APL3225

APL3225
Li+ Charger Protection IC
Features
General Description
•
The APL3225 provides complete Li+ charger protection
against input over-voltage, input over-current and over-
Provide OUT Pin 5V Voltage Clamping Protection
• Thermal Charging Regulation Protection
•
Provide Input Over-voltage Protection
•
Provide Input Over-current Protection
•
Provide Over Temperature Protection
•
Provide Reverse Current Blocking
•
High Immunity of False Triggering
•
High Accuracy Protection Threshold
•
Low On Resistance 0.3Ω Typ.
•
Compact TDFN2x2-8 and DFN3x3-8 Packages
•
Lead Free and Green Devices Available
temperature. When any of the monitored parameters is
over the threshold, the IC turns off the charging current.
All protections also have deglitch time against false triggering due to voltage spikes or current transients.
The APL3225 integrates a 5.5V LDO to prevent ACIN overshoot reaching CHR_LDO and OUT. When any transient
peak voltage above 5.5V presenting in ACIN pin, but below OVP threshold, the internal LDO will clamp its output
at 5.5V. When ACIN voltage exceeds OVP threshold, the
device will turn off charging current. The charging current
is controlled by the GATDRV pin. When sourcing a current from the GATDRV pin, the OUT pin delivers the charging current which is 200-fold magnified in amplitude
based on GATDRV’s current.
(RoHS Compliant)
Other features include accurate VVCDT/VACIN voltage divider,
reverse current blocking from OUT to ACIN and OTP
Applications
•
protection. The APL3225 provides complete Li+ charger
protections, and saves the external MOSFET and Schottky
diode for the charger of cell phone’s PMIC. The above
Cell Phones
features and small package make the APL3225 an ideal
part for cell phones applications.
Pin Configuration
ACIN 1
ACIN 2
GND 3
VCDT 4
Simplified Application Circuit
8 OUT
7 OUT
6 CHR_LDO
5 GATDRV
5V
Adapter
DFN3x3-8
(Top View)
ACIN CHR_LDO
CHR_LDO
APL3225
ACIN 1
ACIN 2
GND 3
VCDT 4
PMIC
GATDRV
8 OUT
7 OUT
6 CHR_LDO
5 GATDRV
GATDRV
VCDT
VCDT
OUT
ISENS
GND
Li+
Battery
TDFN2x2-8
(Top View)
VBAT
= Exposed Pad (connected to ground
plane for better heat dissipation)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
1
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APL3225
Ordering and Marking Information
Package Code
QA : DFN3x3-8
QB : TDFN2x2-8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL3225
Assembly Material
Handling Code
Temperature Range
Package Code
APL3225 QB:
L25
X
X - Date Code
APL3225 QA:
APL
3225
XXXXX
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
VACIN
(Note 1)
Parameter
Rating
Unit
V
ACIN Input Voltage (ACIN to GND)
-0.3 ~ 28
VCHR_LDO
CHR_LDO to GND Voltage
-0.3 ~ 7
V
VGATDRV
GATDRV to GND Voltage
-0.3 ~ VCHR_LDO
V
VCDT
VCDT to GND Voltage
-0.3 ~ 7
V
VOUT
OUT to GND Voltage
-0.3 ~ 7
V
IOUT
TJ
Output Current (OUT to GND)
2
Maximum Junction Temperature
TSTG
Storage Temperature
TSDR
Maximum Lead Soldering Temperature (10 Seconds)
A
150
o
-65 ~ 150
o
260
o
C
C
C
Note 1:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ”recommended operating conditions”is not implied. Exposure to absolute maximum rating conditions for extended periods may affect vice
reliability.
Thermal Characteristic
Symbol
θJA
θJA
Parameter
Typical Value
TDFN2x2-8 Junction-to-Ambient Resistance in free air
DFN3x3-8 Junction-to-Ambient Resistance in free air
(Note 2)
(Note 2)
Unit
75
o
65
o
C/W
C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed
pad of TDFN2x2-8 is soldered directly on the PCB.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
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APL3225
Recommended Operating Conditions
Symbol
Parameter
VACIN
ACIN Input Voltage
IOUT
Output Current
TA
Ambient Temperature
TJ
Junction Temperature
CCHR_LDO
(Note 3)
Range
Unit
4.5 ~ 6.5
V
0~1
A
-40 ~ 85
o
-40 ~ 125
o
CHR_LDO Output Capacitor
C
C
µF
1
Note 3: Refer to the typical application circuit
Electrical Characteristics
Unless otherwise specified, these specifications apply over VACIN=5V, TA= -40 ~ 85 oC. Typical values are at TA=25oC.
Symbol
Parameter
APL3225
Test Conditions
Unit
Min.
Typ.
Max.
IOUT=0A, ICHR_LDO=0A
-
350
600
µA
In OTP
-
-
550
µA
VACIN>VOVP
-
-
550
µA
VACIN rising
2.4
2.6
2.8
V
ACIN POR Hysteresis
-
250
-
mV
ACIN Power-On Blanking Time
-
8
-
ms
-
0.3
0.35
Ω
-
500
-
Ω
5.265
5.5
5.735
V
2.4
3
3.6
kΩ
6.6
6.8
7
V
150
200
250
mV
ACIN INPUT CURRENT and POWER-ON-RESET (POR)
IACIN
VPOR
TB(ACIN)
ACIN Supply Current
ACIN POR Threshold
INTERNAL SWITCH ON RESISTANCE
ACIN to OUT On Resistance
IOUT = 1A
CHR_LDO Discharge
VACIN = 12V , VCHR_LDO = 2V
Resistnace
INPUT OVER-VOLTAGE PROTECTION (OVP)
VREG
Internal LDO Output Voltage
VOVP
Input OVP Threshold
VACIN = 6V, IOUT = 10mA, TJ = -40 ~ 125 oC
LDO Output Series Resistance
APL3225
VACIN rising, TJ = -40 ~ 125 oC
Input OVP Hysteresis
TOVP
TON(OVP)
Input OVP Propagation Delay
-
-
1
µs
Input OVP recovery time
-
1
-
ms
OVER-CURRENT PROTECTION (OCP)
IOC
Over-Current Trip Threshold
TJ = 25 oC, TJ = -40 ~ 25 oC
1.5
-
-
A
ICL
Current Limit Level
TJ = 25 oC, TJ = -40 ~ 25 oC
1.2
-
-
A
0.1035
0.1056
0.1078
V/V
100
200
300
A/A
VCDT INTERNAL DIVIDER
Divider Ratio
VVCDT/VACIN
CHARGE CURRENT CONTROL
Current Mirror Gain
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
IOUT = 0.6A, IOUT/IGATDRV
3
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APL3225
Electrical Characteristics (Cont.)
Unless otherwise specified, these specifications apply over VACIN=5V, TA= -40 ~ 85 oC. Typical values are at TA=25oC.
Symbol
Parameter
APL3225
Test Conditions
Unit
Min.
Typ.
Max.
-
20
-
mV
-
150
-
mV
-
-
1
µA
REVERSE CURRENT BLOCKING
PMOS Lockout Threshold
PMOS Lockout Release
Threshold
OUT Input Current (Reverse
Current Blocking)
VOUT OVERSHOOT CLAMP
VCCAMP
VACIN = 0V, VOUT = 4.2V, VGATDRV=0V
Overshoot Clamp Rising
Threshold
VOUT rising slew rate > 0.2V/µs
4.6
4.8
5.0
V
Overshoot Clamp Pull Low
Resistance
VOUT rising slew rate > 0.2V/µs
-
3
-
Ω
Overshoot Clamp Active Time
From Overshoot Clamp Threshold being
surpassed
-
150
-
µs
TJ rising
-
160
-
°C
-
40
-
°C
Thermal Shutdown Protection
TOTP
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
Copyright  ANPEC Electronics Corp.
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APL3225
Pin Description
PIN
NO
1
FUNCTION
NAME
ACIN
Power Supply Input. Connect this pin to external DC supply. Bypass to GND with a 1µF
(minimum) ceramic capacitor.
3
GND
Ground terminal.
4
VCDT
Provide an interval voltage divider. This pin divides ACIN voltage into 39/369 ratio.
5
GATDRV
6
CHR_LDO
2
7
OUT
8
Exposed Pad
Charging current control pin. When sourcing a current from this pin, the OUT pin will source
out a current whose magnitude is 200xIGATDRV .
Output Pin. The pin provides supply voltage to the PMIC input. Bypass to GND with a 1µF
(minimum) ceramic capacitor.
Output Pins. The pin provides supply source current in series with a resistor to battery.
This pin possesses the overshoot clamp function to limit peak voltage.
-
Exposed Thermal Pad. Must be electrically connected to the GND pin.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
5
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APL3225
Block Diagram
ACIN
VCDT
CHR_LDO
GATDRV
GND
OUT
OVERSHOOT CLAMP
Typical Application Circuit
5V
Adapter
1, 2
ACIN CHR_LDO
C1
1µF
6
CHR_LDO
C2
1µF
APL3225
5
GATDRV
4
VCDT
7, 8
OUT
3
GATDRV
VCDT
ISENS
0.2Ω
GND
Li+
Battery
Designation
CACIN
PMIC
VBAT
Description
1µF, 25V, X5R, 0603
Murata GRM188R61E105K
1µF, 16V, X5R, 0603
Murata GRM188R61C105K
CCHR_LDO
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
1µF, 6.3V, X5R, 0603
Murata GRM185R60J225KE26
6
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APL3225
Function Description
ACIN Power-On-Reset (POR)
Current Limit
The APL3225 is built-in a power-on-reset circuit to keep
The output current is monitored by the internal current
limit circuit. When the output current reaches the current
the output shut off until internal circuitry is operating
properly. The POR circuit has hysteresis and a de-glitch
limit threshold, the device limits the output current at current limit threshold. The current limit level decrease as
feature so that it will typically ignore undershoot transients
on the input. When input voltage exceeds the POR thresh-
the junction temperature increase. When the Junction
temperature increases, the internal current limit circuit
old and after 8ms blanking time, the output voltage starts
a soft-start to reduce the inrush current.
reduces the current limit level, allowing the device’s Junction temperature to cool down.
ACIN Over-Voltage Protection (OVP) and LDO Mode
Operation
Internal P-MOSFET and Reverse Current Blocking
The CHR_LDO output of the IC operates similar to a lin-
The APL3225 integrates a P-channel MOSFET with the
ear regulator. When the ACIN input voltage is less than
VREG, and above the ACIN POR VACIN, the internal LDO
body diode reverse protection to replace the external PNP
transistor and Schottky diode for cell phone’s PMIC. The
output voltage tracks the input voltage with a voltage drop
caused by RDS(on) of MOSFET Q1. When the ACIN input
body diode reverse protection prevents battery voltage
supplies to CHR_LDO and ACIN pin. When the P-chan-
voltage is greater than VREG plus the RDS(on) drop of Q1,
and less than VOVP, the internal LDO output voltage is
nel MOSFET’s negative VSD voltage is detected, the internal bulk selection circuitry will switch the body diode of
regulated to VREG, and this is also referred as LDO mode
operation. If the input voltage rises above VOVP, the inter-
the P-channel MOSFET forward biased from source to
drain, meanwhile the P-channel is turned off regardless
nal FET Q1 and Q2 will be turned off within 1µs to protect
connected system on OUT pin. When the input voltage
of GATDRV’s current. This after the detection of negative
VSD, the P-channel MOSFET is in lockout state to prevent
returns below the input OVP threshold minus the
hysteresis, the FETs is turned on again after 1ms recov-
battery discharging from ACIN and CHR_LDO to external
circuitry. The P-channel MOSFET lockout will be releases
ery time. The input OVP circuit has a 200mV hysteresis
and a recovery time of TON(OVP) to provide noise immunity
when positive VSD is detected.
against transient conditions.
OUT Overshoot Clamp
This OUT pin possesses the overshoot clamp function to
Charging Current Control
limit peak voltage. Since the clamping function needs a
low resistance path between OUT pin and external high
The charging current is controlled by the GATDRV pin.
