8-Channel ESD Protection Array in Chip Scale Package CM1205 Features Product Description • The CM1205 transient voltage suppressor array provides a very high level of protection for sensitive electronic components that may be subjected to ESD. • • • • • Functionally and pin compatible with CMD’s PACDN1408 ESD protection device Eight transient voltage suppressors in a single package Optiguard coated for improved reliability at assembly In-system Electrostatic Discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages RoHS compliant (lead-free) 10-bump CSP TM Applications • • • • • • • • ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs The CM1205 will safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, +8kV contact discharge). All I/Os are rated at +25kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of this device enables extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1205 features OptiGuard coating for improved reliability at assembly and is available with RoHS compliant lead-free finishing. TM Block Diagram ©2010 SCILLC. All rights reserved. April 2010 – Rev. 3 Publication Order Number: CM1205/D CM1205 Ordering Information PART NUMBERING INFORMATION 1 Bumps Package Ordering Part Number Part Marking 10 CSP CM1205-08CP 120508 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 2 of 8 | www.onsemi.com RATING UNITS -40 to +85 °C CM1205 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VREV Reverse Standoff Voltage IDIODE=10µA ILEAK Leakage Current VIN=3.3V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Note 2 Channel Capacitance At 2.5V DC, f = 1MHz, VESD VCL C MIN TYP 1 MAX 6.0 5.6 -1.2 6.8 -0.8 UNITS V 100 nA 8.0 -0.4 V V +30 kV +25 kV +12 -8 39 V V 47 pF Note 1: TA=25°C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Rev. 3 | Page 3 of 8 | www.onsemi.com CM1205 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature 260ûC Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Rev. 3 | Page 4 of 8 | www.onsemi.com CM1205 Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 5 of 8 | www.onsemi.com CM1205 Mechanical Details The CM1205 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSions Package Custom CSP Bumps 10 Dim Millimeters Min Nom Max Inches Min Nom Max A1 1.109 1.154 1.199 0.0437 0.0454 0.0472 A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.612 0.682 0.751 0.0241 0.0268 0.0296 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1205 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 6 of 8 | www.onsemi.com CM1205 CSP Tape and Reel Specifications POCKET SIZE (mm) TAPE WIDTH B0 X A0 X K0 W PART NUMBER CHIP SIZE (mm) CM1205-08CP 3.104 X 1.154 X 0.682 3.28 X 1.32 X 0.81 8mm Figure 5. Tape and Reel Mechanical Data Rev. 3 | Page 7 of 8 | www.onsemi.com REEL DIAMETER QTY PER REEL P0 P1 178mm (7") 3500 4mm 4mm CM1205 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Literature Distribution Center for ON Semiconductor Toll Free USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your Email: [email protected] Phone: 81-3-5773-3850 local Sales Representative Rev. 3 | Page 8 of 8 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit