5V/Div, DC
CH1: VACIN , 5V/Div, DC
CH2: VCHRIN , 2V/Div, DC
CH2: VCHRIN , 2V/Div, DC
CH3: IOUT , 1A/Div, DC
TIME: 10µs/Div
CH3: IOUT , 1A/Div, DC
TIME: 2ms/Div
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APL3213/A
Pin Description
PIN
FUNCTION
NO.
NAME
1, 2, 3
ACIN
Power Supply Input.
4
GND
Ground.
5
NC
6, 7, 8
OUT
-
EP
No Connection.
Output Voltage Pin. The output voltage follows the input voltage when no fault is detected.
Exposed Thermal Pad. Must be electrically connected to the GND pin.
Block Diagram
ACIN
OUT
POR
Charge
Pump
ACIN OVP
Gate Driver and
Control Logic
0.5V
GND
Thermal
Shutdown
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APL3213/A
Typical Application Circuit
5V Adapter or USB
1, 2, 3
ACIN
6, 7, 8
OUT
Charger
1µF
1µF
APL3213/A
Li+ Battery
GND
4
Figure 1. The Typical Protection Circuit for Charger Systems.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Aug., 2011
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APL3213/A
Function Description
Power-Up
The APL3213/A have a built-in power-on-reset circuit to
keep the output shutting off until internal circuitry is operating properly. The POR circuit has hysteresis and a
deglitch feature so that it will typically ignore undershoot
transients on the input. When input voltage exceeds the
POR threshold and after 8ms blanking time, the output
voltage starts a soft-start to reduce the inrush current.
Input Over-Voltage Protection (OVP)
The input voltage is monitored by the internal OVP circuit.
When the input voltage rises above the input OVP
threshold, the internal FET will be turned off within 1µs to
protect connected system on OUT pin. When the input
voltage returns below the input OVP threshold minus the
hysteresis, the FET is turned on again after 8ms recovery
time. The input OVP circuit has a 200mV hysteresis and
a recovery time of TON(OVP) to provide noise immunity
against transient conditions.
Over-Temperature Protection
When the junction temperature exceeds 140οC, the internal thermal sense circuit turns off the power FET and
allows the device to cool down. When the device’s junction temperature cools by 20οC, the internal thermal sense
circuit will enable the device, resulting in a pulsed output
during continuous thermal protection. Thermal protection is designed to protect the IC in the event of overtemperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125 οC.
VOVP
VPOR
VACIN
VOUT
Figure 2. OVP Timing Chart
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APL3213/A
Application Information
Capacitor Selection
The input capacitor is for decoupling and prevents the
input voltage from overshooting to dangerous levels. In
the AC adapter hot plug-in applications or load current
step-down transient, the input voltage has a transient
spike due to the parasitic inductance of the input cable. A
25V, X5R, dielectric ceramic capacitor with a value between 1µF and 4.7µF placed close to the ACIN pin is
recommended.
The output capacitor is for output voltage decoupling, and
also the input capacitor of the charging circuit.
At least, a 1µF, 10V, X5R capacitor is recommended.
Layout Consideration
In some failure modes, a high voltage may be applied to
the device. Make sure the clearance constraint of the PCB
layout must satisfy the design rule for high voltage.
The exposed pad of the TDFN2x2-8 performs the function of channeling heat away. It is recommended that
connect the exposed pad to a large copper ground plane
on the backside of the circuit board through several thermal vias to improve heat dissipation.
The input and output capacitors should be placed close
to the IC.
The high current traces like input trace and output trace
must be wide and short.
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Aug., 2011
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APL3213/A
Package Information
TDFN2x2-8
D
b
E
A
A1
D2
E2
A3
L
K
Pin 1 Corner
e
TDFN2x2-8
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
A1
0.00
0.05
0.000
0.002
MILLIMETERS
A3
INCHES
0.20 REF
0.008 REF
b
0.18
0.30
0.007
0.012
D
1.90
2.10
0.075
0.083
D2
1.00
1.60
0.039
0.063
0.083
0.039
E
1.90
2.10
0.075
E2
0.60
1.00
0.024
0.45
0.012
e
0.50 BSC
L
0.30
K
0.20
0.020 BSC
0.018
0.008
Note : 1. Followed from JEDEC MO-229 WCCD-3.
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APL3213/A
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TDFN2x2-8
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.20
1.75±0.10
3.50±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.4
3.35 MIN
3.35 MIN
1.30±0.20
4.0±0.10
4.0±0.10
(mm)
Devices Per Unit
Package Type
TDFN2x2-8
Copyright  ANPEC Electronics Corp.
Rev. A.3 - Aug., 2011
Unit
Tape & Reel
Quantity
3000
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APL3213/A
Taping Direction Information
TDFN2x2-8
USER DIRECTION OF FEED
Classification Profile
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APL3213/A
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
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Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
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APL3213/A
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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