Package Mounting Methods

Package Mounting Methods
(Mounting Methods/Reliability/Storage)
1. Mounting Methods
2. Surface Mounted Plastic Package Reliability
3. Storage
DB81-10004-2E
1
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
1. Mounting Methods
1.1
Lead inserted type
There are two methods for mounting lead inserted type packages on a printed circuit board: one
method where the solder is applied directly to the printed circuit board, and another method
where the package is mounted in a socket on the board.
When applying solder directly to the board, the leads are inserted into the mounting holes in
the printed circuit board first, and the flow soldering method (wave soldering method) is used
with jet solder. This is the most popular and widely used method for mounting packages on a
printed circuit board.
However, during the soldering process, heat in excess of the normal maximum rating for the
storage temperature is applied to the leads. As a result, quality assurance concerning heat
resistance during soldering limits the soldering process to the levels shown below; do not
exceed these levels during soldering work.
1. Solder temperature and immersion time
260 °C (500 °F), 10 seconds or less
2. Lead immersion position
Up to a distance of at least 1 to 1.5 mm from the main body of the package
3. When mounting an element using the solder flow method, ensure that the element
itself is not immersed in the solder.
4. When using flux, avoid chlorine based fluxes; instead, use a resin-based flux.
Note, however, that if the module leads are exposed to the solder for a long period of time,
solder on the module board may melt and previously mounted ICs may become detached.
Also be careful to prevent any solder from coming into direct contact with the packages
mounted on the module.
When using socket mounting, in some cases when the surface treatment of the socket pins is
different from the surface metal
2
DB81-10004-2E
PACKAGE
1.2
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
Surface mounted type
Compared to the lead inserted type, surface mounted packages have finer, thinner leads, which
means that the leads are more easily bent. In addition, as packages come to have more and
more pins, the lead pitch is becoming narrower, making handling more difficult.
When the pitch of an IC is narrow, problems such as open pins caused by bent leads or short
circuits caused by solder bridges occur easily; therefore, suitable mounting technology
becomes a necessity.
Surface mounted packages include flat packages with gull-wing leads or straight leads,
packages with J-leaded, and ball-grid array packages (BGA); the packages can be either plastic
or ceramic. In the case of surface mounted packages, the solder reflow method is recommended
as the mounting method for either type of package.
Fig1 illustrates the basic process for mounting.
Fig 1 Flow Chart of Basic Mounting Process
Boards
(1) Solder paste application
Component
(2) Component preprocessing (baking, preliminary soldering)
(3) Component placement
(4) Solder reflow
(5) Cleaning/drying
Visual check/testing
There are a variety of methods for soldering surface mounted packages onto a printed circuit
board. Some of these methods are described below.
The mounting methods can be broadly classified into two types: partial heating methods and
the total heating methods. The partial heating methods are desirable from a reliability
standpoint since the thermal stress is small, but from the standpoint of mass production such
methods are somewhat more difficult to implement.
DB81-10004-2E
3
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
(1)Partial heating methods
Soldering method
Advantages
Disadvantages
• Less stress placed • Limited suitability for
mass production
on IC package
Manual method
• Bent leads can be • Danger of electrostatic damage
repaired
• Low equipment/
facility cost
Soldering iron
• Less stress placed • Limited suitability for
mass production
on IC package
Block heater method
Pulse current
Heater
• Bent leads can be • Danger of electrostatic damage
repaired
• No problem if the
leads are raised a
little
• Faster than the
manual method
• Less stress placed • Limited suitability for
on IC package
mass production
Laser method
• Problems arise if leads
are raised slightly
Laser
• Less stress placed • Very low suitability for
mass production
on IC package
Hot air method
Hot air
4
• Low operating
costs
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
(2)Total heating methods
Soldering method
Advantages
• Highly suited for
mass production
Full dip method
Disadvantages
• Places the most stress
on package
• Existing techniques and facilities can be used
Melted solder
Infrared reflow method
Infrared heater
• Low operating
costs
• Highly suited for
mass production
• Low operating
costs
• Highly suited for
mass production
Vapor phase reflow method
Saturated steam
Inert liquid
(florinate)
Heater
Hot air heating method (used with far infrared heat)
Far infrared heater
• Places comparatively
large amount of stress
on package
• Operating costs are
high
• Places comparatively little stress
on package
• Uniformity of temperature distribution is excellent
• Places comparatively little stress
on package
• Oxidation due to surrounding air may occur
• Highly suited for
mass production
Forced convection
Underside heating method
Conveyor belt
• High temperatures are not
applied directly to
the package
• Cannot be used with
double-sided boards
Heater
DB81-10004-2E
5
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
1.3
PACKAGE
Precautions on mounting
Points of consideration concerning mounting work are explained below.
