DG467, DG468 Vishay Siliconix Low Power, High Voltage SPST Analog Switches DESCRIPTION FEATURES The DG467 and DG468 are dual supply single-pole/singlethrow (SPST) switches. On resistance is 10 maximum and flatness is 2 max over the specified analog signal range. These analog switches were designed to provide high speed, low error switching of precision analog signals. The primary application areas are in the routing and switching in telecommunications and test equipment. Combining low power, low leakages, low on-resistance and small physical size, the DG467/468 are also ideally suited for portable and battery powered industrial and military equipment. • Halogen-free according to IEC 61249-2-21 Definition • ± 15 V Analog Signal Range • On-Resistance - RDS(on): 10 max • Fast Switching Action - TON: 100 ns • VL Logic Supply Not Required • TTL CMOS Input Compatible • Rail To Rail Signal Handling • Dual Or Single Supply Operation • Compliant to RoHS Directive 2002/95/EC BENEFITS The DG467 has one normally closed switch, while the DG468 switch is normally open. They operate either from a single + 7 V to 36 V supply or from dual ± 4.5 V to ± 20 V supplies. They are offered in the very popular, small TSOP6 package. • • • • • • Wide Dynamic Range Low Signal Errors and Distortion Break-Befor-Make Switching Action Simple Interfacing Reduced Board Space Improved Reliability APPLICATIONS • • • • • • • • Precision Test Equipment Precision Instrumentaion Communications Systems PBX, PABX Systems Audio Equipment Redundant Systems PC Multimedia Boards Hard Disc Drivers FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION DG467 TRUTH TABLE NC 1 6 COM V- 2 5 V+ IN 3 4 GND Logic 0 1 DG467 ON OFF DG468 OFF ON Logic "0" 0.8 V Logic "1" 2.4 V Device Marking: DG467DV = G7xxx DG468DV = G8xxx TSOP6 DG468 NO 1 6 COM V- 2 5 V+ IN 3 4 GND TSOP6 Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix ORDERING INFORMATION Temp Range DG467/DG468 Package - 40 °C to 85 °C 6-Pin TSOP Part Number DG467DV-T1-E3 DG468DV-T1-E3 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Referenced To V- Symbol V+ Unit 44 25 (V-) - 2 to (V+) + 2 or 30 mA, whichever occurs first 30 GND Digital Inputsa, VNO/NC, VCOM Current, (Any Terminal) Continuous Current (NO or NC or COM) Pulsed at 1 ms, 10 % duty cycle Storage Temperature (Package)b Limit 100 - 65 to 150 TSOPc 570 V mA °C mW Power Dissipation 6-Pin Notes: a. Signals on NO, NC, COM, or IN exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings. b. All leads welded or soldered to PC Board. c. Derate 7 mW/°C above 70 °C. www.vishay.com 2 Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix SPECIFICATIONSa (V ± = ± 15 V) Test Conditions Unless Otherwise Specified V+ = 15 V, V- = - 15 V Parameter D Suffix - 40 °C to 85 °C VIN = 2.4 V, 0.8 Vf Temp.b Min.d Full - 15 INO/NC = 10 mA, VCOM = 10 V V+ = 13.5 V, V- = - 13.5 V INO/NC = 10 mA, VCOM = ± 5 V, 0 V V+ = 13.5 V, V- = - 13.5 V Room Full 7 9 10 Room Full 0.7 1 2 INO/NC(off) V+ = 16.5, V- = - 16.5 V VCOM = ± 15.5 V VNO/NC = -/+ 15.5 V -1 - 10 -1 - 10 - 0.1 ICOM(off) Room Full Room Full 1 10 1 10 ICOM(on) V+ = 16.5 V, V- = - 16.5 VCOM = VNO/NC = ± 15.5 V Room Full -1 - 10 2.4 Symbol Typ.c Max.d Unit 15 V Analog Switch Analog Signal Rangee VANALOG Drain-Source On-Resistance rON On-Resistance Flatness rON Flatness Switch Off Leakage Current Channel On Leakage Current - 0.1 - 0.1 nA 1 10 Digital Control Input, High Voltage IINH Full Input, Low Voltage IINL Full Input Capacitancee Input Current CIN IIN 0.8 Room VIN = 0 or 5 V 5 -1 V pF 1 µA 140 160 80 100 ns Dynamic Characteristics Turn-On Time tON Turn-Off Time tOFF VNO/NC = ± 10 V Room Full Room Full Q CL = 1 nF, Vgen = 0 V, Rgen = 0 Room 21 pC OIRR CL= 5 pF, RL = 50 , f = 1 MHz Room - 61 dB Room 30 Charge Injectione Off-Isolatione Source Off Capacitance e CS(off) Drain Off Capacitancee CD(off) Channel On Capacitancee