Package Datasheet

QUAD FLAT PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
256 PIN PLASTIC
FPT-256P-M09
256-pin plastic QFP
(FPT-256P-M09)
256-pin plastic QFP
(FPT-256P-M09)
Lead pitch
0.40 mm
Package width 
package length
28.0 28.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
4.03 mm MAX
Weight
5.74g
Remark
Low heat resistance type
Code(Reference)
P-FQFP256-28  28-0.40
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
30.60±0.20(1.205±.008)SQ
* 28.00±0.10(1.102±.004)SQ
192
0.145±0.055
(.006±.002)
129
193
128
0.08(.003)
Details of "A" part
3.73±0.30
(Mounting height)
(.147±.012)
+0.10
0.40 –0.15
INDEX
+.004
0°~8°
256
.016 –.006
(Stand off)
65
"A"
LEAD No.
1
C
(0.50(.020))
64
0.40(.016)
0.18±0.05
(.007±.002)
2003-2010 FUJITSU SEMICONDUCTOR LIMITED F256025S-c-3-6
0.07(.003)
M
0.25(.010)
0.60±0.15
(.024±.006)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering.
FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package
dimensions in this document.
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