Mechanical Dimensions

Packaging Information
Mechanical Dimensions
DIP-16
New Product Changed to PDIP-16 (2013.10)
1.524(0.060) TYP
Unit: mm(inch)
7.320(0.288)
7.920(0.312)
5°
3.710(0.146)
4.310(0.170)
6°
6°
4°
4°
0.360(0.014)
0.560(0.022)
0.700(0.028)
2.540(0.100)
TYP
0.204(0.008)
0.360(0.014)
8.200(0.323)
9.400(0.370)
0.510(0.020)MIN
3.000(0.118)
3.600(0.142)
3.200(0.126)
3.600(0.142)
Φ3.000(0.118)
Depth
0.050(0.002)
0.150(0.006)
6.200(0.244)
6.600(0.260)
18.800(0.740)
19.200(0.756)
R0.750(0.030)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DIP-16 (Special for AZ4052)
1. 524(0. 060)TYP
Unit: mm(inch)
7. 320(0. 288)
7. 920(0. 312)
5°
3. 710(0. 146)
4. 310(0. 170)
6°
6°
4°
4°
0. 360(0. 014)
0. 560(0. 022)
0. 700(0.028)
2. 540(0. 100)
TYP
0. 204(0.008)
0. 360(0. 014 )
8. 500(0. 335)
TYP
0.510(0. 020)MIN
3. 000(0. 118)
3. 600(0. 142)
3. 200(0. 126)
3. 600(0. 142)
Φ3. 000(0. 118)
Depth
0. 050(0.002)
0. 150(0.006)
6. 200(0. 244)
6. 600(0. 260)
18. 800(0. 740)
19. 200(0. 756)
R0. 750(0. 030)
Note: Eject hole , oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-16
New Product Changed to SO-16 (2013.10)
Unit: mm(inch)
D
D1
7°
0.310(0. 012)
0.510(0. 020)
7°
B
A
20:1
0.250(0.010)
0.400(0. 016)
1.270(0.050)
BSC
9.800(0.386)
10.200(0.402)
1.270(0. 050)
0°
8°
R 0.070(0. 003)
0.200(0. 008)
R 0.070(0. 003)
0.200(0. 008)
B
20:1
8°
C
3°
7°
0.200(0. 008)
Sφ1.000(0. 039)
Depth 0.200(0.008)
8°
A
0.150(0.006)
×45 °
0.400(0.016)
8°
C-C
50:1
1.000(0.039)
0.170(0.007)
0.250(0.010)
3.800(0. 150)
4.040(0. 159)
9.5
°
0.200(0.008)
0.250(0.010)
0.050(0.002)
0.250(0.010)
5.800(0. 228)
6.240(0. 246)
C
Note: Eject hole, oriented hole and mold mark is optional.
D
Symbol
D1
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Dec. 2014
Option1
1.350
1.750
0.053
0.069
1.250
Option2
-
1.260
-
0.050
1.020
.
1.650
0.049
0.065
-
0.040
-
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-16
Z
G
Y
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
WSOP-16
Unit: mm(inch)
9.950(0.392)
10.400(0.409)
0.050(0.002)
0.200(0.008)
5.000(0.197)
5.600(0.220)
7.400(0.291)
8.200(0.323)
0.300(0.012)
0.700(0.028)
1.270(0.050)
TYP
0.130(0.005)
0.200(0.008)
0.350(0.014)
0.550(0.022)
2.250(0.089)
MAX
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DIP-14
New Product Changed to PDIP-14 (2013.10)
1.524(0.060) TYP
10°
Unit: mm(inch)
0.700(0.028)
7.620(0.300)TYP
1.600(0.063)
1.800(0.071)
5°
10°
4°
4°
0.204(0.008)
0.360(0.014)
8.200(0.323)
9.400(0.370)
0.254(0.010)
0.360(0.014)
0.560(0.022)
2.540(0.100)TYP
3.000(0.118)
3.600(0.142)
0.510(0.020)MIN
Φ3.000(0.118)
Depth
0.100(0.004)
0.200(0.008)
1.600(0.063)
1.800(0.071)
0.130(0.005)MIN
6.200(0.244)
6.600(0.260)
18.800(0.740)
19.200(0.756)
R1.000(0.039)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-14
New Product Changed to SO-14 (2013.10)
A
0.700(0. 028)
5°
15°
Unit: mm(inch)
0.250(0. 010)×45°
0.500(0.020)×45°
0.100(0. 004)
0.250(0. 010)
8°
8°
0°
8°
9.5 °
7°
0.310(0. 012)
0.510(0. 020)
8°
0.100(0.004)
0.250(0.010)
1.350(0.053)
1.750(0.069)
8. 550(0. 337)
8. 750(0. 344)
3.800(0. 150)
4.000(0. 157)
1.270(0. 050)
1.000(0.039)
A
20:1
6.200(0.244)
1.300(0.051)
5.800(0.228)
0.200(0.008)MIN
R0.200(0. 008)
R0.200(0. 008)
0°
8°
0.400(0. 016)
1.270(0. 050)
0.250(0.010)
φ2. 000(0. 079)
Depth 0.060(0. 002)
0.100(0. 004)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-14
G
Z
Y
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DIP-8
New Product Changed to PDIP-8 (2013.10)
Unit: mm(inch)
0.700(0.028)
7.620(0.300)TYP
1.524(0.060) TYP
6°
5°
6°
3.200(0.126)
3.600(0.142)
3.710(0.146)
4.310(0.170) 4°
4°
0.510(0.020)MIN
3.000(0.118)
3.600(0.142)
0.204(0.008)
0.360(0.014)
8.200(0.323)
9.400(0.370)
0.254(0.010)TYP
2.540(0.100) TYP
0.360(0.014)
0.560(0.022)
0.130(0.005)MIN
6.200(0.244)
6.600(0.260)
R0.750(0.030)
Φ3.000(0.118)
Depth
0.100(0.004)
0.200(0.008)
9.000(0.354)
9.600(0.378)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TDIP-8
1.500(0.059)
1.700(0.067)
Unit: mm(inch)
0.500(0.020)MIN
0.600(0.024)
0.800(0.031)
3.300(0.130)MAX
7.570(0.298)
8.200(0.323)
3.100(0.122)
3.500(0.138)
0.940(0.037)
1.040(0.041)
0.390(0.015)
0.550(0.022)
8.200(0.323)
9.400(0.370)
1.470(0.058)
1.670(0.066)
2.540(0.100)
BCS
9.150(0.360)
9.350(0.368)
6.250(0.246)
6.450(0.254)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DIP-7
New Product Changed to PDIP-7 (2013.10)
Unit: mm(inch)
7.320(0. 288)
7.920(0. 312)
0.204(0.008)
0.360(0. 014)
3.200(0. 126)
3.600(0. 142)
3.710(0.146)
4.310(0.170)
0.510(0. 020) MIN
3.000(0. 118)
3.600(0. 142)
0.380(0. 015)
0.570(0. 022)
1.524(0. 060)BSC
2.540(0. 100)BSC
8.400(0. 331)
9.000(0. 354)
6.200(0. 244)
6.600(0. 260)
9.000(0. 354)
9.400(0. 370)
Note: Eject hole , oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TDIP-7
1.500(0.059)
1.700(0.067)
3.300(0.130)MAX
Unit: mm(inch)
0.500(0.020)MIN
0.600(0.024)
0.800(0.031)
7.570(0.298)
8.200(0.323)
3.100(0.122)
3.500(0.138)
0.940(0.037)
1.040(0.041)
0.390(0.015)
0.550(0.022)
1.470(0.058)
1.670(0.066)
8.200(0.323)
9.400(0.370)
2.540(0.100)
BCS
9.150(0.360)
9.350(0.368)
6.250(0.246)
6.450(0.254)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-8
Unit: mm(inch)
SEE DETAIL A
2.900(0.114)
3.100(0.122)
0.050(0.002)
0.150(0.006)
0.090(0.004)
0.200(0.008)
1.200(0.047)
MAX
0.800(0.031)
1.050(0.041)
12 °
TOP & BOTTOM
0.650(0.026)
TYP
GAGE PLANE
TYP
4.500(0.177)
6.400(0.252)
R0.090(0.004)
0.400(0.016)
4.300(0.169)
R0.090(0.004)
0°
8°
0.450(0.018)
0.750(0.030)
SEATING
PLANE
0.190(0.007)
0.300(0.012)
1.000(0.039)
REF
0.250(0.010)
TYP
1.950(0.077)
TYP
DETAIL A
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSSOP-8
G
Z
Y
X
E
E1
Dimensions
Value
Dec. 2014
Z
G
X
Y
E
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
7.720/0.304
4.160/0.164
0.420/0.017
1.780/0.070
0.650/0.026
1.950/0.077
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-8
New Product Changed to SO-8 (2013.10)
4.700(0.185)
5.100(0. 201)
7°
~ 9°
Unit: mm(inch)
0.320(0. 013)
TYP
1.350(0. 053)
1.750(0. 069)
8°
8°
~ 9°
7°
0.600(0. 024)
0.725(0. 029)
D
5.800(0. 228)
6.200(0. 244)
1.270(0. 050)
TYP
D
20:1
0.300(0. 012)
R0.150(0.006)
0.100(0. 004)
1.000(0. 039)
TYP
3.800(0. 150)
Option 1
4.000(0. 157)
0.300(0. 012)
0.150(0. 006)
0.250(0. 010)
Option 1
0°
8°
1°
7°
0.510(0. 020)
R0.150(0.006)
0.450(0. 017)
0.820(0. 032)
Option 2
0.350(0. 014)
TYP
Note: Eject hole , oriented hole and mold mark is optional .
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-8
Grid
placement
courtyard
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-7
New Product Changed to SO-7 (2013.10)
5.800(0.228)
Unit: mm(inch)
1.350(0.053)
1.750(0.069)
6.200(0.244)
0.330(0.013)
0.510(0.020)
2.54(0.100)
TYP
4.700(0.185)
5.100(0.201)
1.270(0.050)
TYP
0.080(0.003)
0.250(0.010)
3.800(0.150)
4.000(0.157)
1.250(0.049)
1.500(0.059)
0.350(0.014)
TYP
0°
8°
Option 1
0.450(0.017)
0.800(0.031)
45°
0.150(0.006)
0.250(0.010)
Option 2
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-7
G
Z
E1
Y
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
E1
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
1.270/0.050
2.540/0.100
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-223
New Product Changed to SOT223 (2013.10)
Unit: mm(inch)
6.300(0.248)
6.700(0.264)
)
0.200(0.008
)
4
1
0.350(0.0
2.900(0.114)
3.100(0.122)
0.850(0.033)
3.700(0.146)
3.300(0.130)
7.300(0.287)
6.700(0.264)
MIN
0.250(0.010)
1.750(0.069)
TYP
2.300(0.091)
0.600(0.024)
TYP
0.810(0.032)
4.500(0.177)
0°
10°
4.700(0.185)
0.010(0.0004)
0.150(0.006)
1.500(0.059)
1.520(0.060)
1.700(0.067)
1.800(0.071)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-223
Grid placement courtyard
X2
Y
Z
G
X1
Y
E1
Dimensions
Value
Dec. 2014
E2
Z
G
X1
X2
Y
E1
E2
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
8.400/0.331
4.000/0.157
1.200/0.047
3.500/0.138
2.200/0.087
2.300/0.091
4.600/0.181
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3
New Product Changed to SC59 (2013.10)
Unit: mm(inch)
2.820(0.111)
3.100(0.122)
1.800(0.071)
2.000(0.079)
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
2.650(0.104)
3.000(0.118)
1.450(0.057)
MAX.
0.950(0.037)
TYP
0.100(0.004)
0.200(0.008)
0.200(0.008)
0
8
0.300(0.012)
0.500(0.020)


0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-23-3
X
G
E1
Z
E2
Y
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value
3.600/0.142
1.600/0.063
0.700/0.028
1.000/0.039
0.950/0.037
1.900/0.075
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3(Only for AH920/AH921A/AH921)
Unit: mm(inch)
2. 820(0. 111)
3. 100(0. 122)
0. 100(0. 004)
0. 200(0. 008)
Package Sensor
Location
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
2.650(0.104)
3.000(0.118)
1. 230(0.048)
1. 530(0.060)
Die
0. 200(0. 008)
A4
0. 770(0. 030)
1. 070(0. 042)
1.450(0.057)
MAX.
0. 950(0. 037)
TYP
1. 800(0. 071)
2. 000(0. 079)
0
8
0. 300(0. 012)
0. 500(0. 020)


0. 000(0. 000)
0. 150(0. 006)
A4
Symbol
min(mm) max(mm) min(inch) max(inch)
0. 900(0. 035)
1. 300(0. 051)
Dec. 2014
Option 1 0.475
0.575
0.019
0.023
Option 2 0.640
0.740
0.025
0.029
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3(Only for AH922/AH922B/AH922C)
Unit: mm(inch)
2. 820(0. 111)
3. 020(0. 119)
0. 100(0. 004)
0. 200(0. 008)
0.300(0.012)
0.600(0.024)
Package Sensor
Location
1.500(0.059)
1.700(0.067)
2.650(0.104)
2.950(0.116)
1. 300(0. 051)
1. 600(0. 063)
Die
0. 200(0. 008)
A4
0. 770(0. 030)
1. 070(0. 042)
1.450(0.057)
MAX.
0. 950(0. 037)
TYP
1. 800(0. 071)
2. 000(0. 079)
0
8
0. 300(0. 012)
0. 500(0. 020)
0. 000(0. 000)
0. 150(0. 006)
A4
Symbol
min(mm) max(mm) min(inch) max(inch)
0. 900(0. 035)
1. 300(0. 051)
Dec. 2014
Option 1 0.475
0.575
0.019
0.023
Option 2 0.640
0.740
0.025
0.029
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3(AH49F/AH49H)
Unit: mm(inch)
2.820(0.111)
3.100(0.122)
0.100(0.004)
0.200(0.008)
0.300(0.012)
0.600(0.024)
1.300(0.051)
1.600(0.063)
1.500(0.059)
1.700(0.067)
Package Sensor Location
2.650(0.104)
3.000(0.118)
(For Hall IC)
Die
0.200(0.008)
A4
0.670(0.026)
0.970(0.038)
1.450(0.057)
MAX.
0.950(0.037)
TYP
1.800(0.071)
2.000(0.079)
0
8
0.300(0.012)
0.500(0.020)
0.000(0.000)
0.150(0.006)
A4
Symbol
0.900(0.035)
1.300(0.051)
Dec. 2014


min(mm) max(mm) min(inch) max(inch)
Option 1 0.475
0.575
0.019
0.023
Option 2 0.640
0.740
0.025
0.029
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3(Only for AH9247)
Unit: mm(inch)
2. 820(0. 111)
3. 100(0. 122)
0. 100(0. 004)
0. 200(0. 008)
Package Sensor
Location
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
2.650(0.104)
3.000(0.118)
1. 350(0. 053)
1. 550(0. 061)
Die
0. 200(0. 008)
A4
0. 800(0. 031)
1. 000(0. 039)
1.450(0.057)
MAX.
0. 950(0. 037)
TYP
1. 800(0. 071)
2. 000(0. 079)
0
8
0. 300(0. 012)
0. 500(0. 020)


0. 000(0. 000)
0. 150(0. 006)
A4
Symbol
min(mm) max(mm) min(inch) max(inch)
0. 900(0. 035)
1. 300(0. 051)
Dec. 2014
Option 1 0.475
0.575
0.019
0.023
Option 2 0.640
0.740
0.025
0.029
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3(2)
Unit: mm(inch)
0.100(0.004)
0.200(0.008)
1.400(0.055)
1.600(0.063)
2.700(0.106)
3.100(0.122)
2.700(0.106)
3.100(0.122)
0.400(0.158)
REF
0.850(0.033)
1.050(0.041)
1.000(0.039)
1.400(0.055)
1.900(0.075)
TYP
0.350(0.014)
0.500(0.020)
0.450(0.018)
0.550(0.022)
0°
10°
0.000(0.000)
0.100(0.004)
1.000(0.039)
1.300(0.051)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3 (Only for AH9248 and AH9249)
Unit: mm(inch)
2.820(0.111)
3.020(0.119)
0.100(0.004)
0.200(0.008)
0.300(0.012)
0.600(0.024)
2.650(0.104)
2.950(0.116)
1.500(0.059)
1.700(0.067)
1.45(0.057)
TYP
Die
0.200(0.008)
A4
0.900(0.035)
TYP
1.450(0.057)
MAX.
0.950(0.037)
TYP
1.800(0.071)
2.000(0.079)
0
8
0.300(0.012)
0.500(0.020)


0.000(0.000)
0.150(0.006)
A4
Symbol
min(mm) max(mm) min(inch) max(inch)
0.900(0.035)
1.300(0.051)
Dec. 2014
Option 1 0.475
0.575
0.019
0.023
Option 2 0.640
0.740
0.025
0.029
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-3 (Only for AH49E)
Unit: mm(inch)
2.820(0.111)
3.100(0.122)
0.100(0.004)
0.200(0.008)
0.300(0.012)
0.600(0.024)
1.300(0.051)
1.600(0.063)
1.500(0.059)
1.700(0.067)
Package Sensor Location
2.650(0.104)
3.000(0.118)
(For Hall IC)
Die
0.200(0.008)
A4
0.685(0.027)
0.985(0.039)
1.450(0.057)
MAX.
0.950(0.037)
TYP
1.800(0.071)
2.000(0.079)
0
8
0.300(0.012)
0.500(0.020)


0.000(0.000)
0.150(0.006)
A4
Symbol
min(mm) max(mm) min(inch) max(inch)
0.900(0.035)
1.300(0.051)
Dec. 2014
Option 1 0.475
0.575
0.019
0.023
Option 2 0.640
0.740
0.025
0.029
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23
New Product Changed to SOT23 (2013.10)
3.0 °
7.0°
0.0°~10.0°
0.010(0.0004)
0.100(0.004) 0.200(0.008)MIN
7.0°
0.080(0.003)
0.180(0.007)
0.550(0.022)REF
1.200(0.047)
1.400(0.055)
2.300(0.091)
2.500(0.098)
Dec. 2014
R0.100(0.004)
0.900(0.035)
1.100(0.043)
2.800(0.110)
3.000(0.118)
0.890(0.035)
1.030(0.041)
0.100(0.004) GAUGE PLANE
4×R0.100(0.004)
0.500(0.020)
0.700(0.028)
2.0°
1.050(0.041)REF
Unit: mm(inch)
0.300(0.012)
0.510(0.020)
1.900(0.075)REF
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-23
Grid placement courtyard
Y
Z
G
Y
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
2.900/0.114
1.100/0.043
0.800/0.031
0.900/0.035
0.950/0.037
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23 (Special for LG IT)
3.0 °
7.0°
0.0°~10.0°
0.000(0.000)
0.100(0.004) 0.200(0.008)MIN
7.0°
0.080(0.003)
0.150(0.006)
0.550(0.022)REF
1.200(0.047)
1.400(0.055)
2.250(0.089)
2.500(0.098)
Dec. 2014
R0.100(0.004)
0.900(0.035)
1.100(0.043)
2.800(0.110)
3.000(0.118)
0.920(0.036)
0.980(0.039)
0.100(0.004) GAUGE PLANE
4×R0.100(0.004)
0.500(0.020)
0.700(0.028)
2.0°
1.050(0.041)REF
Unit: mm(inch)
0.300(0.012)
0.500(0.020)
1.800(0.071)
2.000(0.079)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-5 (Except ITVS)
New Product Changed to SOT25 (2013.10)
0.300(0.012)
0.600(0.024)
0.100(0.004)
0.200(0.008)
1.500(0.059)
1.700(0.067)
3.000(0.118)
2.650(0.104)
2.820(0.111)
3.100(0.122)
Unit: mm(inch)
0.200(0.008)
0.700(0.028)
REF
MAX
1.450(0.057)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
0°
8°
1.800(0.071)
2.000(0.079)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-23-5
E2
G
Z
E1
Y
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value
3.600/0.142
1.600/0.063
0.700/0.028
1.000/0.039
0.950/0.037
1.900/0.075
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-5 (Only for AP2128 special datasheet)
0. 100(0. 004)
0. 200(0. 008)
Gauge Plane 0. 000(0. 000)
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
2.950(0.116)
2.650(0.104)
2. 820(0. 111)
3. 020(0. 119)
Unit: mm(inch)
0. 100(0. 004)
0. 200(0. 008)
0.700(0.028)
REF
MAX
1.450(0.057)
0. 950(0. 037)
TYP
0. 300(0. 012)
0. 400(0. 016)
0°
8°
1. 800(0. 071)
2. 000(0. 079)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-89
New Product Changed to SOT89 (2013.10)
Unit: mm(inch)
1.400(0.055)
1.600(0.063)
4.400(0.173)
4.600(0.181)
Option 1
2.300(0.091)
2.600(0.102)
3.950(0.156)
4.250(0.167)
2.060(0.081)REF
3
0.900(0.035)
1.200(0.047)
0.350(0.014)
0.450(0.018)
0.320(0.013)
0.540(0.021)
0.480(0.019)
0.620(0.024)
0.320(0.013)
0.540(0.021)
3.000(0.118)
TYP
10
3
R0.150(0.006)
10
Option 1
Option 2
1.550(0.061)REF
1.030(0.041)REF
R 0.200(0.008)
0.320(0.013)REF
45
Dec. 2014
2.630(0.104)
2.930(0.115)
1.620(0.064)REF
2.210(0.087)REF
1.500(0.059)
1.620(0.064)
1.800(0.071)
1.830(0.072)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-89
X1
Z
X2
Y1
Y
E
X
Dimens
Z
X
X1
X2
Y
Y1
E
ions
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
Value
4.600/0.181
0.550/0.022
1.850/0.073
0.800/0.031
1.300/0.051
1.475/0.058
1.500/0.059
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220-3
New Product Changed to TO220-3 (2013.10)
9.660(0. 380)
10.660(0. 420)
Option 1
φ3.540(0. 139)
4.080(0. 161)
2.540(0.100)
3.420(0.135)
Unit: mm(inch)
0.510(0. 020)
1.390(0. 055)
14.220(0.560)
16.510(0.650)
φ1.500(0. 059)
27.880(1.098)
30.280(1.192)
8.390(0.330)
9.520(0.375)
0. 200(0. 008)
7°
3.560(0. 140)
4.820(0. 190)
2.040(0. 080)
2.920(0. 115)
3°
7°
1.150(0. 045)
1.770(0. 070)
0.813(0. 032)
0. 381(0. 015)
2.540(0. 100)
Option 2
Dec. 2014
0.356 (0.014)
0.610 (0.024)
2.540(0. 100)
Option 3
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220-3(u)
2.580(0.102)
3.380(0.133)
0.550(0.022)
1.350(0.053)
1.160(0.046)
1.760(0.069)
14.230(0.560)
16.510(0.650)
F1.500(0.059)
27.880(1.098)
30.280(1.192)
8.520(0.335)
9.520(0.375)
1.850(0.073)
9.660(0.380)
10.660(0.420)
F 3.560(0.140)
4.060(0.160)
Unit: mm(inch)
0.200(0.008)
7°
3.560(0.140)
4.820(0.190)
2.080(0.082)
2.880(0.113)
3°
7°
0.381(0.015)
60°
0.813(0.032)
8.763(0.345)
6 0°
0.381(0.015)
2.540(0.100)
Dec. 2014
2.540(0.100)
0.356(0.014)
0.406(0.016)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220-3(2)
Unit: mm(inch)
9.800(0.386)
10.200(0.402)
F 3.560(0.140)
3.640(0.143)
0.600(0.024)
REF
11.100(0.437)
REF
1.200(0.047)
1.400(0.055)
1.200(0.047)
1.400(0.055)
6.300(0.248)
6.700(0.264)
1.620(0.064)
1.820(0.072)
9.000(0.354)
9.400(0.370)
3°
4.400(0.173)
4.600(0.181)
2.200(0.087)
2.500(0.098)
3°
0.700(0.028)
0.900(0.035)
2.540(0.100)
REF
Dec. 2014
12.600(0.496)
13.600(0.535)
1.170(0.046)
1.390(0.055)
9.600(0.378)
10.600(0.417)
3.000(0.118)
REF
3°
2.540(0.100)
REF
0.400(0.016)
0.600(0.024)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220-3(2) Special for Gree
Unit: mm(inch)
9.800(0. 386)
10.200(0. 402)
3.560(0. 140)
3.640(0. 143)
0.600(0. 024)
REF
11.100(0.437)
REF
1.200(0. 047)
1.400(0. 055)
1.200(0. 047)
1.400(0. 055)
6.300(0.248)
6.700(0.264)
1.620(0. 064)
1.820(0. 072)
9.000(0.354)
9.400(0.370)
3°
4.400(0. 173)
4.600(0. 181)
2.200(0. 087)
2.500(0. 098)
3°
0.700(0. 028)
0.900(0. 035)
2.540(0. 100)
REF
Dec. 2014
12.600(0.496)
13.600(0.535)
1.170(0. 046)
1.390(0. 055)
9.600(0.378)
10.600(0.417)
3.000(0. 118)
REF
3°
2.540(0. 100)
REF
0.460(0. 018)
0.600(0. 024)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220-3(3)
R0.500(0.020)
5°
Unit: mm(inch)
5°
4.380(0.172)
4.580(0.180)
10.060(0.396)
10.260(0.404)
10.100(0.398) REF
7.900(0.311)
8.100(0.319)
2.750(0.108)
REF
1.270(0.050)
3.420(0.135)
REF
REF
Ø3.840(0.151)
3.600(0.142)
3.800(0.150)
8.800(0.346)
9.200(0.362)
9.800(0.386)
10.200(0.402)
9.400(0.370)
9.600(0.378)
30°
R1.000(0.039)
Ø1.400(0.055)
1.600(0.063)
1.400(0.055)
1.600(0.063)
3.210(0.126)
3.410(0.134)
8°
5°
5°
9.250(0.364)
9.750(0.384)
13.150(0.518)
13.750(0.541)
1.270(0.050)
REF
2.450(0.096)
2.650(0.104)
0.710(0.028)
0.910(0.036)
0.350(0.014)
0.550(0.217)
2.540(0.100)
REF
Dec. 2014
2.540(0.100)
REF
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220F-3
9.700(0. 382)
10.300(0. 406)
F 3.000(0. 119)
3.550(0. 140)
Unit: mm(inch)
Option 1
3. 000(0. 119)
3. 400(0. 134)
6.900(0. 272)
7.100(0. 280)
2. 350(0. 093)
2. 900(0. 114)
3. 370(0. 133)
3. 900(0. 154)
14. 700(0. 579)
16. 000(0. 630)
2.790(0.110)
4.500(0.177)
4. 300(0. 169)
4. 900(0. 193)
1. 000(0. 039)
1. 400(0. 055)
2.520(0.099)
2.920(0.115)
1. 100(0. 043)
1. 500(0. 059)
12. 500(0. 492)
13. 500(0. 531)
0.500(0. 020)
0.900(0. 035)
2.540(0.100)
0. 450(0. 018)
0. 650(0. 026)
2. 540(0. 100)
Option 2
3. 190(0. 126)
3. 250(0. 128)
5
5
5
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO220F-3
Unit: mm(inch)
TO220F-3
D
A3
X
Y
Y1
E
ø
A
b2
b1
L
A2
L1
b
e
e
c
Dim
Min
Max
Typ
A
4.300
4.900
-
A2
2.520
2.920
-
A3
2.350
2.900
-
b
0.550
0.900
-
b1
1.000
1.400
-
b2
1.100
1.500
-
c
0.500
0.700
-
D
9.70
10.30
-
E
14.70
16.00
-
e
-
-
2.540
L
12.50
13.50
-
L1
2.790
4.500
-
X
6.90
7.10
-
Y
2.900
3.300
-
Y1
3.370
3.970
-
ø
3.000
3.550
-
All Dimensions in mm
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-277
New Product Changed to TO277 (2013.10)
6.400(0.252)
6.600(0.260)
Cathode line
by marking
5.600(0.220)
5.800(0.228)
0.800(0.031)
0.850(0.033)
1.100(0.043)
3.000(0.118)
3.300(0.130)
4.100(0.161)
4.300(0.169)
1.000(0.039)
4.200(0.165)
4.400(0.173)
3.520(0.139)
TYP
Unit: mm(inch)
1.860(0.073)
TYP
1.000(0.039)
TYP
1.700(0.067)
1.900(0.075)
0.150(0.006)
TYP
5.400(0.213)
TYP
1.100(0.043)
1.400(0.055)
0.300(0.012)
0.400(0.016)
1.050(0.041)
1.200(0.047)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-277
X1
X2
Y1
E
Y2
G
Dimensions
X1=Y1
mm(inch)
X2
mm(inch)
Y2
mm(inch)
E
mm(inch)
G
mm(inch)
Value
1.300(0.051)
4.600(0.181)
3.400((0.134)
1.860(0.073)
1.000(0.039)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
1.350(0.053)
1.650(0.065)
TO-252-2(1)
6.450(0.254)
6.650(0.262)
5.200(0.205)
5.400(0.213)
Unit: mm(inch)
2.200(0.087)
2.400(0.094)
0.450(0.018)
0.580(0.023)
4.300(0.169)
5.400(0.213)
3°
4°
0.450(0.018)
0.580(0.023)
4.800(0.189)
6.500(0.256)
3.800REF(0.150REF)
4.500(0.177)
4.700(0.185)
1.400(0.055)
1.780(0.070)
0.700(0.028)
0.900(0.035)
0.500(0.020)
0.700(0.028)
2.300TYP
Dec. 2014
5°
5°
5.450(0.215)
6.250(0.246)
0.000(0.000)
0.127(0.005)
2.550(0.100)
2.900(0.114)
0.600(0.024)
0.900(0.035)
9.500(0.374)
9.900(0.390)
8°
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-2(1)
Unit: mm(inch)
X2
Y2
Z
G
Y1
X1
Dimensions
Value
Dec. 2014
E1
Z
X1
X2=Y2
Y1
G
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
11.600/0.457
1.500/0.059
7.000/0.276
2.500/0.098
2.100/0.083
2.300/0.091
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220B-5
10.010(0.394)
10.310(0.406)
3.790(0.149)
3.890(0.153)
2.590(0.102)
2.890(0.114)
12.460(0.491)
12.860(0.506)
0.950(0.037)
R 1.050(0.041)
1.170(0.046)
1.370(0.054)
1.170(0.046)
1.370(0.054)
8.900(0.350)
9.300(0.366)
Unit: mm(inch)
4.470(0.176)
4.670(0.184)
24.300(0.957)
24.700(0.972)
0.710(0.028)
0.910(0.036)
25.100(0.988)
25.500(1.004)
3.400(0.134)
3.600(0.142)
2.520(0.099)
2.820(0.111)
5.300(0.209) 3.800(0.150)
4.000(0.157)
5.500(0.217)
4.250(0.167)
4.550(0.179)
1.700(0.067)TYP
6.700(0.264)
6.900(0.272)
Dec. 2014
3.300(0.130)
3.500(0.138)
0.310(0.012)
0.530(0.021)
8.250(0.325)
8.550(0.337)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-263-2
New Product Changed to TO263-2 (2013.10)
Unit: mm(inch)
Option 1
1.270(0.050)
1.670(0.066)
8.840(0.348)
1.150(0.045)
1.650(0.065)
7.420(0.292)
70°
0.000(0.000)
0.250(0.010)
2.640(0.104)
2.700(0.106)
1.770(0.070)
MAX
1.780(0.070)
2.790(0.110)
14.610(0.575)
15.870(0.625)
1.150(0.045)
1.770(0.070)
3°
0.510(0.020)
0.990(0.039)
2.540(0.100)
2.540(0.100)
2°
8°
0.356(0.014)
0.730(0.029)
2.540(0.100)
2.540(0.100)
Dec. 2014
Option 2
MIN
3°
6.550(0.258)
9.650(0.380)
10.660(0.420)
7.980(0.314)
7°
2.200(0.087)
0°
6°
4.070(0.160)
4.820(0.190)
5.600(0.220)
8.390(0.330)
9.650(0.380)
7°
6.230(0.245)
MIN
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-263-2
Y3
X1
Y2
X2
X3
E
Y1
Z
Dimensions
Z
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
X3
(mm)/(inch)
Value
16.760/0.660
1.200/0.047
8.540/0.336
10.540/0.415
Dimensions
Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value
3.830/0.151
8.560/0.337
3.000/0.118
5.080/0.200
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-263-2 (Special for LG)
3°
9. 650(0. 380)
10.290(0. 405)
1.270(0. 050)
1.390(0. 055)
1.150(0. 045)
1.390(0. 055)
7.420(0. 292)
REF
8.640(0.340)
9.650(0.380)
7°
0.020(0. 001)
0.250(0. 010)
2.640(0. 104)
2.700(0. 106)
2. 413(0.095)
2. 667(0. 105)
Dec. 2014
1. 150(0. 045)
1. 390(0. 055)
2.390(0.094)
2.690(0.106)
1.500(0.059)
14.760(0.581)
15.740(0.620)
7. 980(0. 314)
REF
7°
3°
2°
8°
0. 510(0. 020)
0. 990(0. 039)
2. 413(0.095)
2. 667(0.105)
5.600(0.220)
REF
4.070(0.160)
4.820(0.190)
70 °
Unit: mm(inch)
0. 360(0. 014)
0. 400(0. 016)
0°
6°
2. 413(0.095)
2. 667(0.105) 2. 413(0.095)
2. 667(0.105)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-263-3
New Product Changed to TO263 (2013.10)
Unit: mm(inch)
Option 1
8.840(0.348)
1.270(0.050)
1.670(0.066)
1.150(0.045)
1.650(0.065)
7.420(0.292)
70°
5.600(0.220)
8.390(0.330)
9.650(0.380)
7°
0.000(0.000)
0.250(0.010)
2.640(0.104)
2.700(0.106)
1.150(0.045)
1.770(0.070)
1.780(0.070)
2.790(0.110)
14.760(0.581)
15.740(0.620)
3°
0.510(0.020)
0.990(0.039)
2.540(0.100)
2.540(0.100)
7.980(0.314)
7°
2.200(0.087)
2°
8°
0.356(0.014)
0.730(0.029)
2.540(0.100)
2.540(0.100)
0°
6°
9.650(0.380)
Option 2
MIN
3°
6.550(0.258)
4.070(0.160)
4.820(0.190)
6.230(0.245)
MIN
10.660(0.420)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-263-3
Y3
Y2
X1
E
X2
X3
Y1
Z
Dimensions
Z
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
X3
(mm)/(inch)
Value
16.760/0.660
1.200/0.047
8.540/0.336
10.540/0.415
Dimensions
Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value
3.830/0.151
8.560/0.337
3.000/0.118
2.540/0.100
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-263-3 (Special for LG)
4.070(0.160)
4.820(0.190)
Unit: mm(inch)
3°
9. 650(0. 380)
10. 290(0. 405)
1. 270(0. 050)
1. 390(0. 055)
7. 420(0. 292)
REF
1. 150(0. 045)
1. 390(0. 055)
1. 150(0. 045)
1. 390(0. 055)
0. 510(0. 020)
0. 990(0. 039)
2. 413(0.095)
2. 667(0.105)
2. 640(0. 104)
2. 700(0. 106)
14.760(0.581)
15.740(0.620)
2. 413(0.095)
2. 667(0.105)
7. 980(0. 314)
REF
7°
3°
2°
8°
0. 360(0. 014)
0. 400(0. 016)
0°
6°
Dec. 2014
REF
0. 020(0. 001)
0. 250(0. 010)
2.390(0.094)
2.690(0.106)
8.640(0.340)
9.650(0.380)
7°
5.600(0.220)
70 °
2. 413(0.095)
2. 667(0.105)
2. 413(0.095)
2. 667(0.105)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92(Bulk Packing)
Unit: mm(inch)
New Product Changed to TO92(Bulk Packing) (2013.10)
1.000(0. 039)
3.430(0. 135)
MIN
3.700(0.146)
3.300(0.130)
1.400(0. 055)
0.320(0. 013)
0.510(0. 020)
0. 000(0. 000)
0. 380(0. 015)
Φ1. 600(0. 063)
MAX
1.270(0. 050)
TYP
Dec. 2014
15.500(0.610)
0.360(0. 014)
0.760(0. 030)
12.500(0.492)
4.700(0.185)
4.300(0.169)
4.400(0. 173)
4.800(0. 189)
2.420(0. 095)
2.660(0.105)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
HSOP-28
Unit: mm(inch)
17.890(0.704)
18.190(0.716)
0.204(0.008)
0.360(0.014)
0.400(0.016)
1.270(0.050)
10.000(0.394)
10.650(0.419)
7.400(0.291)
7.600(0.300)
0o ～8 o
5.050(0.199)
5.250(0.207)
0.230(0.009)
0.470(0.019)
2.180(0.086)
2.330(0.092)
0.800(0.031) TYP
0.100(0.004)
0.300(0.012)
2.280(0.090)
2.630(0.104)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SIP-8
Unit: mm(inch)
18.900(0.744)
19.400(0.764)
1 PIN INDEX
45
o
6.250(0.246)
7.700(0.303)
8.300(0.327)
6.750(0.266)
1PIN
3.100(0.122)
3.700(0.146)
0.420(0.017)
0.580(0.023)
0.850(0.033)
1.150(0.045)
2.540(0.100) TYP
Dec. 2014
1.200(0.047)
1.500(0.059)
0.200(0.008)
0.300(0.012)
2.550(0.100)
3.050(0.120)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
LQFP-44
Unit: mm(inch)
11.800(0.465)
12.200(0.480)
9.900(0.390)
10.100(0.398)
11.800(0.465)
12.200(0.480)
9.900(0.390)
10.100(0.398)
0.050 (0.002)
0.150 (0.006)
0°
7°
1.600 (0.063)
MAX
0.300(0.012)
0.450(0.018)
0.800(0.031)
TYP
0.450(0.018)
0.750(0.030)
0.125 (0.005)
TYP
1.350(0.053)
1.450(0.057)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
PQFP-44
Unit: mm(inch)
12.950(0.510)
13.800 (0.543)
9.900(0.390)
10.100(0.398)
12.950(0.510)
13.800 (0.543)
9.900(0.390)
10.100(0.398)
0.250(0.010)
MIN
0°
7°
2.450(0.096)
MAX
0.300(0.012)
0.450(0.018)
0.800(0.031)
TYP
0.730(0.029)
1.030(0.041)
0.130(0.005)
0.230(0.009)
1.950(0.077)
2.100(0.083)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
MSOP-8
Unit: mm(inch)
0.300(0.012)TYP
P
0.150(0.006)TY
2.900(0.114)
3.100(0.122)
4.700(0.185)
5.100(0.201)
0.400(0.016)
0.800(0.031)
0.650(0.026)TYP
0°
8°
0.750(0.030)
0.970(0.038)
0.200(0.008)
2.900(0.114)
3.100(0.122)
0.000(0.000)
0.800(0.031)
1.200(0.047)
`
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
MSOP-8
E
X
Z
G
Y
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
5.500/0.217
2.800/0.110
0.450/0.018
1.350/0.053
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
MSOP-8 (Only for AH9480 and AH9481)
Unit: mm(inch)
0.300(0. 012) TYP
P
0.150(0.006)TY
4.700(0.185)
5.100(0.201)
0.870(0.034)
1.070(0.042)
2.900(0.114)
3.100(0.122)
1.350(0.053)
1.550(0.061)
0.410(0.016)
0.650(0.026)
0.650(0. 026) TYP
Hall Sensor
Location
0.760(0.030)
0.970(0.038)
0.800(0.031)
1.200(0.047)
0.200(0.008)
2.900(0. 114)
3.100(0. 122)
0.000(0.000)
0°
6°
`
Note: Eject hole , oriented hole and mold mark is optional
.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
MSOP-10
Unit: mm(inch)
0.180(0.007)
0.280(0.011)
0.500(0.020)
TYP
2.900(0.114)
3.100(0.122)
4.750(0.187)
5.050(0.199)
0.400(0.016)
0.800(0.031)
0.090(0.004)
0.230(0.009)
0.750(0.030)
0.950(0.037)
0.820(0.032)
1.100(0.043)
0.150(0.006)
2.900(0.114)
3.100(0.122)
0.020(0.001)
0°
6°
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
MSOP-10
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
5.800/0.228
3.000/0.118
0.300/0.012
1.400/0.055
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-6 (Except ITVS)
New Product Changed to SOT26 (2013.10)
Unit: mm(inch)
0°
2.820(0.111)
8°
3.100(0.122)
0.300(0.012)
0.500(0.020)
5
4
2
3
Pin 1 Mark
1
0.300(0.012)
0.600(0.024)
1.500(0.059)
1.700(0.067)
2.650(0.104)
3.000(0.118)
6
0.200(0.008)
0.700(0.028)REF
0.950(0.037)TYP
1.800(0.071)
2.000(0.079)
0.000(0.000)
0.150(0.006)
0.100(0.004)
0.200(0.008)
0.900(0.035) 1.450(0.057)
MAX
1.300(0.051)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-23-6
E
E
Y
G
Z
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
3.600/0.142
1.600/0.063
0.700/0.028
1.000/0.039
0.950/0.037
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-6 (Only for ITVS)
mm(inch) M I N
Unit:
0°
2.820(0. 111)
8°
3.020(0. 119)
0.200(0. 008)
0.300(0. 012)
0.400(0. 016)
2.950(0.116)
2.650(0.104)
0. 525
4
Pin 1 Mark
0. 075
1
2
0. 075
0.300(0. 012)
0. 600(0. 024)
1.500(0.059 )
1.700(0.067 )
5
6
mm(inch) MAX
3
0.700(0. 028) REF
0. 525
0.950(0. 037) TYP
1. 800(0. 071)
2. 000 (0. 079)
0.100(0. 004)
0. 200(0. 008)
0.000(0. 000)
0.150(0. 006)
0.900(0. 035)
1.300(0. 051)
1.450(0. 057)
MAX
Note: Pin 1 Dot Ø 0.15mm
Pin 1 Dot area 0.6mm* 0.6mm
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-8
New Product Changed to SOT28 (2013.10)
Unit: mm(inch)
0°
8°
2.820(0. 111)
3.020(0. 119)
0.300(0. 012)
0.500(0. 020)
0.300(0. 012)
0.600(0. 024)
Pin 1 Mark
1.500(0.059)
1.700(0.067)
2.650(0.104)
2.950(0.116)
0.200(0. 008)
0. 650(0. 026)BSC
0.975(0. 038)BSC
0.000(0. 000)
0.150(0. 006)
0.100(0. 004)
0.200(0. 008)
0.900(0. 035) 1.450(0. 057)
MAX
1.300(0. 051)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-23-8
Y
G
Z
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
3.600/0.142
1.600/0.063
0.500/0.020
1.000/0.039
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-23-5 (Only for ITVS)
Unit:
Pin 1 Mark
0.300(0.012)
0.600(0.024)
0. 525
0. 100(0. 004)
0. 200(0. 008)
1.500(0.059)
1.700(0.067)
2.950(0.116)
2.650(0.104)
2.820(0. 111)
3.020(0. 119)
mm(inch) M I N
mm(inch) MAX
0. 200(0. 008)
0. 075
0.700(0.028)
REF
0.075
0. 300(0. 012)
0. 400(0. 016)
0. 525
MAX
1.450(0.057 )
1.800(0. 071)
2.000(0. 079)
0°
8°
0.950(0. 037)
TYP
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
Note: Pin1 Dot Ø 0.15mm
Pin 1 Dot area 0.6mm * 0.6mm
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-126B
10.800(0.425)
11.200(0.441)
3.000(0.118)
3.400(0.134)
3.700(0.146)
3.900(0.154)
7.800(0.307)
8.200(0.323)
Unit: mm(inch)
1.500(0.059)
1.900(0.075)
F2.900(0.114)
3.100(0.122)
0.600(0.024)
0.800(0.031)
0.900(0.035)
1.100(0.043)
1.717(0.068)
1.917(0.075)
15.300(0.602)
15.700(0.618)
0.600(0.024)
0.800(0.031)
0.500(0.020)
0.700(0.028)
1.778(0.070) TYP
5.234(0.206)
5.434(0.214)
Dec. 2014
0.450(0.018)
0.600(0.024)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
3.600(0.142)
2. 400(0. 094)
2. 900(0. 114)
1. 060(0. 042)
1. 500(0. 059)
Unit: mm(inch)
0.000(0.000)
0.300(0.012)
10.600(0.417)
11.200(0.440)
7. 400(0. 291)
8.200(0. 323)
3.900(0.154)
TO-126
New Product Changed to TO126 (2013.10)
F 3. 100(0. 122)
3. 550(0. 140)
1. 170(0. 046)
1. 470(0. 058)
2.100(0.083)
14.500(0.570)
15.900(0.626)
1.700(0.067)
0. 660(0. 026)
0. 860(0. 034)
0. 400(0. 016)
0. 600(0. 024)
2. 280(0. 090)
TYP
4. 560(0. 180)
TYP.
R 0.760(0.030)
TYP
Dec. 2014
R 1.840(0.072)
TYP
5.310(0.209)
5.010(0.197)
2.850(0.112)
3.150(0.124)
4.850(0.191)
5.150(0.203)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220-5
New Product Changed to TO220-5 (2013.10)
4.370(0.172)
4.770(0.188)
1.120(0.044)
1.400(0.055)
13.400(0.528)
13.900(0.547)
8.200(0.323)
8.900(0.350)
11.760(0.463)
12.160(0.479)
Option 2
F1.5×Dp 0.1 MAX
1.700(0.067)
REF
2.550(0.100)
2.950(0.116)
9.850(0.388)
10.360(0.408)
F 3.640(0.143)
4.040(0.159)
Option 1
2.470(0.097)
2.870(0.113)
1.700(0.067)
0.640(0.025)
0.940(0.037)
TYP
6.700(0.264)
6.900(0.272)
Dec. 2014
Unit: mm(inch)
0.310(0.012)
0.550(0.022)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220FP
9.800(0.386)
10.200(0.402)
φ
Unit: mm(inch)
4.400(0.173)
4.700(0.185)
3.100(0.122)
3.300(0.130)
2.700(0.106)
3.000(0.118)
3.400(0.134)
3.600(0.142)
7.000(0.276)
7.400(0.291)
15.800(0.622)
16.200(0.638)
2.700(0.106)
3.100(0.122)
2.000(0.079)
2.800(0.110)
13.000(0.512)
13.600(0.535)
1.200(0.047)
0.900(0.035)
1.200(0.047)
1
1.500(0.059)
2
3
0.650(0.026)
0.600(0.024)
0.800(0.031)
0.850(0.033)
2.550(0.100)
Dec. 2014
2.550(0.100)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-252-5
New Product Changed to TO252-5 (2013.10)
6.350(0.250)
6.650(0.262)
5.200(0.205)
5.400(0.213)
9.500(0.374)
9.900(0.390)
Unit: mm(inch)
2.200(0.087)
2.400(0.094)
0.430(0.017)
0.580(0.023)
5.400(0.213)
5.700(0.224)
3.800(0.150)
REF
0.000(0.000)
0.127(0.005)
2.550(0.100)
2.900(0.114)
1.270(0.050)
TYP
2.540(0.100)
TYP
0.400(0.016)
0.600(0.024)
0.430(0.017)
0.580(0.023)
1.400(0.055)
1.780(0.070)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-5
X1
Y1
Z
G
Y
E
Dimensions
Value
Dec. 2014
X
Z
X
X1=Y1
Y
G
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
11.000/0.433
0.600/0.024
5.600/0.220
2.000/0.079
3.400/0.134
1.270/0.050
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-252-5 (2)
Unit: mm(inch)
New Product Changed to TO252-5 (2) (2013.10)
0.880(0.035)
1.270(0.050)
6.450(0.254)
6.700(0.264)
2.190(0.086)
2.390(0.094)
5.210(0.205)
5.500(0.217)
0.450(0.018)
0.580(0.023)
9.400(0.370)
10.400(0.409)
6.000(0.236)
6.200(0.244)
6°
8°
0.000(0.000)
0.130(0.005)
4.320(0.170)
MIN
Dec. 2014
0°
10°
1.400(0.055)
1.780(0.070)
0.508(0.020)
5.210(0.205)
MIN
0.510(0.020)
0.710(0.028)
1.270(0.050)
2.740(0.108)REF
0.610(0.024)
0.790(0.031)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-5 (2)
X1
Y1
Z
G
Y
E
X
Dimensi
Z
X
X1=Y1
Y
G
E
ons
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
Value
11.000/0.433
0.600/0.024
5.600/0.220
2.000/0.079
3.400/0.134
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-263-5
New Product Changed to TO263-5 (2013.10)
1.170 (0.046)
1.370 (0.054)
8.200 (0.323)
9.000 (0.354)
0.020(0.001)
0.250(0.010)
5.080 (0.200)
5.480 (0.216)
1.700 (0.067)
TYP
6.700 (0.264)
6.900 (0.272)
Dec. 2014
5.600 (0.220)
REF
15.140 (0.596)
15.540 (0.612)
1.560 (0.061)
1.760 (0.069)
4.470 (0.176)
4.670 (0.184)
9.880 (0.389)
10.180 (0.401)
Unit: mm(inch)
0.710 (0.028)
0.910 (0.036)
0.310 (0.012)
0.530 (0.021)
2.340 (0.092)
2.740 (0.108)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-263-5
Y3
Y1
Y2
X1
X2
X3
E
Z
Dimensions
Z
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
X3
(mm)/(inch)
Value
16.760/0.660
1.200/0.047
8.540/0.336
10.540/0.415
Dimensions
Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value
3.830/0.151
8.560/0.337
3.000/0.118
1.700/0.067
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92-2
New Product Changed to TO92-2 (2013.10)
1.100(0.043)
1.400(0.055)
Unit: mm(inch)
3.430(0.135)
MIN
0.360(0.014)
0.510(0.020)
3.300(0.130)
3.700(0.146)
0.000(0.000)
0.380(0.015)
Φ1.600(0.063)
MAX
4.400(0.173)
4.700(0.185)
4.300(0.169)
4.700(0.185)
0.380(0.015)
0.550(0.022)
2.500(0.098)
3.100(0.122)
14.100(0.555)
14.500(0.571)
1.270(0.050)
TYP
2.440(0.096)
2.640(0.104)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
FSIP-9
Unit: mm(inch)
21.700(0.854)
22.300(0.878)
3.150(0.124)
3.650(0.144)
4.100(0.161)
4.300(0.169)
5.700(0.224)
5.900(0.232)
8.100(0.319)
8.700(0.343)
20.800(0.819)
21.200(0.835)
6.800(0.268)
7.400(0.291)
3.750(0.148)
6.100(0.240)
6.500(0.256)
0.500(0.020)
2.540(0.100)
1.200(0.047)
Dec. 2014
0.400(0.016)
0.550(0.022)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-28 (EDP)
Unit: mm(inch)
9.600(0.378)
9.800(0.386)
6.250(0.246)
6.550(0.258)
BASE PLANE
GAUGE LINE 0.250(0.010)
PIN #1 ID.
4.300(0.169)
4.500(0.177)
0.800(0.032)
1.050(0.041)
1.200(0.047)MAX
0°
8°
0.650(0.026) BSC
0.190(0.007)
0.300(0.012)
0.050(0.002)
0.150(0.006)
0.450(0.018)
0.750(0.030) 0.090(0.004)
0.200(0.008)
SEATING PLANE
EXPOSED PAD
2.740(0.108)
3.050(0.120)
5.640(0.222)
5.940(0.234)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSSOP-28 (EDP)
X1
G
Y1
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Value
7.720/0.304
4.160/0.164
0.450/0.018
1.780/0.070
Dimensions
E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
---
Value
0.650/0.026
6.200/0.244
3.300/0.130
---
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
9.800(0.386)
10.200(0.402)
5.000(0.197)REF
10.050(0.396)
REF
5°
5°
13.600(0.535)
REF
3-R0.250(0.010)
0.500(0.020)
0.700(0.028)
3-1.050(0.041)MIN
3-1.300(0.051)MAX
10.000(0.394)
10.600(0.417)
5°
6.300(0.248)
6.700(0.264)
15.500(0.610)
15.900(0.626)
1.000(0.039)
5°
15.400(0.606)
15.800(0.622)
°
45
10.400(0.409)
3.300(0.130)
3.500(0.138)
3.300(0.130) 1.500(0.059)
5°
3.000(0.118)
3.400(0.134)
3.500(0.138)REF
3- F1.500(0.059)
Dp0.100(0.004) 3.500(0.138)REF
4.300(0.169)
2.600(0.102)
4.700(0.185)
3.000(0.118)
3.500(0.138)REF
1.000(0.039)
2.540(0.100)TYP
1.500(0.059)MAX
1.190(0.047)REF
4-R0.250(0.010)
REF
1.300(0.051)
1.700(0.067)
1.250(0.049)
MIN
1.190(0.047)REF
7.620(0.300)
REF
5°
0.450(0.018)
0.600(0.024)
5°
Dec. 2014
1.900(0.075)
3.500(0.138)REF
Unit: mm(inch)
3- F 1.500(0.059)
Dp0.100(0.004)
TO-220F-4
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
6.400(0.252)
6.600(0.260)
2.200(0.087)
2.400(0.094)
5.700(0.224)
5.900(0.232)
0.950(0.037)
1.450(0.057)
9.250(0.364)
0.800(0.031)
1.000(0.039)
9.750(0.384)
0.460(0.018)
0.560(0.022)
5.200(0.205)
5.400(0.213)
5.400(0.213)
5.600(0.220)
1.300(0.051)
1.500(0.059)
TO-252-4(PPAK)
Unit: mm(inch)
New Product Changed to TO252-4 (PPAK) (2013.10)
0.450(0.018)
0.550(0.022)
2.440(0.096)
2.640(0.104)
4.980(0.196)
5.180(0.204)
Dec. 2014
0.460(0.018)
0.560(0.022)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-4(PPAK)
X1
Y1
Z
G
Y
E
E1
X
Dimensions
E
(mm)/(inch)
E1
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
Value
1.270/0.050
2.540/0.100
1.000/0.039
5.730/0.226
Dimensions
Y
(mm)/(inch)
Y1
(mm)/(inch)
Z
(mm)/(inch)
G
(mm)/(inch)
Value
2.000/0.079
6.170/0.243
10.830/0.426
2.660/0.105
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-252-4 (2)
Unit: mm(inch)
New Product Changed to TO252-4 (2) (2013.10)
0.880(0.035)
1.270(0.050)
6.450(0.254)
6.700(0.264)
2.190(0.086)
2.390(0.094)
5.210(0.205)
5.500(0.217)
0.450(0.018)
0.580(0.023)
9.400(0.370)
10.400(0.409)
6.000(0.236)
6.200(0.244)
6°
8°
0.000(0.000)
0.130(0.005)
0.640(0.025)
1.020(0.040)
4.320(0.170)
MIN
Dec. 2014
0°
10°
1.400(0.055)
1.780(0.070)
0.508(0.020)
5.210(0.205)
MIN
0.510(0.020)
0.710(0.028)
1.270(0.050)
2.740(0.108)REF
0.610(0.024)
0.790(0.031)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-4 (2)
X1
Y1
Z
G
Y
E
E1
X
Dimensions
E
(mm)/(inch)
E1
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
Value
1.270/0.050
2.540/0.100
1.000/0.039
5.730/0.226
Dimensions
Y
(mm)/(inch)
Y1
(mm)/(inch)
Z
(mm)/(inch)
G
(mm)/(inch)
Value
2.000/0.079
6.170/0.243
10.830/0.426
2.660/0.105
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
ZIP-15
19.850(0.781)
2-2.200(0.087) 19.950(0.785)
×45°
Unit: mm(inch)
2.775(0.109)
2.825(0.111)
1.490(0.058)
1.510(0.059)
12.900(0.508)
13.100(0.516)
0.650(0.026)
0.127(0.005)
0.750(0.030)
60°
A1 B1 A2 B2 A3 B3 A4 B4 A5 B5 A6 B6
1.270(0.050)
19.950(0.785)
20.150(0.793)
A
B7
7
0.350(0.014)
0.450(0.018)
A8
5°
1.200(0.047)
5°
R0.500(0.020)
5°
R1.920(0.076)
2- F 2.000(0.079)
Dp0.100(0.004)
0.200(0.008)
17.650(0.695)
17.850(0.703)
0.900(0.035)
5° 1.100(0.043)
10.600(0.417)
10.800(0.425)
0.800(0.031)
5.900(0.232)
6.100(0.240)
3.900(0.154)
4.100(0.161)
3.770(0.148)
18.580(0.731)
18.780(0.739)
22.000(0.866)
22.200(0.874) 22.200(0.874)
22.400(0.882)
F 3.730(0.147)
R0.500(0.020)
2.420(0.095)
2.580(0.102)
BN
4.200(0.165)
4.400(0.173)
4.500(0.177)
4.700(0.185)
AN
0.490(0.019)
0.510(0.020)
4.900(0.193)
5.100(0.201)
R1.000(0.039)
5°
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DIP-20
New Product Changed to PDIP-20 (2013.10)
3.710(0.146)
4.310(0.170)
3.200(0.126)
3.600(0.142)
Unit: mm(inch)
7.620(0.300)TYP
1.524(0.060)TYP
3.000(0.118)
3.600(0.142)
0.360(0.014)
0.560(0.022)
0.204(0.008)
0.360(0.014)
2.540(0.100) 0.510(0.020)
MIN
TYP
8.200(0.323)
9.400(0.370)
6.200(0.244)
6.600(0.260)
25.950(1.022)
26.550(1.045)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-20
New Product Changed to SO-20 (2013.10)
12.520(0.493)
13.000(0.512)
Unit: mm(inch)
0.400(0.016)
1.270(0.050)
7.400(0.291)
7.600(0.299)
10.000(0.394)
10.650(0.419)
0.204(0.008)
0.360(0.014)
0°
8°
1.270(0.050)
TYP
2.100(0.083)
2.500(0.098)
0.350(0.014)
0.510(0.020)
0.100(0.004)
0.300(0.012)
2.350(0.093)
2.650(0.104)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-20
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
11.400/0.449
7.400/0.291
0.600/0.024
2.000/0.079
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
6.350(0.250)
6.650(0.262)
5.200(0.205)
5.400(0.213)
2.200(0.087)
2.400(0.094)
0.430(0.017)
0.580(0.023)
Unit: mm(inch)
4.300(0.169)
5.400(0.212)
4.800(0.189)
6.500(0.256)
1.350(0.053)
1.650(0.065)
TO-252-3(1)
New Product Changed to TO252 (1) (2013.10)
5°
5°
4.500(0.177)
4.700(0.185)
Dec. 2014
1.400(0.055)
1.780(0.070)
0.500(0.020)
0.700(0.028)
2.300TYP
3°
4°
2.550(0.100)
2.900(0.114)
0.700(0.028)
0.900(0.035)
0.430(0.017)
0.580(0.023)
3.800REF(0.150REF)
0.000(0.000)
0.127(0.005)
5.400(0.213)
5.700(0.224)
9.500(0.374)
9.900(0.390)
8°
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-3(1)
X2
Y2
Z
Y1
X1
E
Dimensions
Z
(mm)/(inch)
X1
(mm)/(inch)
X2= Y2
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value
11.600/0.457
1.100/0.043
7.000/0.276
2.500/0.098
2.300/0.091
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-220 Short Lead
9.700(0.382)
10.100(0.398)
8.700(0.343)
1.300(0.051)
1.400(0.055)
F 3.600(0.142)
4.700(0.185)
8.400(0.331)
3°
18.950(0.746)MAX
15.900(0.626)
16.100(0.634)
3.700(0.146)
F 1.500(0.059)
Dp 0.200(0.008)
2.800(0.110)
2.900(0.114)
1.400(0.055)
4.600(0.181)
1.460(0.057)
9.200(0.362)
9.400(0.370)
4.500(0.177)
3.700(0.146)
1.250(0.049)
1.700(0.067)
3°
1.520(0.060)
1.620(0.064)
45 °
3.750(0.148)
1.270(0.050)
1.370(0.054) 3.900(0.154)
1.000(0.039)
3°
3-R0.200(0.008)
6.750(0.266)
6.900(0.272)
Unit: mm(inch)
0.450(0.018)
0.800(0.031)
0.900(0.035)
2.540(0.100)
TYP
3°
2.540(0.100)
TYP
3°
0.600(0.024)
2.400(0.094)
2.600(0.102)
2-R0.300(0.012)
10.000(0.394)
10.200(0.402)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-20
Unit: mm(inch)
6.400(0.252)
6.600(0.260)
1.450(0.057)
