DOCUMENT : SM340000NH REVISION : A2 PAGE : 1 OF 7 SPECIFICATION FOR APPROVAL 1/2W, 0805 Low Resistance Chip Resistor (Lead / Halogen free) 1. Scope This specification applies to 1.2mm x 2.0mm size 1/2W, fixed metal foil with ceramic carrier current sensing resistors used in electronic equipment. 2. Type Designation RL1220 — 4 — □□□□ (1) (2) (3) Where (1) Series No. (2) Power rating 4= 1/2W (3) Resistance value: For example— R010 = 0.010 Ω (4) Resistance tolerance: F= ± 1% G= ± 2% J= ± 5% □ (4) 3. Construction and Physical Dimensions (3) (4)Green (2) (1) (5)White Figure 1. (5) Structure (No mark) Code Letter Dimensions (mm) L 2.00 ± 0.20 W 1.30 ± 0.20 t 0.80 ± 0.25 a 0.40 ± 0.20 NOTE: (1) Substrate: (2) Resistor: (3) Terminals: (4) Marking: (5) Protection coat: Alumina 96% Cu alloy Sn (on Cu ) Heat resistive epoxy resin(Green) Heat resistive epoxy resin(White) DOCUMENT : SM340000NH REVISION : A2 PAGE : 2 OF 7 SPECIFICATION FOR APPROVAL 4. Ratings 4-1 Specification Power Rating* 1/2 W Resistance Range 10~50(mΩ) Temperature Coefficient of Resistance ±100ppm/℃ ±1% , ±2% , ±5% Resistance Tolerance Note*: RATED LOAD(%) Power rating is based on continuous full load operation at rated ambient temperature of 70℃. For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in accordance with the following curve. 100 0 -55 70 170 AMBIENT TEMPERATURE(℃) Figure 2.：Power Temperature Derating Curve 4-2 Rated Voltage The rated voltage shall be determined by the following expression. V = P× R Where V：Rated voltage (V) R：Nominal resistance value (Ω) P：Rated dissipation (W) 4-3 Operating and Storage Temperature Range -55 to +170℃ DOCUMENT : SM340000NH REVISION : A2 PAGE : 3 OF 7 SPECIFICATION FOR APPROVAL 5. Characteristics Test Item Condition of Test Requirements Short Time Overload 2.5 * Rated power for 5 seconds Refer to JIS C 5201-1 4.13 ∆R : ± (0.5%+0.0005Ω) Without significant damage by flashover ( spark, arching ), burning or breakdown etc. Insulation Resistance The resistor shall be cramped in the metal block and tested , as shown below. Test voltage : 100 ± 15VDC for 1 minute Refer to JIS C 5201-1 4.6 Mounting condition G. Between Electrode and Protection Film 100MΩ or over Between Electrode and Substrate 1,000MΩ or over Voltage Proof The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω) Refer to JIS C 5201-1 4.7 Without damage by flashover, fire or breakdown, as shown below. Thermal Shock -55 ~125℃ 100 cycles, 15 min at each extreme condition Refer to JIS C 5201-1 4.19 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Low Temperature Storage Kept at -55℃, 1,000 hours Refer to JIS C 5201-1 4.23.4 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance High Temperature Exposure Kept at 170℃ for 1,000 hours Refer to JIS C 5201-1 4.23.2 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Solderability Temperature of Solder : 245 ± 5℃ Immersion Duration : 2 ± 0.5 second Refer to JIS C 5201-1 4.17 Uniform coating of solder cover minimum of 95% surface being immersed Resistance to Soldering Heat Dipped into solder at 270 ± 5℃ for 10 ± 1 seconds Refer to JIS C 5201-1 4.18 ∆R : ± (0.5%+0.0005Ω) Without distinct deformation in appearance DOCUMENT : SM340000NH REVISION : A2 PAGE : 4 OF 7 SPECIFICATION FOR APPROVAL Test Item Condition of Test Requirements Load Life Rated voltage for 1.5 hours followed by a pause 0.5 hour at 70 ± 2℃. Cycle repeated 1000 hours Refer to JIS C 5201-1 4.25 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Damp Heat with Load 40 ± 2℃ with relative humidity 90% to 95%. D.C. rated voltage for 1.5 hours ON and 30 minutes OFF. Cycle repeated 1,000 hours Refer to JIS C 5201-1 4.24 ∆R : ± (1.0%+0.0005Ω) Without distinct damage in appearance Mechanical Shock 100 G’s for 6milliseconds. 5 pulses Refer to JIS C 5201-1 4.21 ∆R : ± (0.5%+0.0005Ω) Without mechanical damage such as break Bending Test Glass-Epoxy board thickness : 1.6mm Bending width : 2mm Between the fulcrums : 90mm Refer to JIS C 5201-1 4.33 ∆R : ±(0.5%+0.0005Ω) Without mechanical damage such as break DOCUMENT : SM340000NH REVISION : A2 PAGE : 5 OF 7 SPECIFICATION FOR APPROVAL 6. Recommended Solder Pad Dimensions 1220 W (mm) L (mm) D (mm) 1.65 3.4 1.2 Cu Trace Sensing Trace Note : We recommend there is no circuit design between pads to avoid circuit short DOCUMENT : SM340000NH REVISION : A2 PAGE : 6 OF 7 SPECIFICATION FOR APPROVAL 7. Packaging 7-1 Dimensions 7-1-1 Tape packaging dimensions 4.0 ± 0.1 D0 T 2.0 ± 0.05 1.75 ± 0.1 F B0 A0 P1 K0 A0 1.65 ± 0.10 F 3.50 ± 0.05 B0 2.35 ± 0.10 P1 4.00 ± 0.10 T 0.20 ± 0.10 W 8.00 ± 0.30 K0 1.05 ± 0.10 D0 φ1.55 ± 0.05 7-1-2 Reel Dimensions 2.0 ± 0.5 22 min. Label Unit : mm 56 ± 2.0 60 ± 1.0 178 ± 2.0 13.0 ± 0.2 9.0 ± 0.3 11.4 ± 1.0 W SPECIFICATION FOR APPROVAL 7-2 Peel force of top cover tape The peel speed shall be about 300 mm / min. The peel force of top cover tape shall be between 0.1 to 0.7 N. Top Cover Tape 80° 165 ~ 1 0.1 ~ 0.7N Carrier tape 7-3 Numbers of taping 4,000 pieces / reel 7-4 Label marking The following items shall be marked on the reel. (1) Type designation (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin DOCUMENT : SM340000NH REVISION : A2 PAGE : 7 OF 7