When sourcing a current from the GATDRV pin, the OUT
voltage source (in abnormal condition), please connect
this OUT pin directly to outside circuit to let clamping work.
pin delivers the charging current which is 200-fold magnified in amplitude based on GATDRV’s current. The IOUT
current can be calculated by this following equation:
IOUT=200xI GATDRV
where
The IOUT is the current flowing out from OUT pin.
The IGATDRV is the current flowing out from GATDRV pin.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
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APL3225
Application Information
Recommended Minimum Footprint
Capacitor Selection
The input capacitor is for decoupling and prevents the
input voltage from overshooting to dangerous levels. In
Thermal Via diameter
12mil X 5
0.572mm
the AC adapter hot plug-in applications or load current
step-down transient, the input voltage has a transient
Ground plane for
Thermal PAD
0.222mm
0.241mm
1.295mm
spike due to the parasitic inductance of the input cable. A
25V, X5R, dielectric ceramic capacitor with a value between 1µF and 4.7µF placed close to the ACIN pin is
recommended.
The output capacitor of CHR_LDO is for CHR_LDO voltage decoupling. And also can be as the input capacitor of
0.508mm
the charging circuit. At least, a 1µF, 10V, X5R capacitor is
recommended.
0.8mm
TDFN2x2-8
Layout Consideration
In some failure modes, a high voltage may be applied to
the device. Make sure the clearance constraint of the PCB
layout must satisfy the design rule for high voltage. The
exposed pad of the TDFN2x2-8 and DFN3x3-8 performs
Thermal Via diameter
12mil X 5
Ground plane for
Thermal PAD
0.305mm
0.61mm
the function of channeling heat away. It is recommended
that connect the exposed pad to a large copper ground
0.305mm
2.146mm
plane on the backside of the circuit board through several thermal vias to improve heat dissipation. The input
and output capacitors should be placed close to the IC.
The high current traces like input trace and output trace
must be wide and short.
0.66mm
1.575mm
DFN3X3-8
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
8
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APL3225
Package Information
TDFN2x2-8
A
b
E
D
D2
A1
E2
A3
L
Pin 1 Corner
e
S
Y
M
B
O
L
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
0.05
0.000
0.002
0.012
0.083
A1
TDFN2x2-8
MILLIMETERS
0.00
A3
INCHES
0.20 REF
0.008 REF
b
0.18
0.30
0.007
D
1.90
2.10
0.075
D2
1.00
1.60
0.039
0.063
E
1.90
2.10
0.075
0.083
E2
0.60
1.00
0.024
0.039
0.45
0.012
e
L
0.50 BSC
0.30
0.020 BSC
0.018
Note : 1. Follow from JEDEC MO-229 WCCD-3.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
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APL3225
Package Information
DFN3x3-8
D
b
E
A
Pin 1
A1
D2
A3
L
K
E2
Pin 1 Corner
e
S
Y
M
B
O
L
DFN3x3-8
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.80
1.00
0.031
0.039
A1
0.00
0.05
0.000
0.002
A3
0.20 REF
0.008 REF
b
0.25
0.35
0.010
0.014
D
2.90
3.10
0.114
0.122
D2
1.90
2.40
0.075
0.094
E
2.90
3.10
0.114
0.122
E2
1.40
1.75
0.055
0.069
e
0.65 BSC
L
0.30
K
0.20
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
0.026 BSC
0.012
0.50
0.020
0.008
10
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APL3225
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
TDFN2x2-8
Application
DFN3x3-8
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
8.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
8.0±0.20
1.75±0.10
3.50±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
4.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.4
2.35 MIN
2.35 MIN
1.00±0.20
A
H
T1
C
d
D
W
E1
F
178.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
3.30±0.20
3.30±0.20
1.30±0.20
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TDFN2x2-8
Tape & Reel
3000
DFN3x3-8
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
11
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APL3225
Taping Direction Information
TDFN2x2-8
USER DIRECTION OF FEED
DFN3x3-8
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
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APL3225
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
13
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APL3225
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
14
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
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APL3225
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
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