CD(on) RL = 300 , CL = 35 pF f = 1 MHz 100 50 Room 15 f = 1 MHz Room 76 Room Full Room Full 5 V+ = 16.5 V, V- = - 16.5 V VIN = 0 or 5 V pF Power Supplies Positive Supply Current I+ Negative Supply Current I- Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 -1 - 10 - 0.02 15 20 µA www.vishay.com 3 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix SPECIFICATIONSa (V+ = 12 V) Test Conditions Unless Otherwise Specified V+ = 12 V, V- = 0 V Parameter Symbol VIN = 2.4 V, 0.8 Vf D Suffix - 40 °C to 85 °C Temp.b Min.d Full 0 Typ.c Max.d Unit 12 V Analog Switch Analog Signal Rangee Drain-Source On-Resistance On-Resistance Flatness VANALOG rON INO/NC = –10 mA, VCOM = 8 V V+ = 10.8 V Room Full 12 16 20 rON Flatness INO/NC = 10 mA, VCOM = 2, 6, 8 V V+ = 10.8 V Room Full 1.5 3 4 130 VNO, NC = ± 10 V, RL = 300 , CL = 35 pF Room Full Room Full 160 200 80 100 nS Q CL = 1 nF, Vgen = 0 V, Rgen = 0 Room 8 I+ V+ = 13.2 V, VIN = 0 V, 5 V Room Full 3 Dynamic Characteristics Turn-On Time tON Turn-Off Time tOFF Charge Injectione 50 pC Power Supplies Positive Supply Current 7 10 µA Notes: a. Refer to PROCESS OPTION FLOWCHART. b. Room = 25 °C, Full = as determined by the operating temperature suffix. c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. d. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. e. Guaranteed by design, not subject to production test. f. VIN = input voltage to perform proper function. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 4 Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 16 20 16 12 R ON - On-Resistance (Ω) R ON - On-Resistance (Ω) INO/NC = 10 mA V+ = 12 V INO/NC = 10 mA V+ = 9 V 8 V+ = 12 V V+ = 24 V V+ = 36 V 4 85 °C 12 25 °C 8 4 0 0 0 6 12 18 24 VCOM - Analog Voltage (V) 30 36 0 RON vs. VCOM and Single Supply Voltage V=± 8V V = ± 15 V R ON - On-Resistance (Ω) 8 V = ± 15 V 8 4 6 VCOM - Analog Voltage (V) 10 12 10 INO/NC = 10 mA V = ± 12 V 2 RON vs. Analog Voltage and Temperature 10 R ON - On-Resistance (Ω) - 40 °C V = ± 10 V 6 4 V = ± 20 V 2 INO/NC = 10 mA 8 85 °C 6 25 °C 4 - 40 °C 2 0 - 20 - 15 - 10 5 10 -5 0 VCOM - Analog Voltage (V) 15 0 - 15 20 - 10 -5 0 5 10 15 VCOM - Analog Voltage (V) RON vs. VCOM and Dual Supply Voltage 600 RON vs. Analog Voltage and Temperature 10 000 V = ± 16.5 V V = ± 16.5 V 200 I COM(ON) I COM(OFF) 0 I NO/NC(OFF) - 200 Leakage Current (pA) Leakage Current (pA) 400 1000 I COM(ON) I NO/NC(OFF) 100 10 I COM(OFF) - 400 - 600 - 16.5 - 13.5 - 10.5 - 7.5 - 4.5 - 1.5 1.5 4.5 7.5 10.5 13.5 16.5 VCOM, VNO , VNC - Analog Voltage (V) Leakage vs. Analog Voltage Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 1 - 40 - 20 0 20 40 Temperature (°C) 60 80 Leakage Current vs. Temperature www.vishay.com 5 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 1 mA 10 µA 1 µA V = ± 15 V I+, I GND 100 nA 100 µA Isupply I supply 10 nA 1 nA V=±8V V = ± 20 V 10 µA I100 pA 10 pA - 15 10 35 Temperature (°C) 60 0 85 V = ± 15 V V = ± 12 V 1 µA 1 pA - 40 5 10 15 20 Vin (V) Supply Current vs. Temperature Supply Current vs. VIN 350 160 300 140 V + = 12 V t ON , t OFF (ns) t ON , t OFF (ns) t ON 120 250 200 t ON 150 100 80 60 t OFF 100 40 t OFF 50 20 0 ±4 ± 12 ±8 0 - 40 ± 20 ± 16 - 15 Supply Voltage (V) Switching Time vs. Supply Voltages 60 85 Switching Time vs. Temperature 0 140 120 10 35 Temperature (°C) Loss t ON V = ± 15 V - 10 - 20 Loss, OIRR (dB) t ON , t OFF (ns) 100 80 60 t OFF 40 - 30 - 40 OIRR - 50 - 60 20 - 70 0 - 40 - 15 10 35 60 Temperature (°C) Switching Time vs. Temperature www.vishay.com 6 85 - 80 100K 1M 10M 100M 1G Frequency (Hz) Off Isolation and Insertion Loss vs. Frequency Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) 15 2.4 10 Q - Charge Injection (pC) Vth - Threshold Voltage (V) ± 15 V Power supply CL = 1 nF 5 0 -5 12 V Power supply CL = 1 nF - 10 - 15 - 20 - 25 2.0 1.6 1.2 - 30 - 35 0.8 - 40 - 15 - 10 -5 0 5 10 15 5 15 10 VCOM (V) 25 20 30 V+ - Supply Voltage (V) Charge Injection vs. Analog Voltage Input Switching Threshold vs. Supply Voltage TEST CIRCUITS VO is the steady state output with the switch on. + 15 V tr < 20 ns tf < 20 ns 3V Logic Input 50 % V+ NO/NC 10 V 0V COM VO IN RL 300 V- GND CL 35 pF - 15 V CL (includes fixture and stray capacitance) VO = V S tOFF Switch Input VS Switch Output 0V Note: RL VO 90 % tON Logic input waveform is inverted for switches that have the opposite logic sense. RL + rON Figure 1. Switching Time ΔVO + 15 V Rg V gen COM VO IN CL 1 nF 3V GND VO V+ NO/NC V- INX OFF ON Q= OFF VO x CL - 15 V Figure 2. Charge Injection Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 www.vishay.com 7 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DG467, DG468 Vishay Siliconix TEST CIRCUITS VO is the steady state output with the switch on. + 15 V + 15 V C C V+ VS NO/NC VS VO COM V+ COM VO Rg = 50 Rg = 50 0V, 2.4 V NO/NC RL IN GND GND C V- RL IN 0 V, 2.4 V V- C - 15 V - 15 V Figure 4. Insertion Loss VO Off Isolation = 20 log VS Figure 3. Off Isolation + 15 V C V+ NO/NC Meter 0 V, 2.4 V IN HP4192A Impedance Analyzer or Equivalent COM GND V- C f = 1 MHz - 15 V Figure 5. Source/Drain Capacitances Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?74413. www.vishay.com 8 Document Number: 74413 S11-1429–Rev. C, 18-Jul-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information Vishay Siliconix TSOP: 5/6−LEAD JEDEC Part Number: MO-193C e1 e1 5 4 6 E1 1 2 5 4 E E1 1 3 2 3 -B- e b E -B- e 0.15 M C B A 5-LEAD TSOP b 0.15 M C B A 6-LEAD TSOP 4x 1 -A- D 0.17 Ref c R R A2 A L2 Gauge Plane Seating Plane Seating Plane 0.08 C L A1 -C- (L1) 4x 1 MILLIMETERS Dim A A1 A2 b c D E E1 e e1 L L1 L2 R Min Nom Max Min Nom Max 0.91 - 1.10 0.036 - 0.043 0.01 - 0.10 0.0004 - 0.004 0.90 - 1.00 0.035 0.038 0.039 0.30 0.32 0.45 0.012 0.013 0.018 0.10 0.15 0.20 0.004 0.006 0.008 2.95 3.05 3.10 0.116 0.120 0.122 2.70 2.85 2.98 0.106 0.112 0.117 1.55 1.65 1.70 0.061 0.065 0.067 0.95 BSC 0.0374 BSC 1.80 1.90 2.00 0.071 0.075 0.079 0.32 - 0.50 0.012 - 0.020 0.60 Ref 0.024 Ref 0.25 BSC 0.010 BSC 0.10 - - 0.004 - - 0 4 8 0 4 8 7 Nom 1 ECN: C-06593-Rev. I, 18-Dec-06 DWG: 5540 Document Number: 71200 18-Dec-06 INCHES 7 Nom www.vishay.com 1 AN823 Vishay Siliconix Mounting LITTLE FOOTR TSOP-6 Power MOSFETs Surface mounted power MOSFET packaging has been based on integrated circuit and small signal packages. Those packages have been modified to provide the improvements in heat transfer required by power MOSFETs. Leadframe materials and design, molding compounds, and die attach materials have been changed. What has remained the same is the footprint of the packages. The basis of the pad design for surface mounted power MOSFET is the basic footprint for the package. For the TSOP-6 package outline drawing see http://www.vishay.com/doc?71200 and see http://www.vishay.com/doc?72610 for the minimum pad footprint. In converting the footprint to the pad set for a power MOSFET, you must remember that not only do you want to make electrical connection to the package, but you must made thermal connection and provide a means to draw heat from the package, and move it away from the package. In the case of the TSOP-6 package, the electrical connections are very simple. Pins 1, 2, 5, and 6 are the drain of the MOSFET and are connected together. For a small signal device or integrated circuit, typical connections would be made with traces that are 0.020 inches wide. Since the drain pins serve the additional function of providing the thermal connection to the package, this level of connection is inadequate. The total cross section of the copper may be adequate to carry the current required for the application, but it presents a large thermal impedance. Also, heat spreads in a circular fashion from the heat source. In this case the drain pins are the heat sources when looking at heat spread on the PC