4-Channel ESD Array in CSP CM1204 Features Product Description • Functionally and pin compatible with CMD’s The CM1204 is a quad ESD transient voltage supression CSPESD304 TM Optiguard coated for improved reliability diode array. Each diode provides a very high level of • • Four channels of ESD protection subjected to electrostatic discharge (ESD). These diodes • ±15kV ESD protection on each channel safely dissipate ESD strikes of ±15kV, exceeding the (IEC 61000-4-2 Level 4, contact discharge) maximum requirement of the IEC 61000-4-2 international • ±30kV ESD protection on each channel (HBM) standard. • Chip Scale Package features extremely low specification for Human Body Model (HBM) ESD, the lead inductance for optimum ESD protection device provides protection for contact discharges to greater 5-bump, 0.960mm X 1.330mm footprint than +30kV. • protection for sensitive electronic components that may be Using the MIL-STD-883 (Method 3015) Chip Scale Package (CSP) • The CM1204 is particularly well suited for portable RoHS compliant (lead-free) electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low Applications weight. • ESD protection for sensitive electronic equipment • I/O port and keypad and button circuitry The CM1204 features Optiguard protection for portable devices improved reliability at assembly. It is available in a space- • Wireless Handsets saving, low-profile chip scale package with RoHS- • Handheld PCs / PDAs compliant lead-free finishing. • MP3 Players • Digital Camcorders • Notebooks • Desktop PCs TM coating which results in Block Diagram ESD_1 ESD_2 ESD_3 ESD_4 C1 C3 A1 A3 GND ©2010 SCILLC. All rights reserved. April 2010 – Rev. 3 B2 Publication Order Number: CM1204/D CM1204 PIN DESCRIPTIONS Pin Name Description A1 ESD_1 ESD Channel1 A3 ESD_2 ESD Channel 2 B2 GND Device Ground C1 ESD_3 ESD Channel 3 C3 ESD_4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Pins Package 5 CSP 1 Ordering Part Number CM1204-03CP Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 3 | Page 2 of 9 | www.onsemi.com Part Marking S CM1204 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C 200 mW RATING UNITS -40 to +85 °C DC Package Power Rating STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL VDIODE PARAMETER CONDITIONS Diode Reverse Breakdown Voltage IDIODE = 10µA ILEAK Diode Leakage Current VIN=3.3V, TA=25°C VSIG Signal Voltage Positive Clamp Negative Clamp IDIODE = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Note 2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Note 2 Diode Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC VESD VCL CDIODE MIN TYP MAX 6.0 5.6 -1.5 6.8 -0.8 V 100 nA 9.0 -0.4 V V ±30 kV ±15 kV +15 -8 Note 1: TA=-40 to +85°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Rev. 3 | Page 3 of 9 | www.onsemi.com UNITS 22 27 V V 32 pF CM1204 Performance Information Diode Characteristics (nominal conditions unless specified otherwise) Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) Figure 2. Frequency Response (single channel vs. GND, in 50Ω system) Rev. 3 | Page 4 of 9 | www.onsemi.com CM1204 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature 260ûC Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Rev. 3 | Page 5 of 9 | www.onsemi.com CM1204 Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 6 of 9 | www.onsemi.com CM1204 Mechanical Details The CM1204 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 5 Dim Millimeters Min Nom Max Inches Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces Package Dimensions for CM1204 Chip Scale Package Controlling dimension: millimeters Rev. 3 | Page 7 of 9 | www.onsemi.com CM1204 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1204-03CP 1.33 X 0.96 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 1.42 X 1.07 X 0.740 8mm 178mm (7") 3500 4mm 4mm Figure 5. Tape and Reel Mechanical Data Rev. 3 | Page 8 of 9 | www.onsemi.com CM1204 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Literature Distribution Center for ON Semiconductor Toll Free USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your Email: [email protected] Phone: 81-3-5773-3850 local Sales Representative Rev. 3 | Page 9 of 9 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit