MA-COM MASW-001100

MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Features
♦
♦
♦
♦
♦
♦
♦
♦
♦
Broad Bandwidth
Specified from 50MHz to 20GHz
Usable from 50MHz to 26.5GHz
Lower Insertion Loss / Higher Isolation
than pHempt
Rugged
Fully Monolithic,
Glass Encapsulated Construction
Up to +33dBm C.W. Power Handling
RoHS Compliant
MASW-001100-1190
Description
The MASW-001100-1190, MASW-002100-1191 and
MASW-003100-1192 are broadband monolithic
switches using series and shunt connected silicon
PIN diodes. They are designed for use as 2W, high
performance switches in applications up to 26.5GHz.
They provide performance levels superior to those
realized by hybrid MIC designs incorporating
beamlead and PIN chip diodes that require chip and
wire assembly.
MASW-002100-1191
These switches are fabricated using M/A-COM’s
patented HMICTM (Heterolithic Microwave Integrated
Circuit) process, US Patent 5,268,310. This process
allows the incorporation of silicon pedestals that
form series and shunt diodes or vias by imbedding
them in low loss, low dispersion glass. By using
small spacing between elements, this combination of
silicon and glass gives HMIC devices low loss and
high isolation performance through low
millimeter frequencies.
Large bond pads facilitate the use of low inductance
ribbon leads, while gold backside metallization
allows for manual or automatic chip bonding via
80/20, AuSn solder or conductive Ag epoxy.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF C.W. Incident Power
Bias Current +25°C
1
MASW-003100-1192
Absolute Maximum
-65oC to +125oC
-65oC to +150oC
+175oC
| - 50V |
+33dBm C.W.
±20mA
Max operating Conditions for a Combination of
RF Power, D.C. Bias and Temperature:
+33dBm CW @ 15mA (per diode) @+85°C
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
MASW-001100-1190 (SPST)
Electrical Specifications @ TA = +25oC, 20mA Bias
Parameter
Insertion Loss
Isolation
Input Return Loss
Switching Speed1
Voltage Rating2
Signal Compression (500mW)
Frequency
Minimum
Nominal
Maximum
Units
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
1GHz
46
39
34
22
15
14
-
0.4
0.5
0.7
55
47
42
31
33
27
20
0.2
0.7
0.9
1.2
50
-
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
V
dB
MASW-002100-1191 (SPDT)
Electrical Specifications @ TA = +25oC, 20mA Bias
Parameter
Insertion Loss
Isolation
Input Return Loss
Switching Speed1
Voltage Rating2
Signal Compression (500mW)
Frequency
Minimum
Nominal
Maximum
Units
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
1GHz
48
40
34
20
18
15
-
0.4
0.5
0.7
63
50
42
27
25
25
20
0.2
0.7
1.0
1.2
50
-
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
V
dB
MASW-003100-1192 (SP3T)
Electrical Specifications @ TA = +25oC, 20mA Bias
Parameter
Insertion Loss
Isolation
Input Return Loss
Switching Speed1
Voltage Rating2
Signal Compression (500mW)
1.) Typical Switching Speed measured from 10 % to 90 % of
detected RF signal driven by TTL compatible drivers.
2.) Maximum reverse leakage current in either the shunt or
series PIN diodes shall be 10mA maximum at -50 volts.
1.) Typical Switching Speed measured from 10 % to 90 % of
detected RF signal driven by TTL compatible drivers.
2.) Maximum reverse leakage current in either the shunt or
series PIN diodes shall be 10mA maximum at -50 volts.
Frequency
Minimum
Nominal
Maximum
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
6GHz
13GHz
20GHz
1GHz
49
42
33
20
14
11
-
0.5
0.7
0.9
57
48
42
24
22
21
20
0.2
0.8
1.1
1.5
50
-
Units
dB
dB
dB
dB
dB
dB
dB
dB
dB
ns
V
dB
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Typical Performance Curves at TA = +25°C, 20mA Bias Current
MASW-001100-1190
INSERTION LOSS vs. FREQUENCY
MASW-001100-1190
RETURN LOSS vs. FREQUENCY
-0.2
INSERTION LOSS (dB
RETURN LOSS (dB)
-10
-15
Output Return Loss
-20
-25
-30
Input Return Loss
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-35
-1
0
5
10
15
20
25
30
0
10
15
20
25
FREQUENCY (GHz)
MASW-002100-1191
RETURN LOSS vs. FREQUENCY
MASW-002100-1191
INSERTION LOSS vs. FREQUENCY
30
-0.2
INSERTION LOSS (dB
-10
RETURN LOSS (dB)
5
FREQUENCY (GHz)
-15
Output Return Loss
-20
-25
Input Return Loss
-30
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-35
0
5
10
15
20
25
0
30
5
10
25
30
-0.3
INSERTION LOSS (dB
-10
RETURN LOSS (dB)
20
MASW-003100-1192
INSERTION LOSS vs. FREQUENCY
MASW-003100-1192
RETURN LOSS vs. FREQUENCY
-15
15
FREQUENCY (GHz)
FREQUENCY (GHz)
Output Return Loss
-20
-25
Input Return Loss
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1
-1.1
-1.2
-30
0
5
10
15
20
25
30
0
5
FREQUENCY (GHz)
10
15
20
25
30
FREQUENCY (GHz)
S-Parameters: S-Parameter data for these devices are available upon request.
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Typical Performance Curves @ TA = +25°C, 20mA Bias Current
INPUT RETURN LOSS vs. BIAS CURRENT @ 10 GHz
MASW-001100-1190
ISOLATION vs. FREQUENCY
INPUT RETURN LOSS (dB
-22
-35
ISOLATION (dB)
-40
-45
-50
-55
-60
-24
MA S W-0 0 3 10 0
-26
MA S W-0 0 2 10 0
-28
-30
MA S W-0 0 110 0
-32
-65
-34
0
-70
5
10
15
20
25
30
35
40
45
50
55
CURRENT (mA )
-75
-80
0
5
10
15
20
25
-21.5
OUTPUT RETURN LOSS (dB
MASW-002100-1191
ISOLATION vs. FREQUENCY
-35
-40
-45
-22
-22.5
-23
-23.5
MAS W-0 0 110 0
-24
-24.5
MA S W-0 0 3 10 0
-25
MA S W-0 0 2 10 0
-25.5
-50
0
5
10
15
20
30
35
40
45
50
55
-60
-65
INSERTION LOSS vs. BIAS CURRENT @ 10 GHz
-70
-0.35
-75
-80
0
5
10
15
20
25
30
FREQUENCY (GHz)
MASW-003100-1192
ISOLATION vs. FREQUENCY
MAS W-0 0 2 10 0
-0.4
MAS W-0 0 110 0
-0.45
-0.5
MAS W-0 0 3 10 0
-0.55
-0.6
-0.65
-0.7
0
-35
5
10
15
20
25
30
35
40
45
50
55
CURRENT (mA)
-40
-45
ISOLATION vs. BIAS CURRENT @ 10 GHz
-50
-46
-55
-47
-60
-65
-70
-75
-80
0
5
10
15
FREQUENCY (GHz)
20
25
30
ISOLATION (dB)
ISOLATION (dB)
25
CURRENT (mA )
-55
INSERTION LOSS (dB
ISOLATION (dB)
OUTPUT RETURN LOSS vs. BIAS [email protected] 10 GHz
30
FREQUENCY (GHz)
-48
-49
-50
MAS W-0 0 110 0
-51
MAS W-0 0 2 10 0
-52
-53
MAS W-0 0 3 10 0
-54
0
5
10
15
20
25
30
35
40
45
50
55
CURRENT (mA)
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Operation of the MASW Series Switches
Operation of the MASW series of PIN switches is achieved
by simultaneous application of negative DC current to the
low loss switching arm J1, J2, or J3, and positive DC
current to the remaining switching arms as shown in the
bias connection circuits. DC return is achieved via J1. The
control currents should be supplied by constant current
sources. The voltages at these points will not exceed
+1.5 volts (1.2V typical) at currents up to +20mA. In the low
loss state, the series diode must be forward biased and the
shunt diode reverse biased. In the isolated arm, the shunt
diode is forward biased and the series diode is reverse
biased.
MASW-001100-1190 and Bias Connections1
J1
RF INPUT
20pF
20nH
J2 BIAS
20pF
100Ω
20nH
20pF
J2
RF OUTPUT
20pF
Switch
Chip
Driver Connections
MASW-001100-1190
Control Level
(DC Current) at
Condition of
RF Output
J2
J1-J2
-20mA
Low Loss
+20mA
Isolation
MASW-002100-1191 and Bias Connections1
J1 RF INPUT
20pF
J3 BIAS
100Ω
MASW-002100-1191
Control Level
(DC Current) at
20nH
Condition of
RF Output
Condition of
RF Output
J2
J3
J1-J2
J1-J3
-20mA
+20mA
Low Loss
Isolation
+20mA
-20mA
Isolation
Low Loss
20pF
J3
RF OUTPUT
20pF
20pF
20pF
20nH
20pF
Switch
Chip
J2
RF OUTPUT
MASW-003100-1192 and Bias Connections1
MASW-003100-1192
Control Level
(DC Current) at
J2 BIAS
20nH
J1 RF INPUT
Cond. of
Cond. of Cond. of RF
RF Output RF Output
Output
J2
J3
J4
J1-J2
J1-J3
J1-J4
-20mA
+20mA
+20mA
Low Loss
Isolation
Isolation
+20mA
-20mA
+20mA
Isolation
Low Loss
Isolation
+20mA
+20mA
-20mA
Isolation
Isolation
Low Loss
20pF
J4 BIAS
20nH
20pF
20nH
J2 BIAS
100Ω
20pF
20pF
20nH
20pF
J4
RF OUTPUT
20pF
J2
RF OUTPUT
Handling Considerations
Cleanliness: These chips should be handled in a clean
environment.
Electro-Static Sensitivity: The MASW series PIN switches
are ESD, Class 1A sensitive (HBM). The proper ESD
handling procedures should be used.
20pF
20nH
J3 BIAS
20pF
J3
RF OUTPUT
Notes:
1. RLC values are for an operation frequency of 2-18GHz and
bias current of ± 20mA per diode.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Wire Bonding
Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended.
A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy, if
necessary, should be adjusted to the minimum power required to achieve a good bond. RF wire and ribbon
lengths should be kept as short as possible to minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal and can be mounted using 80Au/20Sn eutectic solder or electrically
conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants.
Eutectic Die Attachment: An 80/20 gold-tin eutectic solder preform is recommended with a work surface
temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature
should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than
20
seconds. No more than three seconds should be required for attachment. Solders containing tin should not be
used.
Epoxy Die Attachment: A controlled thickness of no more than 2 mils is recommended for the best
electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after
placement to ensure complete coverage. Cure epoxy per manufacturer’s recommended schedule. Typically
+150°C for 1 hour.
Chip Outline Drawing1,2
DIM
INCHES
MM
MIN.
MAX.
MIN.
MAX.
A
0.014
0.018
0.35
0.45
B
0.025
0.029
0.64
0.74
C
D
0.008 REF
0.004
0.006
0.20 REF
0.10
0.15
E
0.004 REF
0.10 REF
F
0.003 REF
0.08 REF
G
0.003 REF
0.08 REF
H
0.020 REF
0.52 REF
Notes:
1. Topside and backside surface metallization is gold, 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads.
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Chip Outline Drawing1,2
MASW-002100-1191
DIM
INCHES
MM
MIN.
MAX.
MIN.
MAX.
A
0.029
0.033
0.73
0.83
B
0.004
0.006
0.10
0.15
C
0.004 REF
0.10 REF
D
0.005 REF
0.13 REF
E
0.009 REF
0.23 REF
F
0.023 REF
0.58 REF
G
0.007 REF
0.17 REF
H
0.004 REF
0.10 REF
Notes:
1.
2.
Topside and backside surface metallization is gold , 2.5μm thick typical.
Yellow areas indicate wire bonding pads
7
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Chip Outline Drawing 1, 2
MASW-003100-1192
DIM
INCHES
MIN.
MM
MAX.
MIN.
MAX.
A
B
C
0.046
0.050
0.036
0.040
0.019 REF
1.16
1.26
0.92
1.02
0.48 REF
D
0.014 REF
0.36 REF
E
0.004 REF
0.10 REF
F
0.005 REF
0.13 REF
G
0.004
0.006
0.10
0.15
H
0.005 REF
0.12 REF
J
0.004 REF
0.10 REF
Notes:
1. Topside and backside surface metallization is gold , 2.5μm thick typical.
2. Yellow areas indicate wire bonding pads
8
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
V6
Ordering Information
Part Number
Package
MASW-001100-11900W
Waffle Pack
MASW-001100-11900G
Gel Pack
MASW-002100-11910W
Waffle Pack
MASW-002100-11910G
Gel Pack
MASW-003100-11920W
Waffle Pack
MASW-003100-11920G
Gel Pack
9
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.