Ф1.550(0.061)
Dp
0.000(0.000)
0.100(0.004)
BTM E-MARK
4.300(0.169)
4.500(0.177)
6.200(0.244)
6.600(0.260)
0.750(0.030) Dp 0.000(0.000)
0.100(0.004)
0.850(0.033)
#1 PIN
INDEXФ
0.650(0.026)TYP
0.800(0.031)
1.050(0.041)
0.340(0.013)
0.540(0.021)
1.200(0.047)
MAX
0.100(0.004)
0.190(0.007)
0.050(0.002)
0.150(0.006)
4- 10°
14°
TOP & BOTTOM
0.200(0.008)MIN
0.200(0.008)
0.280(0.011)
R0.090(0.004)MIN
R0.090(0.004)MIN
0.250(0.010)TYP
0°
8°
0.450(0.018)
0.750(0.030)
1.000(0.039)
REF
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSSOP-20
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
7.720/0.304
4.160/0.164
0.420/0.017
1.780/0.070
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-89-5
New Product Changed to SOT89-5 (2013.10)
Unit: mm(inch)
1.400(0.055)
1.600(0.063)
4.400(0.173)
4.600(0.181)
2.300(0.091)
2.600(0.102)
3.950(0.156)
4.250(0.167)
2.060(0.081)REF
3
0.320(0.013)
0.540(0.021)
10
0.350(0.014)
0.450(0.018)
0.320(0.013)
0.540(0.021)
Option 1
3.000(0.118)
TYP
3
R0.150(0.006)
10
Option 1
Option 2
1.550(0.061)REF
1.030(0.041)REF
R 0.200(0.008)
45
0.900(0.035)
1.100(0.043)
0.320(0.013)REF
2.630(0.104)
2.930(0.115)
1.620(0.064)REF
2.210(0.087)REF
0.650(0.026)
0.950(0.037)
0.900(0.035)
1.100(0.043)
0.480(0.019)
TYP
Dec. 2014
0.650(0.026)
0.950(0.037)
0.500(0.020)
0.620(0.024)
1.500(0.059)
1.800(0.071)
1.620(0.064)
1.830(0.072)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOT-89-5
X1
Z
X2
Y1
Y
X
E
Dimens
Z
X
X1
X2
Y
Y1
E
ions
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
Value
4.600/0.181
0.550/0.022
1.850/0.073
0.800/0.031
1.300/0.051
1.475/0.058
1.500/0.059
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOT-89-5(Only for AH9281/9282)
1.550(0.061)REF
Unit: mm(inch)
4.400(0.173)
4.600(0.181)
1.400(0.055)
1.030(0.041)REF
1.600(0.063)
45
0.900(0.035)
1.100(0.043)
2.300(0.091)
2.600(0.102)
3.950(0.156)
4.250(0.167)
2.060(0.081)REF
1.400(0.055)
1.700(0.067)
Package Sensor Location
(For Hall IC)
0.320(0.013)
0.900(0.035)
1.100(0.043)
1.840(0.072)
2.140(0.084)
3
10
0.350(0.014)
0.450(0.018)
0.520(0.020)
0.480(0.019)
0.320(0.013)
0.520(0.020)
3.000(0.118)
TYP
1.500(0.059)
1.800(0.071)
0.320(0.013)REF
3
2.210(0.087)REF
1.620(0.064)REF
R0.150(0.006)
10
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-14
Unit: mm(inch)
0.340(0.013)
0.540(0.021)
SEE DETAIL A
0.050(0.002)
0.150(0.006)
0.800(0.031)
1.050(0.041)
0.090(0.004)
1.200(0.047) MAX
0.200(0.008)
4.860(0.191)
5.100(0.201)
TOP&BOTTOM
R0.090(0.004)
>0
o
0.200(0.008)
6.200(0.244)
6.600(0.260)
INDEX
0.950(0.037)
φ 1.050(0.041)
0
DEP
0.100(0.004)
R0.090(0.004)
4.300(0.169)
4.500(0.177)
o
0
o
8
0.450(0.018)
0.750(0.030)
0.250(0.010)
# 1 PIN
1.000(0.039) REF
0.650(0.026)
0.190(0.007)
0.280(0.011)
DETAIL A
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSSOP-14
G Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
7.720/0.304
4.160/0.164
0.420/0.017
1.780/0.070
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SSOP-20
Unit: mm(inch)
DETAIL
7.600(0.299)
8.000(0.315)
1.200(0.047)
F1.200(0.047)
5.100(0.201)
5.500(0.217)
0.020(0.001)
DEP
0.080(0.003)
SEE DETAIL A
1.200(0.047)
0.090(0.004)
0.250(0.010)
0
1
70
7.000(0.276)
7.400(0.291)
100
140
0.650(0.026)
0.070(0.003)
0.230(0.009)
0.220(0.009)
0.380(0.015)
1.690(0.067)
MAX
R0.150(0.006)
0.324(0.013)
R0.150(0.006)
1.400(0.055)
1.600(0.063)
0.250(0.010)
10
70
0.630(0.025)
0.950(0.037)
1.250(0.049)
DETAIL A
1.700(0.067)
1.900(0.075)
OPTIONAL
CONSTRUCTION
Note: Eject hole, oriented hole and mold mark is optional
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SSOP-20
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
9.120/0.359
5.580/0.220
0.450/0.018
1.770/0.070
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SSOP-24
Unit: mm(inch)
8.000(0.315)
8.400(0.331)
0
8
0.550(0.022)
0.950(0.037)
7.600(0.299)
8.000(0.315)
5.100(0.201)
5.500(0.217)
0.090(0.004)
0.250(0.010)
0.050(0.002)
0.230(0.009)
0.650(0.026)
BSC
0.220(0.009)
0.380(0.015)
1.400(0.055)
1.600(0.063)
1.730(0.068)
MAX
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SSOP-24
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
9.120/0.359
5.580/0.220
0.450/0.018
1.770/0.070
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(Only for AH477)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45° TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.950(0.077)
2.250(0.089)
0.850(0.033)
1.150(0.045)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.450(0. 136)
3.750(0. 148)
(For Hall IC)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(Only for AH477A)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45 °TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.720(0.068)
2.020(0.080)
1.100(0.043)
1.400(0.055)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
(For Hall IC)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(Only for AH287)
0.500(0.020)
0.700(0.028)
3.780( 0.149)
4.080(0.161)
Unit: mm(inch)
45 ° TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.720(0.068)
2.020(0.080)
1.100(0.043)
1.400(0.055)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.450(0.136 )
3.750(0.148 )
(For Hall IC)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050)
TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(Only for AH9279)
0.500(0.020)
0.700(0.028)
3.780( 0.149)
4.080( 0.161)
Unit: mm(inch)
45° TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
2.000(0.079)
2.300(0.091)
1.100(0.043)
1.400(0.055)
Package Sensor Location
(For Hall IC)
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(Only for AH277A)
0.500(0.020)
0.700(0.028)
3.780(0.149)
Unit: mm(inch)
45°TYP
4.080(0.161)
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.850(0.073)
1.250(0.049)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
(For Hall IC)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(Only for AH277A Special Datasheet)
0.500(0.020)
0.700(0.028)
3.780(0.149)
Unit: mm(inch)
45°TYP
4.080(0.161)
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
5.170(0.204)
5.270(0.207)
0.360(0.014)
0.510(0.020)
1.850(0.073)
1.250(0.049)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.600(0.142)
3.700(0.146)
(For Hall IC)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94
New Product Changed to TO94 (2013.10)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45°TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.510(0.020)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(For AH266 only)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45 °TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.850(0.073)
1.250(0.049)
Package Sensor Location
(For Hall IC)
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(For AH276 only)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45 °TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.850(0.073)
1.250(0.049)
Package Sensor Location
(For Hall IC)
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(For AH278 only)
0.500(0.020)
0.700(0.028)
3.780(0.149)
Unit: mm(inch)
45 °TYP
4.080(0.161)
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.850(0.073)
1.250(0.049)
Package Sensor Location
(For Hall IC)
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(For AH211 only)
0.500(0.020)
0.700(0.028)
3.780(0.149)
Unit: mm(inch)
45°TYP
4.080(0.161)
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.850(0.073)
1.250(0.049)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(For AH9280 only)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45 °TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
2.000(0.079)
2.300(0.091)
1.100(0.043)
1.400(0.055)
Package Sensor Location
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
(For Hall IC)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-94(For AH9479 only)
0.500(0.020)
0.700(0.028)
3.780(0.149)
4.080(0.161)
Unit: mm(inch)
45 °TYP
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)
4.980(0.196)
5.280(0.208)
0.360(0.014)
0.510(0.020)
1.750(0.069)
1.950(0.077)
0.950(0.037)
1.150(0.045)
Package Sensor Location
(For Hall IC)
0.380(0.015)
0.550(0.022)
3.450(0.136)
3.750(0.148)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-41
25. 400(1. 000) MIN
Unit: mm(inch)
0. 700(0. 028)
0. 900(0. 035)
DIA.
Cathode line
by marking
4. 200(0. 165)
5. 200(0. 205)
2. 000(0. 080)
2. 700(0. 107)
DIA.
25. 400(1. 000) MIN
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
HDIP-12
Unit: mm(inch)
0.510(0.020)MIN
4.060(0.160)
TYP
3.100(0.122)
3.500(0.138)
3.000(0.118)MIN
0.219(0.009)
0.460(0.018)
0.560(0.022)
3.000(0.118)TYP
2.540(0.100)
TYP
0.339(0.013)
MAX
10 °
7.620(0.300)
TYP
6.150(0.242)
6.550(0.258)
1.524(0.060)TYP
18.900(0.744)
19.300(0.760)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92 (Ammo Packing)
Unit: mm(inch)
New Product Changed to TO92(Ammo Packing) (2013.10)
1. 100(0. 043)
1.270(0. 050)
Typ
3. 430(0.135)
MIN
3.800(0.150)
2.500(0. 098)
4.000 (0.157 )
0.000(0.000)
0.380(0.015)
Φ1. 600(0. 063)
MAX
14.500(0.571)
0. 320(0. 013)
0. 510(0. 020)
12.500(0.492)
3.300(0.130)
1. 400(0. 055)
4.700(0.185)
4.300(0.169)
4.400(0. 173)
4.800 (0.189 )
13.000(0. 512)
15.000 (0.591 )
0.380(0.015)
0.550(0.022 )
2.540(0.100)
Typ
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
6. 500(0. 256)
6. 700(0. 264)
2.28BSC
3
7
2.9REF
9.800(0.386)
3
7
0. 900(0. 035)
1.100(0. 043)
3
7
0
8
2.200(0.087)
2.380(0.094)
1
5
0. 470(0. 019)
0. 600(0. 024)
1.400(0.055)
1.700(0.067)
0. 770(0. 030)
0. 890(0. 035)
0.770(0. 030)
1.100(0. 433)
4. 700 REF
10.40(0.409)
1.150(0.045)
1.500(0.059)
0.600(0.024)
1.000(0.039)
1.2±0.1
5.250REF
5. 230(0. 206)
5. 430(0. 214)
1.80REF
6.000(0.236)
6.200(0.244)
0.900(0.035)
1.250(0.049)
TO-252-2 (2)
Unit: mm(inch)
New Product Changed to TO252-2 (2) (2013.10)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-2(2)
Unit: mm(inch)
X2
Y2
Z
G
Y1
X1
Dimensions
Value
Dec. 2014
E1
Z
X1
X2=Y2
Y1
G
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
11.600/0.457
1.500/0.059
7.000/0.276
2.500/0.098
2.100/0.083
2.300/0.091
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
6.500(0. 256)
6.700(0. 264)
4.700REF
5.130(0.202)
5.460(0.215)
1.29±0.1
2.286(0. 090)
BSC
5
9
2.200(0.087)
2.380(0.094)
Dec. 2014
0.470(0.019)
0.600(0.024)
0.900(0.035)
1.100(0.043)
0
8
2.900REF
9.800(0.386)
10.400(0.409)
5
9
3
7
1.400(0.055)
1.700(0.067)
0.720(0.028)
0.850(0.033)
0.720(0.028)
0.900(0. 035)
0.600(0.024)
1.000(0.039)
0.150(0.006)
0.750(0.030)
1.800REF
6.000(0.236)
6.200(0.244)
Option 1
5.250REF
0.900(0.035)
1.250(0.049)
TO-252-2 (3)
Unit: mm(inch)
New Product Changed to TO252-2 (3) (2013.10)
0
8
Option 2
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-2(3)
Unit: mm(inch)
X2
Y2
Z
G
Y1
X1
Dimensions
Value
Dec. 2014
E1
Z
X1
X2=Y2
Y1
G
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
11.600/0.457
1.500/0.059
7.000/0.276
2.500/0.098
2.100/0.083
2.300/0.091
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
Unit: mm(inch)
6.500(0. 256)
6.700(0. 264)
4.620(0.182)
4.920(0.194)
0.470(0.019)
0.600(0.024)
5
9
9.800(0.386)
10.40(0.409)
0.900(0.035)
1.100(0.043)
0
8
2.900REF
0.600(0.024)
1.000(0.039)
0.150(0.006)
0.750(0.030)
1.29±0.1
4.700(0.185)
5.500(0.217)
5.130(0.202)
5.460(0.215)
1.800REF
6.000(0.236)
6.200(0.244)
0.900(0.035)
1.250(0.049)
TO-252-2 (3) (Only for AP2114 Special for Qisda)
2.286(0. 090)
BSC
5
9
1.400(0.055)
1.700(0.067)
0.720(0.028)
0.850(0.033)
0.720(0.028)
0.900(0. 035)
3
7
0
8
2.200(0.087)
2.380(0.094)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
5
9
4.700REF
0.470(0.019)
0.600(0.024)
0.900(0.035)
1.100(0.043)
0
8
2.900REF
9.800(0.386)
10.40(0.409)
5
9
3
7
1.400(0.055)
1.700(0.067)
0.720(0.028)
0.850(0.033)
0.600(0.024)
1.000(0.039)
0.150(0.006)
0.750(0.030)
1.29±0.1
5.250REF
5.130(0.202)
5.460(0.215)
0.720(0.028)
0.900(0.035)
2.286(0.090)
BSC
Unit: mm(inch)
6.500(0.256)
6.700(0.264)
1.800REF
6.000(0.236)
6.200(0.244)
0.900(0.035)
1.250(0.049)
TO-252-2 (Only for AS78XXA Special for CMI and Ampower)
0
8
2.200(0.087)
2.380(0.094)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
5
9
4.700REF
0.470(0.019)
0.600(0.024)
0.900(0.035)
1.100(0.043)
0
8
2.900REF
9.800(0.386)
10.40(0.409)
5
9
3
7
1.400(0.055)
1.700(0.067)
0.720(0.028)
0.850(0.033)
0.600(0.024)
1.000(0.039)
0.150(0.006)
0.750(0.030)
1.29±0.1
5.250REF
5.130(0.202)
5.460(0.215)
0.720(0.028)
0.900(0.035)
2.286(0.090)
BSC
Unit: mm(inch)
6.500(0.256)
6.700(0.264)
1.800REF
6.000(0.236)
6.200(0.244)
0.900(0.035)
1.250(0.049)
TO-252-2 (3) (Only for AS78XXA Special for ASUS)
0
8
2.200(0.087)
2.380(0.094)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-252-2(4)
Unit: mm(inch)
New Product Changed to TO252-2 (4) (2013.10)
2.180(0.086)
2.380(0.094)
6.350(0.250)
6.730(0.265)
0.890(0.035)
1.270(0.050)
4.960(0.195)
5.460(0.215)
4.320(0.170)
MIN
0.460(0.018)
0.600(0.024)
2.160(0.085)
MIN
0
15
1.20±0.05
5.210(0.205)
MIN
5.970(0.235)
6.220(0.245)
9.940(0.391)
10.340(0.407)
1.700(0.067)
1.900(0.075)
1.145(0.045)
1.492(0.059)
0.765(0.030)
1.124(0.044)
2.290(0.090)
BSC
0.640(0.025)
0.884(0.035)
1.010(0.040)
MAX
DETAIL “A”
0.650(0.026)
0.780(0.031)
PLATING
3
3
0.460(0.018)
0.610(0.024)
0.410(0.016)
0.560(0.022)
BASE METAL
0.640(0.025)
0.884(0.035)
SECTION B-B
GAUGE PLANE
1.500(0.059)
1.780(0.070)
Dec. 2014
0
10
B
SEATING
PLANE
B
2.740(0.108)
REF
0.020(0.001)
0.120(0.005)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-2(4)
Unit: mm(inch)
X2
Y2
Z
G
Y1
X1
Dimensions
Value
Dec. 2014
E1
Z
X1
X2=Y2
Y1
G
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
11.600/0.457
1.500/0.059
7.000/0.276
2.500/0.098
2.100/0.083
2.300/0.091
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-252-2 (5)
New Product Changed to TO252-2 (5) (2013.10)
0.880(0.035)
1.270(0.050)
Unit: mm(inch)
6.450(0.254)
6.700(0.264)
2.190(0.086)
2.390(0.094)
5.210(0.205)
5.500(0.217)
0.450(0.018)
0.580(0.023)
9.400(0.370)
10.400(0.409)
6.000(0.236)
6.200(0.244)
6°
8°
0.000(0.000)
0.130(0.005)
0.640(0.025)
1.020(0.040)
4.320(0.170)
MIN
Dec. 2014
0.508(0.020)
0°
10°
5.210(0.205)
MIN
0.640(0.025)
0.880(0.035)
1.400(0.055)
1.780(0.070)
2.286(0.090)
2.740(0.108)REF
0.760(0.030)
1.140(0.045)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-2 (5)
Unit: mm(inch)
X2
Y2
Z
G
Y1
X1
Dimensions
Value
Dec. 2014
E1
Z
X1
X2=Y2
Y1
G
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
11.600/0.457
1.500/0.059
7.000/0.276
2.500/0.098
2.100/0.083
2.300/0.091
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
Unit: mm(inch)
6.500(0. 256)
6.700(0. 264)
3
7
0. 900(0. 035)
1. 100(0. 043)
3
7
3
7
0
8
2.200(0.087)
2.380(0.094)
1
5
0.470(0. 019)
0.600(0. 024)
1.400(0.055)
1.700(0.067)
0.770(0. 030)
0.890(0. 035)
0.770(0. 030)
1.100(0. 433)
2.28BSC
4. 700REF
9.800(0.386)
10.40(0.409)
2.9REF
1.150(0.045)
1.500(0.059)
1.2±0.1
5.250REF
5.230(0. 206)
5.430(0. 214)
1.80REF
6.000(0.236)
6.200(0.244)
0.900(0.035)
1.250(0.049)
TO-252-3(2)
New Product Changed to TO252 (2) (2013.10)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TO-252-3(2)
X2
Y2
Z
Y1
X1
E
Dimensions
Z
(mm)/(inch)
X1
(mm)/(inch)
X2= Y2
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value
11.600/0.457
1.100/0.043
7.000/0.276
2.500/0.098
2.300/0.091
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-15
25. 400(1. 000) MIN
Unit: mm(inch)
0. 700(0. 028)
0. 900( 0.035)
DIA.