(1) Boards
Packages can be mounted on a variety of boards, including resin boards made of materials such
as paper phenol or glass epoxy, ceramic boards, and flexible printed circuit boards, and when
selecting the board material it is essential to give due consideration to factors such as matching
the thermal expansion coefficients of the components to be mounted, electrical and mechanical
characteristics, heat dissipation characteristics, the total reliability level, and cost. In addition,
the reliability and production yield in terms of the wiring pattern on the component mounting
surface also become important factors.
Figs. 2 and 3 show examples of design for surface patterns. In the design stage, consideration
should be given to ease of mounting, reliability of the connections, pattern spacing, and the
possibility of solder bridge formation.
Fig 2 Example of Surface Pattern Design Criteria for SOPs and QFPs
QFP
P
w
0.25mm 2°
W
0.40mm
0.20mm
L
L
(Typ value) + 0.60mm
Also applicable to SOP.
For package with a pitch of 0.5 mm or less;
w (Typ value) + 0.03 mm
W
P × 0.6 mm
For others;
w (Typ value)
6
W
P − 0.30 mm
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
Fig 3 Example of Surface Pattern Design Criteria for BGA
SMD
NSMD
Solder-mask
Opening
Solder-mask
Opening
Pad Pattern
SMD (solder-mask defined)
NSMD (nonsolder-mask defined)
Pad Pattern
Solder-mask
Opening
Pad Pattern
Solder-mask
Opening
0.8 mm pitch FBGA
φ0.48
φ0.38
φ0.35
φ0.45
0.5 mm pitch FBGA
φ0.325
φ0.225
φ0.225
φ0.325
(2) Applying solder paste
There are two methods for supplying the solder paste: by printing and by dispenser.
When done by printing, a stainless steel screen mask is used to apply the solder paste.
When mounting packages with a narrow pitch, how the solder paste printing process is
performed has a major effect on the production yield after the reflow process, so careful
attention must be paid to the selection of the equipment and to the printing conditions.
Careful attention must also be paid to the selection of the solder paste and the printing mask.
If the board surface is not flat and some of the solder is to be applied after a portion of the
components have already been mounted, the remaining solder paste can be applied by using a
dispenser.
(3) Solder paste
The solder paste is a mixture of solder powder (normally #250 to 325) mixed with flux.
The merits of using solder paste include:
• It is easy to control the amount of solder used.
• It is possible to use the viscosity of the paste to temporarily hold components in place.
• There are no impurities from a solder bath, etc.
• It is well suited for automation and mass production.
The most common type of solder is lead-tin eutectic type, but when soldering boards or
components that use silver-lead for conductors, a eutectic type solder with a silver content of
about 2% or 3% is used.
The fluxes used in the paste include fluxes that require cleaning and fluxes that do not require
cleaning. If using a cleaning-type flux, you need to determine the correct cleaning procedure.
Key points to consider in the selection of flux include:
DB81-10004-2E
7
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
a) Selection based on catalog values
• Size and shape of the solder powder
• Solder composition
• Amount of flux and chlorine included
b) Evaluation criteria for actual trials
• Good patterning characteristics (deposits well)
• No change in the viscosity and uniformity of the mixture of solder powder and
flux over time
• Continuous printing possible
• Very little dripping or formation of solder balls when melted
• Easy to clean, with little flux residue, no-discoloration or staining
Although the cost of the solder paste is also important, the total manufacturing cost in terms of
production yield, etc., must be taken into consideration when selecting a paste, not just the cost
of the paste itself.
Before beginning mass production, a thorough study should be conducted and then those
materials that best fit the conditions under which they will be used should be selected.
Solder paste is normally applied through a printing process, using a screen mask about 150 µm
thick.
(4) Component preprocessing (Baking surface mounted plastic packages)
Unlike ceramic packages, plastic packages absorb moisture when exposed to atmosphere.
Although this does not present a reliability problem during storage, if a plastic package that has
absorbed moisture is soldered by the reflow method, the package may crack. Although it
depends on the package type and the reflow method, it is important to note that some packages
must undergo a baking process before the reflow process. (For details, refer to section 2.3,
"Surface Mounted Plastic Package Reliability.")
(5) Component placement
Equipment that positions surface mounted package components is available from a variety of
manufacturers in worldwide. When selecting such equipment, it is necessary to consider the
number of components it will handle and the manner in which the components are packaged
(in containers, trays, or on tape).
Because the leads on flat packages extend outwards, they are easily bent. Because repair is
difficult once the leads are bent, great care must be taken when handling the packages.
As the electrode part of BGA package pins is made from soft metal such as solder, care is
required to ensure that the pin electrodes are not contaminated by scratches or dirt that can
affect mounting.
(6) Full solder dip (wave soldering method)
When using the full solder dip method for mounting, observe the following conditions.
(Contact a Fujitsu sales representative for details on those packages and products for which full
solder dipping is available.)
Solder bath temperature: 260°C max. (500°F max.)
Time: Less than 5 seconds
8
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
(7) Solder reflow
The typical reflow methods are: a) hot air reflow; b) infrared reflow; and c) vapor phase
reflow. General descriptions of each of these methods are provided below. Note that the use of
full solder dipping should be avoided.
a) Hot air reflow
This reflow method uses convective thermal propagation with heat-saturated air.
There are two different types of methods: the far infrared combination type and the hot air
circulation type.
• Temperature profile can be controlled comparatively well.
Advantages
• Temperature distribution can be made relatively uniform.
• Operating cost is low.
• Reflow in a normal oxidizing atmosphere.
Disadvantages
• Processing capability decreases somewhat.
b) Infrared reflow
This reflow method uses radiant heat from an infrared heater.
• Processing capability is high.
Advantages
• Temperature profile can be controlled comparatively well.
• Operating cost is low.
• Temperature differences can arise due to differences in radiation
absorption rates on the board.
Disadvantages
• Caution is required, since the flux is easily blackened.
• Reflow in a normal oxidizing atmosphere.
c) Vapor phase reflow
This reflow method uses the latent heat of vaporization of an inert liquid.
Advantages
• Uniform temperature distribution.
• Reflow in an inert atmosphere.
• No fear of overheating. (Heat is not applied above the boiling point
of the inert liquid.)
Disadvantages
• Temperature profile is limited.
• Operating cost is high.
• Processing capability decreases somewhat.
• Attention must be paid to ventilation.
• Equipment is expensive.
(8) Manual soldering (partial heating method)
This method uses a soldering iron; soldering is done with the IC fixed in place by flux or
adhesive.
Conditions:
DB81-10004-2E
Temperature: 350 °C MAX (662°F max.)
Time: 3 seconds max./pin
9
Package Mounting Methods (Mounting Methods/Reliability/Storage)
1. Mounting Methods
PACKAGE
(9) Cleaning
After soldering, clean away any flux residue.
If any flux left on the printed circuit board begins to absorb moisture, it can have a negative
impact on reliability due to degradation of the insulation resistance or corrosion of the leads
due to the chlorine component of the flux; therefore, cleaning is recommended. Refer to Table
1 for details on the cleaning requirements.
The following cautions should be observed during cleaning:
• Do not touch printed surfaces until the cleaning fluid dries.
• When solder paste was used for mounting, solder balls may have formed, depending on the
paste type, paste quality, mounting conditions, etc.; therefore, pay attention to the need to
clean away any solder ball residue as well.
Table 1 Plastic Package Cleaning Requirements
Frequency
27 to 29 kHz
Ultrasonic wave output
15 w/l or less
Solvent
Water-based cleaning solvent, alcohol-based cleaning solvent, etc.
Cleaning time
Up to 30 seconds (one time)
• The packages must not resonate.
• The packages and printed circuit board must not come into
direct contact with the vibration source.
Cautions
• Do not touch or brush printed surfaces while cleaning is in
progress or while there is cleaning solvent on a package.
• When using solvents, observe public environmental standards
and safety standards.
Note: Cleaning ceramic packages
Do not use ultrasonic cleaning to clean ceramic packages after mounting. Instead, use
hot water, boiling water, steam, etc., for cleaning. Also, caution should be exercised in
regards to the volatility of the cleaning fluids, and performing the work in sealed
equipment is recommended.
(10) Miscellaneous (Including Rework Considerations)
If, after mounting, a package must be reworked, use a hot jet or other method to apply localized
heat in order to remove the package in question, and then mount a proper package in its place
in the same manner. In this instance, the preliminary soldering method and the solder paste
(applied with a dispenser) method can be used individually or together. In either case, keep the
points described in item 4, "Component preprocessing," in mind. From the standpoint of device
reliability, such replacements should be kept to a minimum.
Using underfill resin to improve the impact resistance of packages used in mobile equipment
typically makes rework very difficult. Accordingly, it is recommended that device operation
testing be performed before applying the resin.
10
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
2. Surface Mounted Plastic Package Reliability
The heat stress that surface mounted plastic packages are subjected to when they are mounted
adversely affects their humidity resistance characteristics. This section describes the humidity
resistance characteristics of surface mounted plastic packages.
2.1
Features of surface mounted packages
Compared with lead inserted types, surface mounted packages offer the following advantages
and disadvantages.
(1) Advantages
• Higher mounting densities are possible, making thinner and lighter devices possible.
• Packages can have more pins.
• Surface mounted packages offer benefits from the standpoint of electrical characteristics.
• Because through holes are not needed, costs are lower.
• Surface mounted packages are suited for automated assembly lines.
(2) Disadvantages
• Surface mounted packages are vulnerable to thermal stress during mounting, which can
result in cracked packages or poor humidity resistance characteristics.
• Because the external leads are thin, they are easily bent.
• Because the pitch is very small, solder bridges form easily.
2.2
Mechanism behind degradation of humidity resistance
characteristics due to thermal stress during mounting
For plastic packages, high thermal stress may cause deterioration of the IC Packages.
The moisture resistance of packages is deteriorated by thermal stress in the following phases:
(1)Moisture absorption
Plastic packages absorb moisture in the air. The thinner the package, the sooner the moisture
absorbed to the center.
DB81-10004-2E
11
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
(2) Thermal stress during mounting
The mounting temperature and time depend on the mounting method. In particular, the overall
heating method causes higher thermal stress on the package than the partial heating method.
(3) Temperature increase in package
The increasing temperature causes evaporation of moisture absorbed in phase (1), and
deterioration of resin strength and mismatch between the lead frame and resin of the package
due to the different thermal expansion coefficients.
(4) Resin interface exfoliation
The stress generated in phase (3), causes exfoliation of the package resin interface.
(The water pressure increases to 4.7 MPa (46 atm) at 260°C (500 °F).)
(5) Package cracking
If the above-mentioned stress is high, package cracking and bonding wire breaking may occur.
12
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
2.3
Measures to improve humidity resistance characteristics
In response to the mechanisms described above that contribute to the degradation of a
package’s humidity resistance characteristics, Fujitsu is taking the following measures in order
to improve reliability.
(1) Improvement of mold resins
Fujitsu is striving to improve the sealing power of resins, reduce the stress that they are
subjected to, and to increase their purity.
(2) Improvement of the lead frame
It is essential to eliminate the boundary surface separations that form due to thermal expansion
of the lead frame and the resin when thermal stress is applied during the mounting process.
(3) Improvement of packaging materials for shipment
Since one of the mechanisms described was the absorption of moisture by plastic ICs which in
turn lead to a degradation of humidity resistance characteristics, Fujitsu packages ICs in an
aluminum-laminate pouch that is highly impermeable to moisture, and with silica gel placed
inside the pouch.
2.4
Mounting Rank and Recommended Mounting Conditions
Surface mounted plastic packages occur in many package sizes and thicknesses, and a variety
of resistances to thermal stress during mounting. For this reason Fujitsu establishes an
allowable number of days from unpackaging to mounting for each product. This is called the
product’s mounting rank, and it differs according to package type and mounting conditions.
Table 2 shows the types of mounting ranks and corresponding recommended mounting
conditions.
Even within the same package, the mounting rank may vary between products so that users are
advised to specifically confirm mounting ranks by contacting a Fujitsu marketing
representative.
Table 2 Mounting Rank Types and Recommended Mounting Conditions
Fujitsu mounting ranks are indicated in the format: Rnn Smm Jkk Hxx, or Rnn Smm Jkk Mxx.
These formats have the following meaning:
Rnn: Acceptable reflow mounting conditions in terms of the mounting method and temperature
profile shown in Fig 4.
Symbol
DB81-10004-2E
Acceptable mounting conditions
RZ0
2 × reflow, no control required for moisture absorption
RY0
2 × reflow, within 1 year
R28
2 × reflow, within 28 days
R14
2 × reflow, within 14 days
R08
2 × reflow, within 8 days
R04
2 × reflow, within 4 days
R02
2 × reflow, within 2 days
R00
Not acceptable for 2 × reflow
Xnn
Limited to 1 × reflow, within nn days
13
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Smm: Acceptable mounting conditions for wave soldering (260 °C max, 5 seconds or less)
Symbol
Acceptable mounting conditions
SZ0
1 × solder dip, no control required for moisture absorption
SY0
1 × solder dip, within 1 year
S28
1 × solder dip, within 28 days
S14
1 × solder dip, within 14 days
S08
1 × solder dip, within 8 days
S04
1 × solder dip, within 4 days
S02
1 × solder dip, within 2 days
S00
Not acceptable for 1 × solder dip
SPn
1 × solder dip, bake after unpackaging, within n days
Jnn: JEDEC moisture sensitivity level, according to IPC/JEDEC J-STD-020A.
Symbol
JEDEC moisture sensitivity level
J01
1
J02
2
J2a
2a
J03
3
J04
4
J05
5
J5a
5a
J06
6
J00
Not applicable to JEDEC standard
Hnn: Acceptable reflow mounting conditions in terms of the mounting method and temperature
profile shown in Fig.4-2.
