BD62013FS For air-conditioner fan motor Three phase brushless fan motor controller BD62013FS General Description This controller synthesizes the optimal driving signal from hall sensor signals, and outputs the synthesized signal to control the external level shifter and power transistor. The replacement is also easy because of the almost pin compatible with BD62011FS, BD62012FS and BD62014FS, and this controller provides optimum motor drive for a wide variety of applications, and enables motor unit standardization. Key Specifications Supply voltage range: Duty control voltage range: Phase control range: Operating temperature: Power dissipation: Features 150° commutation logic PWM control (Upper arm switching) Phase control supported from 0° to +30° at 1° intervals Rotational direction switch FG signal output (12 pulses) VREG output (5V/30mA) Protection circuits provided: OCP, TSD, UVLO, MLP and the external fault input (FIB) Package SSOP-A24 10V to 18V 2.1V to 5.4V 0° to 30° -40°C to 110° 1.0W W(Typ.) x D(Typ.) x H(Max.) 10.00mm x 7.80mm x 2.10mm Applications Air conditioners; air cleaners; water pumps; dishwashers; washing machines General OA equipment SSOP-A24 Typical Application Circuit FG Q1 VREG R8 DTR C13 R1 VSP C7 C14 BD62013FS C1 C2~C4 C8 HW HV HU R2 M VREG C15 C11 C5 C9 C10 R5 R4 VCC GND R3 C6 BM620X D1 R6 R7 C12 VDC Fig.1 Application circuit example - BD62013FS & BM620X Product structure : Silicon monolithic integrated circuit .http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 14 · 001 This product is not designed protection against radioactive rays 1/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Block diagram and pin configuration HB HUP HU HUN HVP HV HVN HWP HW HWN TSD VCC VREG UVLO VREG 13 22 VSP 21 10 20 9 19 LOGIC 18 DRIVER 7 6 17 5 16 FG 14 FILTER 5 PC 2 4 VDC UH UL VH VL WH M RCL A/D + PCT 24 V/I 12 TEST VSP 11 15 OSC GND 2 CCW FIB PCT PC VREG HUP HUN HVP HVN HWP HWN VSP FG HB GND RT VCC RCL WL WH VL VH UL UH FIB CCW WL PWM 23 8 VREG DRIVER 3 FAULT RT 1 Fig.2 Block diagram Fig.3 Pin configuration Pin descriptions Pin Name 1 GND 2 RT 3 Function Pin Name Signal ground 24 PCT Carrier frequency setting pin 23 PC VCC Power supply 22 VREG 4 RCL Over current sense pin 21 HUP Hall input pin phase U+ 5 WL Low side driver output phase W 20 HUN Hall input pin phase U- 6 WH High side driver output phase W 19 HVP Hall input pin phase V+ 7 VL Low side driver output phase V 18 HVN Hall input pin phase V- 8 VH High side driver output phase V 17 HWP Hall input pin phase W+ 9 UL Low side driver output phase U 16 HWN Hall input pin phase W- 10 UH High side driver output phase U 15 VSP Duty control voltage input pin 11 FIB External fault input (Low active) 14 FG FG signal output (12 pulses) 12 CCW Direction switch (H:CCW) 13 HB Hall bias output http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 2/20 Function VSP offset voltage output pin Phase control input pin Regulator output TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Functional descriptions 1) Commutation logic When the hall cycle is about 5Hz or less (e.g. when the motor starts up), the commutation mode is 120° rectangle drive with an upper and lower switching (no lead angle). The controller monitors the hall cycle, and switches to 150° commutation drive when the hall cycle reaches or exceeds about 5Hz over four consecutive cycles. Refer to the timing chart, figure 7 and 8. Table 1 120° commutation (Six-state) truth table HU H H H L L L HV L L H H H L HW H L L L H H UH L VH PWM L L L L PWM L PWM L L PWM WH L PWM UL VL H -------------------- PWM L L -------------------- H WL PWM PWM L H -------------------- L -------------------- H L L -------------------- PWM L H L -------------------- H PWM L PWM PWM 2) Duty control The switching duty can be controlled by forcing the DC voltage to the VSP pin, from VSPMIN to VSPMAX. When the VSP voltage is higher than VSPTST, the controller forces PC pin voltage to the ground (Testing mode, the maximum duty and no lead angle). The VSP pin is pulled down internally by a 200kΩ resistor. Therefore, note the impedance when setting the VSP voltage with the resistance voltage divider. 3) Carrier frequency setting The carrier frequency setting can be freely adjusted by connecting an external resistor between the RT pin and ground. The RT pin is biased to a constant voltage, which determines the charge current to the internal capacitor. Carrier frequencies can be set within a range from about 16kHz to 50kHz. Refer to the formula to the right. FOSC [kHz] = 400 RT [kΩ] 4) FG signal output The FG signal is output from the FG pin, and it is generated from the three hall signals (exclusive NOR, 12 pulses). 5) Direction of motor rotation setting The direction of rotation may be switched with the CCW pin. When CCW pin is “H” or open, the motor rotates for CCW direction. When the real direction is different from the setting, the commutation mode is 120° rectangle drive (no lead angle). It is recommended to pull up to VREG voltage when malfunctioning because of the noise. CCW Direction H CCW L CW 6) Hall signal comparator The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, VHALLMIN. We recommend connecting a ceramic capacitor from 100pF to 0.01µF, between the differential input pins of the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range VHALLCM. 7) Hall bias switch When the VSP voltage is higher than VSPHB, the controller outputs VREG voltage to HB pin by an internal switch. A power saving is enabled at the motor rotation stop, by using HB output for the Hall elements bias current. In addition, since the HB output is supplied from the VREG power supply, take into consideration as load connected to the VREG pin, and be aware of the IOMAX value. http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 3/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS 8) Output duty pulse width limiter PWM switching duty pulse width limitation is provided to ensure proper external level shifter and power transistor switching. Because of the pulse width limitation, the controller will not output a pulse of less than TMIN (0.8µs minimum), nor can it output a duty pulse of DMAX or more, because the controller does not keep the external power transistors full on. Also, since the upper and lower external power transistors cannot be turned on simultaneously, the controller is shut off for the period TDT (1.6µs minimum) at the upper and lower part of each phase output (for example, UH and UL). Therefore, the switching maximum duty at the motor starts up is 90 percent (nominal). 9) Phase control setting The driving signal phase can be advanced to the hall signal - (Phase control). The lead angle is set by forcing the DC voltage to the PC pin. The input voltage is converted digitally with the 6-bit A/D converter, in which internal VREG voltage is assumed to be full-scale, and the converted data is processed by logic circuit. The lead angle can be set from 0° to +30° at 1° intervals, and updated fourth hall cycle of phase W falling edge. For the phase control function to operate is only 150° commutation mode. However, the controller forces PC pin voltage to ground (no lead angle) when the testing mode. The VSP offset voltage (Figure 29) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The internal bias current is determined by PCT voltage and the resistor value - VPCT / RPCT -, and mix to PC pin. As a result, the lead angle setting is followed with the duty control voltage, and the performance of the motor can be improved. Please select the RPCT value from 50kΩ to 200kΩ in the range on the basis of 100kΩ, because the PCT pin current capability is a 100µA or less. VPCT = VSP-VSPMIN VSP VSPMIN L.A. PCT L.A. VPCT RPCT ADC PC RPCT RPCL VSP Fig. 4 Phase control setting example 1 VREG VPCT = VSP-VSPMIN VSP VSPMIN L.A. PCT L.A. VPCT ADC R PCT PC R PCH R PCL RPCT VSP Fig. 5 Phase control setting example 2 10) Overcurrent protection (OCP) circuit The over current protection circuit can be activated by connecting a low value resistor for current detection between the external output stage ground and the controller IC ground. When the RCL pin voltage reaches or surpasses the threshold value, the controller forces all the upper switching arm imports low (UH, VH, WH = L, L, L), thus initiating the overcurrent protection operation. When the RCL pin voltage swings below the ground, it is recommended to insert a resistor - 1.5kΩ or more - between RCL pin and current detection resistor because of the malfunction prevention. Since this protection circuit is not a latch type, it returns to normal operation - synchronizing with the carrier frequency - once the RCL pin voltage falls below the threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, so that the protection function does not activate when a short pulse of less than TRCL is input. 11) External fault signal input pin (FIB pin, low active) The FIB pin can force all controller driver outputs low at any time. The FIB pin is pulled up to VREG internally by a 100kΩ resistor, therefore, an open drain output can be connected directly. It is recommended to pull up to VREG voltage when this function is not used and malfunctioning because of the noise. http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 4/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS 12) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (175°C nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150°C nominal). The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not use the IC in an environment where activation of the circuit is assumed. 13) Under voltage lock out (UVLO) circuit To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit is built into this controller. When the power supply voltage falls to VUVL or below, the controller forces all driver outputs low. When the voltage rises to VUVH or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. The voltage monitor circuit is built into for the VREG pin voltage (4.0V nominal) and HB pin voltage (3.5V nominal). Therefore, the UVLO circuit does not release operation when either voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes VUVH or more. 14) Hall signal wrong input detection Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the abnormal hall signals continuously four times or more a motor rotation, the controller forces all driver outputs low and latches the state. It is released that if the duty control voltage VSP is forced ground level once. 15) Motor lock protect When the controller detects the motor locking during the fixed time (4sec. nominal, each edge of the hall signal doesn't input either), the controller forces all driver outputs low in the under in fixed time (20sec. nominal), and self-returns to the normal operation. This circuit is enabled the voltage force to VSP over the duty minimum voltage VSPMIN, and note that the motor cannot starts up when the controller doesn’t detect the motor rotation by the minimum duty control. 16) Internal voltage regulator The internal voltage regulator VREG is output for the bias of the hall element, the phase control setting. However, when using the VREG function, be aware of the IOMAX value. If a capacitor is connected to the ground in order to stabilize output, a 1µF or lower capacitor should be used. In this case, be sure to confirm that there is no oscillation in the output. VCC VREG / HB R1 HUP HU HUN HV HVN HW HWN HVP HWP Controller IC Fig. 6 VREG output pin application example http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 5/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Timing charts (CW) Hall signals HALL U HALL V HALL W Spin up (Hall period < 5Hz) UH VHPWM WH PWM PWM PWM UL PWM PWM PWM VLPWM WL PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM CW direction (lead=0deg) UH PWM VHPWM WH PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM UL VL WL CW direction (lead=30deg) UH PWM VH PWM WH PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM UL VL WL FG output FG Fig. 7 BD62013FS (Clockwise) timing charts http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 6/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Timing charts (CCW) Hall signals HALL U HALL V HALL W Spin up (Hall period < 5Hz) UH PWM PWM VHPWM PWM WH UL PWM PWM PWM PWM PWM PWM PWM PWM WL PWM PWM PWM VLPWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM CW direction (lead=0deg) UH PWM PWM VHPWM PWM PWM WH PWM PWM PWM PWM PWM PWM PWM PWM UL VL WL CW direction (lead=30deg) UH PWM PWM VH PWM WH PWM PWM PWM PWM PWM PWM PWM PWM PWM UL VL WL FG output FG Fig. 8 BD62013FS (Counter clockwise) timing charts http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 7/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Controller outputs and operation mode summary Detected direction Forward (CW:U~V~W, CCW:U~W~V) Reverse (CW:U~W~V, CCW:U~V~W) Conditions Hall sensor period < 5Hz 5Hz < VSPHB < VSP < VSPMIN (Duty off) Normal operation VSPMIN < VSP < VSPMAX (Control range) VSPTST < VSP (Testing mode) < 5Hz 5Hz < Upper and lower arm off 120° Upper and lower switching Overcurrent 150° Upper switching 120° Upper and lower switching 150° Upper switching (No lead angle) Upper arm off 120° Upper switching Upper and lower arm off UVLO TSD Protect operation Upper and lower arm off Motor lock External input Hall sensor abnormally Upper and lower arm off and latch * The controller monitors both edge of three hall sensors for detecting period. * For the phase control function to operate is only 150° commutation mode. However, the controller forces no lead angle when the testing mode. Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground) Parameter Ratings Symbol Unit BD62013FS Supply voltage VCC 20*1 V Duty control voltage VSP -0.3 to 20 V All others VI/O -0.3 to 5.5 V Driver outputs IOMAX(OUT) ±15*1 mA Monitor output IOMAX(FG) ±5*1 mA VREG outputs IOMAX(VREG) -40*1 mA Operating temperature TOPR -40 to 110 °C Storage temperature TSTG -55 to 150 °C Pd 1.00*2 W Tjmax 150 °C Power dissipation Junction temperature *1 Do not, however, exceed Pd or ASO. *2 Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 8mW/°C above 25°C. Operating conditions (Ta=25°C) Parameter Supply voltage http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 Symbol BD62013FS Unit VCC 10 to 18 V 8/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=15V) Parameter Symbol Limits Min. Typ. Max. Unit Conditions Power supply Supply current ICC 1.3 2.5 5.0 mA VREG voltage VREG 4.5 5.0 5.5 V IO=-30mA Output high voltage VOH VREG-0.60 VREG-0.20 VREG V IO=-5mA Output low voltage VOL 0 0.14 0.60 V IO=5mA Dead time TDT 1.6 2.0 2.4 µs Minimum pulse width TMIN 0.8 1.0 1.2 µs IHALL -2.0 -0.1 2.0 µA Driver outputs Hall comparators Input bias current VIN=0V Common mode input VHALLCM 0 - VREG-1.5 V Minimum input level VHALLMIN 50 - - mVp-p Hysteresis voltage P VHALLHY+ 5 13 23 mV Hysteresis voltage N VHALLHY- -23 -13 -5 mV ISP 15 25 35 µA Duty minimum voltage VSPMIN 1.7 2.1 2.5 V Duty maximum voltage VSPMAX 5.0 5.4 5.8 V Testing operation range Duty control Input bias current VIN=5V VSPTST 13 - 18 V Minimum output duty DMIN 1.2 1.8 2.4 % FOSC=18kHz Maximum output duty DMAX 92 95 98 % FOSC=18kHz HB enable voltage VSPHB 0.5 1.0 1.5 V Mode switch and the external input - CCW and FIB Input bias current IIN -70 -50 -30 µA Input high voltage VINH 3 - VREG V VIN=0V Input low voltage VINL 0 - 1 V Hysteresis voltage VINHY 0.2 0.5 0.8 V Output high voltage VMONH VREG-0.40 VREG-0.08 VREG V IO=-2mA Output low voltage VMONL 0 0.06 0.40 V IO=2mA Input bias current IRCL -30 -20 -10 µA VIN=0V Threshold voltage VRCL 0.48 0.50 0.52 V Noise masking time TRCL 0.8 1.0 1.2 µs Minimum lead angle PMIN - 0 1 deg Maximum lead angle PMAX 29 30 - deg VPC=1/2·VREG VSP controlled lead angle PVSP 23 26 29 deg VSP=4V,RPCT/RPC=100kΩ/96.97kΩ FOSC 16 18 20 kHz RT=22kΩ Monitor output - FG Overcurrent protection Phase control VPC=0V OSC Carrier frequency UVLO Release voltage VUVH 8.5 9.0 9.5 V Lockout voltage VUVL 7.5 8.0 8.5 V Hysteresis voltage VUVHY 0.5 1.0 1.5 V http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 9/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Typical performance curves (Reference data) 4 5.4 25°C 110°C -40°C 3 VREG voltage : V REG [V] Circuit Current : I CC [mA] 110°C 25°C -40°C 2 1 0 5.0 4.8 4.6 9 12 15 18 21 9 12 15 18 Supply Voltage : VCC [V] Supply Voltage : VCC [V] Fig.9 Circuit current Fig.10 VREG vs VCC 5.4 21 0.0 Output Drop Voltage : VOH [V] 25°C 110°C -40°C VREG voltage : V REG [V] 5.2 5.2 5.0 4.8 4.6 -0.4 -0.8 -1.2 -40°C 25°C 110°C -1.6 0 10 20 30 40 0 4 8 12 Output Current : IOUT [mA] Output Current : IOUT [mA] Fig.11 VREG drive capability Fig.12 High side output voltage (XH, XL) http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 10/20 16 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Typical performance curves (Reference data) - Continued 0.00 110°C 25°C -40°C Input Bias Current : I HALL [µA] Output Voltage : VOL [V] _ 1.6 1.2 0.8 0.4 0.0 -0.05 -0.10 -0.15 110°C 25°C -40°C -0.20 0 4 8 12 0 16 Output Current : IOUT [mA] Fig.13 Low side output voltage (XH, XL) 2 3 4 Fig.14 Hall comparator input bias current (HXP, HXN) 6 110°C 25°C -40°C 4 3 2 1 110°C 25°C -40°C 0 Input Bias Current : ISP [µA] 200 5 Output Voltage : V WH [V] 1 Input Voltage : VINHXP [V] 150 100 50 110°C 25°C -40°C 0 -1 -30 -15 0 15 30 0 5 10 15 Differential Voltage : VHUP-VHUN [mV] VSP Voltage : VSP [V] Fig.15 Hall comparator hysteresis voltage Fig.16 VSP input bias current http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 11/20 20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Typical performance curves (Reference data) - Continued 100 1.5 Internal Logic : H/L [-] Output Duty : D SP [%] 80 60 40 110°C 25°C -40°C 20 0 1.0 0.5 0.0 110°C 25°C -40°C -0.5 0 2 4 6 8 0 VSP Voltage : VSP [V] 10 15 20 VSP Voltage : VSP [V] Fig.17 Output duty – VSP voltage Fig.18 Testing mode threshold voltage 0.0 0.8 110°C 25°C -40°C Output Voltage : VOL [V] _ Output Drop Voltage : VOH [V] 5 -0.2 -0.4 -0.6 -40°C 25°C 110°C 0.6 0.4 0.2 0.0 -0.8 0 2 4 6 0 Output Current : IOUT [mA] 4 6 Output Current : IOUT [mA] Fig.19 High side output voltage (FG) http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 2 Fig.20 Low side output voltage (FG) 12/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Typical performance curves (Reference data) - Continued 1.5 60 Internal Logic : H/L [-] 50 Input Bias Current : IIN [µA] 110°C 25°C -40°C 110°C 25°C -40°C 40 30 20 110°C 25°C -40°C 1.0 0.5 0.0 10 0 -0.5 0 1 2 Input Voltage : 3 VIN 4 5 1.7 2.1 2.3 Input Voltage : [V] Fig.21 Input bias current (CCW, FIB) 2.5 VIN 2.7 2.9 [V] Fig.22 Input threshold voltage (CCW, FIB) 1.5 30 110°C 25°C -40°C Internal Logic : H/L [-] RCL Input Bias Current : IRCL [µA] 1.9 20 10 0 0 1 2 3 4 1.0 0.5 0.0 -0.5 0.48 5 110°C 25°C -40°C 0.49 0.50 0.51 RCL Input Voltage : VRCL [V] Input Voltage : VRCL [V] Fig.23 RCL input bias current Fig.24 RCL input threshold voltage http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 13/20 0.52 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Typical performance curves (Reference data) - Continued 0.0 5 HB Drop Voltage : VHB [V] HB Output Voltage : V HB [V] _ 6 4 3 110°C 25°C -40°C 2 110°C 25°C -40°C 1 0 -0.2 -0.4 -0.6 -0.8 -40°C 25°C 110°C -1.0 0.0 0.5 1.0 1.5 0 2.0 10 20 30 40 VSP Voltage : VSP [V] HB Output Current : IHB [mA] Fig.25 HB enable voltage Fig.26 HB output drive capability 1.5 6 1.0 UH Voltage : V UH [V] Internal Logic : H/L [-] 5 0.5 0.0 4 -40°C 110°C 25°C 3 110°C -40°C 25°C 2 1 -0.5 0 125 150 175 200 7.0 Junction Temperature : Tj [°C] 8.0 8.5 9.0 9.5 10.0 Supply Voltage : VCC [V] Fig.27 Thermal shut down http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 7.5 Fig.28 Under voltage lock out (VCC) 14/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Typical performance curves (Reference data) - Continued 4 5 3 PC Voltage : V PC [V] PCT Voltage : V PCT [V] 4 3 2 110°C 25°C -40°C 1 2 1 110°C -40°C 25°C 0 0 0 1 2 3 4 5 6 0 7 2 3 4 PCT Voltage : VPCT [V] VSP Voltage : VSP [V] Fig.29 VSP-PCT offset voltage Fig.30 PCT-PC linearity (RPCT=RPC=100kΩ) 30 60 110°C 25°C -40°C 110°C 25°C -40°C Frequency : F OSC [kHz] 50 Phase : LA [deg] 1 40 30 20 25 20 15 10 0 10 0.0 0.2 0.4 0.6 0.8 14 1.0 18 22 26 VPC/VREG (Normalized) : [V/V] External Resistor : RT [kohm] Fig.31 PC voltage normalized - Lead angle Fig.32 Carrier frequency - RT http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 15/20 30 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Application circuit example FG Q1 VREG R8 DTR C13 R1 VSP IC1 VREG C1 C7 C14 C2~C4 C8 HW HV HU M R2 C15 C11 C5 C9 C10 R5 R4 R3 VCC GND C6 R6 IC2 D1 R7 C12 VDC Fig.33 Parts list Parts Value Application circuit example (150° commutation driver) Manufacturer Type Parts Value Ratings Type IC1 - ROHM BD62013FS C1 0.1µF 50V Ceramic IC2 - ROHM BM6201FS C2~4 2200pF 50V Ceramic R1 1kΩ ROHM MCR18EZPF1001 C5 10µF 50V Ceramic R2 150Ω ROHM MCR18EZPJ151 C6 10µF 50V Ceramic R3 22kΩ ROHM MCR18EZPF2202 C7~9 1µF 50V Ceramic R4 100kΩ ROHM MCR18EZPF1003 C10 0.1µF 50V Ceramic R5 51kΩ ROHM MCR18EZPF5102 C11 1µF 50V Ceramic R6 0.5Ω ROHM MCR50JZHFL1R50 x 3 C12 100pF 50V Ceramic R7 10kΩ ROHM MCR18EZPF1002 C13 0.1µF 630V Ceramic R8 0Ω ROHM MCR18EZPJ000 C14 0.1µF 50V Ceramic Q1 - ROHM DTC124EUA C15 1µF 50V Ceramic D1 - ROHM KDZ20B HX - - Hall elements http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 16/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Interfaces VCC VREG VREG VREG 100k RT 100k VSP 250k RCL 2k Fig.34 RT Fig.35 RCL VREG Fig.36 VSP Fig.37 VREG, VCC VREG UH,VH,WH UL,VL,WL FG Fig.38 XH, XL, FG HUP HUN HVP HVN HWP HWN HB Fig.39 HB VREG 2k Fig.40 HXP, HXN VREG 100k 2k CCW FIB PC 2k Fig.41 CCW, FIB http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 2k PCT Fig.42 PC, PCT 17/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Notes for use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures - such as adding fuses - if any value in excess of absolute maximum ratings is to be implemented. 2) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. However, note that even if the voltage does not fall below GND in any other operating condition, it can still swing below GND potential when the motor generates back electromotive force at the RCL terminal. The chip layout in this product is designed to avoid this sort of electrical potential problem, but pulling excessive current may still result in malfunctions. Therefore, it is necessary to observe operation closely to conclusively confirm that there is no problem in actual operation. If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it. 3) Driver outputs The high voltage semiconductor generally driven by this product is connected to the next stage via the controller. If any special mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage clamping diodes or fuses. 4) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 5) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. Also, connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as establishing an external diode between the power supply and the IC power supply pin. 6) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 7) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 8) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Resistor Pin A Pin B C Pin A + N P N + P P N Transistor (NPN) B Parasitic element N P+ N P P substrate Parasitic element GND Pin B E B + P N E P substrate Parasitic element GND C GND Parasitic GND element Other adjacent elements Appendix: Example of monolithic IC structure Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 18/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Ordering information B D 6 2 0 1 ROHM Part Number 3 F S Package FS : SSOP-A24 - E 2 Packaging specification E2 : Embossed taping Physical dimension, tape and reel information Marking diagram SSOP-A24 (TOP VIEW) PRODUCT NAME BD62013FS 1PIN MARK http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 LOT No. 19/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet BD62013FS Revision history Date Revision 01.JUN.2012 001 Changes New release http://www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 · 15 · 001 20/20 TSZ02201-0828ABB00030-1-2 01.JUN.2012 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.