Cathode line
by marking
5.800(0.228)
7.600(0.299)
2.600(0.102)
3.600(0.142)
DIA.
25. 400(1. 000) MIN
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-20 (EDP)
Unit: mm(inch)
New Product Changed to TSSOP-20EP (2013.10)
6.400(0.252)
6.600(0.260)
4.100(0.161)
4.300(0.169)
2.900(0.114)
3.100(0.122)
6.200(0.244)
6.600(0.260)
EXPOSED PAD
4.300(0.169)
4.500(0.177)
#1 PIN
0.000(0.000)
0.750(0.030)
INDEXФ 0.850(0.033) Dp 0.100(0.004)
0.100(0.004)
0.190(0.007)
0.650(0.026)TYP
0.800(0.031)
1.050(0.041)
0.340(0.013)
0.540(0.021)
4-10°
14°
TOP & BOTTOM
0.200(0.008)MIN
R0.090(0.004)MIN
1.200(0.047)
MAX
0.050(0.002) R0.090(0.004)MIN
0.150(0.006)
0.250(0.010)TYP
0°
8°
0.200(0.008)
0.280(0.011)
0.450(0.018)
0.750(0.030)
1.000(0.039)
REF
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSSOP-20 (EDP)
X1
G
Y1
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Value
7.720/0.304
4.160/0.164
0.420/0.017
1.780/0.070
Dimensions
E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
---
Value
0.650/0.026
4.500/0.177
3.300/0.130
---
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SC-70-5
Unit: mm(inch)
0°
2.000(0. 079)
8°
2.200(0. 087)
0.150(0. 006)
0.350(0. 014)
0.200(0. 008)
1.150(0.045)
1.350(0.053)
2.150(0.085)
2.450(0.096)
0.260(0. 010)
0.460(0. 018)
0.525(0. 021) REF
0.650(0. 026)TYP
1.200(0. 047)
1.400(0. 055)
0.000(0. 000)
0.100(0. 004)
0.080(0. 003)
0.150(0. 006)
0.900(0. 035) 0.900(0. 035)
1.000(0. 039) 1.100(0. 043)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SC-70-5
E1
G
Z
Y
X
E
Dimensions
Value
Dec. 2014
Z
G
X
Y
E
E1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.740/0.108
1.140/0.045
0.400/0.016
0.800/0.031
1.300/0.051
0.650/0.026
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-20 (EDP)(Only for AA4005)
Unit: mm(inch)
6.400(0.252)
6.600(0.260)
3.700(0.146)
MAX
4.300(0.169)
6.200(0.244) 4.500(0.177)
6.600(0.260)
EXPOSED
PAD
2.400(0.094)
MAX
#1 PIN
INDEX 0.750(0.030) Dp 0.000(0.000)
0.850(0.033)
0.100(0.004)
0.100(0.004)
0.190(0.007)
0.650(0.026)TYP
0.900(0.035)
1.050(0.041)
0.340(0.013)
0.540(0.021)
1.200(0.047)
MAX
0.050(0.002)
0.150(0.006)
4-10°
14°
TOP & BOTTOM
0.200(0.008)MIN
R0.090(0.004)MIN
R0.090(0.004)MIN
0.250(0.010)TYP
0°
8°
0.200(0.008)
0.280(0.011)
0.450(0.018)
0.750(0.030)
1.000(0.039)
REF
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
PSOP-8
New Product Changed to SO-8EP (2013.10)
Unit: mm(inch)
3.800(0.150)
4.000(0.157)
2.110(0.083)
2.750(0.108)
3.402(0.134)
2.710(0.107)
1.270(0.050)
4.700(0.185)
5.100(0.201)
TYP
0.300(0.012)
0.510(0.020)
5.800(0.228)
6.200(0.244)
0.050(0.002)
0.150(0.006)
1.350(0.053)
1.550(0.061)
0°
8°
0.400(0.016)
1.270(0.050)
0.150(0.006)
0.250(0.010)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
PSOP-8
Y1
G
Z
X1
Y
E
X
Z
G
X
Y
X1
Y1
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
3.600/0.142
2.700/0.106
1.270/0.050
Dimensions
Value
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
PSOP-16
New Product Changed to SO-16EP (2013.10)
Unit: mm(inch)
9.800(0.386)
10.000(0.394)
0
8
3.810(0.150)
REF
3.800(0.150)
4.000(0.157)
5.800(0.228)
6.200(0.244)
2.300(0.091)
REF
0.250(0.010)
0.500(0.020)
0.190(0.007)
0.250(0.010)
1.270(0.050)
BSC
0.400(0.016)
1.270(0.050)
1.350(0.053)
1.750(0.069)
0.330(0.013)
0.510(0.020)
0.050(0.002)
0.250(0.010)
Note: 1. Eject hole, oriented hole and mold mark is optional.
2 . The figure of exposed pad is not restrained as regular rectangle.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
PSOP-16
Y1
G
Z
X1
Y
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
Dimensions
E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
---
Value
1.270/0.050
4.200/0.165
2.700/0.106
---
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
PSOP-8(D)
3.861(0.152)
3.998(0.157)
Unit: mm(inch)
1.422(0.056)
1.676(0.066)
0.351(0.014)
0.508(0.020)
PIN1
1.270(0.050)
TYP
5.840(0.230)
6.200(0.244)
0.025(0.001)
0.127(0.005)
4.801(0.189)
4.953(0.195)
1.397(0.055)
1.549(0.061)
2.310(0.091)
2.510(0.099)
0°
8°
0.406(0.016)
0.889(0.035)
PIN1
1.240(0.049)
1.440(0.057)
3.252(0.128)
3.452(0.136)
0.190(0.008)
0.250(0.010)
1.758(0.069)
1.956(0.077)
0.254(0.010)
x45°
0.406(0.016)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSOT-23-6
New Product Changed to TSOT26 (2013.10)
2.800(0.110)
3.000(0.118)
1.500(0.059)
1.700(0.067)
Pin 1 Mark
R0.100(0.004)
MIN
Unit: mm(inch)
0
8
2.600(0.102)
3.000(0.118)
0.370(0.015)
MIN
0.950(0.037)
BSC
0.100(0.004)
0.250(0.010)
1.900(0.075)
BSC
0.250(0.010)
BSC
GAUGE
PLANE
0.700(0.028)
0.900(0.035)
1.000(0.039)
MAX
0.000(0.000)
0.100(0.004)
Dec. 2014
0.350(0.014)
0.510(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSOT-23-6
X
Y
Z
E
Dimensions
Value
Dec. 2014
E
(mm)/(inch)
0.950/0.037
X
(mm)/(inch)
0.700/0.028
Y
(mm)/(inch)
1.000/0.039
Z
(mm)/(inch)
3.199/0.126
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
FTSOT-23-6 (Except AH9485/AH9486)
Unit: mm(inch)
2.820(0.111)
3.020(0.119)
3.700(0.146)
3.900(0.154)
1.600(0.063)
1.700(0.067)
Pin 1 Mark
0.950(0.037)
BSC
0.350(0.014)
0.500(0.020)
0.393(0.015)
0.493(0.019)
Dec. 2014
0.080(0.003)
0.200(0.008)
0.700(0.028)
0.800(0.031)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
FTSOT-23-6 (Only for AH9485/AH9486)
Unit: mm(inch)
2.820(0.111)
3.020(0.119)
1.180(0.046)
1.380(0.054)
0.850(0.033)
1.050(0.041)
Pin 1 Mark
3.700(0.146)
3.900(0.154)
1.600(0.063)
1.700(0.067)
Package Sensor
Location
0.950(0.037)
BSC
0.350(0.014)
0.500(0.020)
0.393(0.015)
0.493(0.019)
Dec. 2014
0.080(0.003)
0.200(0.008)
0.700(0.028)
0.800(0.031)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
0.900(0.035)
1.250(0.049)
TO-251
New Product Changed to TO251 (2013.10)
6.400(0.252)
6.750(0.266)
2. 200（0. 087）
2. 400（0. 094）
5. 200(0. 205)
5. 400( 0. 213)
0. 450(0. 018)
0. 550( 0. 022)
8.900(0.350)
9.500(0.374)
5.950 (0.234)
6.250 (0.246)
Option 1
Unit: mm(inch)
0. 550 (0. 022 )
0. 740 (0. 029 )
0. 450(0. 018)
0. 570(0. 022)
2. 240(0. 088 )
2. 340(0. 092)
4. 430 (0. 174)
4. 730 ( 0. 186 )
0.890(0.035)
1.150(0.045)
Option 3
Option 2
45
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-2×2-12
1.900(0.075)
2.100(0.083)
Unit: mm(inch)
0.750(0.030)
0.850(0.033)
Pin 1 Mark
1.900(0.075)
2.100(0.083)
0.152(0.006)
REF
0.300(0.012)
0.400(0.016)
PIN # 1
IDENTIFICATION
0.000(0.000)
0.050(0.002)
0.500(0.020)
BSC
0.180(0.007)
0.280(0.011)
0.300(0.012)
0.400(0.016)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-2×2-12
X1
Y1
Y
E
X3
Y2
X2
X
Dimensions
Y=X
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2=X3
(mm)/(inch)
E
(mm)/(inch)
Value
2.300/0.091
0.300/0.012
0.600/0.024
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-3×3-16
2.900(0.114)
3.100(0.122)
Pin 1 Mark
Unit: mm(inch)
PIN # 1 IDENTIFICATION
N1
See DETAIL A
0.250(0.010)
0.550(0.022)
0.180(0.007)
2.900(0.114)
3.100(0.122)
0.280(0.011)
0.500(0.020)
BSC
1.400(0.055)
1.860(0.073)
Exposed
Pad
1.400(0.055)
1.860(0.073)
DETAIL A
1
A
A1
2
1
1
2
16
16
16
15
15
15
2
0.000(0.000)
0.050(0.002)
Pin 1 Options
Symbol
A
A1
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Option2
Dec. 2014
0.700 0.900 0.028
0.550 0.650 0.022
0.035 0.178
0.026
.
0.228
0.150 (TYP)
0.007
0.009
0.006 (TYP)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-3×3-16
E
Y1
Y2
Y3
E
Y
X3
X1
X2
X
Dimensions
X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value
3.400/0.134
0.650/0.026
0.300/0.012
1.700/0.067
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-3.5×3.5-14
Pin 1 Mark
Unit: mm(inch)
1.900(0.075)
2.100(0.083)
0.200(0.008)
0.300(0.012)
N14
N1
PIN #1 IDENTIFICATION
See DETAIL A
N13
N2
3.400(0.134)
3.600(0.142)
0.500(0.020)
BSC
1.900(0.075)
2.100(0.083)
N6
N8
3.400(0.134)
3.600(0.142)
0.350(0.014)
0.450(0.018)
1.500(0.059)
BSC
A1
DETAIL A
1
1
1
2
2
2
3
3
3
4
4
4
0.000(0.000)
0.050(0.002)
Pin 1 options
0.750(0.030)
0.900(0.035)
A1
Symbol
min(mm) max(mm) min(inch) max(inch)
Dec. 2014
Option1
0.203(REF)
0.008(REF)
Option2
0.150(REF)
0.006(REF)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-3.5×3.5-14
E2
Y2
X1
E1
Y1
Y
Y3
X2
X3
X
Dimensions
Value
Dec. 2014
X=Y
X1=Y1
X2=Y2
X3=Y3
E1
E2
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.800/0.150
2.100/0.083
0.650/0.026
0.300/0.012
0.500/0.020
1.500/0.059
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSSOP-24 (EDP)
Unit: mm(inch)
New Product Changed to TSSOP-24EP (2013.10)
0.190(0.007)
0.300(0.012)
13
0.650(0.026)
4.300(0.169)
4.500(0.177)
D
6.200(0.244)
6.600(0.260)
24
1
0.080(0.003)
0.200(0.008)
12
E
GAGE PLANE
0.250(0.010)
0°
8°
0.500(0.020)
0.700(0.028)
7.700(0.303)
7.900(0.311)
0.000(0.000)
0.150(0.006)
1.200(0.047)MAX
D
Symbol
SEATING PLANE
1.000(0.039)
E
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
1.500 1.800
0.059
0.071
2.700
Option2
2.700 3.000 0.106
0.118
3.900
.
3.000 0.106
0.118
4.200 0.154
0.165
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSSOP-24 (EDP)
X1
Z
G
Y1
E
X
Dimen-
Z
G
X
E
X1
Y1
sions
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
Option1
7.350/0.289
4.450/0.175
0.450/0.018
0.650/0.026
3.200/0.126
2.000/0.079
Option2
7.350/0.289
4.450/0.175
0.450/0.018
0.650/0.026
4.400/0.173
3.200/0.126
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSOT-23-8
Unit: mm(inch)
2.692(0.106)
3.099(0.122)
0.080(0.003)
0.254(0.010)
0.300(0.012)
1.397(0.055)
1.803(0.071)
2.591(0.102)
3.000(0.118)
0.610(0.024)
Pin 1 Mark
0.220(0.009)
0.380(0.015)
0.700(0.028)
1.000(0.039)
0.000(0.000)
0.100(0.004)
0.585(0.023)
0.715(0.028)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
HTSSOP-14
Unit: mm(inch)
1. 470(0. 058)
1. 570(0. 062)
6. 350(0. 250)
6. 550(0. 258)
F 1. 450(0. 057)
1. 550(0. 061)
6. 200(0. 244)
6. 600(0. 260)
4. 300(0. 169)
4. 500(0. 177)
SEE
DETAIL A
F 0. 750(0. 030)
0. 850(0. 033)
0.200(0.008) or 1.480(0.058)
0.280(0.011) or 1.610(0.063)
0.100(0.004)
0.190(0.007)
0. 650(0. 026)
BSC
1. 300(0. 051)
BSC
1. 200(0. 047)
MAX
0. 340(0. 013)
0. 540(0. 021)
0. 200(0. 008)
MIN
10
14 
R0. 090(0. 004)
MIN
BASE METAL
0.100(0.004)
0.150(0.006)
0.200(0.008) or 1.470(0.058)
0.240(0.009) or 1.570(0.062)
R0. 090(0. 004)
MIN
0. 250(0. 010)
BSC
0.050(0. 002)
0.200(0. 008)
0
8
0. 450(0. 018)
0. 750(0. 030)
0.900(0. 035)
1.050(0. 041)
1. 000(0. 039)
REF
DETAIL A
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
HTSSOP-14
E1
E2
X1
G
Z
Y
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
Value
7.720/0.304
4.160/0.164
0.420/0.017
1.710/0.067
Dimensions
Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value
1.780/0.070
1.300/0.051
0.650/0.026
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SC-82
New Product Changed to SC82 (2013.10)
Unit: mm(inch)
0.250(0.010)
0.400(0.016)
4
12
0.150(0.006)
Typ
1.150(0.045)
1.350(0.053)
4
12 
0.100(0.004)
0.260(0.010)
1.800(0.071)
2.400(0.094)
0
8
0.260(0.010)
0.460(0.018)
0.350(0.014)
0.500(0.020)
1.800(0.071)
2.200(0.087)
1.300(0.051)
Typ
0.700(0.027)
1.000(0.039)
0.800(0.031)
1.100(0.043)
4
12
Dec. 2014
0.000(0.000)
0.100(0.004)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SC-82
E
Z
G
X1
Y
e
X2
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Value
2.740/0.108
1.140/0.045
0.600/0.024
0.500/0.020
Dimensions
Y
(mm)/(inch)
E
(mm)/(inch)
e
(mm)/(inch)
---
Value
0.800/0.031
1.300/0.051
0.050/0.002
---
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3×3-8
Unit: mm(inch)
0.180(0. 007)
0.300(0. 012)
2.900(0. 114)
3.100(0.122)
0.650(0.026)
BSC
N8
N5
0.375(0.015)
0.575(0.023)
2.900(0.114)
1. 400(0.055)
3.100(0. 122)
1.600(0.063)
2.200(0. 087)
2.400( 0. 094)
PIN #1 IDENTIFICATION
See DETAIL A
Pin 1 Mark
N4
N1
DETAIL A
0.153(0.006)
0.253(0.010)
0.000(0. 000)
0.700(0.028)
0.050(0. 002)
2
1
2
1
2
1
0.800(0.031)
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-3×3-8
X1
Y1
Y2
Y
X2
E
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.400/0.134
0.370/0.015
0.750/0.030
2.600/0.102
1.600/0.063
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2×3-8
1.924(0.076)
2.076(0.082)
0.200(0.008)
MIN
Unit: mm(inch)
0.500(0.020)
TYP
0.224(0.009)
0.376(0.015)
1.300(0.051)
1.500(0.059)
2.924(0.115)
3.076(0.121)
1.400(0.055)
1.600(0.063)
N1
Pin 1 Mark
0.550(0.022)
0.650(0.026)
Dec. 2014
0.000(0.000)
0.050(0.002)
0.200(0.008)
0.300(0.012)
0.152(0.006)
REF
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2×3-8
Unit: mm(inch)
X1
Y1
X2
Y
Y2
E
X
Dimensions
X
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
Value
1.800/0.071
3.300/0.130
0.300/0.012
0.600/0.024
Dimensions
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value
1.700/0.067
1.600/0.063
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3.3×1.3-8 (Except ITVS)
3.224(0.127)
3.376(0.133)
N7
Unit: mm(inch)
1.250(0.049)
TYP
N8
0.544(0.021)
0.696(0.027)
0.200(0.008)
MIN
1.224(0.048)
1.376(0.054)
Pin 1 Mark
0.304(0.012)
0.456(0.018)
N6
N1
0.200(0.008)
0.300(0.012)
0.000(0.000)
0.050(0.002)
0.500(0.020)
TYP
0.127(0.005)
REF
0.350(0.014)
0.450(0.018)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3.3×1.3-8 (Only for ITVS)
mm(inch) M I N
Unit:
3.224(0.127)
3.376(0.133)
0.325
N7
N8
0.544(0.021)
1.224(0.048) 0.696(0.027)
1.376(0.054) 0.200(0.008)
MIN
Pin 1
Mark
0.075
1.250(0.049)
TYP
mm(inch) MAX
0.075
0.304(0.012)
0.456(0.018)
N6
0.625
N1
0.200(0.008)
0.300(0.012)
0.500(0.020)
TYP
0.000(0.000)
0.050(0.002)
0.127(0.005)
REF
0.350(0.014)
0.450(0.018)
Note: Pin 1 Dot Ø 0.15mm
Pin 1 Dot area 0.4mm * 0.7mm
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3.3×3.3-8
Unit: mm(inch)
New Product Changed to POWERDI3333-8 (2013.10)
Pin 1 Mark
2.220(0.087)
2.320(0.091)
0.515(0.020)
TYP
N1
N4
0.350(0.014)
0.450(0.018)
0.200(0.008)
MIN
3.250(0.128)
3.350(0.132)
1.560(0.061)
1.660(0.065)
0.200(0.008)
TYP
N8
3.250(0.128)
3.350(0.132)
0.750(0.030)
0.850(0.033)
0.650(0.026)
TYP
0.270(0.011) 0.390(0.015)
0.370(0.015)
TYP
0.203(0.008)
TYP
0.000(0.000)
0.050(0.002)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-3.3×3.3-8
E
X2
Y2
Y3
Y
X1
Y1
E
Dimensions
Value
Dec. 2014
Y
X1=X2
Y1
Y2
Y3
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.700/0.146
0.420/0.017
0.700/0.028
0.600/0.024
2.250/0.089
0.650/0.026
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S
New Product Changed to SIP-3 (2013.10)


44
46
Unit: mm(inch)
0.710(0.028)
0.810(0.032)
1.480(0.058)
1.680(0.066)
4.000(0.157)
4.200(0.165)
3.080(0.121)
3.280(0.129)
0.440(0.017)
TYP
2.200(0.087)
2.400(0.094)
13.500(0.531)
14.500(0.571)
1.270(0.050)
TYP
Dec. 2014
0.380(0.015)
TYP
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO92S (TYPE B) (Only for AH9247)
L
A
c
E
b2
A2
b
e
D
0
L1
Min/Max
0.67/0.83
0.35/0.55
1.85/2.15
Hall Sensor
1
2
Die
1.05/1.35
PART
MARKING
SURFACE
3
Sensor Location
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SC59 (Only for AH9247)
A
B C
G
H
K
M
N
J
D
L
0.80/1.00
PART
MARKING
SURFACE
Hall Sensor
Pin1
0.57/0.77
0.10/0.20
Min/Max
Die
1.35/1.55
Sensor Location
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SC59 (Only for AH9247)
Y
Z
C
X
Dec. 2014
E
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
U-DFN2020-3 (Only for AH9247)
A
A3
A1
Seating Plane
D
D2
R0
L
.20
0
Pin #1 ID
E
E3
E2
D3
b
e
L
Min/Max
PART MARKING
SURFACE
0.57/0.63
Hall Sensor
0.20/0.40
0.75/0.95
1.00/1.20
Die
Top View
Sensor Location
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
U-DFN2020-3 (Only for AH9247)
X3
X1
Y1
0
R0.05
R0
R0
X2
Y2
G
0
. 20
0
.20
R0
5
.22
Y4
Y3
Y
X
C
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S(Only for AH49F)
L
a1
J
a2
B
P
N
D
C
a3
A
E
G H
F
a4
Min/Max
0.71/0.81
0.35/0.55
1.90/2.20
PART
MARKING
SURFACE
Hall Sensor
1
2
Die
1.15/1.45
PART
MARKING
SURFACE
3
Sensor Location
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SC59(Only for AH49F)
A
B C
G
H
K
J
M
N
D
L
0.67/0.97
PART
MARKING
SURFACE
0.475/0.575
0.10/0.20
Min/Max
Die
Hall Sensor
Pin1
1.3/1.6
Sensor Location
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
U-DFN2020-6 (Only for AH49F)
A1
A
A3
Seating Plane
D
D2
Pin #1 ID
E
E2
Z(4x)
L
b
e
Bottom View
Min/Max
0.95/1.15
PART MARKING
SURFACE
0.57/0.63
0.20/0.40
0.86/1.06
Hall Sensor
Die
Pin1
Top View
Sensor Location
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-1.6×1.6-6
Unit: mm(inch)
New Product Changed to U-DFN1616-6 (2013.10)
0.950(0. 037)
1.050(0. 041)
1.550(0. 061)
1.650(0. 065)
0.190(0. 007)
0.290(0. 011)
1.550(0. 061)
1.650(0. 065)
0.550(0. 022)
0.650(0. 026)
PIN # 1 IDENTIFICATION
See DETAIL A
0.500(0. 020)
BSC
Pin 1 Mark
0.180(0. 007)
0.280(0. 011)
DETAIL A
0.700(0. 028)
0.800(0. 031)
0.000(0. 000)
0.050(0. 002)
0.195(0. 008)
0. 211(0. 008)
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-1.6×1.6-6
E
Y2
Y
X2
Y1
X1
Dimensions
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
Value
2.000/0.079
0.300/0.012
0.500/0.020
1.200/0.047
0.800/0.031
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
U-DFN1616-6 (Type G)
Unit: mm(inch)
1.250(0.049)
1.350(0.053)
1.550(0.061)
1.650(0.065)
0.200(0.008)
0.300(0.012)
1.550(0.061)
1.650(0.065)
0.650(0.026)
0.750(0.030)
PIN # 1 IDENTIFICATION
0.200(0.008)
Typ
0.500(0.020)
Typ
Pin 1Mark
0.200(0.008)
Typ
Top View
0.150(0.006)
0.250(0.010)
Bottom View
0.550(0.022)
0.600(0.024)
0.000(0.000)
0.050(0.002)
0.127(0.005)
Typ
Side View
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
U-DFN1616-6 (Type G)
E
X2
Y2
Y
G
Y1
X1
Dimensions
Y
(mm)/(inch)
X1
(mm)/(inch)
E
(mm)/(inch)
G
(mm)/(inch)
Value
1.900/0.075
0.300/0.012
0.500/0.020
0.150/0.006
Dimensions
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
---
Value
0.450/0.018
1.300/0.051
0.700/0.028
---
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-1.8×2-6
1.700(0. 067)
1.900(0. 075)
Unit: mm(inch)
0.500(0. 020)
TYP
N4
N6
0.180(0. 007)
0.280(0. 011)
0.200(0. 008)
MIN
1.900(0. 075)
2.100(0. 083)
0.900(0. 035)
REF
PIN #1 IDENTIFICATION
See DETAIL A
N3
P in 1 Mark
N1
1.400(0. 055)
REF
0.000(0.000)
0.050(0.002)
0.550(0. 022)
0.650(0.026)
0.174(0. 007)
0.326(0. 013)
DETAIL A
0.150(0. 006)
REF
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-1.8×2-6
E
Y2
Y
X2
Y1
X1
Dimensions
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
Value
2.400/0.094
0.300/0.012
0.500/0.020
1.600/0.063
1.000/0.039
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-1.8×2-6A
Unit: mm(inch)
1.700(0.067)
1.900(0.075)
0.500(0.020)
N4
TYP
N6
0.180(0.007)
0.280(0.011)
0.200(0.008)
MIN
1.900(0.075)
2.100(0.083)
0.900(0.035)
REF
PIN #1 IDENTIFICATION
See DETAIL A
Pin 1 Mark
0.000(0.000)
0.050(0.002)
0.450(0.018)
0.550(0.022)
0.174(0.007)
0.326(0.013)
N1
N3
1.400(0.055)
REF
DETAIL A
0.150(0.006)
REF
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-1.8×2-6A
E
Y2
Y
X2
Y1
X1
Dimensions
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
Value
2.400/0.094
0.300/0.012
0.500/0.020
1.600/0.063
1.000/0.039
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2×2-6
1.900(0.075)
2.100(0. 083)
Unit: mm(inch)
0.650(0.026)
TYP
N4
N6
0.180(0. 007)
0.350(0. 014)
0.250(0.010)
0.450(0.018)
1.900(0. 075)
2.100(0. 083)
E
PIN #1 IDENTIFICATION
See DETAIL A
N3
N1
Pin 1 Mark
D
0.000(0.000)
0.050(0.002)
DETAIL A
A3
A
2
2
1
1
2
1
Pin 1 Options
D
E
Symbol
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Option2
0.047 (TYP)
1.200 (TYP)
1.550
1.750
0.061
0.069
0.700 (TYP)
.
0.860
1.060
0.042
A3
A
Symbol
0.028 (TYP)
0.034
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Option2
Dec. 2014
0.700
.
0.570
0.800
0.028
0.031
0.203 (TYP)
0.008 (TYP)
0.630
0.022
0.025
0.150 (TYP)
0.006 (TYP)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2×2-6
X
X1
Y2
Y
Y1
X2
E
X
Y
X1
Y1
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
1.700/0.067
2.400/0.094
1.650/0.065
1.010/0.040
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
0.350/0.014
0.525/0.021
0.650/0.026
Dimensions
Value
Dimensions
Value
Dec. 2014
–
–
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
(140331 confirmed by AE Zhang Tao)
DFN-2×2-6 (Only for AH49F)
1.900(0.075)
2.100(0. 083)
Unit: mm(inch)
0.650(0.026)
TYP
N4
Package Sensor
Location
N6
0.900(0. 035)
1.100(0. 043)
0.180(0. 007)
0.350(0. 014)
0.250(0.010)
0.450(0.018)
1.900(0. 075)
2.100(0. 083)
E
PIN #1 IDENTIFICATION
See DETAIL A
N3
0.900(0. 035)
1.100(0. 043)
Pin 1 Mark
N1
D
0.000(0.000)
0.050(0.002)
DETAIL A
A3
A
Die
0.220(0.009)
0.320(0.013)
2
2
1
1
2
1
Pin 1 Options
D
E
Symbol
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Option2
0.047 (TYP)
1.200 (TYP)
1.550
1.750
0.061
0.069
0.700 (TYP)
.
0.860
1.060
0.034
0.042
A3
A
Symbol
0.028 (TYP)
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Option2
Dec. 2014
0.700
.
0.570
0.800
0.028
0.031
0.203 (TYP)
0.008 (TYP)
0.630
0.022
0.025
0.150 (TYP)
0.006 (TYP)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2×2-8
Unit: mm(inch)
New Product Changed to W-DFN2020-8 (2013.10)
0.550(0. 022)
1.950(0. 077)
0.650(0. 026)
2.050(0. 081)
N5
N8
1.150(0. 045)
1.250(0. 049)
1.950(0. 077)
2.050(0. 081)
PIN #1 IDENTIFICATION
Pin 1 Mark
See DETAIL A
N4
0.200(0. 008)
N1
0.300(0. 012)
0.500(0. 020)
0.400(0. 016)
BSC
0.300(0. 012)
DETAIL A
0.178(0. 007)
0.228(0. 009)
0.000(0. 000)
0.700(0. 028)
0.800(0. 031)
0.050(0. 002)
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2×2-8
X1
Y1
Y2
X2
Y
E
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.400/0.094
0.300/0.012
0.600/0.024
1.300/0.051
0.700/0.028
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2.2×2.2-8
2.100(0. 083)
2.300(0. 091)
Unit: mm(inch)
0.300(0. 012)
0.400(0. 016)
0.200(0. 008)
0.300(0. 012)
2.100(0.083)
2.300(0.091)
N5
0.200(0. 008)
MIN.
N8
1.050(0. 041)
1.150(0. 045)
1.550(0. 061)
1.650(0. 065)
PIN #1 IDENTIFICATION
Pin 1 Mark
See DETAIL A
N4
N1
0.550(0. 022)
BSC
DETAIL A
0.000(0. 000)
0.050(0. 002)
0.700(0. 028)
0.800(0. 031)
2
1
2
1
2
1
Pin 1 options
0.200(0. 008)
REF
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2.2×2.2-8
E
Y
Y1
X1
Y2
X2
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.600/0.102
1.900/0.075
1.100/0.043
0.300/0.012
0.600/0.024
0.550/0.022
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2.5×1.0-10(Except ITVS)
Unit: mm(inch)
New Product Changed to U-DFN2510-10 (2013.10)
Option 1
2.450(0.096)
2.575 (0.101)
Pin 1 Mark
N6
0.950(0.037)
1.075(0.042)
0.500(0.020)TYP
N10
0.325(0.013)
0.450(0.018)
0.350(0.014)
0.450(0.018)
PIN #1
IDENTIFICATION
N5
N1
0.350 (0.014)
0.450 (0.018)
0.150(0.006)
0.250(0.010)
Option 2
Option 3
0.152(0.006)
REF
0.545(0.021)
0.650(0.026)
Dec. 2014
0.000(0.000)
0.050(0.002)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2.5×1.0-10 (Only for ITVS)
mm(inch) M I N
Unit:
0.500(0.020)TYP
2.450(0.096)
2.550 (0.100)
N6
0.325
0.950(0.037)
1.050(0.041)
Pin 1 Mark
0.075
mm(inch) MAX
N10
0.350(0.014)
0.450(0.018)
0.350(0.014)
0.450(0.018)
PIN #1
IDENTIFICATION
N5
N1
0.075
0.350 (0.014)
0.450 (0.018)
0.625
0.150(0.006)
0.250(0.010)
0.152(0.006)
REF
0.550(0.022)
0.650(0.026)
0.000(0.000)
0.050(0.002)
Note: Pin 1 Dot Ø 0.15mm
Pin 1 Dot area 0.4mm * 0.7mm
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2.5×1.0-10
E
E
X1
Y
G Z
X2
Dimensions
Value
Dec. 2014
Z
G
X1
X2
Y
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
1.350/0.053
0.150/0.006
0.250/0.010
0.450/0.018
0.600/0.024
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2.5×1.0-10(1)
Unit: mm(inch)
0.500(0.020)TYP
2.450(0.096)
2.550(0.100)
N6
0.950(0.037)
1.050(0.041)
N10
0.350(0.014)
0.450(0.018)
0.350(0.014)
0.450(0.018)
PIN#1 IDENTIFICATION
Pin 1 Mark
N5
0.350(0.014)
0.450(0.018)
N1
0.150(0.006)
0.250(0.010)
0.152(0.006)REF
0.450(0.018)
0.550(0.022)
Dec. 2014
0.000(0.000)
0.050(0.002)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-4×4-24
Unit: mm(inch)
0.200(0.008)
0.500(0.020)
MIN
BSC
3.900(0. 154)
4.100(0.161)
N24
N19
PIN # 1 IDENTIFICATION
See DETAIL A
N1
Pin 1 Mark
3.900(0. 154)
4.100(0. 161)
D
N13
N7
0.300(0.012)
0.500(0.020)
0.180(0. 007)
E
0.300(0. 012)
0.000(0.000)
0.050(0.002)
DETAIL A
A3
A
22
23
24
22
23
24
22
23
24
1
1
1
2
2
2
3
3
3
Pin 1 Options
D=E
Symbol
A3
A
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
2.600
2.800 0.102
0.110
0.700
0.850 0.028
0.033
0.153
0.253 0.006
0.010
Option2
2.350
2.550 0.093
0.100
0.700
0.850 0.028
0.033
0.153
0.253 0.006
0.010
Option3
2.600
2.800 0.102
0.110
0.550
0.650 0.022
0.026
0.125
0.175 0.005
0.007
Dec. 2014
.
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-4×4-24
E
Y1
E
Y
Y3
Y2
X3
X2
X1
X
Dimensions
X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value
4.400/0.173
0.300/0.012
0.650/0.026
2.800/0.110
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-4×4-24 (Type B)
Unit: mm(inch)
0.500(0.020)
3.950(0. 156)
4.050(0.159)
0.630(0.025)
TYP
TYP
N24 PIN # 1 IDENTIFICATION
N19
N1
Pin 1 Mark
3.950(0. 156)
4.050(0. 159)
2.650(0.104)
2.750(0.108)
N13
0.350(0.014)
0.450(0.018)
N7
0.190(0. 007)
0.290(0. 011)
2.650(0.104)
2.750(0.108)
0.000(0.000)
0.050(0.002)
0.550(0.022)
0.650(0.026)
Dec. 2014
0.150(0.006)
TYP
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-4×4-24 (Type B)
X
E
Y2
E
Y1
Y
Y3
X2
X1
X=Y1
Y
X1
Y2
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.840/0.112
4.300/0.169
0.340/0.013
0.600/0.024
–
–
–
–
Dimensions
Value
X2=Y3
E
(mm)/(inch)
(mm)/(inch)
2.800/0.110
0.500/0.020
Dimensions
Value
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-6×6-48
Unit: mm(inch)
0.300(0. 012)
0.500(0. 020)
5.900(0. 232)
6.100(0. 240)
J
N25
N37
5.900(0.232)
6.100(0.240)
K
Pin 1 Mark
N13
N48
N1
PIN # 1 IDENTIFICATION
0.400(0. 016)
BSC
See DETAIL A
DETAIL A
A
0.000(0. 000)
0.050(0. 002)
0.200(0. 008)
REF
0.150(0. 006)
0.250(0. 010)
3
2
46
46
46
47
47
47
48
48
48
1
3
2
1
3
2
1
Pin 1 Options
J=K
A
Symbol
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Option2
Dec. 2014
4.400
4.150
4.600
4.450
0.173
0.163
0.181
0.175
0.700
.
0.800
0.800
0.028
0.031
0.900
0.031
0.035
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-6×6-48
E
Y1
E
Y3
Y2
Y
X3
X2
X1
X
Dimensions
X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value
6.300/0.248
0.250/0.010
0.600/0.024
4.600/0.181
0.400/0.016
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-7×7-56
6.900(0.272)
7.100(0.280)
Unit: mm(inch)
0.300(0.012)
0.500(0.020)
N43
5.100(0.201)
5.300(0.209)
PIN # 1 IDENTIFICATION
See DETAIL A
N56
N1
Pin 1 Mark
6.900(0.272)
7.100(0.280)
5.100(0.201)
5.300(0.209)
0.400(0.016)
BSC
N29
N15
0.150(0.006)
0.250(0.010)
0.400(0.016)
BSC
0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
56
55
54
53
56
55
54
53
56
55
54
0.700(0.028)
0.800(0.031)
53
DETAIL A
1
1
1
2
2
2
3
3
3
4
4
4
Pin 1 Options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-7×7-56
X
X2
E
Y3
X3
Y2
X1
Y1
Y
E
Dimensions
X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value
7.400/0.291
5.400/0.213
0.250/0.010
0.700/0.028
0.400/0.016
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-8×8-68
7.900(0.311)
8.100(0.319)
Unit: mm(inch)
PIN # 1 IDENTIFICATION
N52
0.300(0.012)
0.500(0.020)
See DETAIL A
N68
N1
Pin 1 Mark
7.900(0.311)
8.100(0.319)
E
D
N35
N18
0.400(0.016)
BSC
0.150(0.006)
0.250(0.010)
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
68
67
66
65
68
67
66
65
68
67
66
65
DETAIL A
1
1
1
2
2
2
3
3
3
4
4
4
Pin 1 Options
D
E
Symbol
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1
Dec. 2014
4.300
4.500
0.169
0.177
4.300
.
Option2
5.400
5.600
0.213
0.220
5.400
Option3
6.100
6.300
0.240
0.248
6.100
.
4.500
0.169
0.177
5.600
0.213
0.220
6.300
0.240
0.248
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-8×8-68
X
Y2
Y
Y1
E
X1
X2
E
Y3
X3
Dimensions
X=Y
mm(inch)
X1=Y1
mm(inch)
X2=Y2
mm(inch)
E
mm(inch)
X3=Y3
mm(inch)
Option1
8.400(0.331)
4.700(0.185)
0.250(0.010)
0.400(0.016)
0.700(0.028)
Option2
8.400(0.331)
5.800(0.228)
0.250(0.010)
0.400(0.016)
0.700(0.028)
Option3
8.400(0.331)
6.500(0.256)
0.250(0.010)
0.400(0.016)
0.700(0.028)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SSOP-16
Unit: mm(inch)
3.800(0.150)
4.000(0.157)
7
0.200(0.008)
0.300(0.012)
7
0.635(0.025)
BSC
4.700(0.185)
F 0.800(0.031)
5.100(0.201)
0.100(0.004)
1.000(0.039)
0.900(0.035)
0.250(0.010)
1.350(0.053)
1.750(0.069)
0.400(0.016)
1.270(0.050)
5.800(0.228)
6.200(0.244)
SEE
DETAIL A
1.350(0.053)
1.550(0.061)
8
0.150(0.006)
0
R0.150(0.006)
0.250(0.010)
8
0.250(0.010)
R0.150(0.006)
8
0.650(0.026)
0.750(0.030)
0.200(0.008)
0.250(0.010)
0.020(0.001)
0.050(0.002)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
DETAIL A
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SSOP-16
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
7.400/0.291
3.400/0.134
0.400/0.016
2.000/0.079
0.635/0.025
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SSOP-10
Unit: mm(inch)
1.350(0.053)
1.550(0.061)
3.800(0.150)
4.000(0.157)
0.300(0.012)
0.450(0.018)
4.700(0.185)
5.100(0.201)
0.100(0.004)
0.250(0.010)
5.800(0.228)
6.200(0.244)
0.400(0.016)
1.270(0.050)
1.000(0.039)
BSC
1.350(0.053)
1.750(0.069)
0
8
0.170(0.007)
0.250(0.010)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SSOP-10
G
Z
Y
X
E
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
7.400/0.291
3.400/0.134
0.600/0.024
2.000/0.079
1.000/0.039
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-5×5-28
Unit: mm(inch)
0.500(0.020)
BSC
PIN # 1 IDENTIFICATION
N28
3.050(0.120)
4.900(0. 193)
3.250(0. 128)
N22
5.100(0. 201)
See DETAIL A
N1
Pin 1 Mark
4.900(0.193)
5.100(0.201)
N15
N8
3.050(0.120)
0.450(0. 018)
0.000(0. 000)
0.200(0. 008)
0.300(0. 012)
3.250(0. 128)
0.650(0.026)
0.050(0.002)
DETAIL A
26
0.800(0. 031)
0.178(0. 007)
0.900(0. 035)
0.228(0.009)
27
26
28
27
26
28
27
28
1
1
2
2
1
2
3
3
3
Pin 1 Options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-5×5-28
E
Y1
Y2
E
Y
Y3
X3
X2
X1
X
Dimensions
X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value
5.200/0.205
0.300/0.012
0.700/0.028
3.300/0.130
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-5×5-40
Unit: mm(inch)
4.900(0.193)
5.100(0.201)
J
N21
0.325(0.013)
0.475(0.019)
N31
4.900(0.193)
5.100(0.201)
K
Pin 1 Mark
N40
N11
N1
0.4000(0.016)
PIN # 1 IDENTIFICATION
BSC
See DETAIL A
DETAIL A
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
0.150(0.006)
0.250(0.010)
3
2
1
38
38
38
39
39
39
40
40
40
3
2
1
3
2
1
J=K
Symbol
Pin 1 Options
min(mm) max(mm) min(inch) max(inch)
Option1
Dec. 2014
3.200
.
3.400
0.126
0.134
Option2
3.300
3.500
0.130
0.138
Option3
3.600
3.800
0.142
0.150
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-5×5-40
E
Y1
X2
E
Y3
Y
Y2
X3
X1
X
Dimensions
X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Option1
5.400/0.213
0.250/0.010
0.650/0.026
3.500/0.138
0.400/0.016
Option2
5.400/0.213
0.250/0.010
0.650/0.026
3.600/0.142
0.400/0.016
Option3
5.400/0.213
0.250/0.010
0.650/0.026
3.800/0.150
0.400/0.016
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-95 (Only for AH487)
Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
1.700(0.067)
2.000(0.079)
0.850(0.033)
1.150(0.045)
3.531(0.139)
3.785(0.149)
Package Sensor Location
(For Hall IC)
1.220(0.048)
1.620(0.064)
0.381(0.015)
0.581(0.023)
14.000(0.551)
16.000(0.630)
0.360(0.014)
0.510(0.020)
0.950(0.037)
REF
0.330(0.013)
0.432(0.017)
5.105(0.201)
5.359(0.211)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-95
New Product Changed to TO95 (2013.10)
Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
3.531(0.139)
3.785(0.149)
1.220(0.048)
1.620(0.064)
0.381(0.015)
0.581(0.023)
14.000(0.551)
16.000(0.630)
0.360(0.014)
0.510(0.020)
0.950(0.037)
REF
0.330(0.013)
0.432(0.017)
5.105(0.201)
5.359(0.211)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-95(for AH9281/9282 only)
Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
2.250(0.089)
2.450(0.096)
1.150(0.045)
1.350(0.053)
3.531(0.139)
3.785(0.149)
Package Sensor Location
(For Hall IC)
1.220(0.048)
1.620(0.064)
0.381(0.015)
0.581(0.023)
14.000(0.551)
16.000(0.630)
0.360(0.014)
0.510(0.020)
0.950(0.037)
REF
0.330(0.013)
0.432(0.017)
5.105(0.201)
5.359(0.211)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-95(for AH9480/9481only)
Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
2.200(0.087)
2.400(0.094)
1.000(0.039)
1.200(0.047)
3.531(0.139)
3.785(0.149)
Package Sensor Location
(For Hall IC)
1.220(0.048)
1.620(0.064)
0.381(0.015)
0.581(0.023)
14.000(0.551)
16.000(0.630)
0.360(0.014)
0.510(0.020)
0.950(0.037)
REF
0.330(0.013)
0.432(0.017)
5.105(0.201)
5.359(0.211)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TSOT-23-5
New Product Changed to TSOT25 (2013.10)
2.800(0.110)
3.000(0.118)
5
Unit: mm(inch)
0°
8°
R0.100(0.004)
MIN
4
0.600(0.024)
REF
2.600(0.102)
3.000(0.118)
1.500(0.059)
1.700(0.067)
0.300(0.012)
0.500(0.020)
2
1
3
0.950(0.037)
TYP
0.100(0.004)
0.250(0.010)
0.300(0.012)
0.510(0.020)
GAUGE PLANE
0.250(0.010)
TYP
1.900(0.075)
TYP
5°
A1
A
4X7
°
A2
A
Symbol
A1
A2
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option1 0.700 0.900 0.028 0.035 0.700 0.800 0.028 0.031
Option2
Dec. 2014
-
1.000
-
.
0.039 0.840 0.900 0.033 0.035
0.000 0.100
0.000 0.004
0.010 0.100
0.000 0.004
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
TSOT-23-5
E
E
Z
Y
X
Dimensions
Value
Dec. 2014
E
(mm)/(inch)
0.950/0.037
X
(mm)/(inch)
0.700/0.028
Y
(mm)/(inch)
1.000/0.039
Z
(mm)/(inch)
3.199/0.126
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
CSP-9 (For web)
Unit: mm(inch)
1.000(0.039)
TYP
X
0.500(0.020)
TYP
Y
3
2
1
C
Pin 1 Mark
B
0.500(0.020)
TYP
A
F 0.320(0.013)
TYP
1.000(0.039)
TYP
0.600(0.024)
0.700(0.028)
0.215(0.008)
0.255(0.010)
Note: X & Y: To determine the exact package size of a particular device, refer to the device
datasheet.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
CSP-9
Unit: mm(inch)
1.000(0.039)
TYP
1.500(0.059)
0.500(0.020)
TYP
TYP
3
2
1
C
1.500(0.059)
Pin 1 Mark
TYP
B
0.500(0.020)
TYP
A
F 0.320(0.013)
TYP
1.000(0.039)
TYP
0.600(0.024)
0.700(0.028)
0.215(0.008)
0.255(0.010)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S-3
44
46
Unit: mm(inch)
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
3.850(0.152)
4.150(0.163)
2.900(0.114)
3.310(0.130)
0.380(0.015)
0.550(0.022)
1.600(0.063)
TYP
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.480(0.019)
1.270(0.050)
TYP
Dec. 2014
0.360(0.014)
0.510(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S-3 (Only for AH920/AH922/AH922B/AH922C)
44
46
Unit: mm(inch)
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
3.850(0.152)
4.150(0.163)
1.200(0.047)
1.500(0.059)
1.850(0.073)
2.150(0.085)
2.900(0.114)
3.310(0.130)
Package Sensor Location
0.380(0.015)
0.550(0.022)
1.600(0.063)
TYP
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.480(0.019)
1.270(0.050)
TYP
Dec. 2014
0.360(0.014)
0.510(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S-3(Only for AH41/AH921/AH921A/AH49F/AH49H) Unit: mm(inch)
44
46
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
3.850(0.152)
4.150(0.163)
1.200(0.047)
1.500(0.059)
1.850(0.073)
2.150(0.085)
2.900(0.114)
3.310(0.130)
Package Sensor Location
0.380(0.015)
0.550(0.022)
1.600(0.063)
TYP
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.480(0.019)
1.270(0.050)
TYP
Dec. 2014
0.360(0.014)
0.510(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S-3(Only for AH9248 and AH9249)
44
46
Unit: mm(inch)
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
3.850(0.152)
4.150(0.163)
1.050(0.041)
1.350(0.053)
1.850(0.073)
2.150(0.085)
Package Sensor Location
0.380(0.015)
0.550(0.022)
2.900(0.114)
3.310(0.130)
1.600(0.063)
TYP
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.480(0.019)
1.270(0.050)
TYP
Dec. 2014
0.360(0.014)
0.510(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-92S-3(Only for AH9247)
44
46
Unit: mm(inch)
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
3.850(0.152)
4.150(0.163)
Package Sensor Location
0.380(0.015)
0.550(0.022)
1.850(0.073)
2.150(0.085)
1.050(0.041)
1.350(0.053)
2.900(0.114)
3.310(0.130)
1.600(0.063)
TYP
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.480(0.019)
1.270(0.050)
TYP
Dec. 2014
0.360(0.014)
0.510(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-27
25.400(1.000) MIN
Unit: mm(inch)
1.200(0.047)
1.300(0.051)
DIA.
Cathode line
by marking
8.500(0.335)
9.500(0.374)
5.000(0.197)
5.600(0.220)
DIA.
25.400(1.000) MIN
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-27 (A)
Cathode line
by marking
8. 500(0. 335)
9. 500(0. 374)
Unit: mm(inch)
5. 000(0. 197)
5. 600(0. 220)
DIA.
15. 100(0. 594)
16. 100(0. 634)
1. 800(0. 071)
MIN.
3. 500(0. 138)
4. 500(0. 177)
19. 500(0. 768)
20. 500(0. 807)
1. 200(0. 047)
1. 300(0. 051)
1. 500(0. 059)
MAX.
DIA.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-27 (B)
Cathode line
by marking
Unit: mm(inch)
8.500(0.335)
9.500(0.374)
5.000(0.197)
5.600(0.220)
DIA.
13.500(0.531)
14.500(0.571)
3.500(0.138)
4.500(0.177)
Dec. 2014
1.700(0.067)
MIN
1.200(0.047)
1.300(0.051)
19.500(0.768)
20.500(0.807)
DIA.
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-27 (C)
8. 500(0. 335)
9. 500(0. 374)
Cathode line
by marking
6.000(0.236)
7.000(0.276)
5. 000(0. 197)
5. 600(0. 220)
DIA.
90°± 2°
19. 500(0. 768)
20. 500(0. 807)
Dec. 2014
Unit: mm(inch)
1. 200(0. 047)
1. 300(0. 051)
1.200(0.047)
MAX
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-214AA
New Product Changed to SMB (2013.10)
Cathode line
by marking
Unit: mm(inch)
4.250(0.167)
4.750(0.187)
3.480(0.137)
3.730(0.147)
1.930(0.076)
2.080(0.082)
1.990(0.078)
2.610(0.103)
0.150(0.006)
0.310(0.012)
0.900(0.035)
1.410(0.056)
0.000(0.000)
0.200(0.008)
5.260(0.207)
5.460(0.215)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DO-214AA
G
Y
X1
X
Y
X1
G
X
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.720/0.107
2.072/0.082
1.760/0.069
5.904/0.232
Dimensions
Value
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-214AB
New Product Changed to SMC (2013.10)
Cathode line
by marking
Unit: mm(inch)
6.600(0.260)
7.110(0.280)
5.590(0.220)
6.220(0.245)
2.900(0.114)
3.200(0.126)
2.006(0.079)
2.620(0.103)
0.203(0.008)
MAX
0.760(0.030)
1.520(0.060)
7.750(0.305)
8.130(0.320)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-214AC
New Product Changed to SMA (2013.10)
3. 990(0.157)
4.750(0.187)
2.400(0.094)
2.830(0.111)
1.250(0.049)
1.650(0.065)
Cathode line by
marking
Unit: mm(inch)
0.150(0.006)
0.310(0.012)
1. 900(0. 075)
2. 290(0. 090)
0.080(0.003)
0. 310(0. 012)
0. 760(0. 030)
1. 520(0. 060)
4. 800(0. 189)
5. 280(0. 208)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DO-214AC
G
Y
X1
X
Y
X1
G
X
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.100/0.083
2.000/0.079
1.600/0.063
5.600/0.220
Dimensions
Value
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOD-123
New Product Changed to SOD123 (2013.10)
Cathode line
by marking
2.600(0.102)
3.100(0.122)
1.630(0.064)
2.000(0.079)
Unit: mm(inch)
0.000(0.000)
0.100(0.004)
0.850(0.033)
1.250(0.049)
3.500(0.138)
3.900(0.154)
0.900(0.035)
1.080(0.043)
0.100(0.004)
0.250(0.010)
Option 2
Option 1
0.200(0.008)
TYP
0.950(0.037)
1.250(0.049)
1.100(0.043)
TYP
0.430(0.017)
0.830(0.033)
Dec. 2014
0.400(0.016)
0.500(0.020)
1.350(0.053)
TYP
0.400(0.016)
0.500(0.020)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOD-123
Option 1
X1
X2
G
Y2
Y1
Option 2
X1
G
X2
Y2
Y1
Dimensions
G
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Y1
(mm)/(inch)
Y2
(mm)/(inch)
Option1
2.100/0.083
1.000/0.039
1.000/0.039
1.400/0.055
1.400/0.055
Option2
1.000/0.039
2.200/0.087
0.900/0.035
1.400/0.055
1.400/0.055
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
R-1
20. 000(0. 787)
MIN.
Cathode line
by marking
Unit: mm(inch)
0. 500(0. 020)
0. 640(0. 025)
DIA.
2. 900(0. 114)
DIA.
3. 500(0. 138)
2. 200(0. 087)
2. 600(0. 102)
DIA.
