VISHAY SQD19P06-60L-GE3

SQD19P06-60L
www.vishay.com
Vishay Siliconix
Automotive P-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
- 60
RDS(on) () at VGS = - 10 V
0.055
RDS(on) () at VGS = - 4.5 V
0.100
ID (A)
• TrenchFET® Power MOSFET
• Package with Low Thermal Resistance
- 20
Configuration
Single
TO-252
S
• 100 % Rg and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
• AEC-Q101 Qualifiedd
G
Drain Connected to Tab
G
D
S
D
Top View
P-Channel MOSFET
ORDERING INFORMATION
Package
TO-252
Lead (Pb)-free and Halogen-free
SQD19P06-60L-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
- 60
Gate-Source Voltage
VGS
± 20
TC = 25 °C
Continuous Drain Current
Continuous Source Current (Diode
ID
TC = 125 °C
Conduction)a
Pulsed Drain Currentb
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipationb
L = 0.1 mH
TC = 25 °C
Operating Junction and Storage Temperature Range
V
- 20
- 11
IS
- 25
IDM
- 80
IAS
- 24
EAS
28
PD
TC = 125 °C
UNIT
46
15
A
mJ
W
TJ, Tstg
- 55 to + 175
°C
SYMBOL
LIMIT
UNIT
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
PCB
Mountc
Junction-to-Case (Drain)
RthJA
50
RthJC
3.2
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width  300 μs, duty cycle  2 %.
c. When mounted on 1" square PCB (FR-4 material).
d. Parametric verification ongoing.
S11-2065-Rev. C, 24-Oct-11
1
Document Number: 65158
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD19P06-60L
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
VGS = 0 V, ID = - 250 μA
- 60
-
-
VDS = VGS, ID = - 250 μA
- 1.5
-
- 2.5
VDS = 0 V, VGS = ± 20 V
-
-
± 100
-
-
-1
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
VDS
VGS(th)
RDS(on)
gfs
VGS = 0 V
VDS = - 60 V
VGS = 0 V
VDS = - 60 V, TJ = 125 °C
-
-
- 50
VGS = 0 V
VDS = - 60 V, TJ = 175 °C
-
-
- 150
VGS = - 10 V
VDS- 5 V
- 20
-
-
VGS = - 10 V
ID = - 19 A
-
0.046
0.055
VGS = - 10 V
ID = - 19 A, TJ = 125 °C
-
-
0.095
VGS = - 10 V
ID = - 19 A, TJ = 175 °C
-
-
0.125
VGS = - 4.5 V
ID = - 10 A
VDS = - 15 V, ID = - 17 A
-
0.075
0.100
-
20
-
-
1192
1490
V
nA
μA
A

S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
-
160
200
Reverse Transfer Capacitance
Crss
-
96
120
Total Gate Chargec
Qg
-
27
41
-
3.9
-
-
5.9
-
2.3
4.7
7.1
-
7
11
-
9
14
-
25
38
-
12
18
-
-
- 80
A
-
- 0.85
- 1.5
V
Gate-Source
Chargec
Gate-Drain Chargec
Gate Resistance
Turn-On Delay Timec
Rise Timec
Turn-Off Delay
Qgs
Fall Timec
Source-Drain Diode Ratings and
VGS = - 10 V
VDS = - 25 V, f = 1 MHz
VDS = - 30 V, ID = - 19 A
Qgd
f = 1 MHz
Rg
td(on)
tr
Timec
VGS = 0 V
td(off)
VDD = - 30 V, RL = 1.6 
ID  - 19 A, VGEN = - 10 V, Rg = 1 
tf
pF
nC

