2-Channel Headset/Microphone EMI Filter Array with ESD Protection CM1412 Features Product Description • The CM1412 is a dual, low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800 to 2700 MHz range. These pi-style filters support bidirectional filtering that control EMI both to and from a microphone element. They also support AC signals, enabling audio signals to pass through without distortion. • • • • • • • • • • Functionally and pin compatible with CMD’s CSPEMI202A OptiGuard™ coated for improved reliability at assembly Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports AC signals—ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free RoHS compliant Applications • • • • • • • EMI filtering and ESD protection for headset microphone ports Wireless handsets Handheld PCs / PDAs MP3 players Digital camcorders Notebooks Desktop PCs In addition, the CM1412 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1412 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1412 incorporates OptiGuard™ coating which results in improved reliability at assembly and is available in a space-saving, lowprofile Chip Scale Package with lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1412/D CM1412 Block Diagram PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 MIC_IN1 Microphone Input 1 (from microphone) A3 MIC_IN2 Microphone Input 2 (from microphone) B2 GND C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C3 MIC_OUT2 Microphone Output 2 (to audio circuitry) Device Ground Rev. 3 | Page 2 of 9 | www.onsemi.com CM1412 Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps Package Ordering Part Number1 Part Marking 5 CSP CM1412-03CP CB Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 200 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 3 of 9 | www.onsemi.com CM1412 ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL R CONDITIONS Resistance RMATCH C PARAMETER Capacitance VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 68Ω, C = 47pF fC MAX UNITS 61 68 75 Ω 5 % 56 pF 1.0 μA 15 -5 V V 38 Diode Leakage Current VCL TYP Resistance Matching ILEAK VESD MIN 5 -15 47 7 -10 ±15 kV ±8 kV +15 -19 V V 60 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 3 | Page 4 of 9 | www.onsemi.com CM1412 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Rev. 3 | Page 5 of 9 | www.onsemi.com CM1412 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 6 of 9 | www.onsemi.com 260°C CM1412 Mechanical Details CSP Mechanical Specifications The CM1411 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 5 Millimeters Inches Dim Min Nom Max Min Nom Max A1 0.885 0.930 0.975 0.0348 0.0366 0.0384 A2 1.365 1.410 1.455 0.0537 0.0555 0.0573 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.165 0.215 0.265 0.0065 0.0085 0.0104 C2 0.220 0.270 0.320 0.0087 0.0106 0.0126 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1412 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 7 of 9 | www.onsemi.com CM1412 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1412 1.41 X 0.95 X 0.644 POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W REEL DIAMETER QTY PER REEL P0 P1 1.52 X 1.07 X 0.720 178mm (7") 3500 4mm 4mm 8mm Figure 5. Tape and Reel Mechanical Data Rev. 3 | Page 8 of 9 | www.onsemi.com CM1412 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 3 | Page 9 of 9 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative