KERSEMI IRFR4105

PD - 91302C
IRFR/U4105
HEXFET® Power MOSFET
l
l
l
l
l
Ultra Low On-Resistance
Surface Mount (IRFR4105)
Straight Lead (IRFU4105)
Fast Switching
Fully Avalanche Rated
D
VDSS = 55V
RDS(on) = 0.045Ω
G
Description
The D-PAK is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for throughhole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
ID = 27A…
S
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
D -P A K
T O -252 A A
I-P A K
T O -25 1A A
Absolute Maximum Ratings
Parameter
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current ‡
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚‡
Avalanche Current‡
Repetitive Avalanche Energy‡
Peak Diode Recovery dv/dt ƒ
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
Units
27…
19
100
68
0.45
± 20
65
16
6.8
5.0
-55 to + 175
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
300 (1.6mm from case )
Thermal Resistance
Parameter
RθJC
RθJA
RθJA
Junction-to-Case
Junction-to-Ambient (PCB mount) **
Junction-to-Ambient
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Typ.
Max.
Units
–––
–––
–––
2.2
50
110
°C/W
1
5/11/98
IRFR/U4105
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
V(BR)DSS
∆V(BR)DSS/∆TJ
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
IGSS
Min. Typ. Max. Units
Conditions
55
––– –––
V
V GS = 0V, ID = 250µA
––– 0.052 ––– V/°C Reference to 25°C, ID = 1mA
––– ––– 0.045
VGS = 10V, ID = 16A „
2.0
––– 4.0
V
VDS = V GS, ID = 250µA
6.5
––– –––
S
VDS = 25V, ID = 16A‡
––– ––– 25
VDS = 55V, VGS = 0V
µA
––– ––– 250
VDS = 44V, VGS = 0V, TJ = 150°C
––– ––– 100
VGS = 20V
nA
––– ––– -100
V GS = -20V
––– ––– 34
ID = 16A
––– ––– 6.8
nC
VDS = 44V
––– ––– 14
VGS = 10V, See Fig. 6 and 13 „‡
–––
7.0 –––
VDD = 28V
–––
49 –––
ID = 16A
ns
–––
31 –––
RG = 18Ω
–––
40 –––
RD = 1.8Ω, See Fig. 10 „‡
Between lead,
–––
4.5
–––
nH
6mm (0.25in.)
G
from package
––– 7.5 –––
and center of die contact†
––– 700 –––
VGS = 0V
––– 240 –––
pF
VDS = 25V
––– 100 –––
ƒ = 1.0MHz, See Fig. 5‡
D
S
Source-Drain Ratings and Characteristics
IS
ISM
VSD
trr
Qrr
ton
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ‡
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
––– ––– 27…
showing the
A
G
integral reverse
––– ––– 100
p-n junction diode.
S
––– ––– 1.6
V
TJ = 25°C, IS = 16A, VGS = 0V „
––– 57
86
ns
TJ = 25°C, IF = 16A
––– 130 200
nC di/dt = 100A/µs „‡
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
„ Pulse width ≤ 300µs; duty cycle ≤ 2%
max. junction temperature. ( See fig. 11 )
‚ VDD = 25V, starting TJ = 25°C, L = 410µH
RG = 25Ω, IAS = 16A. (See Figure 12)
… Calculated continuous current based on maximum allowable junction
ƒ ISD ≤ 16A, di/dt ≤ 420A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
temperature; Package limitation current = 20A
† This is applied for I-PAK, Ls of D-PAK is measured between lead and
center of die contact
‡ Uses IRFZ34N data and test conditions
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
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IRFR/U4105
1000
1000
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
TOP
100
I , D rain-to-Source Current (A )
D
I , Drain-to-S ource C urrent (A )
D
TOP
10
4.5 V
1
2 0µ s P U L S E W ID TH
T C = 25 °C
0.1
0.1
1
10
100
10
4.5 V
1
20 µ s P U LS E W ID TH
T C = 1 75 °C
0.1
A
0.1
100
1
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
2.4
R D S (on) , D rain-to-Source O n Resistance
(Norm alized)
I D , D rain-to -So urc e C urre nt (A )
100
TJ = 2 5 °C
TJ = 1 7 5°C
10
V DS = 25V
2 0 µ s P U LS E W ID TH
1
4
5
6
7
8
9
V G S , G ate-to-So urce Vo ltag e (V)
Fig 3. Typical Transfer Characteristics
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A
100
V DS , D rain-to-S ource V oltage (V )
V DS , D rain-to-S ource V oltage (V )
tion
10
10
A
I D = 2 6A
2.0
1.6
1.2
0.8
0.4
V G S = 1 0V
0.0
-60
-40
-20
0
20
40
60
80
100 120 140 160 180
T J , Junction T em perature (°C )
Fig 4. Normalized On-Resistance
Vs. Temperature
3
A
IRFR/U4105
20
V GS
C is s
C rs s
C iss C o s s
C , Capacitance (pF)
1000
=
=
=
=
0V,
f = 1MHz
C g s + C g d , C d s S H O R TE D
C gd
C ds + C gd
V G S , G ate-to-S ourc e V oltage (V )
1200
I D = 16 A
V DS = 44V
V DS = 28V
16
800
C o ss
12
600
400
C rss
200
0
A
1
10
8
4
FO R TE S T C IR C U IT
S E E F IG U R E 1 3
0
100
0
V D S , D rain-to-S ourc e V oltage (V )
30
A
40
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
1000
O P E R A TIO N IN TH IS A R E A L IM ITE D
B Y R D S (o n)
I D , Drain C urrent (A )
I S D , Reverse D rain C urrent (A)
20
Q G , T otal G ate C h arge (n C )
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
100
TJ = 17 5°C
TJ = 25 °C
10
100
10µ s
100µ s
10
1m s
V G S = 0V
1
0.4
0.8
1.2
1.6
V S D , S ourc e-to-D rain V oltage (V )
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
10
A
2.0
T C = 25 °C
T J = 17 5°C
S ing le P u lse
1
1
10
100
A
V D S , D rain-to-S ource V oltage (V )
Fig 8. Maximum Safe Operating Area
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IRFR/U4105
30
RD
VDS
LIMITED BY PACKAGE
VGS
25
D.U.T.
I D , Drain Current (A)
RG
+
-VDD
20
5.0V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
15
10
Fig 10a. Switching Time Test Circuit
VDS
5
90%
0
25
50
75
100
125
150
175
TC , Case Temperature ( ° C)
10%
VGS
Fig 9. Maximum Drain Current Vs.
Case Temperature
td(on)
tr
t d(off)
tf
Fig 10b. Switching Time Waveforms
Thermal Response (Z thJC )
10
1
D = 0.50
0.20
0.10
0.05
0.1
0.02
0.01
PDM
SINGLE PULSE
(THERMAL RESPONSE)
t1
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak T J = P DM x Z thJC + TC
0.01
0.00001
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRFR/U4105
1 5V
L
VD S
D .U .T
RG
IA S
10V
tp
D R IV E R
+
V
- DD
A
0.0 1 Ω
Fig 12a. Unclamped Inductive Test Circuit
E AS , S ingle P ulse A valanc he Energy (m J )
140
TO P
120
B O TTO M
ID
6 .5A
1 1A
16 A
100
80
60
40
20
VDD = 25V
0
25
V (B R )D SS
50
A
75
100
125
150
175
S tarting T J , J unc tion T em perature (°C )
tp
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
50KΩ
QG
12V
.2µF
.3µF
5.0 V
QGS
D.U.T.
QGD
+
V
- DS
VGS
VG
3mA
Charge
Fig 13a. Basic Gate Charge Waveform
6
IG
ID
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
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IRFR/U4105
Peak Diode Recovery dv/dt Test Circuit
+
D.U.T
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
ƒ
+
‚
-
-
„
+

•
•
•
•
RG
dv/dt controlled by RG
Driver same type as D.U.T.
ISD controlled by Duty Factor "D"
D.U.T. - Device Under Test
Driver Gate Drive
D=
Period
P.W.
+
-
VDD
P.W.
Period
VGS=10V
*
D.U.T. ISD Waveform
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
VDD
Forward Drop
Inductor Curent
Ripple ≤ 5%
ISD
* VGS = 5V for Logic Level Devices
Fig 14. For N-Channel HEXFETS
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7
IRFR/U4105
Package Outline
TO-252AA Outline
Dimensions are shown in millimeters (inches)
2 .3 8 (.0 9 4 )
2 .1 9 (.0 8 6 )
6 .7 3 (.2 6 5 )
6 .3 5 (.2 5 0 )
1 .1 4 (.0 4 5 )
0 .8 9 (.0 3 5 )
-A 1 .2 7 (.0 5 0 )
0 .8 8 (.0 3 5 )
5 .4 6 (.2 1 5 )
5 .2 1 (.2 0 5 )
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
4
6 .4 5 (.2 4 5 )
5 .6 8 (.2 2 4 )
6 .2 2 (.2 4 5 )
5 .9 7 (.2 3 5 )
1 .0 2 (.0 4 0 )
1 .6 4 (.0 2 5 )
1
2
1 0 .4 2 (.4 1 0 )
9 .4 0 (.3 7 0 )
3
0 .5 1 (.0 2 0 )
M IN .
-B 1 .5 2 (.0 6 0 )
1 .1 5 (.0 4 5 )
3X
1 .1 4 (.0 4 5 )
2X
0 .7 6 (.0 3 0 )
0 .8 9 (.0 3 5 )
0 .6 4 (.0 2 5 )
0 .2 5 (.0 1 0 )
2 .2 8 (.0 9 0 )
4 .5 7 (.1 8 0 )
L E A D A S S IG N M E N T S
1 - GATE
2 - D R A IN
3 - SOURCE
4 - D R A IN
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
M A M B
N O TE S :
1 D IM E N S IO N IN G & T O L E R A N C IN G P E R A N S I Y 1 4 .5 M , 1 9 8 2 .
2 C O N T R O L L IN G D IM E N S IO N : IN C H .
3 C O N F O R M S T O J E D E C O U T L IN E T O -2 5 2 A A .
4 D IM E N S IO N S S H O W N A R E B E F O R E S O L D E R D IP ,
S O L D E R D IP M A X . + 0 .1 6 (.0 0 6 ).
Part Marking Information
TO-252AA (D-PARK)
E XA M P L E : T H IS IS A N IR F R 1 2 0
W IT H A S S E M B L Y
LOT COD E 9U1P
IN T E R N A T IO N A L
R E C T IF IE R
LO GO
A
IR F R
120
9U
ASS EMB LY
LOT CODE
8
F IR S T P O R T IO N
OF PART NUMBER
1P
S E C O N D P O R TIO N
OF PART NUMBER
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IRFR/U4105
Package Outline
TO-251AA Outline
Dimensions are shown in millimeters (inches)
6 .7 3 (.2 6 5 )
6 .3 5 (.2 5 0 )
2 .3 8 (.0 9 4 )
2 .1 9 (.0 8 6 )
-A -
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
1 .2 7 (.0 5 0 )
0 .8 8 (.0 3 5 )
5 .4 6 (.2 1 5 )
5 .2 1 (.2 0 5 )
L E A D A S S IG N M E N T S
1 - GATE
2 - D R A IN
3 - SOURCE
4 - D R A IN
4
6 .4 5 (.2 4 5 )
5 .6 8 (.2 2 4 )
6 .2 2 (.2 4 5 )
5 .9 7 (.2 3 5 )
1 .5 2 (.0 6 0 )
1 .1 5 (.0 4 5 )
1
2
3
-B 2 .2 8 (.0 9 0 )
1 .9 1 (.0 7 5 )
3X
1 .1 4 (.0 4 5 )
0 .7 6 (.0 3 0 )
2 .2 8 (.0 9 0 )
N O TE S :
1 D IM E N S IO N IN G & T O L E R A N C IN G P E R A N S I Y 1 4 .5 M , 1 9 8 2 .
2 C O N T R O L L IN G D IM E N S IO N : IN C H .
3 C O N F O R M S T O J E D E C O U T L IN E T O -2 5 2 A A .
4 D IM E N S IO N S S H O W N A R E B E F O R E S O L D E R D IP ,
S O L D E R D IP M A X . + 0 .1 6 (.0 0 6 ).
9 .6 5 (.3 8 0 )
8 .8 9 (.3 5 0 )
3X
1 .1 4 (.0 4 5 )
0 .8 9 (.0 3 5 )
0 .8 9 (.0 3 5 )
0 .6 4 (.0 2 5 )
0 .2 5 (.0 1 0 )
2X
M A M B
0 .5 8 (.0 2 3 )
0 .4 6 (.0 1 8 )
Part Marking Information
TO-251AA (I-PARK)
E XA M P L E : TH IS IS A N IR F U 1 2 0
W IT H A S S E M B L Y
LOT CODE 9U1P
IN TE R N A T IO N A L
R E C TIF IE R
LO G O
IR F U
12 0
9U
AS SEMBLY
LOT CODE
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F IR S T P O R TIO N
OF PART NUMBER
1P
S E C O N D P O R TIO N
OF PART NUM BER
9
IRFR/U4105
Tape & Reel Information
TO-252AA
TR
TRR
1 6.3 ( .641 )
1 5.7 ( .619 )
12 .1 ( .4 76 )
11 .9 ( .4 69 )
F E E D D IR E C T IO N
TR L
16.3 ( .64 1 )
15.7 ( .61 9 )
8 .1 ( .3 18 )
7 .9 ( .3 12 )
F E E D D IR E C T IO N
NO T ES :
1. C O N T R O LL IN G D IM E N S IO N : M ILLIM E T E R .
2. A LL D IM E N S IO N S A R E S H O W N IN M ILL IM E T E R S ( IN C H E S ).
3. O U T L IN E C O N F O R M S T O E IA -4 81 & E IA -54 1.
13 IN C H
16 m m
NOTES :
1. O U T LIN E C O N F O R M S T O E IA -481 .
10
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