ns
Characteristicsb
Pulsed Currenta
ISM
Forward Voltage
VSD
IF = - 10 A, VGS = 0 V
Notes
a. Pulse test; pulse width  300 μs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S11-2065-Rev. C, 24-Oct-11
2
Document Number: 65158
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD19P06-60L
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
30
30
VGS = 10 V thru 5 V
24
I D - Drain Current (A)
I D - Drain Current (A)
24
18
12
VGS = 4 V
18
12
TC = 25 °C
6
6
VGS = 2 V, 1 V
TC = 125 °C
VGS = 3 V
0
TC = - 55 °C
0
0
3
6
9
12
15
0
2
VDS - Drain-to-Source Voltage (V)
8
10
Transfer Characteristics
0.25
25
TC = - 55 °C
20
R DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
6
VGS - Gate-to-Source Voltage (V)
Output Characteristics
TC = 25 °C
15
10
TC = 125 °C
5
0.20
0.15
VGS = 4.5 V
0.10
VGS = 10 V
0.05
0
0
0
5
10
15
20
0
25
6
12
18
24
VGS - Gate-to-Source Voltage (V)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
2000
30
VGS - Gate-to-Source Voltage (V)
10
1500
C - Capacitance (pF)
4
Ciss
1000
500
Coss
ID = 19 A
8
VDS = 30 V
6
4
2
Crss
0
0
0
10
20
30
40
50
0
60
10
15
20
25
30
Qg - Total Gate Charge (nC)
VDS - Drain-to-Source Voltage (V)
Capacitance
S11-2065-Rev. C, 24-Oct-11
5
Gate Charge
3
Document Number: 65158
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD19P06-60L
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
100
2.3
ID = 10 A
10
VGS = 10 V
I S - Source Current (A)
R DS(on) - On-Resistance
(Normalized)
2.0
1.7
1.4
1.1
TJ = 150 °C
1
TJ = 25 °C
0.1
0.01
0.8
0.5
- 50
0.001
- 25
0
25
50
75
100
125
150
0
175
0.2
0.6
0.8
1.0
1.2
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
Source Drain Diode Forward Voltage
On-Resistance vs. Junction Temperature
0.5
1.0
0.4
0.7
ID = 250 µA
VGS(th) Variance (V)
RDS(on) - On-Resistance (Ω)
0.4
0.3
0.2
TJ = 150 °C
0.1
0
2
4
6
ID = 5 mA
0.1
- 0.2
TJ = 25 °C
0.0
0.4
8
- 0.5
- 50
10
- 25
0
VGS - Gate-to-Source Voltage (V)
25
50
75
100
125
150
175
TJ - Temperature (°C)
On-Resistance vs. Gate-to-Source Voltage
Threshold Voltage
- 60
VDS - Drain-to-Source Voltage (V)
ID = 10 mA
- 64
- 68
- 72
- 76
- 80
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
S11-2065-Rev. C, 24-Oct-11
4
Document Number: 65158
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD19P06-60L
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
IDM Limited
I D - Drain Current (A)
100
Limited by
RDS(on)*
10
100 µs
1 ms
10 ms
100 ms, 1 s, 10 s, DC
1
0.1
TC = 25 °C
Single Pulse
BVDSS Limited
0.01
0.01
* VGS
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which R DS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
S11-2065-Rev. C, 24-Oct-11
5
Document Number: 65158
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD19P06-60L
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?65158.
S11-2065-Rev. C, 24-Oct-11
6
Document Number: 65158
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
TO-252AA Case Outline
E
MILLIMETERS
A
C2
e
b2
D1
e1
E1
L
gage plane height (0.5 mm)
L4
b
L5
H
D
L3
b3
C
A1
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
2.18
2.38
0.086
0.094
A1
-
0.127
-
0.005
b
0.64
0.88
0.025
0.035
b2
0.76
1.14
0.030
0.045
b3
4.95
5.46
0.195
0.215
0.024
C
0.46
0.61
0.018
C2
0.46
0.89
0.018
0.035
D
5.97
6.22
0.235
0.245
D1
4.10
-
0.161
-
E
6.35
6.73
0.250
0.265
E1
4.32
-
0.170
-
H
9.40
10.41
0.370
0.410
e
2.28 BSC
e1
0.090 BSC
4.56 BSC
0.180 BSC
L
1.40
1.78
0.055
0.070
L3
0.89
1.27
0.035
0.050
L4
-
1.02
-
0.040
L5
1.01
1.52
0.040
0.060
ECN: T13-0592-Rev. A, 02-Sep-13
DWG: 6019
Note
• Dimension L3 is for reference only.
Revision: 02-Sep-13
Document Number: 64424
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72594
Revision: 21-Jan-08
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3
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000