board. Since surface mounted packages are small, and reflow soldering is the most common form of soldering for surface mount components, “thermal” connections from the planar copper to the pads have not been used. Even if additional planar copper area is used, there should be no problems in the soldering process. The actual solder connections are defined by the solder mask openings. By combining the basic footprint with the copper plane on the drain pins, the solder mask generation occurs automatically. A final item to keep in mind is the width of the power traces. The absolute minimum power trace width must be determined by the amount of current it has to carry. For thermal reasons, this minimum width should be at least 0.020 inches. The use of wide traces connected to the drain plane provides a low impedance path for heat to move away from the device. REFLOW SOLDERING Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected to solder reflow as a test preconditioning and are then reliability-tested using temperature cycle, bias humidity, HAST, or pressure pot. The solder reflow temperature profile used, and the temperatures and time duration, are shown in Figures 2 and 3. Figure 1 shows the copper spreading recommended footprint for the TSOP-6 package. This pattern shows the starting point for utilizing the board area available for the heat spreading copper. To create this pattern, a plane of copper overlays the basic pattern on pins 1,2,5, and 6. The copper plane connects the drain pins electrically, but more importantly provides planar copper to draw heat from the drain leads and start the process of spreading the heat so it can be dissipated into the ambient air. Notice that the planar copper is shaped like a “T” to move heat away from the drain leads in all directions. This pattern uses all the available area underneath the body for this purpose. 0.167 4.25 0.074 1.875 0.014 0.35 0.122 3.1 0.026 0.65 0.049 1.25 0.049 1.25 0.010 0.25 FIGURE 1. Recommended Copper Spreading Footprint Document Number: 71743 27-Feb-04 Ramp-Up Rate +6_C/Second Maximum Temperature @ 155 " 15_C 120 Seconds Maximum Temperature Above 180_C 70 − 180 Seconds Maximum Temperature 240 +5/−0_C Time at Maximum Temperature 20 − 40 Seconds Ramp-Down Rate +6_C/Second Maximum FIGURE 2. Solder Reflow Temperature Profile www.vishay.com 1 AN823 Vishay Siliconix 10 s (max) 255 − 260_C 1X4_C/s (max) 3-6_C/s (max) 217_C 140 − 170_C 60 s (max) 60-120 s (min) Pre-Heating Zone 3_C/s (max) Reflow Zone Maximum peak temperature at 240_C is allowed. FIGURE 3. Solder Reflow Temperature and Time Durations THERMAL PERFORMANCE TABLE 1. Equivalent Steady State Performance—TSOP-6 Thermal Resistance Rqjf 30_C/W On-Resistance vs. Junction Temperature 1.6 VGS = 4.5 V ID = 6.1 A 1.4 rDS(on) − On-Resiistance (Normalized) A basic measure of a device’s thermal performance is the junction-to-case thermal resistance, Rqjc, or the junction-to-foot thermal resistance, Rqjf. This parameter is measured for the device mounted to an infinite heat sink and is therefore a characterization of the device only, in other words, independent of the properties of the object to which the device is mounted. Table 1 shows the thermal performance of the TSOP-6. 1.2 1.0 0.8 0.6 −50 SYSTEM AND ELECTRICAL IMPACT OF TSOP-6 −25 0 25 50 75 100 125 150 TJ − Junction Temperature (_C) FIGURE 4. Si3434DV In any design, one must take into account the change in MOSFET rDS(on) with temperature (Figure 4). www.vishay.com 2 Document Number: 71743 27-Feb-04 Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR TSOP-6 0.099 0.039 0.020 0.019 (1.001) (0.508) (0.493) 0.064 (1.626) 0.028 (0.699) (3.023) 0.119 (2.510) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index APPLICATION NOTE Return to Index www.vishay.com 26 Document Number: 72610 Revision: 21-Jan-08 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1