20. 000(0. 787)
MIN.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-24
New Product Changed to SO-24 (2013.10)
2.350(0.093)
2.800(0.110)
2.100(0.083)
2.650(0.104)
0.204(0.008)
0.330(0.013)
1.270(0.050)
BSC
15.200(0.598)
15.600(0.614)
0.330(0.013)
0.510(0.020)
Unit: mm(inch)
0.050(0.002)
0.300(0.012)
9.800(0.386)
10.610(0.418)
7.400(0.291)
7.600(0.299)
0°
8°
0.400(0.016)
1.270(0.050)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-24
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
11.400/0.449
7.400/0.291
0.600/0.024
2.000/0.079
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3X3-10
Unit: mm(inch)
1.500(0. 059)
0.250(0.010)
1.800(0. 071)
0.550(0. 022)
0.500(0.020)
2.900(0. 114)
TYP
3.100(0.122)
N6
N10
2.300(0. 090)
2.500(0.098)
2.900(0.114)
PIN #1 IDENTIFICATION
See DETAIL A
3.100(0. 122)
Pin 1 Mark
N5
N1
0.200(0.008)
0.300(0. 012)
0.000(0. 000)
DETAIL A
0.050(0.002)
A3
A
2
1
2
1
2
1
Pin 1 options
A
Symbol
A3
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Dec. 2014
Option 1 0.700
0.800
0.028
0.031
Option 2 0.570
0.630
0.022
0.025
0.153
0.253
0.150 (Typ)
0.006
0.010
0.006 (Typ)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-3X3-10
X1
Y1
X2
Y
Y2
E
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.300/0.130
0.300/0.012
0.600/0.024
2.600/0.102
1.800/0.071
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
WDFN-3X3-10
Unit: mm(inch)
2.900(0.114)
3.100(0.122)
N6
2.000(0.079)
REF
N10
2.250(0.089)
2.500(0.098)
1.550(0.061)
1.800(0.071)
2.900(0.114)
3.100(0.122)
Pin 1 Mark
See DETAIL A
0.300(0.012)
N5
Pin 1 Mark
0.500(0.020)
N1
0.500(0.020)
BSC
0.180(0.007)
0.300(0.012)
DETAIL A
0.700(0.028)
0.800(0.031)
0.153(0.006)
0.253(0.010)
0.000(0.000)
0.050(0.002)
2
1
2
1
Pin 1 Mark options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
WDFN-3×3-10
E
Y2
Y
X2
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.400/0.134
0.300/0.012
0.650/0.026
2.500/0.098
1.800/0.071
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3X3-6
Unit: mm(inch)
2.250(0. 089)
2.350(0. 093)
1.900(0.075)
REF
N4
N6
2.950(0. 116)
3.050(0. 120)
2.950(0. 116)
3.050(0. 120)
1.550(0.061)
1.650(0.065)
PIN #1 IDENTIFICATION
Pin 1 Mark
See DETAIL A
0.250(0. 010)
0.350(0. 014)
0.350(0. 014)
0.450(0. 018)
0.700(0. 028)
0.800(0. 031)
0.195(0.008)
0.211(0.008)
0.350(0.014)
0.450(0.018)
N3
N1
0.950(0.037)
BSC
DETAIL A
0.000(0. 000)
0.050(0. 002)
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-3×3-6
E
Y2
X2
Y
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.400/0.134
0.550/0.022
0.650/0.026
2.500/0.098
1.700/0.067
0.950/0.037
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-3X3-12
Unit: mm(inch)
0.450(0. 018) TYP
2.900(0.114)
3.100(0.122)
N7
N12
0. 324(0. 013)
0. 476(0. 019)
0.200(0. 008) MIN
1.500(0. 059)
1.700(0. 067)
2.900(0.114)
3.100(0.122)
2.450(0. 096)
2.650(0. 104)
Pin 1 Mark
PIN #1 IDENTIFICATION
See DETAIL A
N6
N1
0.150(0. 006)
0.250(0. 010)
0.000(0. 000)
0.050(0. 002)
DETAIL A
0.203(0. 008) REF
0.700(0. 028)
0.800(0. 031)
3
2
1
3
2
1
3
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-3X3-12
E
Y2 Y
X2
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.400/0.134
0.250/0.010
0.650/0.026
2.800/0.110
1.700/0.067
0.450/0.018
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
WDFN-3X3-12
Unit: mm(inch)
TOP VIEW
BOTTOM VIEW
2.900(0.114)
3.100(0.122)
2.250(0.089)REF
N7
2.900(0.114)
3.100(0.122)
N12
1.350(0.053)
1.800(0.071)
2.250(0.089)
2.500(0.098)
Pin 1 Mark
PIN #1
IDENTIFICATION
0.350(0.014)
0.470(0.019)
N6
N1
0.150(0.006)
0.280(0.011)
Recommend Footprint
0.450(0.018)BSC
0.800(0.031)
2.400(0.094)
SIDE VIEW
1.500(0.059)
2.200(0.087)
0.203(0.008)REF
0.700(0.028)
0.800(0.031)
0.250(0.010)
Dec. 2014
0.000(0.000)
0.050(0.002)
0.450(0.018)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
WDFN-3×3-12
E
Y
Y2
X2
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.400/0.134
0.280/0.011
0.650/0.026
2.500/0.098
1.800/0.071
0.450/0.018
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
WDFN-2X2-6
Unit: mm(inch)
BOTTOM VIEW
TOP VIEW
1. 950(0. 077)
2. 050(0. 081)
1. 300(0. 051) REF
N4
N6
1. 350(0. 053)
1. 450(0. 057)
1. 950(0. 077)
2. 050(0. 081)
0. 550(0. 022)
0. 650(0. 026)
PIN #1
IDENTIFICATION
Pin 1 Mark
0. 250(0. 010)
0. 350(0. 014)
N3
N1
0. 250(0. 010)
0. 350(0. 014)
0. 650(0. 026) BSC
SIDE VIEW
0. 203(0. 008) REF
0. 700(0. 028)
0. 800(0. 031)
Dec. 2014
0. 000(0. 000)
0. 050(0. 002)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
WDFN-2×2-6
E
Y2
Y
X2
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.400/0.094
0.400/0.016
0.600/0.024
1.500/0.059
0.700/0.028
0.650/0.026
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-4.5X3.5-20
Pin 1 Mark
Unit: mm(inch)
1.500(0.059)
0.300(0.012)
BSC
0.500(0.020)
N20
N1
N19
4.500(0.177)
BSC
PIN # 1 IDENTIFICATION
See DETAIL A
N2
2.950(0.116)
3.100(0.122)
N12
N9
N11
3.500(0.138)
BSC
N10
1.950(0.077)
2.100(0.083)
0.700(0.027)
0.800(0.031)
DETAIL A
0.180(0.007)
0.300(0.012)
0.500(0.020)
BSC
1
1
1
2
2
2
3
3
3
4
4
4
Pin 1 Options
0.200(0.008)
REF
0.000(0.000)
0.050(0.002)
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-4.5X3.5-20
E1
Y1
Y2
E2
Y
Y3
X3
X2
X1
X
Dec. 2014
Dimensions
X
(mm)/(inch)
Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
Value
3.900/0.154
4.900/0.193
0.300/0.012
0.650/0.026
Dimensions
X3
(mm)/(inch)
Y3
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value
2.100/0.083
3.100/0.122
1.500/0.059
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
QFN-4X4-16
P in 1 Mark
Unit: mm(inch)
1. 950(0.077)
3.850(0.152)
4.150(0.163)
REF
N13
0.300(0.012)
0.500(0. 020)
PIN # 1 IDENTIFICATION
N16
See DETAIL A
N1
0.650(0. 026)
BSC
3.850(0. 152)
4.150(0.163)
2.250(0. 089)
2.650(0. 104)
0. 250(0.010)
0. 350(0.014)
N9
N5
2.250(0. 089)
2.650(0. 104)
DETAIL A
0.700(0. 028)
0.800(0. 031)
0.153(0. 006)
0.253(0. 010)
0.000(0. 000)
0.050(0. 002)
15
16
15
16
15
16
1
1
1
2
2
2
Pin 1 Options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
QFN-4X4-16
E
X2
Y1
Y3
Y
X3
E
Y2
X1
X
Dec. 2014
Dimensions
X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2=E
(mm)/(inch)
X3=Y3
(mm)/(inch)
Value
4.400/0.173
0.400/0.016
0.650/0.026
2.700/0.106
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
HMSOP-10
Unit: mm(inch)
New Product Changed to MSOP-10EP (2013.10)
0.400(0.016)
4.700(0.185)
5.100(0.201)
2.900(0.114)
3.100(0.122)
0.750(0.030)
2.500(0.100)
0.750(0.030)
2.500(0.100)
0.800(0.031)
2.900(0.114)
3.100(0.122)
0°
6°
0.170(0.007)
0.270(0.011)
0.500(0.020)
BSC
0.950(0.037)
REF
0.130(0.005)
0.200(0.008)
0.170(0.007)
0.230(0.009)
BASE METAL
0.000(0.000)
0.150(0.006)
1.100(0.043)
MAX.
0.080(0.003)
0.180(0.007)
0.170(0.007)
0.270(0.011)
PLATING
Note: 1. Eject hole, oriented hole and mold mark is optional.
2. The figure of exposed pad is not restrained as regular rectangle.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
HMSOP-10
X1
Y1 G
Z
1
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
X1=Y1
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
5.800/0.228
3.000/0.118
0.300/0.012
2.600/0.102
1.400/0.055
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2X2-3
Unit: mm(inch)
1.220(0.048)
1.420(0.056)
1.900(0.075)
2.100(0.083)
0.300(0.012)
0.500(0.020)
N3
1.900(0.075)
2.100(0.083)
0.780(0.031)
0.980(0.039)
Pin 1 Mark
N2
0.650(0.026)
TYP
N1
0.200(0.008)
MIN.
0.700(0.028)
0.800(0.031)
0.180(0.007)
0.300(0.012)
Dec. 2014
0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2X2-3
X1
Y1
X2
Y2
Y
Y3
X3
E
Dimensions
Y
(mm)/(inch)
X1=X3
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Value
2.200/0.087
0.400/0.016
0.300/0.012
1.600/0.063
Dimensions
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
---
Value
1.100/0.043
0.600/0.024
1.300/0.051
---
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2X2-3 ( Only for AH9248/AH9249)
Unit: mm(inch)
1.220(0.048)
1.420(0.056)
1.900(0.075)
2.100(0.083)
0.300(0.012)
0.500(0.020)
N3
Package Sensor Location
(For Hall IC)
1.900(0.075)
2.100(0.083)
0.780(0.031)
0.980(0.039)
Pin 1 Mark
N2
0.850(0.033)
1.150(0.045)
0.650(0.026)
TYP
0.990(0.039)
1.290(0.051)
0.700(0.028)
0.800(0.031)
N1
0.200(0.008)
MIN.
0.220(0.009)
0.320(0.013)
Die
0.180(0.007)
0.300(0.012)
Dec. 2014
0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2X2-3 (Only for AH9247)
1.220(0.048)
1.420(0.056)
0.750(0.030)
0.950(0.037)
1.900(0.075)
2.100(0.083)
Unit: mm(inch)
0.300(0.012)
0.500(0.020)
N3
Package Sensor Location
1.900(0.075)
2.100(0.083)
0.780(0.031)
0.980(0.039)
Pin 1 Mark
N2
0.650(0.026)
TYP
1.000(0.039)
1.200(0.047)
0.700(0.028)
0.800(0.031)
N1
0.200(0.008)
MIN.
0.220(0.009)
0.320(0.013)
Die
0.180(0.007)
0.300(0.012)
Dec. 2014
0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-4X3-12
0.450(0. 018)
0.550(0. 022)
0.330(0. 013)
0.430(0. 017)
N7
2.900(0.114)
3.100(0.122)
N12
3.250(0. 128)
3.350(0. 132)
Bottom View
Exposed Pad
Pin 1 Mark
N6
0.200(0. 008)
REF
0.200(0. 008)
MIN.
1.650(0.065)
1.750(0.069)
3.900(0. 154)
4.100(0. 161)
Unit: mm(inch)
N1
0.200(0. 008)
0.300(0. 012)
PIN #1 IDENTIFICATION
See DETAIL A
0.000(0. 000)
0.050(0. 002)
DETAIL A
0.700(0. 028)
0.800(0. 031)
3
2
1
3
2
1
3
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-4X3-12
E
Y
Y2
X2
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
3.400/0.134
0.300/0.012
0.600/0.024
3.500/0.138
1.800/0.071
0.500/0.020
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
PDFN-5X6-8
Unit: mm(inch)
New Product Changed to POWERDI5060-8 (2013.10)
4.700(0.185)
5.100(0.201)
1.000(0.039)
1.200(0.047)
0.900(0.035)
1.100(0.043)
0.510(0.020)
0.710(0.028)
3.820(0.150)
4.020(0.158)
1.20±0.10
+0
DEPTH 0.05 -0.05
3.180(0.125)
3.540(0.139)
5.600(0.220)
6.000(0.236)
E
0.100(0.004)
MAX
0.510(0.020)
MIN
0.510(0.020)
0.710(0.028)
0.330(0.013)
0.510(0.020)
0.060(0.002)
0.200(0.008)
0.210(0.008)
0.340(0.013)
D
Option 1
1.170(0.046)
1.370(0.054)
8
12
Option 1
D
Symbol
E
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
--
5.100
5.150(BSC)
--
0.201
0.203(BSC)
5.900
6.100
6.150(BSC)
0.232
0.240
0.242(BSC)
Option 2
1.000(0.039)
1.400(0.055)
3.700(0.146)
4.100(0.161)
3.280(0.129)
3.680(0.145)
Pin 1 Mark
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
PDFN-5X6-8
X
E
Y3
Y2
Y
Y1
X1
E
X
Y
X1
Y1=E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
5.700/0.224
6.600/0.260
0.610/0.024
1.270/0.050
Y2
Y3
–
–
(mm)/(inch)
(mm)/(inch)
3.800/0.150
0.710/0.028
–
–
Dimensions
Value
Dimensions
Value
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
PDFN-5X6-8 (2)
4.800(0.189)
5.000(0.197)
1.000(0.039)
1.200(0.047)
Unit: mm(inch)
1.000(0.039)
1.200(0.047)
0.510(0.020)
0.710(0.028)
D2
1.20±0.10
+0.05
E2
DEPTH 0.05 -0.05
5.700(0.224)
5.800(0.228)
5.900(0.232)
6.100(0.240)
0.100(0.004)
MAX
5.100(0.201)
MAX
0.060(0.002)
0.200(0.008)
1.100(0.043)
MIN
0.510(0.020)
0.710(0.028)
0.350(0.014)
0.450(0.018)
0.210(0.008)
0.340(0.013)
1.170(0.046)
1.370(0.054)
8
12
D2
Symbol
E2
min(mm) max(mm) min(inch) max(inch) min(mm) max(mm) min(inch) max(inch)
Dec. 2014
Option 1 3.820
4.020
0.150
0.158
3.340
3.540
0.131
0.139
Option 2 3.820
4.020
0.150
0.158
3.180
3.380
0.125
0.133
Option 3 3.910
4.110
0.154
0.162
3.340
3.540
0.131
0.139
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-28
New Product Changed to SO-28 (2013.10)
Unit: mm(inch)
17.700(0.697)
18.100(0.713)
0.204(0.008)
0.330(0.013)
7.400(0.291)
7.700(0.303)
10.210(0.402)
10.610(0.418)
0°
8°
1.270(0.050)
BSC
0.330(0.013)
0.510(0.020)
2.290(0.090)
2.500(0.098)
0.400(0.016)
1.270(0.050)
0.100(0.004)
0.300(0.012)
2.350(0.093)
2.650(0.104)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-28
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
11.400/0.449
7.400/0.291
0.600/0.024
2.000/0.079
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
SOIC-32
New Product Changed to SO-32 (2013.10)
20.880(0.822)
21.080(0.830)
2.540(0.100)
MAX
7.400(0.291)
7.600(0.299)
Unit: mm(inch)
0.550(0.022)
0.950(0.037)
8.700(0.343) 10.200(0.402)
9.100(0.358) 10.600(0.417)
0.100(0.004)
0.200(0.008)
"A"
0.300(0.012)
0.500(0.020)
1.270(0.050)
TYP
0.200(0.008)
0.300(0.012)
0.550(0.022)
0.950(0.037)
Details of "A"
19.050(0.750)
REF
0.350(0.014)
0.550(0.022)
0.950(0.037)
Note: Eject hole, oriented hole and mold mark is optional.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
SOIC-32
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
11.400/0.449
7.400/0.291
0.600/0.024
2.000/0.079
1.270/0.050
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-1.5x2-6
Unit: mm(inch)
0.174(0. 007)
0.326(0. 013)
N6
0.200(0. 008)
MIN.
N4
1.424(0. 056)
1.576(0. 062)
0.800(0.031)
1.000(0.039)
1.924(0.076)
2.076(0.082)
1.000(0. 039)
1.200(0. 047)
Pin 1 Mark
PIN #1 IDENTIFICATION
See DETAIL A
N3
0.200(0. 008)
0.300(0. 012)
N1
0.500(0. 020)
TYP.
0.000(0. 000)
0.050(0. 002)
DETAIL A
0.350(0. 014)
0.450(0. 018)
0. 127(0. 005)
REF
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-1.5x2-6
E
Y1
X1
Y
Y2
X2
Dimensions
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2=E
(mm)/(inch)
Value
2.400/0.094
1.400/0.055
1.000/0.039
0.300/0.012
0.500/0.020
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DO-27(L)
8. 500(0. 335)
9. 500(0. 374)
Cathode line
by marking
Unit: mm(inch)
5. 000(0. 197)
5. 600(0. 220)
DIA.
6. 000(0. 236)
7. 000(0. 276)
19. 500(0. 768)
20. 500(0. 807)
Dec. 2014
1. 200(0. 047)
1. 300(0. 051)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
CSP-4 (P 0.4)
Unit: mm(inch)
0. 400(0. 016)
TYP.
X
Y
0.400(0.016)
TYP.
2
1
B
0. 550(0. 022)
0. 650(0. 026)
Note : X & Y :
A
F 0. 270(0. 011)
TYP.
Pin 1 Mark
0. 180(0. 007)
0. 220(0. 009)
To determine the exact package size of a particular device,
refer to the device
datasheet.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
CSP-4 (P 0.5)
Unit: mm(inch)
0. 500(0. 020)
TYP.
X
Y
0.500(0.020)
TYP.
2
1
B
Pin 1 Mark
A
F0.320(0. 013)
TYP.
0. 600(0. 024)
0. 700(0. 028)
Note : X & Y :
0. 215(0. 008)
0. 255(0. 010)
To determine the exact package size of a particular device,
refer to the device
datasheet.
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
CSP-4 (P 0.4)(Only for AP2121)
0. 960(0. 038)
1. 060(0. 042)
Unit: mm(inch)
0. 400(0. 016)
TYP.
0.400(0.016)
TYP.
0.940(0.037)
1.040(0.041)
2
1
B
0. 550(0. 022)
0. 650(0. 026)
Dec. 2014
A
F 0. 270(0. 011)
TYP.
Pin 1 Mark
0. 180(0. 007)
0. 220(0. 009)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
CSP-4 (P 0.5)(Only for AP2121)
0. 960(0. 038)
1. 060(0. 042)
Unit: mm(inch)
0. 500(0. 020)
TYP.
0.500(0.020)
TYP.
0.940(0.037)
1.040(0.041)
2
1
B
Pin 1 Mark
A
F0.320(0. 013)
TYP.
0. 600(0. 024)
0. 700(0. 028)
Dec. 2014
0. 215(0. 008)
0. 255(0. 010)
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2x2-6 (1)
Unit: mm(inch)
New Product Changed to U-DFN2020-6 (2013.10)
0.200(0. 008)
MIN.
0.650(0. 026)
N4 TYP.
1.900(0. 075)
2.100(0. 083)
0.224(0. 009)
0.376(0. 015)
N5
N6
1.500(0. 059)
1.700(0. 067)
0.850(0. 033)
1.050(0. 041)
1.900(0. 075)
2.100(0. 083)
Pin 1 Mark
PIN #1 IDENTIFICATION
See DETAIL A
N3
N1
N2
DETAIL A
0. 250(0. 010)
0. 350(0. 014)
0. 000(0. 000)
0. 050(0. 002)
2
0. 550(0. 022)
0. 650(0. 026)
Dec. 2014
0.152(0. 006)
REF.
1
2
1
2
1
Pin 1 options
BCD Semiconductor Manufacturing Limited
Packaging Information
Mounting Pad Layout
DFN-2x2-6 (1)
E
Y2 Y
X2
Y1
X1
Dimensions
Value
Dec. 2014
Y
X1
Y1
X2
Y2
E
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
(mm)/(inch)
2.400/0.094
0.400/0.016
0.525/0.021
1.800/0.071
1.050/0.041
0.650/0.026
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
DFN-2x2-6 (1) (Only for AH9482/AH9483)
0.200(0.008)
MIN.
0.650(0.026)
N4 TYP.
1.900(0.075)
2.100(0.083)
Unit: mm(inch)
0.224(0.009)
0.376(0.015)
N5
N6
0.830(0.033)
1.030(0.041)
1.500(0.059)
1.700(0.067)
1.900(0.075) 0.850(0.033)
2.100(0.083) 1.050(0.041)
Hall Sensor
Location
Pin 1 Mark
PIN # 1 IDENTIFICATION
See DETAIL A
N3
N1
N2
0.580(0.023)
0.780(0.031)
0.250(0.010)
0.350(0.014)
0.000(0.000)
0.050(0.002)
DETAIL A
0.550(0.022)
0.650(0.026)
0.152(0.006)
REF.
2
1
2
1
2
1
Pin 1 options
Dec. 2014
BCD Semiconductor Manufacturing Limited
Packaging Information
Mechanical Dimensions
TO-3P
Unit: mm(inch)
New Product Changed to TO3P (2013.10)
15.450 (0.608)
15.850 (0.624)
4.600 (0.181)
5.000 (0.197)
3.300 (0.130)
REF
0.000 (0.000)
0.300 (0.012)
1.200 (0.047)
1.600 (0.063)
6.900 (0.272)
7.100 (0.280)
13.450 (0.530)
REF
3.200 (0.126)
REF
9.400 (0.370)
9.800 (0.386)
5.150 (0.203)
5.550 (0.219)
13.700 (0.539)
14.100 (0.555)
23.200 (0.913)
23.600 (0.929)
20.300 (0.799)
20.600 (0.811)
5.000 (0.197)
REF
1.450 (0.057)
1.650 (0.065)
1.800 (0.071)
2.200 (0.087)
39.900 (1.571)
40.300(1.587)
13.400 (0.528)
13.800 (0.543)
2.800 (0.110)
3.200 (0.126)
0.800 (0.031)
1.200 (0.047)
0.500 (0.020)
0.700 (0.028)
Dec. 2014
5.450 (0.215)
TYP
BCD Semiconductor Manufacturing Limited