Symbol
Acceptable mounting conditions
HZ0
2 × reflow, no control required for moisture absorption
HY0
2 × reflow, within 1 year
H28
2 × reflow, within 28 days
H14
2 × reflow, within 14 days
H08
2 × reflow, within 8 days
H04
2 × reflow, within 4 days
H02
2 × reflow, within 2 days
Mnn: Acceptable reflow mounting conditions in terms of the mounting method and
temperature profile shown in Fig.4-3.
Symbol
14
Acceptable mounting conditions
MZ0
2 × reflow, no control required for moisture absorption
MY0
2 × reflow, within 1 year
M28
2 × reflow, within 28 days
M14
2 × reflow, within 14 days
M08
2 × reflow, within 8 days
M04
2 × reflow, within 4 days
M02
2 × reflow, within 2 days
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Mounting by partial heating methods:
Partial heating methods may be used with any mounting rank.
Fig 4 Temperature profile for hot air reflow/infrared reflow scheme 1
240 °C
235 °C
210 °C
150 to 190 °C
(b)
RT
(c)
(e)
(d)
(d ’)
(a)
(a) Temperature increase gradient
(b) Preliminary heating
(c) Temperature increase gradient
(d) Actual heating
(d’)
(e) Natural cooling or forced cooling
Average: 1 °C/s to 4 °C/s (33.8°F/s to 39.2°F/s)
Temperature: 150 °C to 190 °C
(302°F to 374°F), 60 s to 120 s
Average: 1 °C/s to 4 °C/s (33.8°F/s to 39.2°F/s)
Temperature: 240 °C (464°F) MAX., 235 °C
(455°F) or more, 10 s or less
(Temperature of the top of the package body)
Temperature: 210 °C (410°F) or more, 40 s or less
Fig 5 Temperature profile for hot air reflow/infrared reflow scheme 2
260 °C
255 °C
220 °C
170 to 190 °C
(b)
RT
(c)
(e)
(d)
(a)
(a) Temperature increase gradient
(b) Preliminary heating
(c) Temperature increase gradient
(d) Actual heating
(d’)
(d ’)
Average: 1 °C/s to 4 °C/s (33.8°F/s to 39.2°F/s)
Temperature: 170 °C to 190 °C (338°F to 374°F),
60 s to 180 s
Average: 1 °C/s to 4 °C/s (33.8°F/s to 39.2°F/s)
Temperature: 260 °C (500°F) MAX., 255 °C
(491°F) or more, 10 s or less
(Temperature of the top of the package body)
Temperature: 230 °C (446°F) or more, 40 s or less
Temperature: 225 °C (437°F) or more, 60 s or less
Temperature: 220 °C (428°F) or more, 80 s or less
(e) Natural cooling or forced cooling
DB81-10004-2E
15
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Fig 6 Temperature profile for hot air reflow/infrared reflow scheme 3
250 °C
245 °C
220 °C
170 to 190 °C
(b)
RT
(c)
(e)
(d)
(d ’)
(a)
(a) Temperature increase gradient
Average: 1 °C/s to 4 °C/s (33.8°F/s to 39.2°F/s)
(b) Preliminary heating
Temperature: 170 °C to 190 °C (338°F to 374°F),
60 s to 180 s
(c) Temperature increase gradient
Average: 1 °C/s to 4 °C/s (33.8°F/s to 39.2°F/s)
(d) Actual heating
Temperature: 250 °C (482°F) MAX.,245 °C
(473°F) or more, 10 s or less
(Temperature of the top of the package body)
(d’)
Temperature: 230 °C (446°F) or more, 40 s or less
Temperature: 225 °C (437°F) or more, 60 s or less
Temperature: 220 °C (428°F) or more, 80 s or less
(e) Natural cooling or forced cooling
Fig 7 Temperature profile for vapor phase reflow scheme (Reference)
(a) Temperature increase gradient
(b) Temperature
1 °C/s to 8 °C/s (33.8°F/s to 46.4°F/s)
200 °C (392°F) or more [Typ: 215 °C (419°F)]
Time: 30 s to 60 s
The temperature profiles in Fig 5 and Fig 6 are subject to change without prior notification.
Users are advised to contact the Fujitsu Marketing Department for confirmation.
2.5
Storage and drying processing
Surface mounted plastic packages should be stored while still packed in the materials that they
were shipped in from Fujitsu. If you have any questions, contact Fujitsu.
16
DB81-10004-2E
PACKAGE
2.6
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
Reliability data
Because surface mounted plastic packages are mounted by total heating methods, they are
easily affected by thermal stress during the mounting process, with the result that packages
sometimes crack or their humidity resistance characteristics are adversely affected.
In addition to normal reliability evaluations, Fujitsu subjects surface mounted plastic packages
to Temperature Cycling tests and PCT tests after preprocessing the packages for solder heat
resistance, all in order to evaluate reliability versus the stresses encountered during the
mounting process.
Tables 3 to 16 show examples of the results of these evaluations.
Table 3 Reliability Testing Results (Plastic BCC-48 MB15G202)
1. Life tests
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
25
1000
0
High Temperature Operation Life
(AC operation) ∗2
100 °C (212 °F)
55*1
1000
0
Temperature Humidity Bias
(AC operation) ∗2
85 °C/85%RH
(185 °F/85%RH)
25*1
1000
0
Number of
Tests
Number of
Failure
55*1
0
25
0
Test item
2. Environmental tests
Test item
Test conditions
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F)
(200 cycles)
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F)
(200 cycles)
PCT
121 °C (249.8 °F), 2.03E5 Pa,168 h
55*1
0
PCT-Bias *3
121 °C (249.8 °F), 2.03E5 Pa, 96 h
25
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 48 h + IR 245 °C (473 °F) Max.
*2: AC operating conditions: Power supply voltage; 3.6 V, Operating frequency; 1MHz / 2MHz
*3: PCT-Bias operating conditions: Power supply voltage; 3.6 V
DB81-10004-2E
17
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Table 4 Table4 Reliability Testing Results (Plastic CSOP-48 Flash Memory)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
25
1000
0
Temperature Humidity Bias
(DC operation) *2
85 °C/85%RH
(185 °F/85%RH)
25*1
1000
0
Number of
Tests
Number of
Failure
55*1
0
25
0
2. Environmental tests
Test item
Test conditions
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F) (200 cycles)
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
PCT
121 °C (249.8 °F), 2.03E5 Pa, 168 h
55*1
0
PCT-Bias *2
121 °C (249.8 °F), 2.03E5 Pa, 96 h
25
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 24 h + IR 245 °C (473 °F) Max.
*2: DC/ PCT-Bias operating conditions: Power supply voltage; 4.1 V
Table 5 Table5 Reliability Testing Results (FBGA-288 CS36 Series)
Test item
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F)
(200 cycles)
55*1
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
55*1
0
PCT-Bias *2
121 °C (249.8 °F), 1.72E5 Pa, 96 h
11
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 24 h + IR 235 °C (455 °F) Max.
*2: PCT-Bias operating conditions: Power supply voltage; 3.0 V/4.0 V
Table 6 Table6 Reliability Testing Results (FBGA-304 CS70B Series)
Test item
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F)
(200 cycles)
34*
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
34*
0
*: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 24 h + IR 235 °C (455 °F) Max.
18
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Table 7 Table7 Reliability Testing Results (FD-FBGA-60 MB81F641642G)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
11
1000
0
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
18*1
1000
0
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−65 °C to 150 °C ( −85 °F to 302 °F) (200 cycles)
53*1
0
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
11
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
54*1
0
PCT-Bias *3
121 °C (249.8 °F), 1.72E5 Pa, 96 h
11
0
2. Environmental tests
Test item
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 24 h + IR 245 °C (473 °F) Max.
*2: AC operating conditions: Power supply voltage; 4.5 V, Input frequency; 10 MHz
*3: PCT-Bias operating conditions: Power supply voltage; 4.5 V, Input frequency; 500 kHz
Table 8 Table8 Reliability Testing Results (Over mold BGA-256 CS70B Series)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
25
1000
0
High Temperature Operation Life
(AC operation) *2
125 °C (257 °F)
55*1
1000
0
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
25*1
1000
0
Low Temperature Operation Life
(AC operation) *2
−55 °C (−67 °F)
25
1000
0
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F) (200 cycles)
55*1
0
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
25
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
55*1
0
PCT-Bias ∗3
121 °C (249.8 °F), 1.72E5 Pa, 96 h
25
0
2. Environmental tests
Test item
*1:Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 30 °C/80%RH
(86 °F/80%RH), 72 h + IR 235 °C (455 °F) Max.
2*: AC operating conditions: Power supply voltage; 3.0 V/4.0 V, Input frequency; 8 MHz
3*: PCT-Bias operating conditions: Power supply voltage; 3.0 V/4.0 V
DB81-10004-2E
19
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Table 9 Table9 Reliability Testing Results (Multi Chip Stacked FBGA-73 MB84VD22181EE)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
26
1000
0
High Temperature Operation Life
(AC operation) *2
125 °C (257 °F)
77*1
1000
0
Temperature Humidity Bias
(DC operation) *3
85 °C/85%RH
(185 °F/85%RH)
46*1
1000
0
Number of
Tests
Number of
Failure
2. Environmental tests
Test item
Test conditions
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F)
(200 cycles)
46*1
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
46*1
0
PCT-Bias *3
121 °C (249.8 °F), 1.72E5 Pa, 96 h
26
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 12 h + IR 245 °C (473°F) Max.
*2: AC operating conditions: Power supply voltage; 4.0 V, Input frequency; 1 MHz
*3: DC/ PCT-Bias operating conditions: Power supply voltage; 4.0 V
Table 10 Table10 Reliability Testing Results (Plastic TSOP-48 Flash Memory)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
Data pattern Zero
Data pattern CKBD
417
364
1000
1000
0
0
High Temperature Operation Life
(AC operation) *2
150 °C (302 °F)
605
1000
0
Temperature Humidity Bias
(DC operation) *3
85 °C/85%RH
(185 °F/85%RH)
110
55*1
1000
1000
0
0
Number of
Tests
Number of
Failure
2. Environmental tests
Test item
Test conditions
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F)
(200 cycles)
215*1
0
PCT
121 °C (249.8 °F), 2.03E5 Pa, 168 h
165*1
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 20 h + IR 245 °C (473 °F) Max.
*2: AC operating conditions: Power supply voltage; 3.6 V, Input frequency; 1 MHz
*3: DC operating conditions: Power supply voltage; 3.6 V
20
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Table 11 Table11 Reliability Testing Results (Plastic TSOP-54 (LOC) MB81F641642D)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
55
1000
0
High Temperature Operation Life
(AC operation) *2
125 °C (257 °F)
105*1
1000
0
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
55*1
1000
0
Low Temperature Operation Life
(AC operation) *2
−55 °C (−67 °F)
55
1000
0
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F) (200 cycles)
105*1
0
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
55
0
PCT
121 °C (249.8 °F), 2.03E5 Pa, 168 h
55*
PCT-Bias *3
121 °C (249.8 °F), 2.03E5 Pa, 96 h
25
2. Environmental tests
Test item
1
0
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 24 h + IR 245 °C (473 °F) Max.
*2: AC operating conditions: Power supply voltage; 4.5 V, Input frequency; 10 MHz
*3: PCT-Bias operating conditions: Power supply voltage; 4.5 V
Table 12 Table12 Reliability Testing Results (Plastic TQFP-100 CS70B Series)
1. Life tests
Number of
Tests
Test duration
(h)
Number of
Failure
25
1000
0
55*1
1000
0
25*1
1000
0
25
1000
0
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F) (200 cycles)
55*1
0
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
25
0
PCT
121 °C (249.8 °F), 2.03E5 Pa, 168 h
55*1
0
121 °C (249.8 °F), 2.03E5 Pa, 96 h
25
0
Test item
Test conditions
150 °C (302 °F)
High Temperature Storage
High Temperature Operation Life
125 °C (257 °F)
(AC operation) *2
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
Low Temperature Operation Life
−55 °C (−67 °F)
(AC operation) *2
2. Environmental tests
Test item
PCT-Bias
*3
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 30 °C/80%RH
(86 °F/80%RH), 72 h + IR 245 °C (473 °F) Max.
*2: AC operating conditions: Power supply voltage; 3.0 V/4.0 V, Input frequency; 8 MHz
*3: PCT-Bias operating conditions: Power supply voltage; 3.0 V/4.0 V
DB81-10004-2E
21
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Table 13 Table13 Reliability Testing Results (TAB-BGA-720 CS70B Series)
1. Life tests
Number of
Tests
Test duration
(h)
Number of
Failure
25
1000
0
30*1
1000
0
24*1
1000
0
25
1000
0
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−55 °C to 125 °C (−67 °F to 257 °F) (500 cycles)
50*1
0
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
25
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
50*
PCT-Bias *3
121 °C (249.8 °F), 1.72E5 Pa, 96 h
25
Test item
Test conditions
High Temperature Storage
150 °C (302 °F)
High Temperature Operation Life
100 °C (212 °F)
(AC operation) *2
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
Low Temperature Operation Life
-55 °C (-67 °F)
(AC operation) *2
2. Environmental tests
Test item
1
0
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 30 °C/80%RH
(86 °F/80%RH), 72 h + IR 235 °C (455 °F) Max.
*2: AC operating conditions: Power supply voltage; 3.0 V/4.0 V, Input frequency; 8 MHz
*3: PCT-Bias operating conditions: Power supply voltage; 3.0 V/4.0 V
Table 14 Table14 Reliability Testing Results (Enhanced BGA-672 CS70B Series)
1. Life tests
Test item
Test conditions
Number of
Tests
Test duration
(h)
Number of
Failure
High Temperature Storage
150 °C (302 °F)
25
1000
0
High Temperature Operation Life
AC operation) *2
125 °C (257 °F)
25*1
1000
0
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
25*1
1000
0
Low Temperature Operation Life
AC operation) *2
−55 °C (−67 °F)
12
1000
0
Test conditions
Number of
Tests
Number of
Failure
Temperature Cycling
−55 °C to 125 °C (−67 °F to 257 °F) (500 cycles)
55*1
0
Thermal Shock
0 °C to 100 °C (32 °F to 212 °F) (200 cycles)
25
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
55*1
0
121 °C (249.8 °F), 1.72E5 Pa, 72 h
25
0
2. Environmental tests
Test item
PCT-Bias
*3
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 30 °C/80%RH
(86 °F/80%RH), 96 h + IR 230 °C (464 °F) Max. (3 times)
*2: AC operating conditions: Power supply voltage; 3.0 V/4.0 V, Input frequency; 8 MHz
*3: PCT-Bias operating conditions: Power supply voltage; 3.0 V/4.0 V
22
DB81-10004-2E
Package Mounting Methods (Mounting Methods/Reliability/Storage)
2. Surface Mounted Plastic Package Reliability
PACKAGE
Table 15 Table15 Reliability Testing Results (Plastic HQFP-304 CS70B Series)
1. Life tests
Test item
Test conditions
High Temperature Storage
150 °C (302 °F)
High Temperature Operation Life
125 °C (257 °F)
(AC operation) *2
Temperature Humidity Bias
(AC operation) *2
85 °C/85%RH
(185 °F/85%RH)
Low Temperature Operation Life (AC
−55 °C (−67 °F)
operation) *2
Number of
Tests
Test duration
(h)
Number of
Failure
25
1000
0
55*1
1000
0
25*1
1000
0
25
1000
0
Number of
Tests
Number of
Failure
2. Environmental tests
Test item
Test conditions
Temperature Cycling
−65 °C to 150 °C (−85 °F to 302 °F) (200 cycles)
55*1
0
PCT
121 °C (249.8 °F), 2.03E5 Pa, 168 h
55*1
0
PCT-Bias *3
121 °C (249.8 °F), 2.03E5 Pa, 96 h
25
0
*1: Pre-condition: Baking 125 °C (257 °F), 24 h + Moisture Absorption 85 °C/85%RH
(185 °F/85%RH), 24 h + IR 245 °C (473 °F) Max.
*2: AC operating conditions: Power supply voltage; 3.0 V/4.0 V, Input frequency; 8 MHz
*3: PCT-Bias operating conditions: Power supply voltage; 3.0 V/4.0 V
Table 16 Table16 Reliability Testing Results (Multichip Stacked LGA-73 MB84VD22182EC)
1. Life tests
Test item
Test conditions
Temperature Humidity Bias
(DC operation) *2
85 °C/85%RH
(185 °F/85%RH)
Number of
Tests
Test duration
(h)
Number of
Failure
18*1
1000
0
Number of
Tests
Number of
Failure
2. Environmental tests
Test item
Test conditions
Temperature Cycling
−55 °C to 125 °C (−67 °F to 257 °F) (500 cycles)
54*1
0
PCT
121 °C (249.8 °F), 1.72E5 Pa, 168 h
54*1
0
PCT-Bias *2
121 °C (249.8 °F), 1.72E5 Pa, 96 h
11
0
*1: Pre-condition: Baking 125 °C (257°F), 24 h + Moisture Absorption 85 °C/85%RH (185°F/85%RH),
12 h + IR 245 °C (473°F) Max. + Moisture Absorption 85 °C/85%RH (185°F/85%RH),
12 h + IR 245 °C (473°F) Max.
*2: DC/ PCT-Bias operating conditions: Power supply voltage; 4.0 V
DB81-10004-2E
23
Package Mounting Methods (Mounting Methods/Reliability/Storage)
3. Storage
PACKAGE
3. Storage
Products should be stored while still packed in the materials that they were shipped in from
Fujitsu.
• Befor open Dry Package, the recommended condition for the storage area is as below;
Room Temperature; 5 to 30 °C (41 to 86 °F)
Room Humidity; 70%RH or less
After open Dry Package, the recommended condition for the storage area is as below;
Room Temperature; 5 to 30 °C (41 to 86 °F)
Room Humidity; 40%RH to 70%RH
• Do not store the products where they will be exposed to corrosive gases or in dusty
locations.
• Because sudden temperature changes can cause moisture to condense on the products, store
the products in an area where the temperature remains fairly constant.
• Note that if products are stored for an extended period of time, the solderability of the lead
pins may decline, rust may form, or the electrical characteristics may deteriorate.
•
•
•
•
•
•
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely
for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU does
not warrant proper operation of the device with respect to use based on such information. When you develop equipment
incorporating the device based on such information, you must assume any responsibility arising out of such use of the
information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as
license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of
FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party's intellectual property right or
other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual property
rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required
for export of those products from Japan.
Copyright ©2004-2006 FUJITSU LIMITED All rights reserved.
24
DB81-10004-2E